JPH0481321B2 - - Google Patents
Info
- Publication number
- JPH0481321B2 JPH0481321B2 JP58007812A JP781283A JPH0481321B2 JP H0481321 B2 JPH0481321 B2 JP H0481321B2 JP 58007812 A JP58007812 A JP 58007812A JP 781283 A JP781283 A JP 781283A JP H0481321 B2 JPH0481321 B2 JP H0481321B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- conductor
- magnetic material
- chip inductor
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
産業上の利用分野
本発明は、焼成により製造される閉磁路型チツ
プインダクタに関するものである。
従来例の構成とその問題点
近年、各種電子部品の小型化が要請されてお
り、電子部品の一つとしてのインダクタのチツプ
化も進んでいる。上記チツプ化の代表的な方法と
して、印刷法を利用する方法と巻線式とがある。
第一の方法は、印刷法を利用し磁性体シートの上
にコイル状の導電パターンを形成し、これを連続
的に積層することにより薄型の積層インダクタを
構成するものである。また、第二の方法として第
1図に示すものがある。これは、磁性体棒1に樹
脂などによつて被覆された巻線2を巻き、巻線2
の端子3を内部電極4に接続し、このコイル素体
を加圧成形によつて磁性体粉5で外装を施し、そ
の後、空気中で800〜1300℃の焼成温度で焼成し、
さらに内部電極4の上に外部電極6を施して閉磁
路型のチツプインダクタを構成するものである。
しかし、これらの方法には以下のような問題点
がある。まず、第一の方法では、インダクタンス
を高めるために多層化した場合積層数が非常に多
くなり、プロセスが煩雑になる上、仕上りの形状
が不均一なりやすい。次に第二の方法では、従来
インダクタの線材として使用してきたCu線が焼
成時に酸化して導電性が悪くなり、あるいは焼成
時の熱により断線する。
発明の目的
本発明は、このような従来の問題点を除去し、
製造が容易で安定した性能を有するチツプインダ
クタを提供することを目的とする。
発明の構成
本発明のチツプインダクタは、基本的には前記
第二の方法の改良に関わるものであつて、導体の
周囲に耐熱絶縁体と樹脂から成る被覆を施した導
線を磁性体に巻き付け、導線の両端に内部端子を
設けたコイル素体を形成し、このコイル素体は磁
性体粉を加圧成型したのち焼成した焼結磁性体で
外装され、かつ焼成磁性体の相対する両端面に前
記内部端子を露出させて外部端子を付設したチツ
プインダクタであつて、前記導体がAlを3〜8
重量%含み、残部がCuの合金からなる線材を用
いたものである。これにより線材に、耐酸化性を
もたせ、磁性体に巻きつける際の引張応力に耐え
うる機械的強度をもたせることができる。なお、
本発明において、Alの含有量を3〜8重量%と
したのは、インダクタの有する抵抗値を小さくし
所望のQ値を得、Alの添加によつて、上記機械
的強度をもたせ、表面に形成されるAl2O3を保護
皮膜として耐酸化性をもたせるためである。Al
の含有量が3重量%未満では、Alの添加によつ
て表面にAl2O3の形成が少なく、その結果、酸化
しやすくなつて断線や導線率が悪くなり、所望の
Q値が得られない。Alの含有量が8重量%を超
えると合金の硬度が高くなり線材に加工すること
自体が困難となる。
実施例の説明
以下、本発明の構成と作用を実施例にもとづい
て具体的に説明する。
第2図は本発明の一実施例におけるチツプイン
ダクタに用いた導線の断面図を示すものである。
第2図に示すように、導線10は導体7の周囲に
耐熱性絶縁体8を被覆し、さらに樹脂9で被覆し
てある。本実施例では導体として70μφの8重量
%Al−92重量%Cu合金線を、耐熱性絶縁体とし
てFe2O3、NiO、ZnOを主成分とする磁性体を、
樹脂としてポリエステル樹脂をそれぞれ用いた。
ここで、AlCu合金線は線引加工法により得た。
また、耐熱性絶縁体である磁性体は、6.7%ブチ
ラール樹脂粉末+3.3%フタル酸ジnブチル+90
%テルピノールのビイクルに60%の磁性粉末を加
えて混練したペーストに、ポリイソシアネートの
45%酢酸エチル溶液20%を添加して良く混合した
ものを塗布、乾燥したものである。
またポリエステル樹脂は、これを溶かした溶液
にポリイソシアネートの45%酢酸エチル溶液20%
を添加し良く混合した溶液を塗布した。ポリエス
テル樹脂で被覆する目的は、耐熱性絶縁体である
磁性体のみでは皮膜強度が弱く、巻線時などに剥
離が生じるので、これを防止するためである。
以上のような線材を用いたチツプインダクタの
製造方法として、次のような方法を取つた。第3
図に示すように幅3mm、長さ5mm、厚さ2mmの
Fe2O3、NiO、ZnOを主成分とするフエライト焼
成体11に本発明に係る線材を用いた導線12を
密着して40ターン巻き、導線の両端13をAg−
Pdペーストで接続して内部端子14を形成した。
さらに、このコイル素体15を加圧形成によつて
第4図のようにFe2O3、NiO、ZnOを主成分とす
る磁性体粉16で外装を施し、これを空気中で
850℃で焼成し、さらにその両端面を研磨してコ
イル素体の端子部分の内部端子14を露出させ、
この両端面にAg−Pdペーストをデイツプして外
部端子17を形成した。このようにして第5図に
示すようなチツプインダクタを得た。同様な製造
方法で導体として70μφの1重量%Al−99重量%
Cu合金線、3重量Al−97重量Cu合金線、6重量
%Al−94重量%Cu合金線を使つてチツプインダ
クタを得た。70μφの15重量%Al−85重量%Cu合
金線を線引加工法で作ろうとしたが合金の硬度が
高くできなかつた。かかるインダクタの断面を観
察したところ、線材間に焼成磁性体が連続して形
成されており、線材の表面にAl2O3の皮膜層が形
成されていることがわかつた。得れられた各々の
チツプインダクタのインダクタンス値は第1表の
通りになつた。
INDUSTRIAL APPLICATION FIELD The present invention relates to a closed magnetic circuit type chip inductor manufactured by firing. Conventional Structures and Their Problems In recent years, there has been a demand for miniaturization of various electronic components, and inductors as one of the electronic components have also been made into chips. Typical methods for making chips include a printing method and a wire winding method.
