JPH0476570B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for heating a heat-sensitive element and measuring the temperature thereof.

[Prior Art] FIG. 3 is a side view showing a conventional heat-sensitive element, and FIG. 4 is a front view thereof.

This heat-sensitive element 10 has a base 1 made of ceramic or the like.
1 has platinum 12 pattern printed on it,
Lead wires 13 and 14 are provided at the ends of the platinum 12.

FIG. 5 is a diagram showing a case where a black body paint is applied to the heat-sensitive element and used as a black body reference.

First, the above-described heat-sensitive element 10 and the same heat-sensitive element 10a are bonded together using an adhesive 16, and black paint is applied to the heat-sensitive element 10. Then, by energizing the heat-sensitive element 10a, the heat-sensitive element 10a is used for heating, and by detecting a change in the resistance value of the heat-sensitive element 10, the heat-sensitive element 10 is used for temperature measurement. ing. In other words,
Since the resistance value of the heat-sensitive element 10 increases as the temperature increases, this property is utilized to detect the resistance value and measure the temperature at that time.

However, if you do this, the heat source (thermal element 1
0a) and the temperature detection position (thermal element 10) are apart, and since the adhesive 16 is interposed between them, a delay in temperature change occurs. Therefore,
In the black paint 15, there is a problem in that the temperature ripple (difference between high temperature and low temperature) becomes large.

[Object of the Invention] The present invention has been made by focusing on the problems of the above-mentioned conventional example, and an object of the present invention is to provide a heating and temperature measuring device for a heat-sensitive element in which ripples do not occur in the temperature generated by the heat-sensitive element. That is.

[Embodiment of the Invention] FIG. 1 is an explanatory diagram showing an embodiment of the present invention.

The heat sensitive element 10 is the same as that shown in FIGS. 3 and 4. However, the heat-sensitive element 10 shown in FIG. 1 not only performs heating but also measures temperature.

Lead wires 13 and 14 connect diodes 31 and 32
is connected to the temperature measurement circuit 21 via
Temperature control circuit 22 via diodes 33 and 34
It is connected to the. The temperature control circuit 22 is composed of a thyristor or the like, and controls the amount of heat applied to the platinum 12 by controlling the time during which electricity is supplied from the power source 19.

Here, the platinum 12 can be energized from the temperature measurement circuit 21 during the positive half-wave period, and the platinum 12 can be energized from the temperature control circuit 22 during the negative half-wave period. In other words, the timing of temperature measurement and the timing of heating are different.

Note that during the positive half-wave period, the temperature control circuit 2
2 is not energized, and the temperature measurement circuit 21 is not energized during the negative half wave period.
Internal processes 2 and 21 are being performed.

Next, the operation of the above embodiment will be explained.

FIG. 2 is a time chart showing the operation of the above embodiment.

In this second figure, time is plotted on the horizontal axis (actually,
The heating timing is set in the positive half-wave period from 0 to 180 degrees (indicated by the angle), and by controlling the heating time in this period (the time shown by diagonal lines in Figure 2), the platinum The amount of heating for 12 is controlled. In other words, the longer the heating time, the higher the temperature of platinum 12 becomes.

On the other hand, the temperature measurement timing is set during the negative half wave period from 180 to 360 degrees, and during this period,
The resistance value of the platinum 12 at that time is measured, and the temperature of the black body 15 is detected based on this measured value.

The positive half-wave period and the negative half-wave period form one cycle, and this cycle is repeated.

The temperature detected by the temperature detection circuit 21 is
A signal corresponding to the detected temperature is displayed on the display 23 and fed back to the temperature control circuit 22, and temperature control is performed to maintain the preset temperature.

As mentioned above, since the heat source and the temperature measurement position are the same, no temperature ripple occurs in principle.

In addition, contrary to the above, the temperature measurement timing is set during the positive half wave period from 0 to 180 degrees, and
The heating timing may be set during the negative half wave period up to 360 degrees. In addition, although the above heating and temperature measurement are performed every half cycle, the temperature is measured after several cycles of continuous heating.
This may be repeated. Furthermore, a DC power source may be used instead of the AC power source 19, and the heating timing and temperature measurement timing may be set alternately at predetermined time intervals.

The heat-sensitive element 10 may be a planar resistor, may use a heating element other than platinum 12, or may be a normal heating element without the black body 15.

[Effects of the Invention] According to the present invention, there is an effect that no ripple occurs in the temperature generated by the heat-sensitive element.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of an embodiment of the present invention.
FIG. 2 is a time chart showing an example of the operation of the above embodiment. FIG. 3 is a side view showing an example of a heat-sensitive element used in the conventional example and the above embodiment. FIG. 4 is a front view of FIG. 3. FIG. 5 is an explanatory diagram of a conventional example. DESCRIPTION OF SYMBOLS 10... Heat sensitive element, 12... Platinum, 21... Temperature measurement circuit, 22... Temperature control circuit, 23... Display.

Claims (1)

[Claims] 1. A heat-sensitive device characterized in that the heating and temperature measurement are repeated by differentiating the timing of heating a predetermined heat-sensitive element and the timing of measuring the temperature of the heat-sensitive element. Element heating and temperature measurement equipment. 2. In claim 1, the heating is performed during a positive or negative half-wave period of AC power, and the temperature measurement is performed during a negative or positive half-wave period other than the period in which the heating is performed. A heating and temperature measuring device for a heat-sensitive element, characterized in that the heating is carried out during a period of time. 3. The heating and temperature measuring device for a heat-sensitive element according to claim 1, wherein the heating timing and the temperature measurement timing are switched in a time-sharing manner. 4. The heating and temperature measuring device for a thermosensitive element according to claim 3, wherein the heating is performed by an AC power supply or a DC power supply. 5. The heating and temperature measuring device for a heat-sensitive element according to claim 1, wherein the heat-sensitive element is a planar resistor. 6. The heating and temperature measuring device for a heat-sensitive element according to claim 1, wherein the heat-sensitive element is a flat platinum heat-sensitive element. 7. The heating and temperature measuring device for a heat-sensitive element according to claim 1, wherein the temperature of the heat-sensitive element is controlled based on the result of the temperature measurement. 8. The heating and temperature measuring device for a thermosensitive element according to claim 1, further comprising display means for displaying the measured temperature value.