JPH0478466B2 - - Google Patents
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- Publication number
- JPH0478466B2 JPH0478466B2 JP58196913A JP19691383A JPH0478466B2 JP H0478466 B2 JPH0478466 B2 JP H0478466B2 JP 58196913 A JP58196913 A JP 58196913A JP 19691383 A JP19691383 A JP 19691383A JP H0478466 B2 JPH0478466 B2 JP H0478466B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- temperature
- heating
- glass transition
- transition temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は、金属箔張積層板の新規な寸法安定性
の改良法に関するもであり、従来法に比較して、
著しく短時間で寸法安定性の向上を達成すること
が可能なものである。
紙、ガラス布、ガラス不織布その他種々の補強
基材に種々の樹脂を含浸・乾燥したプリプレグを
１枚〜複数枚と、その片面あるいは両面に銅、
鉄、アルミニウム、その他の金属もしくは合金で
ある金属箔を重ねて積層成形し金属箔張積層板が
製造される。この金属箔張積層板を用いて、通
常、エツチング法によつてプリント配線板が製造
されるが、この工程においては、加熱、冷却が繰
り返される。このようなプリント配線板加工工程
中に、金属箔張積層板の寸法が変化し、パターン
の位置精度が悪化する問題がある。
この現象を金属箔張積層板の寸法安定性と呼
ぶ。寸法安定性を良くする為、特定の補強基材を
使用したり、含浸する樹脂組成物を工夫したり、
積層成形方法を改良したりなどの種々の方法が研
究開発されており、寸法安定性はかなりの程度向
上してきている。しかしながら、これでも尚不十
分な場合があり、このような場合には、古くから
周知慣用の方法として実施されている一種のアニ
ーリングの方法によつて、更に寸法安定性の向上
が計られている。アニーリングの方法としては、
金属箔張積層板を除々に加熱し、基材含浸樹脂の
ガラス転移温度よりやや高い温度まで昇温した
後、この温度で２〜４時間保ち、その後除々に冷
却する方法、および金属箔張積層板を積層成形機
で加熱硬化後、一旦基材含浸樹脂のガラス転移温
度以下に冷却した後、プレス圧力を低下または実
質的に解除した状態で再び基材含浸樹脂のガラス
転移温度よりやや高い温度まで昇温し、室温まで
除々に冷却する方法などがある。
アニーリングの方法は、極めて有効なものであ
るが、時間が長くかかるという欠点がある。
本発明は、短時間に、しかも必要十分な寸法安
定性を計る新規な方法について鋭意研究した結
果、金属箔張積層板の寸法安定化のための加熱は
必ずしも金属箔張積層板全体をその含浸樹脂のガ
ラス転移温度以上まで加熱する必要はなく、金属
箔と金属箔に近接する絶縁体層を該含浸樹脂のガ
ラス転移温度以上まで加熱するのみで良く、従つ
て加熱時間も著しく短時間で良いこと、更に冷却
も除々にする如く特にコントロールする必要もな
いことを発見し完成したものである。
すなわち、本発明は、加熱・加圧工程と冷却工
程を経て積層成形された金属箔張積層板を１枚ず
つ、該積層板の金属箔の温度が金属箔接着樹脂層
のガラス転移温度以上となるように、該ガラス転
移温度より高い温度に加熱された面状発熱体間に
挟むか又は該ガラス転移温度より高い温度に加熱
された熱ロール間を通すことにより５秒〜１分間
の短時間加熱した後、室温に冷却することを特徴
とする金属箔張積層板の寸法安定化法であり、好
ましい加熱の実施態様としては、該金属箔張積層
板を該金属箔張積層板の金属箔接着樹脂層のガラ
ス転移温度より高い温度に加熱された面状発熱体
間に挟むか、または金属箔接着樹脂層のガラス転
移温度より高い温度に加熱された熱ロール間に通
すことにより行うことによるものである。
本発明の方法は、以上の如きものであり、この
ことの効果は、実施例によつて実証されている通
り、アニーリングの方法と同等のものである。こ
のような、短時間の加熱、放冷や空冷などの急速
冷却によつて、寸法安定性が従来のアニーリング
と同等に達成されることは全く新規な発見であ
る。この理由は明確では無いが、金属箔張積層板
の寸法安定性を左右する因子として、従来類推さ
れてきたこと、即ち、
積層成形による残留応力
加熱による硬化収縮
の内、現在の積層成形技術によつて製造された積
層板類については、が極めて大きい作用を及ぼ
