JPH0480100B2

JPH0480100B2 -

Info

Publication number: JPH0480100B2
Application number: JP60297853A
Authority: JP
Inventors: Hironobu Yamamoto; Takashi Nara; Sadao Sato; Yasuhiro Sagara
Original assignee: Tokuriki Honten Co Ltd
Current assignee: Tokuriki Honten Co Ltd
Priority date: 1985-12-30
Filing date: 1985-12-30
Publication date: 1992-12-17
Also published as: JPS62158839A

Description

[Detailed description of the invention]

《産業上の利用分野》本発明はAgを主成分とし、その中に金属酸化
物を分散した銀−酸化物系の接点材料に関するも
のである。《従来の技術》従来、電気接点材料としては、いろいろなもの
が用いられているが、とりわけAg−CdO接点が
広く使用されている。 AgにCdOを10％程度分散させた接点は、耐溶
着性、耐アーク性、耐消耗性、接触安定性などの
諸接点特性が優れているため各種スイツチ、コン
タクター、ブレーカーなど小から大電流領域まで
広く用いられている。 AgマトリツクスにCdOを分散させることは、
接点表面の清浄作用や溶着力の軽減などの電気的
諸特性を改善するものとして確かに効果的であ
る。しかしこのような効果を充分果してきたのは特
に交流回路であり、極性の変化しない直流回路で
使用したときは一方の極から他方の極へ転移が起
こり易くなり接触状態が非常に不安定になる。また、近時各産業分野における合理化、自動化
は目覚ましい発達を遂げているが、これに伴ない
装置が大型化、複雑化する傾向にある一方、これ
ら装置の制御系はむしろ高い精密度を要求される
ため、急速に電子化制御に移行している。電気回路の断続において、電子化された正確な
制御に制御角が一定となり、接点のONの時期と
OFFの時期がずれることなく常に一定の状態に
コントロールされることから、接点開閉時には疑
似的な直流現象が起こることにより、一方の極か
ら他方の極へ接点材質が層状に転移し始め、（別
表１）の比較例における層状堆積物の項から理解
されるように、10⁴回の接点開閉後、層状に移転
堆積する量が0.83〜1.85mm³の如く大となり、従つ
て、それ以上開閉回数を増加して行つた場合に
は、堆積物はさらに成長し、遂に当該堆積物がな
んらかの原因により脱落してしまうことが予測さ
れ、このような状態となつた際には、接点の総体
的な消耗量が大となり、その接触安定性も著しく
損なわれることとなる。そして、上記の如き堆積物の脱落が生ずること
のないまま接点の開閉作動が進行したときは、接
点のロツキングあるいは溶着となつた事故につな
がることにもなる。そこで、本願人は、電気接点の表面の清浄作用
やアークに対する諸現象、例えば消弧作用などが
添加する酸化物の物性、特にその蒸気圧の温度特
性に最も関係が深いとする思考基盤に基づいて、
既に次のような研究をすすめてきている。即ち、当該蒸気圧に関し、約500〜1500℃の温
度範囲でCdOの蒸気圧より高いSb酸化物に着目
し、これをAg中に分散させることによりAg−
CdO系のものと同等以上の接点表面清浄作用が発
揮し得たことは、特願昭48−61188（特公昭53−
18165）に明示の如く確認され、さらにZn，Cu，
Mn，Sn酸化物を分散させた系においても特願昭
48−120317（特公昭55−6091）で特に耐アーク消
耗性、耐溶着性に効果的なことを確認している。ところが、このAgにSb酸化物あるいはSb酸化
物とZn，Cu，Mn，Sn酸化物を分散させた電気
接点材料について種々な回路条件で試験を行つた
ところ前述のように、制御角の一定な電子化制御
により接点の開閉を長時間行つた場合にあつて
は、どちらか一方の極に接点材料の堆積が始ま
り、当該堆積物にアークが集中して異常消耗に発
展することが確認された。《発明が解決しようとする問題点》そこで、上記の異常消耗につき、その原因を追
及した。ここで、通常電気接点を開閉すると、接点間に
は激しいアークが発生し、接点表面はかなりの高
温にさらされる。このとき接点表面は、接点特性に有効な成分が
逸散することで、消耗するのであり、この際失わ
れた効果的な成分が接点内部から表層部へ間断な
く補われるのが理想的な接点材料といえる。ところで、前掲のAg−Sb−Zn−Cu−Mn−Sn
系については、この効果的成分が順調に供給され
ないため前述のような現象が起こつたものと考え
られる。これらについて詳細な検討を進めた結果、接点
内部から表層への順調な有効成分の供給力は、ア
ークによる表層成分の揮発によつて促がされる点
に着目し酸化物の蒸気圧と深い関係があると推定
した。そこでSb酸化物の蒸気圧を基準とし、それよ