The first method is to form a coil-shaped conductive pattern on a magnetic sheet using a printing method, and to construct a thin laminated inductor by continuously laminating the coil-shaped conductive pattern. Further, as a second method, there is a method shown in FIG. This involves winding a winding 2 coated with resin or the like around a magnetic bar 1.
The terminal 3 of the coil body is connected to the internal electrode 4, and the coil body is coated with magnetic powder 5 by pressure molding, and then fired in air at a firing temperature of 800 to 1300°C.
Further, an external electrode 6 is provided on the internal electrode 4 to constitute a closed magnetic circuit type chip inductor. However, these methods have the following problems. First, in the first method, when multi-layering is used to increase inductance, the number of layers becomes extremely large, the process becomes complicated, and the finished shape tends to be uneven. In the second method, the Cu wire conventionally used as the wire for inductors oxidizes during firing, resulting in poor conductivity, or breaks due to the heat during firing. Purpose of the invention The present invention eliminates such conventional problems,
An object of the present invention is to provide a chip inductor that is easy to manufacture and has stable performance. Structure of the Invention The chip inductor of the present invention basically relates to an improvement of the second method, and involves winding a conductor around a magnetic material with a conductor coated with a heat-resistant insulator and a resin. A coil body is formed with internal terminals provided at both ends of the conductor, and this coil body is sheathed with a sintered magnetic material made by pressure-molding magnetic powder and then fired. A chip inductor in which the internal terminal is exposed and an external terminal is attached, the conductor having an Al content of 3 to 8
% by weight, and the balance is Cu. This allows the wire to have oxidation resistance and mechanical strength that can withstand tensile stress when it is wound around a magnetic material. In addition,
In the present invention, the reason why the Al content is set to 3 to 8% by weight is to reduce the resistance value of the inductor to obtain the desired Q value, and by adding Al, to provide the above mechanical strength and to improve the surface of the inductor. This is to provide oxidation resistance by using the formed Al 2 O 3 as a protective film. Al
If the content is less than 3% by weight, the addition of Al will result in less Al 2 O 3 being formed on the surface, resulting in easy oxidation, resulting in wire breakage and poor conductivity, making it difficult to obtain the desired Q value. do not have. If the Al content exceeds 8% by weight, the hardness of the alloy increases and it becomes difficult to process it into a wire rod. Description of Examples Hereinafter, the structure and operation of the present invention will be specifically explained based on Examples. FIG. 2 shows a cross-sectional view of a conductive wire used in a chip inductor in an embodiment of the present invention.