し、且つ、その残留応力は、従来極めて薄いため
無視されがちであつた金属箔と絶縁層との間に集
中していたものであり、は現在の材料選択方法
を含む積層成形技術においては、極めて小さいも
のであつたものとの推定するのが合理的と考えら
れる。
以下、本発明について説明する。
本発明の積層板とは、通常の金属箔張積層板で
あり、その厚み、基材、含浸樹脂、その他いかな
るものであつても良い。
本発明の加熱方法は、従来のアニーリング法に
比べてその処理時間を大幅に減少されることに特
徴を有するものであり、上記の如く、金属箔の温
度が金属箔接着樹脂層のガラス転移温度以上とな
るように加熱することによつて、金属箔に接触・
近接している接着樹脂層の温度もそのガラス転移
温度以上とした後、室温に冷却することを満足す
る範囲内に於いて、その処理手段、処理時間（短
時間）、冷却の方法等特に限定されるものでは無
い、しかしながら、生産性の向上の面からは、よ
り短時間（通常、５秒〜１分間の短時間）に処理
が終了することが望ましく、加熱時間は数〜数十
秒で十分その目的を達成できる。また、加熱の方
法も、金属箔張積層板の金属箔接着樹脂層のガラ
ス転移温度より高い温度に加熱された面状発熱体
間に挟むか、または金属箔接着樹脂層のガラス転
移温度より高い温度に加熱された熱ロール間に通
すことにより行うことによつて、金属箔張積層板
の全面に渡つて、より均一により短時間に所望の
温度となるようにするのが好ましい。ここに、面
状発熱体またはロールの温度は、金属箔接着樹脂
層のガラス転移温度より10℃以上、好ましくは、
20℃以上高い温度〜通常300℃以下の温度から適
宜選択する。
尚、加熱熱伝導には、圧力を加えることは余り
好ましくはなく、熱伝導が良好となるように接触
圧程度とする。
また、加熱後、取り出して冷却するが、これ
も、特別の手段は不要であり、単に放置するのみ
でも、扇風機等で空冷する方法などいずれの方法
でもよい。
以上のごとくである本発明の方法によれば、従
来のアニーリングの方法と同等の寸法安定性が、
従来の百分の一以下の処理時間で達成されるもの
でその実用性は極めて高いものである。
以下、実施例、比較例によつて、本発明をより
具体的に説明する。
実施例 １〜４
JIS GE4Fタイプ銅張積層板1.6mm18／18、寸法
500mm×500mmを試料として、熱盤温度160℃の小
型プレス熱盤間に試料を挟み、ゲージ圧力０Kg／
cm2で５秒〜１分間（実施例１〜４）、0.5時間及び
１時間（比較例１、２）でそれぞれ加熱処理した
後、取り出し、放冷した。
この試料の寸法安定性を測定した結果を第１表
に示した。
比較例 ３、４
実施例１と同様の試料を処理せず、および140
℃の熱風乾燥機中で２時間加熱後、放冷したもの
についてそれぞれ寸法安定性の測定をした。結果
を第１表に示した。
実施例５〜８及び比較例５、６
JIS GE4Fタイプ銅張積層板0.8mm18／18、寸法
500mm×500mmを試料として、熱盤温度160℃の小
型プレス熱盤間に試料を挟み、ゲージ圧力０Kg／
cm2で５秒〜１時間の範囲で加熱処理した後、取り
出し、放冷した。
この試料の寸法安定性を測定した結果を第１表
に示した。
比較例 ７、８
実施例２と同様の試料を処理せず、および140
℃の熱風乾燥機中で２時間加熱後、放冷したもの
についてそれぞれ寸法安定性の測定をした。結果
を第１表に示した。
尚、寸法安定性の試験方法は、以下の方法によ
つた。
500mm×500mmの正方形の両面銅張積層板の四
角部に１mmφの穴を約400mm間隔で開け、穴間
距離を座標測定器にて測定する(a)。
該試料の銅箔をエツチング除去後、170℃、
30分加熱し、冷却後、穴間距離を座標測定器に
て測定する(b)。
寸法変化率は下式で算出した。
寸法変化率＝ｂ−ａ／ａ×100
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel method for improving the dimensional stability of metal foil-clad laminates.
It is possible to achieve improved dimensional stability in a significantly short period of time. One or more sheets of prepreg made by impregnating and drying various resins on various reinforcing base materials such as paper, glass cloth, glass non-woven cloth, and copper on one or both sides.
