JPH0511920B2 - - Google Patents
Info
- Publication number
- JPH0511920B2 JPH0511920B2 JP62218815A JP21881587A JPH0511920B2 JP H0511920 B2 JPH0511920 B2 JP H0511920B2 JP 62218815 A JP62218815 A JP 62218815A JP 21881587 A JP21881587 A JP 21881587A JP H0511920 B2 JPH0511920 B2 JP H0511920B2
- Authority
- JP
- Japan
- Prior art keywords
- synchrotron radiation
- speed
- sensor
- exposure apparatus
- extraction window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005469 synchrotron radiation Effects 0.000 claims description 29
- 238000000605 extraction Methods 0.000 claims description 12
- 230000005855 radiation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035479 physiological effects, processes and functions Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Particle Accelerators (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、シンクロトロン放射光源から放射さ
れるシンクロトロン放射光を利用する分野におけ
る、シンクロトロン放射光露光装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a synchrotron radiation exposure apparatus in the field of utilizing synchrotron radiation emitted from a synchrotron radiation light source.
（従来の技術）
近年、シンクロトロン放射光を利用した露光技
術の研究開発が急速に広がつてきている。第３図
に、従来の技術によるシンクロトロン放射光露光
装置を示した。同様の図が、例えば1986年に発行
された刊行物ニユークリア・インストルメンツ・
アンド・メソツド・イン・フイジイスク・リサー
チ（Nuclear Instruments and Methods in
Physics Research）A246巻、658〜667頁に示さ
れている。ストレイジリングから放射されるシン
クロトロン放射光１が、ビームラインに導入にさ
れる。ビームラインは、ミラーボツクス２、窓
３、高速遮断バルブ４、高速遮断バルブのセンサ
ー５、放射光取出し窓６等から構成される。露光
装置７を放射光取出し窓６の近傍に設置して、シ
ンクロトロン放射光露光装置の構成となる。(Prior Art) In recent years, research and development of exposure technology using synchrotron radiation has been rapidly expanding. FIG. 3 shows a conventional synchrotron radiation exposure apparatus. A similar diagram was published, for example, in the publication Nuclear Instruments published in 1986.
Nuclear Instruments and Methods in Physiology Research
Physics Research) A246, pages 658-667. Synchrotron radiation 1 emitted from the storage ring is introduced into the beam line. The beam line is composed of a mirror box 2, a window 3, a high-speed cutoff valve 4, a sensor 5 for the high-speed cutoff valve, a synchrotron radiation extraction window 6, and the like. The exposure device 7 is installed near the radiation extraction window 6, forming a synchrotron radiation exposure device.
（発明が解決しようとする問題点）
第３図の構成おいて、放射光取出し窓は通常、
厚さ10〜25μｍで数cm角のBe箔を使用する。しか
も、大気中に放射線を取出すことが多いので、１
気圧が加わる。従つてBe箔の破壊事故の可能性
が高く、装置としての信頼性が極めて低い。その
ため、第３図のように高速遮断バルブを設置する
構成をとる。Be箔を用いた窓（以下Be窓と略
す）の破壊が起こると、第３図のセンサー５で、
異常圧力（高いため）を感知して、センサー部か
らの信号によつて高速遮断バルブを閉じることに
なる。ところが、第３図のような構成では、仮に
高速遮断バルブに動作不能等の事故が発生した場
合には大気がストレイジリングまで入つてしま
い、ストレイジリングに大きなダメージを与える
ことになる。(Problems to be Solved by the Invention) In the configuration shown in FIG. 3, the synchrotron radiation extraction window is usually
Use Be foil with a thickness of 10 to 25 μm and several cm square. Moreover, since radiation is often extracted into the atmosphere,
Air pressure is added. Therefore, there is a high possibility that the Be foil will be destroyed, and the reliability of the device is extremely low. Therefore, a configuration is adopted in which a high-speed shutoff valve is installed as shown in FIG. When the window using Be foil (hereinafter referred to as Be window) breaks down, the sensor 5 in Fig. 3 detects the
It detects abnormal pressure (because it is high) and closes the high-speed shutoff valve based on the signal from the sensor section. However, in the configuration shown in FIG. 3, if an accident such as inoperability of the high-speed shutoff valve occurs, the atmosphere will enter the storage ring, causing great damage to the storage ring.