り高い蒸気圧を有する各種酸化物とSb酸化物と
を共存した系で実験を繰り返した結果、別途、特
願昭60−295976に明示の如く、AgにSbとTeの酸
化物を複合添加することによつて、前記の如く有
効成分の表層への供給が順調となり、層状堆積防
止に極めて大きな効果があることを見出したので
ある。そして、さらに特願昭60−295977のように、
Agに約1500〜4000℃の温度範囲でCdoよりも高
い蒸気圧をもつSn酸化物をも組み合わせて分散
させることにより、上記のように、単に種々な回
路条件に適合し、層状の堆積物や欠落などによる
異常な消耗のないようにするだけでなく、アーク
消耗量を低減し、接点の溶着回数特性をも改善し
得ることが確認できた。また、特願昭60−297852に開示の通り、Agに
SbとTeの酸化物だけでなく、これにZn，Cu，
Mnの内一種以上の酸化物をも分散させること
で、これまた、上記の如く層状の堆積物や欠落な
どによる異常な消耗のないようにし、かつアーク
消耗量を低減し、溶着回数特性の改善がなされる
ことも確認された。本願第１発明では、上記のAgにSbとTeの酸化
物を加え、さらに、Snの酸化物だけでなく、Zn，
Cu，Mnの内一種以上の酸化物をも分散複合させ
ることで、種々な回路条件に適合し、しかも層状
の堆積物や欠落などによる異常な消耗のない電気
接点材料を提供するだけでなく、アーク消耗量と
溶着回数の特性につき、さらに一層の改善をしよ
うとしており、第２発明では、これに適量のFe，
Ni，Co酸化物を一種以上添加することで、その
特性をより向上させようとしている。《問題点を解決するための手段》本発明は上記の目的を達成するために、第１発
明では、銀を主成分とし、これに金属成分が0.2
〜6.2重量％となるSb酸化物と、金属成分が0.05
〜５重量％となるCu，Zn，Mnの酸化物一種以上
と、金属成分が0.05〜５重量％となるSnの酸化物
と更に金属成分が0.01〜２重量％Te酸化物とが
分散されていることを特徴とする銀−酸化物系の
接点材料を提供しようとしており、さらに第２発
明では、上記第１発明に、0.02〜0.5重量％とな
るFe，Ni，Co酸化物の一種以上をも分散させる
ようにしたことを特徴とする銀−酸化物系の接点
材料を提供しようとしている。《実施例》本発明を後記の具体例によつて、さらに詳記す
ると、先ずこのような電気接点材料を製造するに
は既知のように、焼結法によつても内部酸化法に
よつてもよいが、溶製内部酸化法ではSbとTeお
よびCu，Zn，Mn，Snを添加したAg合金を酸化
雰囲気中で高温に保持してその表面より酸素を侵
入させ、Sb，Te，Cu，Zn，Mn，Snその他の元
素を選択的に酸化するものであり、長時間該酸化
を続けることによりAgマトリツクス中に当該酸
化物を分散せしめて電気接点材料を製するもので
ある。ここで、AgへのSbとTeとCu−Zn−Mnおよび
Snの添加量の上限を夫々6.2重量％と２重量％お
よび５重量％に限定しなければならない理由は、
Ag−Sb合金のα固溶体におけるSbの最大固溶限
が、300℃で6.2重量％であり、この添加量を超過
するSbを添加した場合には著しく加工性を阻害
することとなり、量産的加工が不能となるからで
あり、Agに対し、Cu−Zn−Mnの一種または二
種以上の添加は30％程度の量でも充分可能である
が、上記の通り既にAgに最大6.2重量％のSbを含
んだ合金系に更にCu−Zn−MnおよびSnを添加
する場合であると、Agへの固溶度が急に減少す
ると共に一種または二種以上５重量％を越えた添
加であると展延性が著しく低下し、所望形状まで
の加工が極めて困難となるからである。 Snの上限を５重量％に限定した理由は、これ
以上添加したときは、当該Ag合金の酸素の侵入
力が鈍り、溶質元素が侵入した酸素と結合して酸
化される内部酸化の進み方が遅くなり、この結
果、接点表面にスケール（酸化皮膜）を形成する
だけで、接点深層部までの内部酸化が困難となつ
てしまい、従つて量産性の問題が残つてしまうか
らである。またTeの上限を２重量％に限定した理由は、
TeのAgに対する溶解度が低いことに加え、これ
以上の添加では塑性加工が極めて困難なためであ
る。一方、Sb，Te，Cu，Zn，Mn，Snの添加量が
夫々0.2重量％、0.01重量％、0.05重量％未満の場
合は後述する添加効果が得られない。次に第２発明においてFe族元素の添加量を0.02
〜0.5重量％に限定した理由は、Agに対するFe族
元素の固溶度が0.5重量％を越えると急激に減少
するためAgマトリツクス中に偏在、偏析して加
工性を阻害し、0.02重量％未満の添加では内部酸
化組織の調整に対する効果が低いためである。また第２発明にあつては、第族元素のFe，
Ni，Coの一種または二種以上の添加は、Agマト
リツクス中に析出するとSbとTeおよびCu，Zn，
Mn，Sn酸化物を均一に分散せしめると共に、結
晶粒を微細化する効果がある。ここで具体例を示せば、99.5重量％以上の純度
を有するSb，Te，Cu，Zn，Mn，SnおよびFe，
Ni，Coを原料とし（別表１）に示す組成合金を