A metal foil-clad laminate is manufactured by laminating and forming metal foils made of iron, aluminum, other metals, or alloys. A printed wiring board is usually manufactured by an etching method using this metal foil-clad laminate, and heating and cooling are repeated in this process. During such printed wiring board processing steps, the dimensions of the metal foil-clad laminate change, resulting in a problem that the positional accuracy of the pattern deteriorates. This phenomenon is called the dimensional stability of metal foil-clad laminates. In order to improve dimensional stability, we use specific reinforcing base materials, modify the impregnated resin composition,
Various methods, such as improved lamination molding methods, have been researched and developed, and dimensional stability has been improved to a considerable extent. However, even this may still be insufficient, and in such cases, a type of annealing method that has been practiced for a long time as a well-known and commonly used method is used to further improve the dimensional stability. . The annealing method is
A method in which a metal foil-clad laminate is gradually heated to a temperature slightly higher than the glass transition temperature of the base impregnated resin, kept at this temperature for 2 to 4 hours, and then gradually cooled, and a metal foil-clad laminate. After the plate is heated and cured in a lamination molding machine, it is once cooled to below the glass transition temperature of the base material impregnated resin, and then heated again to a temperature slightly higher than the glass transition temperature of the base material impregnated resin with the press pressure reduced or substantially released. There is a method in which the temperature is raised to a temperature of 100% and then gradually cooled to room temperature. Although the annealing method is very effective, it has the disadvantage of being time consuming. As a result of intensive research into a new method for measuring necessary and sufficient dimensional stability in a short period of time, the present invention has revealed that heating for dimensional stabilization of metal foil-clad laminates does not necessarily require the entire metal foil-clad laminate to be impregnated. There is no need to heat the metal foil to a temperature higher than the glass transition temperature of the resin, and it is only necessary to heat the metal foil and the insulating layer adjacent to the metal foil to a temperature higher than the glass transition temperature of the impregnated resin, and therefore the heating time can be extremely short. Furthermore, they discovered that there was no need to particularly control the cooling process as it was done gradually. That is, in the present invention, each metal foil clad laminate is laminated and formed through a heating/pressure process and a cooling process, and the temperature of the metal foil of the laminate is equal to or higher than the glass transition temperature of the metal foil adhesive resin layer. For a short time of 5 seconds to 1 minute, the heating element is placed between sheet heating elements heated to a temperature higher than the glass transition temperature, or by passing it between heating rolls heated to a temperature higher than the glass transition temperature. This is a method for stabilizing the dimensions of a metal foil-clad laminate, which is characterized by heating and then cooling to room temperature.A preferred embodiment of heating is to heat the metal foil-clad laminate to the metal foil of the metal foil-clad laminate. By sandwiching it between sheet heating elements heated to a temperature higher than the glass transition temperature of the adhesive resin layer, or by passing it between heated rolls heated to a temperature higher than the glass transition temperature of the metal foil adhesive resin layer. It is something. The method of the present invention is as described above, and the effect thereof is equivalent to that of the annealing method, as demonstrated by the examples. It is a completely new discovery that dimensional stability can be achieved on a par with conventional annealing through short-time heating and rapid cooling such as natural cooling or air cooling. The reason for this is not clear, but the factors that have traditionally been assumed to affect the dimensional stability of metal foil-clad laminates are: Residual stress due to laminate molding Curing shrinkage due to heating; In the laminates manufactured in this way, the stress exerts an extremely large effect, and the residual stress was concentrated between the metal foil and the insulating layer, which were conventionally extremely thin and tended to be ignored. It is considered reasonable to assume that the difference was extremely small in the laminated molding technology including the current material selection method. The present invention will be explained below. The laminate of the present invention is a normal metal foil-clad laminate, and may have any thickness, base material, impregnated resin, and other properties. The heating method of the present invention is characterized in that the processing time is significantly reduced compared to the conventional annealing method, and as described above, the temperature of the metal foil reaches the glass transition temperature of the metal foil adhesive resin layer. By heating to the above temperature, the metal foil can be contacted and
Within the range that satisfies the temperature of the adjoining adhesive resin layer, which is made equal to or higher than its glass transition temperature, and then cooled to room temperature, there are no particular restrictions on the processing means, processing time (short time), cooling method, etc. However, from the perspective of improving productivity, it is desirable to complete the process in a shorter time (usually a short time of 5 seconds to 1 minute), and the heating time is from several to several tens of seconds. It is sufficient to achieve that purpose. In addition, the heating method is to sandwich the sheet between sheet heating elements heated to a temperature higher than the glass transition temperature of the metal foil adhesive resin layer of the metal foil clad laminate, or to heat the metal foil laminate to a temperature higher than the glass transition temperature of the metal foil adhesive resin layer. It is preferable that the desired temperature be achieved more uniformly and in a shorter time over the entire surface of the metal foil-clad laminate by passing it between hot rolls heated to a certain temperature. Here, the temperature of the planar heating element or roll is 10°C or higher than the glass transition temperature of the metal foil adhesive resin layer, preferably,
The temperature is appropriately selected from a temperature higher than 20°C to a temperature usually lower than 300°C. It should be noted that it is not very preferable to apply pressure for heating heat conduction, and the pressure is set to about the level of contact pressure so that heat conduction is good. Further, after heating, it is taken out and cooled, but this also does not require any special means, and any method such as simply leaving it as it is or cooling it with air using an electric fan or the like may be used. According to the method of the present invention as described above, dimensional stability equivalent to that of the conventional annealing method can be achieved.