As shown in FIG. 2, the conducting wire 10 has a conductor 7 covered with a heat-resistant insulator 8, and further covered with a resin 9. In this example, a 70 μφ 8 wt% Al-92 wt% Cu alloy wire was used as the conductor, and a magnetic material mainly composed of Fe 2 O 3 , NiO, and ZnO was used as the heat-resistant insulator.
Polyester resin was used as the resin.
Here, the AlCu alloy wire was obtained by a wire drawing method.
In addition, the magnetic material, which is a heat-resistant insulator, is 6.7% butyral resin powder + 3.3% di-n-butyl phthalate + 90%
% terpinol vehicle and 60% magnetic powder and knead it, then add polyisocyanate to the paste.
A 20% 45% ethyl acetate solution was added and mixed well, then applied and dried. For polyester resin, add a 45% solution of polyisocyanate to a 20% solution of ethyl acetate.
A well-mixed solution was applied. The purpose of coating with polyester resin is to prevent the strength of the coating from being weak when using only a magnetic material, which is a heat-resistant insulator, and peeling occurs during winding. The following method was used to manufacture a chip inductor using the wire rod as described above. Third
As shown in the figure, the width is 3mm, length is 5mm, and thickness is 2mm.
A conductive wire 12 made of the wire according to the present invention is tightly wound around a ferrite fired body 11 mainly composed of Fe 2 O 3 , NiO, and ZnO, and wound with 40 turns, and both ends 13 of the conductive wire are wrapped with Ag-
Internal terminals 14 were formed by connecting with Pd paste.
Furthermore, this coil body 15 is coated with magnetic powder 16 mainly composed of Fe 2 O 3 , NiO, and ZnO as shown in FIG.
It is fired at 850°C, and both end faces are polished to expose the internal terminal 14 of the terminal part of the coil body.
External terminals 17 were formed by dipping Ag--Pd paste on both end faces. In this way, a chip inductor as shown in FIG. 5 was obtained. 1% Al-99% by weight of 70μφ as a conductor using the same manufacturing method
A chip inductor was obtained using a Cu alloy wire, a 3 weight Al-97 weight Cu alloy wire, and a 6 weight% Al-94 weight% Cu alloy wire. An attempt was made to make a 70μφ 15wt% Al-85wt%Cu alloy wire by wire drawing, but the hardness of the alloy could not be increased. When the cross section of such an inductor was observed, it was found that the fired magnetic material was continuously formed between the wire rods, and that a film layer of Al 2 O 3 was formed on the surface of the wire rod. The obtained inductance values of each chip inductor were as shown in Table 1.
【表】
また、Qの周波数特性は第6図に示すものとな
つた。第6図からわかるように、本発明のよう
に、Alの含有量を3〜8重量%にした場合、所
望のQの周波数特性が得られるがそれを超えると
所望のQの周波数特性が得られない。
なお、実施例では、フエライト焼成体の形状を
角型としたが、本発明における上記焼成体の形状
はなんら限定されるものではなく、例えば丸型で
あつても上記と同様な効果が得られる。
発明の効果
以上の説明から明らかなように、本発明によれ
ばAlを3〜8重量%含み、残部がCuからなる合
金線をチツプインダクタの線材として用いれば、
空気中でも焼成が可能となり、磁性体に巻きつけ
るのに耐えうる機械的強度を有することができる
など従来の問題点を除去し、さらに巻線方式でチ
ツプインダクタが製造できるため、従来の印刷法
を利用したチツプインダクタの製造方法に比べて
プロセスが非常に簡単ななるなどの利点がある。[Table] Also, the frequency characteristics of Q were as shown in Figure 6. As can be seen from FIG. 6, when the Al content is set to 3 to 8% by weight as in the present invention, the desired Q frequency characteristics can be obtained, but beyond that, the desired Q frequency characteristics cannot be obtained. I can't. In the examples, the shape of the ferrite fired body was square, but the shape of the fired body in the present invention is not limited in any way, and even if it is round, for example, the same effect as above can be obtained. . Effects of the Invention As is clear from the above description, according to the present invention, if an alloy wire containing 3 to 8% by weight of Al and the remainder being Cu is used as a wire rod for a chip inductor,
It eliminates the problems of conventional methods, such as being able to be fired in air and having the mechanical strength to withstand winding around a magnetic material.Furthermore, chip inductors can be manufactured using a wire-wound method, which eliminates the need for conventional printing methods. This method has the advantage that the process is much simpler than the previously used manufacturing method for chip inductors.