次の工程で製作した。高周波誘導溶解炉で、溶解、鋳造したインゴツ
トを熱間鍛造、表面切削後、その一面にAg板を
熱圧着して、ろう付用のAg層を形成する。次に当該素材を冷間圧延して厚さ２mmの板にし
た後直径６mmの円盤状に打抜き、これを720℃の
酸化雰囲気中でSb，Te，Cu，Zn，Mn，Snおよ
びFe，Ni，Coを内部酸化して夫々本発明合金
（(A)，(B)，(C)，(D)，(E)，(F)，（Ｇ），（Ｈ），（
Ｉ））
を得た。比較のためAg−10重量％Cd、Ag−３重量％
Sb−１重量％Sn−１重量％Cu、Ag−２重量％
Te合金をつくり実験に供した。接点試験は、接触抵抗とアーク消耗量および層
状堆積の傾向について、夫々ASTM接点試験機
（AC200V，60A）とアーク消耗試験機
（AC200V，10A）および市販スイツチによる実
機テスト（AC200V，35A）を行つて評価した。《発明の効果》（別表１）のようにAg−10Cdoの層状堆積物
は1.05mm³、Ag−3Sd−1Cu−1Snの層状堆積物が
0.83mm³、Ag−2Teの層状堆積物は1.85mm³であるの
に対し、本発明になる(A)，(B)，(C)，(D)，(E)，(F)，
（Ｇ），（Ｈ），（Ｉ）合金は、何れも0.1mm³以下の極
く微小であり、SbとTeの複合添加が極めて効果
的であることを示している。しかし、これはAgに対するSbとTeの複合添加
が条件であり、Te酸化物のみの添加では層状堆
積物防止に対する効果が著しく低いことを念のた
め述べておく。また、アーク消耗量と接点の溶着回数について
も、本発明合金は前掲AgにSbとTeの酸化物を主
に複合したもの（特願昭60−295676）が、（別表
２）の(イ)，(ロ)，(ハ)，(ニ)，(ホ)，(ヘ)，(ト)，（
チ），（リ）
の如き試験結果となつたのに対し、これらと（別
表１）の(A)〜（Ｉ）を夫々対比すれば明らかな通
り、かなりの改善を確認することができた。これまた本願人の前掲特願昭60−295677による
AgにSb酸化物とTe酸化物、そしてSn酸化物を
も複合添加した接点材料が、（別表３）の(イ)，(ロ)，
(ハ)，(ニ)，(ホ)，(ヘ)，(ト)，（チ），（リ），（ヌ
）のよう
な試験結果となつたのに対し、当該(イ)〜（リ）と
（別表１）の(A)〜（Ｉ）とを対応比較すれば明ら
かな通り、アーク消耗量と溶着回数の点で、かな
りの改善を見ることができた。さらに、本願人の特願昭60−297852によるAg
にSbとTeの酸化物とCu，Zn，Mnの内一種以上
の酸化物を複合添加した接点材料が、（別表４）
の(イ)，(ロ)，(ハ)，(ニ)，(ホ)，(ヘ)，(ト)，（チ）
，（リ），
（ヌ），（ル）如き試験結果となつたのに対し、当
該(イ)〜（リ）と（別表１）の(A)〜（Ｉ）と比照す
ることで、アーク消耗量と溶着回数について、か
なりの改善を認めることができた。また、第族元素のFe，Ni，Coの一種または
二種以上の添加は、Agマトリツクス中に析出す
るSbとTeの酸化物とCu，Zn，Mn酸化物の一種
以上およびSn酸化物を均一に分散せしむると共
に結晶粒を微細化する効果がある。 <<Industrial Application Field>> The present invention relates to a silver-oxide contact material containing Ag as a main component and having a metal oxide dispersed therein. <<Prior Art>> Conventionally, various materials have been used as electrical contact materials, but Ag-CdO contacts have been particularly widely used. Contacts made by dispersing about 10% CdO in Ag have excellent contact properties such as welding resistance, arc resistance, wear resistance, and contact stability, so they can be used in small to large current applications such as various switches, contactors, and breakers. It is widely used. Dispersing CdO in Ag matrix is
