JPH0481849B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic mechanical component in which a case housing a rotating mechanism including a rotor is provided with an opening through which a tool for rotating the rotor can be inserted. The present invention relates to a device for forming a cover sheet so as to close an opening to form a closed electronic mechanism component. There are various types of electronic mechanical components of this type, such as trimmer capacitors, variable resistors, variable coils, and rotary switches, and the present invention can be applied to all of these electronic mechanical components.

BACKGROUND TECHNOLOGY In electronic mechanical parts, a rotating mechanism including a rotor is
It is built into a case. In such electronic mechanical parts, by rotating the rotor,
For example, in a trimmer capacitor, the capacitance is changed,
For example, it is possible to change the resistance value of a variable resistor. Therefore, in order to make desired adjustments by changing the characteristics of each of the electronic mechanical components by external operation, the case is provided with an opening through which the rotor can be rotated. ing.

By the way, when electronic mechanical components are mounted on a printed circuit board, flux during soldering generally enters through the opening provided in the case.
This had an adverse effect on the characteristics of electronic mechanical parts. Furthermore, in order to improve workability and reduce mass production costs, it is desired that a plurality of electronic components can be soldered at once by passing the entire electronic component into a molten solder bath. however,
In the case of electronic mechanical components, since solder enters through the opening provided in the case, it has an adverse effect on the rotor, etc., and as a result, for example, the rotor may become unable to rotate. For this reason, it was necessary to separately solder only the electronic mechanical components, such as the trimmer capacitor, at a later stage.

Therefore, a cover sheet is pasted to close the opening of the case to prevent flux during soldering.
A so-called sealed electronic mechanism component has been proposed that prevents solder from entering when using a molten solder bath. Such sealed electronic mechanical parts are
For example, it is disclosed in Japanese Patent Application Laid-Open No. 58-72353. In this conventional example, the heat-resistant cover sheet is
It is also attached to the outside of the case using heat-resistant adhesive to close the opening of the case. Therefore, in such sealed electronic mechanical parts, flux is prevented from entering during soldering, and even when immersed in a molten solder bath, solder is prevented from entering the case, and other It becomes possible to carry out soldering in a simultaneous process with electronic components.

Note that the cover sheet is made of a material that is thick and strong enough to be easily torn with a screwdriver, etc., so if it becomes necessary to rotate the rotor of an electronic mechanical component, use a screwdriver etc. to tear the cover sheet. While tearing, the rotor can be rotated using the screwdriver.

Problems to be Solved by the Invention However, in the case of the above-mentioned prior art, there was a problem in that the process of attaching the cover sheet was troublesome. In other words, if a cover sheet is attached one by one to parts that are several mm square, both the parts and the cover sheet will be so small that it will be extremely difficult to handle them, and it is difficult to attach such cover sheets to small parts. , becomes extremely difficult.
It is also possible to prepare a large cover sheet and attach it to many parts, but in this case, it would be necessary to switch the cover sheet after attaching it, and the cover sheet would need to be attached along the outer periphery of the case. Cutting is also cumbersome. Further, the thickness or height of the electronic mechanical component increases by the amount of the cover sheet attached thereto, and such an increase in size is not desirable, especially for small components.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an apparatus for efficiently forming a cover sheet in an opening of an electronic mechanical component while solving the problems of the prior art as described above.

Means for Solving the Problems In order to solve the above-mentioned problems of the prior art, the applicant of this patent has already proposed an electronic mechanism component that includes a cover sheet formed in a special manner. Although this electronic mechanism component has not yet been published, a patent application filed on December 12, 1988
Described in issue 234685. In this future application,
An electronic mechanism component is disclosed in which a cover sheet is formed so as to close an opening by utilizing the state change of a resin to be a cover sheet from an uncured state to a hardened state. The present application is directed to an apparatus for efficiently manufacturing the "electronic mechanical component provided with a cover sheet" disclosed in the previous application. That is, the present invention includes the following configuration.

First, there is provided a base plate supply section that supplies a long and flexible base plate that is wound into a roll shape, and a base plate winding section that winds up the base plate into a roll shape. The bedplate is extended horizontally between the bedplate supply section and the bedplate winding section, and the following steps are applied to the horizontally extending portion of the bedplate in order from the bedplate supply section side. The device is placed.

(a) A resin material supply device that supplies a heat-curable resin material to become a cover sheet onto a base plate in an uncured state.