第1図は従来のチツプインダクタの断面図、第
2図は本発明の一実施例に用いた導線の断面図、
第3図は本発明の一実施例におけるコイル素体の
斜視図、第4図はその加圧成形体の斜視図、第5
図は本発明にかかる線材を用いて製造されたチツ
プインダクタの一実施例の斜視図、第6図はその
Qの周波数特性図である。
1……磁性体棒、2……巻線、3……巻線の端
子、4……内部電極、5……磁性体粉、6……外
部電極、7……導体、8……耐熱性絶縁体、9…
…樹脂、10……導線、11……焼成磁性体、1
2……導線、13……導線の端子、14……内部
端子、15……コイル素体、16……磁性体粉、
17……外部端子。
FIG. 1 is a sectional view of a conventional chip inductor, FIG. 2 is a sectional view of a conducting wire used in an embodiment of the present invention,
FIG. 3 is a perspective view of a coil element according to an embodiment of the present invention, FIG. 4 is a perspective view of a press-molded body thereof, and FIG.
The figure is a perspective view of an embodiment of a chip inductor manufactured using the wire according to the present invention, and FIG. 6 is a frequency characteristic diagram of the Q. 1... Magnetic rod, 2... Winding wire, 3... Winding terminal, 4... Internal electrode, 5... Magnetic powder, 6... External electrode, 7... Conductor, 8... Heat resistance Insulator, 9...
...Resin, 10...Conducting wire, 11...Sintered magnetic material, 1
2... Conductor wire, 13... Conductor wire terminal, 14... Internal terminal, 15... Coil element, 16... Magnetic powder,
17...External terminal.
Claims (1)
を施した導線を磁性体に巻き付け、前記導線の両
端に内部端子を設けたコイル素体を形成し、この
コイル素体は磁性体粉を加圧成型したのち焼成し
た焼結磁性体で体装され、かつこの焼結磁性体の
相対する両端面に前記内部端子を露出させて外部
端子を付設したチツプインダクタであつて、前記
導体がAlを3〜8重量%含み、残部Cuの合金で
あることを特徴とするチツプインダクタ。1. A conductor wire coated with a heat-resistant insulator and resin is wound around a magnetic material to form a coil element with internal terminals provided at both ends of the conductor, and this coil element is coated with magnetic powder. A chip inductor that is packaged with a sintered magnetic material that is pressure-molded and then fired, and has external terminals attached with the internal terminals exposed on both opposing end surfaces of the sintered magnetic material, the conductor being made of Al. A chip inductor characterized by being an alloy containing 3 to 8% by weight of Cu with the remainder being Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58007812A JPS59132605A (en) | 1983-01-19 | 1983-01-19 | Chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58007812A JPS59132605A (en) | 1983-01-19 | 1983-01-19 | Chip inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59132605A JPS59132605A (en) | 1984-07-30 |
| JPH0481321B2 true JPH0481321B2 (en) | 1992-12-22 |
Family
ID=11676009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58007812A Granted JPS59132605A (en) | 1983-01-19 | 1983-01-19 | Chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132605A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011003733A (en) * | 2009-06-18 | 2011-01-06 | Tdk Corp | Inductor component |
-
1983
- 1983-01-19 JP JP58007812A patent/JPS59132605A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59132605A (en) | 1984-07-30 |
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