It is certainly effective in improving electrical properties such as cleaning the contact surface and reducing welding force. However, this effect has been particularly effective in AC circuits, and when used in DC circuits where the polarity does not change, transition easily occurs from one pole to the other, making the contact state extremely unstable. . Furthermore, although rationalization and automation in various industrial fields have made remarkable progress in recent years, this has led to a tendency for equipment to become larger and more complex, while the control systems for these equipment are required to have higher precision. Therefore, there is a rapid shift to electronic control. When electrical circuits are disconnected, the control angle is constant due to accurate electronic control, and the timing of contact ON and
Since the OFF timing is always controlled to be in a constant state without any deviation, a pseudo direct current phenomenon occurs when the contact opens and closes, and the contact material begins to transfer in layers from one pole to the other (see attached table). As can be understood from the section on layered deposits in the comparative example in 1), after ¹⁰⁴ contacts are opened and closed, the amount of layered deposits becomes as large as 0.83 to 1.85 mm ³ , and therefore, the amount of layered deposits becomes large, such as 0.83 to 1.85 mm 3 . If this is done with an increase in The amount of wear will be large, and the contact stability will be significantly impaired. If the opening and closing operations of the contacts proceed without the deposits falling off as described above, this may lead to accidents such as locking or welding of the contacts. Therefore, the applicant has based on the idea that the cleaning effect on the surface of electrical contacts and various phenomena against arcs, such as arc-extinguishing effects, are most closely related to the physical properties of the added oxide, especially the temperature characteristics of its vapor pressure. hand,
We are already promoting the following research. In other words, we focused on Sb oxide, which has a vapor pressure higher than that of CdO in the temperature range of approximately 500 to 1500°C, and by dispersing it in Ag, Ag-
The fact that it was able to exhibit a contact surface cleaning effect equal to or higher than that of CdO-based products was demonstrated in Japanese Patent Application No. 48-61188.