(b) A film forming device that stretches uncured resin material into a film on a base plate.

(c) An electronic mechanical component supply device that feeds the electronic mechanical component onto a film-like resin material with the opening of the electronic mechanical component facing downward.

(d) A hot plate placed on the underside of the base plate and a presser plate provided so as to move toward and away from the hot plate while sandwiching the base plate and facing the hot plate. In response to the approach movement of the plate, the electronic mechanical components are pushed toward the base plate, the edge of the opening is bitten into the film-like resin material, the resin material that will become the cover sheet is taken into the opening, and the heat from the hot plate is removed. A pressurizing/heating device for curing the resin material.

Further, the device of the present invention is equipped with an intermittent feeding mechanism that feeds the bedplate intermittently, and this mechanism allows the bedplate to be moved intermittently while the resin material is being hardened by the pressure/heating device. It is something to send.

Effects of the Invention In the present invention, the series of steps from supplying a resin material to be a cover sheet, introducing it into an opening of an electronic mechanical component, and curing the resin material in that state to form a desired cover sheet is provided. This process is efficiently carried out in the feeding motion of a long and flexible base plate. Therefore, it is possible to save labor and form cover sheets on large quantities of electronic mechanical components with stable quality.

Embodiment FIG. 1 is a schematic diagram of an apparatus according to an embodiment of the present invention. Using the apparatus shown in FIG. 1, a cover sheet is formed over the opening of the electronic mechanical component. Therefore, before describing the apparatus shown in FIG. 1, an example of an electronic mechanical component to which the present invention is applied will be described with reference to FIGS. 8 and 9.

8 and 9 show a trimmer capacitor as an example of an electronic mechanical component. Case 1
is molded with two terminals 2 and 3 embedded therein. The case 1 is made of, for example, a material that can withstand the melting temperature of solder, for example, a heat-resistant thermosetting resin that can withstand a temperature of about 300°C. The end of the terminal 3 inside the case 1 is fixed in a state where the central axis 4 inside the case 1 is received, and constitutes a cylindrical part 5 that forms a cylindrical outer peripheral surface around the central axis 4. . The central axis 4 has a cylindrical portion 5
When integrally molding the terminal 3 including the case 1 into the case 1,
The cylindrical portion 5 is filled with resin. An end portion 6 of the terminal 2 inside the case 1 is provided so that a portion thereof is exposed from the bottom surface of the case 1. Each of the terminals 2 and 3 is led out to the outside of the case 1.

An opening 7 is formed in the case 1.
A rotation mechanism section is housed below the case 1 and inside the case 1 . Since the illustrated electronic mechanism component is a trimmer capacitor, this rotating mechanism part is
In FIG. 9, from the bottom, it is comprised of a dielectric plate 8, which becomes a stator, a metal rotor 9, which becomes a part of a rotor, a spring 10, and a driver plate 11, respectively. A substantially semicircular electrode conductor 12 that contacts the terminal 2 is formed on the lower surface of the dielectric plate 8 . The metal rotor 9 includes a rotor electrode 13 facing the electrode conductor 12 with a dielectric plate 8 in between, and the area facing the electrode conductor 12 can be changed by rotation of the metal rotor 9. The upper surface of the metal rotor 9 has grooves 1
4 is provided, where the aforementioned spring 10
is inserted between the metal rotor 9 and the metal rotor 9 so as not to rotate with each other. The driver plate 11 is
By caulking its lower end, it is mechanically fixed to the spring 10. As clearly shown in FIG. 8, the driver plate 11 is formed with a generally cross-shaped adjustment groove 15.

With the configuration described so far, for example, when the tip of the driver is fitted into the adjusting groove 15 of the driver plate 11 and a rotational force is applied thereto, the spring 1
0, the metal rotor 9 is rotated. Therefore, the opposing area between the electrode conductor 12 and the rotor electrode 13 is changed, and the volume can be adjusted. This capacitance is taken out by a terminal 2 in contact with an electrode conductor 12 and another terminal 3 connected via a driver plate 11 via a spring 10 in contact with a metal rotor 9.

In such a trimmer capacitor, as shown in FIG.
It is formed in a state where it is adhered to the inner circumferential surface of the edge part of. This cover sheet 16 is shown as transparent in FIG. 8 so that the inside of the case 1 can be seen through. Note that the cover sheet 16 is
In fact, it may be transparent, and in that case, the rotational positions of the driver plate 11, metal rotor 9, etc. can be easily seen from the outside of the case 1.