This process is achieved in less than one-hundredth of the processing time of conventional methods, and its practicality is extremely high. Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples. Examples 1 to 4 JIS GE4F type copper clad laminate 1.6mm18/18, dimensions
Using a 500 mm x 500 mm sample, place the sample between small press hot plates with a hot plate temperature of 160℃, and press the gauge pressure to 0 kg/
After heat treatment at cm 2 for 5 seconds to 1 minute (Examples 1 to 4), 0.5 hour and 1 hour (Comparative Examples 1 and 2), the sample was taken out and allowed to cool. Table 1 shows the results of measuring the dimensional stability of this sample. Comparative Examples 3 and 4 Samples similar to Example 1 were untreated and 140
After heating in a hot air dryer at ℃ for 2 hours, the dimensional stability of each sample was measured after being left to cool. The results are shown in Table 1. Examples 5 to 8 and Comparative Examples 5 and 6 JIS GE4F type copper clad laminate 0.8mm18/18, dimensions
Using a 500 mm x 500 mm sample, place the sample between small press hot plates with a hot plate temperature of 160℃, and press the gauge pressure to 0 kg/
After heat treatment at cm 2 for 5 seconds to 1 hour, it was taken out and allowed to cool. Table 1 shows the results of measuring the dimensional stability of this sample. Comparative Examples 7, 8 Samples similar to Example 2 without treatment and 140
After heating in a hot air dryer at ℃ for 2 hours, the dimensional stability of each sample was measured after being left to cool. The results are shown in Table 1. The dimensional stability test method was as follows. Drill 1 mmφ holes at approximately 400 mm intervals in the square part of a 500 mm x 500 mm square double-sided copper-clad laminate, and measure the distance between the holes with a coordinate measuring device (a). After removing the copper foil of the sample by etching,
After heating for 30 minutes and cooling, measure the distance between the holes with a coordinate measuring device (b). The dimensional change rate was calculated using the following formula. Dimensional change rate = b-a/a x 100 [Table]
Claims (1)
れた金属箔張積層板を１枚ずつ、該積層板の金属
箔の温度が金属箔接着樹脂層のガラス転移温度以
上となるよに、該ガラス転移温度より高い温度に
加熱された面状発熱体間に挟むか又は該ガラス転
移温度より高い温度に加熱された熱ロール間を通
すことにより５秒〜１分間の短時間加熱した後、
室温に冷却することを特徴とする金属箔張積層板
の寸法安定化法。1 One by one, the metal foil-clad laminates that have been laminated and molded through the heating/pressing process and the cooling process are heated so that the temperature of the metal foil of the laminate is equal to or higher than the glass transition temperature of the metal foil adhesive resin layer. After heating for a short time of 5 seconds to 1 minute by sandwiching it between planar heating elements heated to a temperature higher than the glass transition temperature or passing it between heating rolls heated to a temperature higher than the glass transition temperature,
A method for dimensional stabilizing metal foil-clad laminates characterized by cooling to room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19691383A JPS6088491A (en) | 1983-10-20 | 1983-10-20 | Dimensional stability of metal foil clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19691383A JPS6088491A (en) | 1983-10-20 | 1983-10-20 | Dimensional stability of metal foil clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6088491A JPS6088491A (en) | 1985-05-18 |
| JPH0478466B2 true JPH0478466B2 (en) | 1992-12-11 |
Family
ID=16365739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19691383A Granted JPS6088491A (en) | 1983-10-20 | 1983-10-20 | Dimensional stability of metal foil clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6088491A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6299141A (en) * | 1985-10-25 | 1987-05-08 | 新神戸電機株式会社 | Manufacture of glass nonwoven-fabric base material laminatedboard |
| JPH0289644A (en) * | 1988-09-28 | 1990-03-29 | Shin Kobe Electric Mach Co Ltd | Heat treatment of thermosetting resin laminate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57203548A (en) * | 1981-06-09 | 1982-12-13 | Matsushita Electric Works Ltd | Manufacture of laminated board |
-
1983
- 1983-10-20 JP JP19691383A patent/JPS6088491A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6088491A (en) | 1985-05-18 |
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