18165), and furthermore, Zn, Cu,
The patent application also applies to systems in which Mn and Sn oxides are dispersed.
48-120317 (Special Publication No. 55-6091), it has been confirmed that it is particularly effective in arc wear resistance and welding resistance. However, when we tested electrical contact materials in which Sb oxide or Sb oxide and Zn, Cu, Mn, and Sn oxides were dispersed in Ag under various circuit conditions, we found that the control angle was not constant as described above. It has been confirmed that when contacts are opened and closed for a long time using electronic control, contact material begins to accumulate on one of the poles, and arcs concentrate on the deposits, leading to abnormal wear. . <<Problems to be Solved by the Invention>> Therefore, the cause of the above-mentioned abnormal wear was investigated. When electrical contacts are normally opened and closed, a strong arc is generated between the contacts, and the contact surfaces are exposed to considerably high temperatures. At this time, the contact surface wears out as the components effective for contact characteristics dissipate, and the ideal contact is such that the effective components lost at this time are continuously replenished from the inside of the contact to the surface layer. It can be said to be a material. By the way, the above-mentioned Ag−Sb−Zn−Cu−Mn−Sn
Regarding the system, it is thought that the above-mentioned phenomenon occurred because this effective ingredient was not supplied smoothly. After conducting detailed studies on these issues, we found that the smooth supply of active ingredients from the inside of the contact to the surface layer is facilitated by the volatilization of the surface layer components due to the arc, and found that there is a deep relationship with the vapor pressure of the oxide. It is estimated that there is. Therefore, using the vapor pressure of Sb oxide as a standard, we repeated experiments in systems in which Sb oxide and various oxides with higher vapor pressures coexisted. It was discovered that by adding a combination of Sb and Te oxides to Ag, the effective ingredients can be smoothly supplied to the surface layer as described above, and this is extremely effective in preventing layered deposition. Furthermore, as in patent application No. 60-295977,
By dispersing Ag in combination with Sn oxide, which also has a higher vapor pressure than Cdo in the temperature range of about 1500-4000°C, it simply adapts to different circuit conditions and eliminates layered deposits and It was confirmed that it not only prevents abnormal wear due to breakage, etc., but also reduces the amount of arc wear and improves the welding frequency characteristics of the contacts. In addition, as disclosed in patent application No. 60-297852, Ag.
In addition to oxides of Sb and Te, Zn, Cu,
By dispersing one or more oxides of Mn, it also prevents abnormal wear due to layered deposits and missing parts as mentioned above, reduces arc wear, and improves welding frequency characteristics. It was also confirmed that In the first invention of the present application, oxides of Sb and Te are added to the above Ag, and in addition to oxides of Sn, Zn,
By dispersing and compounding one or more oxides of Cu and Mn, we not only provide an electrical contact material that is compatible with various circuit conditions and does not suffer from abnormal wear due to layered deposits or missing parts. We are trying to further improve the characteristics of arc consumption and number of welding, and in the second invention, we add an appropriate amount of Fe,
By adding one or more types of Ni and Co oxides, efforts are being made to further improve its properties. <<Means for Solving the Problems>> In order to achieve the above-mentioned object, the present invention has a first invention in which silver is the main component, and the metal component is 0.2%.