The cover sheet 16 is made of a heat-curing material such as silicone, which has heat resistance that can withstand the melting temperature of solder (e.g., heat resistance that can withstand immersion in a molten solder bath at 270° C. for 20 seconds) and excellent adhesive strength. Composed of adhesives.

Returning to FIG. 1, such a cover sheet 16
The apparatus for forming the . The device comprises various work stations arranged along the direction of flow of the bed plate 18, indicated by arrow 17. That is, a long and flexible base plate 1
8 is wound into a roll, is supplied from the base plate supply section 19, and finally sent to the base plate winding section 20.
At this point, it is wound up again into a roll. Base plate 18
extend horizontally between the base plate supply section 19 and the base plate winding section 20, and along the horizontally extending path of the base plate 18, the main ones are A resin material supply device 21, a film forming device 22, an electronic mechanical component supply device 23, and a pressure/heating station 24 are arranged. Each part of this device will be described below in accordance with the flow direction of the base plate 18.

In the base plate supply section 19, the rolled base plate 18 is pulled out in the direction of arrow 25. The base plate 18 has enough heat resistance to withstand the temperature at which a thermosetting resin described later is cured, and can be made of, for example, a polyethylene terephthalate film.

The base plate 18 pulled out from the base plate supply unit 19 is guided by guide rollers 26 and led to a horizontal path. The guide roller 26 may also serve as a roller for applying a mold release agent to the upper surface of the base plate 18. That is, the surface of the guide roller 26 is made of a sponge, for example, and by dropping a mold release agent thereon and allowing it to soak in, the surface of the base plate 18 that is in contact with the guide roller 26 is released. A molding agent will be applied.

Next, the resin material supply device 21 is arranged. This resin material supply device 21 is for supplying a thermosetting resin material, which is to become the cover sheet 16 described above, onto the base plate 18 in an uncured state.
The resin material supply device 21 includes a tank having a nozzle facing downward, and uncured resin stored in the tank is supplied onto the base plate 18 through the nozzle.

As described above, the resin supplied onto the base plate 18 is transferred to the base plate 1 by the next film forming device 22.
It is spread on the film in an 8-shape. Details of this process are shown in FIGS. 2 and 3. As the resin 27 made up of the resin material supply device 21 described above, the silicone adhesive as exemplified above is used, but it is desirable that this has appropriate shape retention before curing. Therefore, a material with a relatively high viscosity, for example, about 10,000 to 400,000 cps is used. The base plate 18 is sent in the direction of arrow 28 by a feeding mechanism that will be described later.
On the base plate 18, a roller 29 is arranged on the upstream side, and a blade 30 is arranged on the downstream side. The roller 29 is rotationally driven in the direction of an arrow 31. The outer peripheral surface of the roller 29 forms a predetermined gap with respect to the base plate 18. End guides 32 are provided on both sides of the roller 29. The end guide 32 rotates independently of the rollers 29, contacts the base plate 18, and rotates in accordance with the movement of the base plate 18. This end guide 34 may be square-shaped, and in this case, it is used as one that elastically presses onto the base plate 18 and does not rotate. The blade 30 contacts the base plate 18 at both ends thereof, but forms a predetermined gap with the base plate 18 at its intermediate portion.

The uncured resin 27 is pressed against the base plate 18 by the action of the rollers 29, and thus the base plate 1
8. The resin 27 is
When passing under the roller 29, the resin 27 is regulated by the end guide 32, so when passing under the roller 29, the width of the resin 27 is kept approximately constant. As an example,
The resin 27 after passing through the roller 29 is, for example,
It is in the form of a film with an almost uniform thickness of 0.35 mm, but its thickness is slightly thicker than the thickness of the resin film to be obtained. Next, when passing through the blade 30, a resin film 33 having a uniform thickness of, for example, 0.3 mm is obtained. The thickness of this resin film 33 correlates with the thickness of the cover sheet 16 formed on the electronic mechanical component, and is actually selected to be about 0.05 to 0.5 mm. The gap between the blade 30 and the base plate 18 is set to the required thickness of the resin film 33.

