JPH0481359B2 - - Google Patents

Description

[Detailed description of the invention]

[Technical Field] The present invention relates to a silicon steel plate-based copper-clad laminate based on a silicon steel plate. [Background Art] When manufacturing a copper-clad laminate using a silicon steel plate as a base, as shown in FIG. The copper clad laminate 5 is manufactured by pasting the foil 4, but in the conventional example, the silicon steel plate 1 has a thickness of 0.65 mm.
copper clad laminates 5 are manufactured using thick silicon steel plates 1.
However, when a copper clad laminate 5 is manufactured, it has the disadvantage that when a current is passed through the copper clad laminate 5, iron loss is large. Therefore, in order to reduce iron loss, it is better to reduce the thickness of the silicon steel plate 1, but when a thin silicon steel plate is used for a printed circuit board, the mechanical strength is weak. There was a problem in that the plate was prone to bending, warping, etc. 6 in the figure is an inorganic layer coated on the front and back surfaces of the silicon steel plate 1. [Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to provide a silicon steel sheet-paced copper-clad laminate that can increase mechanical strength without increasing iron loss. That is. [Disclosure of the Invention] That is, the present invention is constructed by laminating a plurality of silicon steel plates 1 via an adhesive layer 2, and pasting a copper foil 4 on the surface of the laminated silicon steel plates 1, 1 via an electrical insulating layer 3. The above object has been achieved by a silicon-copper plate spaced copper-clad laminate having the following characteristics. The present invention will be explained in detail below with reference to Examples. The silicon steel plate 1 is formed to have a thickness of 0.65 mm or less, preferably about 0.5 mm, and by reducing the thickness, iron loss is reduced. In other words, when a current is passed through the silicon steel plate 1
A magnetic field is generated, but when the plate thickness is thick, the magnetic field becomes stronger and the electric energy that jumps out from the magnetic field becomes large. Furthermore, galvanized inorganic layers 6 are formed on the front and back surfaces of the silicon steel plate 1 in order to improve corrosion resistance and the like. In manufacturing a copper-clad laminate 6 based on this silicon steel plate 1, as shown in FIG. Then, a copper foil 4 is attached to one or both sides of the laminated silicon steel plates 1 via an electrically insulating layer 3. Here, the adhesive layer 2 may be formed by applying and curing a synthetic resin liquid such as epoxy resin, phenolic resin, or unsaturated polyester resin, or by applying such synthetic resin liquid to glass, Tetron, paper, etc. It may also be formed by placing and curing a prepreg formed by impregnating a fiber base material. These adhesive layers 2 are used to bond and integrate the upper and lower silicon steel plates 1, 1. At this time, in order to increase the adhesive force between the silicon steel plates 1, 1, the inorganic layer 6 on the surface of the silicon steel plates 1 may be mechanically removed to expose the base of the silicon steel plates 1. In addition, as the electrical insulating layer 3, the synthetic resin liquid or prepreg used for the adhesive layer 2 can be used, and in this case, a silicon steel plate can be used to improve the adhesiveness between the copper foil 4 and the silicon copper plate 1. It is preferable to mechanically polish and remove the inorganic layer 6 on one surface. In this way, a silicon steel plate base in which a plurality of silicon steel plates 1, 1, 1 are laminated with adhesive layers 2, 2 interposed therebetween, and a copper foil 4 is bonded and integrated on the surface of this via an electrical insulating layer 3. A copper-clad laminate can be obtained. Since the thickness of each of the stacked silicon steel plates 1 is as thin as 0.65 mm or less, the iron loss caused by the silicon steel plates 1 is small. In addition, the copper-clad laminate 5 manufactured based on a single thin silicon steel plate has insufficient mechanical strength to be used in a printed circuit board, and is prone to bending or warping. By laminating 1, 1, 1 with the adhesive layer 3 having good insulating property interposed therebetween, the mechanical strength can be improved without increasing iron loss. The present invention will be explained in detail below with reference to Examples. <Example> Three silicon steel plates (RM-18) with a thickness of 0.5 mm were laminated with epoxy resin interposed therebetween, and a copper foil was layered on the surface of the laminated silicon steel plates with epoxy resin interposed therebetween, and a weight of 30 kg/
A silicon steel plate-based single-sided copper-clad laminate with a copper foil integrally bonded to one side was obtained by heating and pressure forming under the conditions of cm ² ·160°C for 120 minutes. Conventional Example 1 A single-sided copper-clad laminate based on a silicon steel plate was obtained in the same manner as in Example 1, except that only one silicon steel plate was used and copper foil was attached to the surface of the silicon steel plate. Conventional Example 2 A single-sided copper-clad laminate based on a silicon steel plate was prepared in the same manner as in Example 1, except that only one silicon steel plate (RM-18) with a thickness of 0.65 mm was used and copper foil was attached to the surface of the silicon steel plate. Obtained. Next, the results of the iron loss and plate bending resistance of the copper-clad laminates obtained in Examples and Conventional Examples 1 and 2 are shown in the following table.

〔Effect of the invention〕

As described above, in the present invention, a plurality of silicon steel plates are laminated with an adhesive layer interposed therebetween, and a copper foil is attached to the surface of the laminated silicon plate via an electrical insulating layer. By using it, not only can core loss be reduced, but also the mechanical strength can be increased to prevent plate bending, warping, etc.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway sectional view of a conventional example, and FIG. 2 is a partially cutaway sectional view of an embodiment of the present invention. 1 is a silicon steel plate, 2 is an adhesive layer, 3 is an electrical insulation layer,
4 is copper foil.

Claims (1)

[Scope of Claims] 1. A silicon steel plate base copper clad, characterized in that a plurality of silicon steel plates are laminated via an adhesive layer, and copper foil is adhered to the surface of the laminated silicon steel plate via an electrical insulating layer. Laminated board. 2. The silicon steel plate-based copper-clad laminate according to claim 1, wherein the adhesive layer is formed of a coated and cured layer of a synthetic resin liquid. 3. The silicon steel plate-based copper-clad laminate according to claim 1, wherein the adhesive layer is formed of a base material layer impregnated with synthetic resin.