また、露光時はミラーを振動させるため、ミラ
ー部においては真空外からミラーの振動を制御す
る機構が設けられることが多く、ミラー部からの
真空リークの可能性も大きい。第３図の構成で
は、このようなリークが生じると防御手段は無
く、ストレイジリングに大きなダメージを与える
ことになる。また、別の観点として、高速遮断バ
ルブの設置位置としては、出来れば、ストレイジ
リングから遠い位置である方が、ストレイジリン
グの超高真空保護の意味からは望ましい。しかる
にリソグラフイ用ビームラインに高速遮断バルブ
を設置する場合、ビームライン途中で真空リーク
対策を万全にすると、必然的にストレイジリング
に近い所に高速遮断バルブを設置することが多
く、ストレイジリングの超高真空保護に対しては
万全とは言い難い。本発明では、このような従来
の問題点を除去して、ストレイジリングの超高真
空保護を十分に達成するシンクロトロン放射光露
光装置を提供することにある。 Furthermore, since the mirror is vibrated during exposure, the mirror section is often provided with a mechanism for controlling the vibration of the mirror from outside the vacuum, and there is a high possibility of vacuum leakage from the mirror section. In the configuration shown in FIG. 3, if such a leak occurs, there is no defense means, and the storage ring will be seriously damaged. In addition, from another point of view, it is desirable to install the high-speed shutoff valve as far away from the storage ring as possible from the standpoint of protecting the storage ring in ultra-high vacuum. However, when installing a high-speed shut-off valve on a beam line for lithography, if thorough measures are taken to prevent vacuum leaks in the middle of the beam line, the high-speed shut-off valve is often installed close to the storage ring. It is difficult to say that it is perfect for high vacuum protection. An object of the present invention is to provide a synchrotron radiation exposure apparatus that eliminates these conventional problems and satisfactorily protects the storage ring in ultra-high vacuum.
（問題点を解決するための手段）
本発明は、シンクロトロン放射光源、ビームラ
イン、放射光取出し窓、露光装置から構成される
シンクロトロン放射露光装置において、前記ビー
ムラインに、真空破壊を感知して作動する高速遮
断バルブを複数個設置することを特徴とするシン
クロトロン放射光露光装置である。(Means for Solving the Problems) The present invention provides a synchrotron radiation exposure apparatus that includes a synchrotron radiation light source, a beam line, a synchrotron radiation extraction window, and an exposure device. This is a synchrotron radiation exposure apparatus characterized by installing a plurality of high-speed shutoff valves that operate at the same time.
（実施例）
以下本発明の実施例について、図面を参照しな
がら説明する。第１図は本発明の一実施例におけ
るシンクロトロン放射光露光装置の構成図であ
る。シンクロトロン放射光源８から放射されるシ
ンクロトロン放射光１がビームラインに導入され
る。ビームラインは、ミラーボツクス２と放射光
取出し窓６を備えており、露光装置７が、放射光
取出し窓６の近傍に設置される。本発明の新たな
構成として高速遮断バルブ，９をミラーボツク
スの上流に設置する。またこのバルブのセンサー
，１０を、ミラーボツクスの上流に設置する。
次に、高速遮断バルブ，１１を放射光取出し窓
６の上流かつミラーボツクス２の下流に当る地点
に設置する。高速遮断バルブのセンサーは、
放射光取出し窓６の極く上流に設置する。第１図
の構成をとると、放射光取出し窓の破壊のとき
は、センサーが作動し、高速遮断バルブが閉
じ、ミラーボツクス２からのリークのときは、セ
ンサーが作動し、高速遮断バルブが閉じる。
また、放射光取出し窓６の破壊のとき、故障等の
理由でのセンサーが作動しないときは、のセ
ンサーが働き、高速遮断バルブが閉じる。よつ
て本発明の目的は達成される。(Example) Examples of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram of a synchrotron radiation exposure apparatus in one embodiment of the present invention. Synchrotron radiation light 1 emitted from a synchrotron radiation light source 8 is introduced into the beam line. The beam line includes a mirror box 2 and a radiation extraction window 6, and an exposure device 7 is installed near the radiation extraction window 6. As a new configuration of the present invention, a high-speed shutoff valve, 9, is installed upstream of the mirror box. The sensor 10 of this valve is also installed upstream of the mirror box.