A first intermittent feed mechanism 34 is arranged downstream of the film forming device 22. The intermittent feed mechanism 34 includes, for example, a pair of chuck mechanisms 35, as shown in a plan view in FIG. This chuck mechanism 35 reciprocates in the direction of arrow 36. In the forward movement, it grips both sides of the base plate 18 and sends the base plate 18 in the directions of arrows 17 and 28. In the backward movement, it moves the base plate 18 in the directions of arrows 17 and 28. The plate 18 is released and only the user returns to the original position.

Next, the base plate 18 is guided by a guide roller 37, a dancing roller 38, and a guide roller 39. The guide rollers 37 and 39 have their axes fixed in position, and the dancing roller 38 has
It is provided so as to be movable up and down as shown by arrow 40. By moving in the direction of arrow 40, the dancing roller 38 absorbs the slack in the base plate 18 due to the difference in time spent in each process included in this apparatus.

Next, the electronic mechanical component supply device 23 is arranged. As shown in FIG. 5, the electronic mechanical component supply device 23 includes a suction head 42 that holds the electronic mechanical component 41 by, for example, vacuum suction. In practice, a large number of suction heads 42 are provided so that a large number of electronic mechanical components 41 are arranged in rows and columns on the base plate 18. As an example, lined up in a row
An electronic mechanism component feeding device 23 having 15 suction heads 42 is used, which simultaneously feed the parts in the width direction of the base plate 18.
Fifteen electronic mechanical components 41 are supplied. and,
Since the base plate 18 is stopped during the processing period by the pressurizing/heating device 24, which will be described later, the electronic mechanical component supplying device 23 uses this stopping period to feed, for example, 15×32=480 pieces. Electronic mechanical components 41 are arranged on the base plate 18.

It should be understood that the electronic mechanical component 41 shown in FIG. 5 is shown as the trimmer capacitor shown in FIGS. 8 and 9 described above. Therefore,
What is shown above the case 1 are the terminals 2 and 3, which are bent downward from the state shown in FIG.
That is, it is shown as a result of making the trimmer capacitor into a chip shape. As is clear from the attitude of the electronic mechanism component 41 shown in FIG.
It is placed on the resin film 33 with the side (FIG. 9) facing downward.

Referring again to FIG. 1, a pressurizing/heating station 24 is disposed downstream of the electronic mechanical component supply device 23. In this embodiment, in this pressurizing/heating station 24, two pressurizing/heating devices 24a and 24b having the same configuration are arranged side by side. The pressurizing/heating devices 24a and 24b each operate a hot plate 43 disposed on the lower surface side of the base plate 18, and an arrow 44 with respect to the hot plate 43 while facing the base plate 18 between the hot plate 43 and the hot plate 43. A presser plate 45 is provided so as to move toward and away from each other in the direction. The hot plate 43 is heated to a temperature of, for example, 100 to 150°C. The presser plate 45 is moved in the direction of arrow 4 by the cylinder 46.
Driven in 4 directions. Preferably, an elastic body, such as rubber 47, is attached to the lower surface of the holding plate 45 so that a load is evenly applied to each of the plurality of electronic mechanical components 41.

The hot plate 43 and presser plate 45 of the pressurizing/heating device 24a or 24b are connected to the electronic mechanism component 41.
And the state acting on the resin film 33 is
It is shown in FIG. In FIG. 6, the case 1 of the electronic mechanical component 41 is shown partially broken, but what is visible inside the case 1 is a part of the driver plate 11 shown in FIG. However, the dimensions are somewhat exaggerated.

In particular, the pressurizing/heating device 24a located on the upstream side
When paying attention to this, the resin film 33 is heated by the hot plate 43 and directed in the direction of hardening, but in the initial stage, the resin film 33 remains in an unhardened state. Therefore, the presser plate 45
When the electronic mechanism component 41 is pushed downward through the rubber 47, the opening 7 is inserted into the resin film 33 formed on the base plate 18 held on the fixedly provided hot plate 43. The edges will dig in. As a result, a portion of the resin film 33 comes into contact with the inner peripheral surface of the edge of the opening 7. As a result, the resin material that is to become the cover sheet 16 that closes the opening 7 is introduced into the opening 7. In this example, pressure is applied from the presser plate 45 to such an extent that the edge of the opening 7 comes into contact with the base plate 18 and cuts the resin film 33. Further, inside the case 1, a part of the driver plate 11 is in contact with or buried in the resin film 33. In order to realize this state, the upper surface of the driver plate 11 is preferably positioned lower than the upper surface of the case 1 by, for example, about 0.05 to 0.1 mm.