~6.2% by weight of Sb oxide and 0.05% metal content
One or more oxides of Cu, Zn, and Mn with ~5% by weight, an oxide of Sn with a metal component of 0.05~5% by weight, and a Te oxide with a metal component of 0.01~2% by weight are dispersed. The second invention further provides a silver-oxide contact material characterized by containing 0.02 to 0.5% by weight of one or more of Fe, Ni, and Co oxides to the first invention. The present invention aims to provide a silver-oxide contact material characterized in that silver is dispersed therein. 《Example》 The present invention will be described in more detail with reference to specific examples below. First, in order to manufacture such an electrical contact material, as is known, a sintering method and an internal oxidation method are used. However, in the melt internal oxidation method, an Ag alloy containing Sb, Te, Cu, Zn, Mn, and Sn is held at high temperature in an oxidizing atmosphere to allow oxygen to enter from the surface. This method selectively oxidizes Zn, Mn, Sn, and other elements, and by continuing the oxidation for a long time, the oxides are dispersed in an Ag matrix to produce an electrical contact material. Here, Sb, Te, Cu−Zn−Mn and
The reason why the upper limit of the amount of Sn added must be limited to 6.2% by weight, 2% by weight, and 5% by weight, respectively is as follows.
The maximum solid solubility limit of Sb in the alpha solid solution of Ag-Sb alloy is 6.2% by weight at 300°C, and if Sb is added in excess of this amount, the processability will be significantly inhibited, making it difficult to process in mass production. This is because it becomes impossible to add one or more types of Cu-Zn-Mn to Ag in an amount of about 30%, but as mentioned above, up to 6.2% by weight of Sb is already added to Ag. When Cu-Zn-Mn and Sn are further added to an alloy system containing Cu-Zn-Mn, the solid solubility in Ag suddenly decreases, and the addition of one or more of them in an amount exceeding 5% by weight can lead to problems. This is because the ductility decreases significantly, making it extremely difficult to process it into a desired shape. The reason why the upper limit of Sn is limited to 5% by weight is that if more than this is added, the ability of oxygen to penetrate into the Ag alloy will be weakened, and the progress of internal oxidation in which the solute elements will combine with the invading oxygen and be oxidized will be reduced. As a result, only scale (oxide film) is formed on the surface of the contact, making it difficult to internally oxidize the contact to the deep layer, thus leaving a problem in mass production. The reason for limiting the upper limit of Te to 2% by weight is as follows.
This is because, in addition to the low solubility of Te in Ag, adding more than this makes plastic working extremely difficult. On the other hand, when the amounts of Sb, Te, Cu, Zn, Mn, and Sn added are less than 0.2% by weight, 0.01% by weight, and 0.05% by weight, respectively, the effects of addition described below cannot be obtained. Next, in the second invention, the amount of Fe group element added is 0.02
The reason why it is limited to ~0.5% by weight is that the solid solubility of Fe group elements in Ag decreases rapidly when it exceeds 0.5% by weight, so it is unevenly distributed and segregated in the Ag matrix and inhibits workability. This is because the addition of is less effective in adjusting the internal oxidation structure. In addition, in the second invention, the group elements Fe,
When one or more types of Ni and Co are added, Sb and Te and Cu and Zn are precipitated in the Ag matrix.