Next, a high-speed shutoff valve 11 is installed at a point upstream of the radiation extraction window 6 and downstream of the mirror box 2. The sensor of the fast shutoff valve is
It is installed very upstream of the synchrotron radiation extraction window 6. With the configuration shown in Figure 1, when the synchrotron radiation extraction window is destroyed, the sensor is activated and the high-speed shutoff valve is closed, and when there is a leak from mirror box 2, the sensor is activated and the high-speed shutoff valve is closed. .
Further, when the radiation extraction window 6 is destroyed and the sensor does not operate due to a malfunction or the like, the sensor operates and the high-speed cutoff valve closes. The object of the invention is thus achieved.
第２図は本発明の他の実施例におけるシンクロ
トロン放射光露光装置の構成図である。この構成
では、高速遮断バルブ，９と高速遮断，１１
とが、ともにミラーボツクス２の上流に設置され
ている。このような構成でも本発明の目的が構成
されることは明らかであるが、第２図の構成は、
ミラーボツクスをストレイジリングから比較的遠
い位置に設置するような場合において、適当であ
る。 FIG. 2 is a block diagram of a synchrotron radiation exposure apparatus in another embodiment of the present invention. In this configuration, fast shutoff valves, 9 and fast shutoff, 11
Both are installed upstream of mirror box 2. Although it is clear that the object of the present invention can be achieved even with such a configuration, the configuration shown in FIG.
This is suitable when the mirror box is installed relatively far from the storage ring.
なお高速遮断バルブを３個以上使用する例につ
いても、本発明の目的を達成することは明らかで
あるので、図を用いての説明は省略する。 It is clear that the object of the present invention can also be achieved in an example in which three or more high-speed shutoff valves are used, so a description using the drawings will be omitted.
（発明の効果）
本発明によつて信頼性の高いシンクロトロン放
射光露光装置が得られ、SRリソグラフイの実用
化を一層促進する。(Effects of the Invention) According to the present invention, a highly reliable synchrotron radiation exposure apparatus can be obtained, further promoting the practical application of SR lithography.
第１図、第２図は本発明の一実施例におけるシ
ンクロトロン放射光露光装置を示す構成図であ
り、第３図は従来のシンクロトロン放射光露光装
置の模式図である。
１……シンクロトロン放射光、２……ミラーボ
ツクス、３……窓、４……高速遮断バルブ、５…
…センサー、６……放射光取出し窓、７……露光
装置、８……ストレイジリング、９……高速遮断
バルブ、１０……のセンサー、１１……高速
遮断バルブ、１２……のセンサー。
1 and 2 are block diagrams showing a synchrotron radiation exposure apparatus according to an embodiment of the present invention, and FIG. 3 is a schematic diagram of a conventional synchrotron radiation exposure apparatus. 1... Synchrotron synchrotron radiation, 2... Mirror box, 3... Window, 4... High speed cutoff valve, 5...
...sensor, 6... synchrotron radiation extraction window, 7... exposure device, 8... storage ring, 9... high-speed cutoff valve, 10... sensor, 11... high-speed cutoff valve, 12... sensor.
Claims (1)
射光取出し窓、露光装置から構成されるシンクロ
トロン放射光露光装置において、前記ビームライ
ンに、真空破壊を感知して作動する高速遮断バル
ブを複数個設置することを特徴とするシンクロト
ロン放射光露光装置。1. In a synchrotron radiation exposure apparatus consisting of a synchrotron radiation light source, a beam line, a synchrotron radiation extraction window, and an exposure device, a plurality of high-speed shutoff valves that operate upon sensing vacuum breakage are installed in the beam line. A synchrotron radiation exposure device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62218815A JPS6461700A (en) | 1987-08-31 | 1987-08-31 | Synchrotron radiation light exposing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62218815A JPS6461700A (en) | 1987-08-31 | 1987-08-31 | Synchrotron radiation light exposing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6461700A JPS6461700A (en) | 1989-03-08 |
| JPH0511920B2 true JPH0511920B2 (en) | 1993-02-16 |
Family
ID=16725778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62218815A Granted JPS6461700A (en) | 1987-08-31 | 1987-08-31 | Synchrotron radiation light exposing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6461700A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69033002T2 (en) * | 1989-10-02 | 1999-09-02 | Canon K.K. | Exposure device |
| DE102012215697A1 (en) * | 2012-09-05 | 2014-03-06 | Carl Zeiss Smt Gmbh | Blocking element for the protection of optical elements in projection exposure systems |
-
1987
- 1987-08-31 JP JP62218815A patent/JPS6461700A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6461700A (en) | 1989-03-08 |
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