If the state shown in Fig. 6 is maintained, the base plate 1
8 is given heat from the hot plate 43. As a result, the resin material constituting the resin film 33 begins to harden. On the other hand, in the case of the pressurizing/heating device 24b disposed on the downstream side, the resin film 33 and the electronic mechanical component 41 are processed by the pressurizing/heating device 24a on the upstream side.
exposed to a second treatment. Therefore, the pressure/heating device 24b on the downstream side is used to completely cure the resin film 33, which was insufficiently heated by the pressure/heating device 24a on the upstream side. In this way, the two pressurizing/heating devices 24a,
24b, the resin film 33 can be heated by selecting to use both pressure/heating devices 24a, 24b or using either pressure/heating device 24a or 24b.
It is possible to provide a heating time suitable for the curing characteristics of the resin material used as the material.

A second intermittent feed mechanism 48 is arranged downstream of the pressurization/heating station 24 . The second intermittent feeding mechanism 48 is similar to the first intermittent feeding mechanism 34 described above.
Similarly, it has a chuck mechanism, which is indicated by arrow 49.
It works to intermittently feed the base plate 18 while reciprocating in the direction. 1 of this second intermittent feeding mechanism 48
Depending on the intermittent feeding operation, the base plate 18 is fed by a length that can be processed by one of the pressurizing and heating devices 24a or 24b.

A guide roller 50 and a dancing roller 51 are arranged downstream of the second intermittent feeding mechanism 48, and the base plate 18 is guided by these rollers 50 and 51 to the base plate winding section 20 intermittently in the direction of the arrow 52. It is wound up. The dancing roller 51 is movable in the direction of the arrow 53, similar to the dancing roller 38 described above, and absorbs slack until the base plate 18 is wound up by the base plate winding section 20.

In FIG. 1, the pressurizing/heating station 24
At the stage after passing through, the electronic mechanical component 41
It remains held on the base plate 18. However, the electronic mechanical component 41 must be peeled off from the base plate 18 at some stage before it is used, as shown in FIG. In this peeling step, it is sufficient to simply apply a force to separate the electronic mechanical component 41 and the base plate 18 from each other. In addition,
As described above, the mold release agent previously applied to the surface of the base plate 18 can facilitate the separation of the base plate 18 from the resin film 33 located within the opening 7 . Such a peeling process is performed between the pressure/heating station 24 and the base plate winding section 20, or the base plate winding section 20 winds the base plate 18 while holding the electronic mechanical component 41. may be carried out at an appropriate stage thereafter.

In this example, a silicone adhesive was used as the material constituting the cover sheet 16.
Therefore, the cover sheet 16 itself has some stretch and does not become an obstacle to inserting a driver or the like into the driver plate 11. For example, it is possible to insert it with a load of 50g or less. When the driver plate 11 is rotated by this driver, the cover sheet 16 is, for example, 0.05 to 0.5 mm
Because it is so thin, it can easily break between the inner circumferential surface of the case 1 and the outer circumferential surface of the driver plate 11, as shown by 54 in FIG. 9, for example, and does not require a large torque. For example, rupture is possible with a torque of 150 gcm or less. Further, even if a break line is formed at the position indicated by "54", since most of the cover sheet 16 is held by the driver plate 11, there will be no large gap, and therefore the adjustment will be easy. You can also expect a dustproof effect later on.

When viewed in relation to the cover sheet 16 formed by applying the apparatus of the present invention and the opening 7 of the case 1, the embodiments are not limited to those shown in FIGS. 7 and 9.
Modifications as described below are also possible.

As shown in FIG. 10, the cover sheet 16 is
Although it is adhered to the inner circumferential surface of the opening 7 of the case 1, it is formed so as to ride up to the upper edge of the edge of the opening 7 of the case 1. Formation of such a cover sheet 16 can be performed, for example, by the above-mentioned first process.
This is possible by changing the pressure conditions from the presser plate 45 in the pressure/heating station 24 shown in the figure.

As shown in FIG. 11, a stepped portion 55 may be formed around the opening 7 of the case 1, and the cover sheet 16 may be formed to rest on this stepped portion 55.

In FIG. 12, the opening 7 of the case 1 is defined by a sloped surface. Therefore, the cover sheet 16 is formed in a state in which it is adhered to the inner circumferential surface of the sloped opening 7. In this example, since a knife edge is formed around the opening 7 of the case 1, the resin film 33 can be heated without applying much pressure from the presser plate 45 in the pressurizing/heating station 24 shown in FIG. can be cut.