It has the effect of uniformly dispersing Mn and Sn oxides and making crystal grains finer. Here, specific examples include Sb, Te, Cu, Zn, Mn, Sn and Fe with a purity of 99.5% by weight or more,
An alloy with the composition shown in Attached Table 1 was manufactured using Ni and Co as raw materials in the following steps. The ingot is melted and cast in a high-frequency induction melting furnace, then hot forged, and the surface is cut. An Ag plate is then thermocompression bonded to one side of the ingot to form an Ag layer for brazing. Next, the material was cold-rolled into a plate with a thickness of 2 mm, punched into a disk shape with a diameter of 6 mm, and this material was rolled into a plate of Sb, Te, Cu, Zn, Mn, Sn and Fe, Ni in an oxidizing atmosphere at 720°C. , Co are internally oxidized to produce alloys of the present invention ((A), (B), (C), (D), (E), (F), (G), (H), (
I))
I got it. For comparison, Ag-10wt%Cd, Ag-3wt%
Sb - 1% by weight Sn - 1% by weight Cu, Ag - 2% by weight
A Te alloy was made and used for experiments. Contact tests were conducted using an ASTM contact tester (AC200V, 60A), an arc consumption tester (AC200V, 10A), and a commercially available switch (AC200V, 35A) to check contact resistance, arc consumption, and layered deposition trends. I evaluated it. 《Effect of the invention》 As shown in (Appended Table 1), the layered deposit of Ag-10Cdo is ^1.05mm3 , and the layered deposit of Ag-3Sd-1Cu-1Sn is 1.05mm3.
(A), ( ^B ), (C), (D), (E), (F) ^,
All of the (G), (H), and (I) alloys have extremely small particles of 0.1 mm ³ or less, indicating that the combined addition of Sb and Te is extremely effective. However, it should be noted that this requires the combined addition of Sb and Te to Ag, and that the addition of only Te oxide has a significantly low effect on preventing layered deposits. In addition, regarding the amount of arc consumption and the number of times of welding of contacts, the alloy of the present invention, which is a composite of Ag mentioned above and mainly oxides of Sb and Te (Japanese Patent Application No. 60-295676), was found to , (B), (C), (D), (E), (F), (G), (
Chile)
Although the test results were as follows, as is clear from comparing these with (A) to (I) of (Appended Table 1), a considerable improvement could be confirmed. This is also based on the applicant's aforementioned patent application No. 60-295677.
Contact materials made by adding a composite of Sb oxide, Te oxide, and Sn oxide to Ag are (A), (B) in (Appended Table 3),
In contrast to the test results (c), (d), (e), (f), (g), (ch), (li), and (nu), ) and (A) to (I) in (Appended Table 1), it is clear that a considerable improvement could be seen in terms of arc consumption and number of weldings. In addition, Ag
Contact materials in which oxides of Sb and Te and oxides of one or more of Cu, Zn, and Mn are added in combination (Table 4)
(a), (b), (c), (d), (e), (f), (g), (ch)
,(ri),
Although the test results were as shown in (N) and (R), by comparing (A) to (I) of (Appended Table 1) with (A) to (I) of (Appended Table 1), the amount of arc consumption and number of welding We were able to see a considerable improvement in this. In addition, the addition of one or more of the group elements Fe, Ni, and Co allows the oxides of Sb and Te, one or more of the oxides of Cu, Zn, and Mn, and the Sn oxide to be uniformly precipitated in the Ag matrix. It has the effect of dispersing the particles and making the crystal grains finer.

【表】【table】

【table】

Claims

[Scope of Claims] 1 Silver as the main component, with a metal component of 0.2 to 6.2
% by weight of Sb oxide, one or more oxides of Cu, Zn, Mn with a metal component of 0.05-5% by weight, an oxide of Sn with a metal component of 0.05-5% by weight, and a further metal component. A silver-oxide contact material characterized in that 0.01 to 2% by weight of Te oxide is dispersed therein. 2 The main component is silver, and the metal component is 0.2 to 6.2
% by weight of Sb oxide, one or more oxides of Cu, Zn, Mn with a metal component of 0.05-5% by weight, an oxide of Sn with a metal component of 0.05-5% by weight, and a metal component of 0.05-5% by weight. 0.01 to 2% by weight of Te oxide, and 0.02 to 0.5% by weight of Fe, Ni, and Co as metal components.
A silver-oxide contact material characterized in that one or more types of oxides are dispersed therein.