In the embodiment described above with reference to FIG. 1, the mold release agent was applied by the guide roller 26. However, if a base plate 18 that has been previously treated to prevent adhesion to the resin film 33 is used, such application of a mold release agent is not necessary. Further, even if the base plate 18 itself is made of a material such as a fluorocarbon resin that has low adhesiveness to the resin film 33, there is no need to apply a release agent.

Further, the first intermittent feeding mechanism 34 may be replaced with a mechanism that continuously feeds the base plate 18. In this case, for example, the guide roller 37 shown in FIG. 1 may be constituted by a sprocket, and the base plate 18 may be provided with feed holes into which the teeth of the sprocket fit. The base plate 18 in which the feed holes are formed in advance may be used, or a feed hole forming device may be provided between the guide roller 26 and the resin material supply device 21, for example.

Further, the film forming device 22 may be replaced with a squeegee.

Furthermore, the pressurization/heating station 24 in FIG.
In this case, the resin film 33 on the base plate 18 may be left at a semi-cured stage without being completely cured. The resin film 33 may be completely cured after the electronic mechanical component 41 is peeled off from the base plate 18. In this case, since the peeling process is performed with the resin film 33 in a semi-cured state, the peeling process can be performed more easily.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of an embodiment of the present invention. FIG. 2 is an enlarged perspective view showing details of the film forming apparatus 22 of FIG. 1. FIG. 3 is a sectional view of the portion shown in FIG. 2. Fourth
The figure shows the first intermittent feed mechanism 34 of FIG. 1 in a plan view. FIG. 5 shows a state in which the suction head 42 included in the electronic mechanical component supplying device 23 of FIG. 1 holds the electronic mechanical component 41 and supplies it onto the resin film 33. FIG. 6 shows that the pressure/heating device 24a or 24b in FIG.
Shows the state in which heating is being performed. Figure 7 shows
The process of peeling off the electronic mechanical component 41 from the base plate 18 is shown. FIG. 8 is a plan view showing a trimmer capacitor as an example of an electronic mechanical component to which the present invention is applied. FIG. 9 is a sectional view taken along the line - in FIG. 1. 10 to 12 are cross-sectional views showing other examples of how the cover sheet 16 is formed. In the figure, 1 is a case, 7 is an opening, 9 is a rotor (metal rotor), 11 is a driver plate as part of the rotor, 15 is an adjustment groove, 16 is a cover sheet, 18 is a base plate, and 19 is a base plate Supply section, 2
0 is a base plate winding unit, 21 is a resin material supply device, 22
23 is a film forming device, 23 is an electronic mechanism parts supply device, 24a and 24b are pressurizing/heating devices, 33 is a resin film, 41 is an electronic mechanism component, 43 is a hot plate, 45 is a presser plate, and 48 is an intermittent feeding mechanism ( (second intermittent feeding mechanism).

Claims (1)

[Scope of Claims] 1. A rotation mechanism unit including a rotor is built into a case, and the case is provided with an opening into which a tool for rotating the rotor can be inserted. An apparatus for forming a cover sheet in a closed manner, comprising: a base plate supply section that supplies a long and flexible base plate that is wound into a roll; and a base that winds the base plate into a roll. a board winding part, and for a bed plate extending horizontally between the bed plate supply part and the bed plate winding part, in order from the bed plate supply part side: (a) a sheet to be a cover sheet; (b) a resin material supply device that supplies a heat-curable resin material onto the base plate in an uncured state; (b) a film forming device that stretches the uncured resin material onto a film on the base plate; (c) an electronic mechanical component supplying device that supplies the electronic mechanical component onto the film-like resin material with the opening facing downward; and (d) a hot plate disposed on the lower surface side of the base plate and the hot plate. A presser plate is provided so as to move toward and away from the hot plate while facing the plate with the base plate in between, and the electronic mechanical component is moved toward the base plate in accordance with the approaching movement of the presser plate. The end edge of the opening is pushed into the film-like resin material, the resin material that is to become the cover sheet is taken into the opening, and the resin material is hardened by heat from the hot plate. - A heating device, and further comprising an intermittent feeding mechanism that feeds the base plate intermittently with a stop period while the resin material is being hardened by the pressure/heating device. A device for forming a cover sheet in an opening.