JPH0517252B2 - - Google Patents
Info
- Publication number
- JPH0517252B2 JPH0517252B2 JP18016483A JP18016483A JPH0517252B2 JP H0517252 B2 JPH0517252 B2 JP H0517252B2 JP 18016483 A JP18016483 A JP 18016483A JP 18016483 A JP18016483 A JP 18016483A JP H0517252 B2 JPH0517252 B2 JP H0517252B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- group
- aluminum
- photocurable epoxy
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 claims description 25
- 229920000647 polyepoxide Polymers 0.000 claims description 25
- -1 aluminum compound Chemical class 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 150000003377 silicon compounds Chemical class 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 125000005372 silanol group Chemical group 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920000620 organic polymer Polymers 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 238000004804 winding Methods 0.000 description 7
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical group ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
- KFYLWBHJQAVNGU-UHFFFAOYSA-N (6-hydroxycyclohexa-2,4-dien-1-ylidene)methanone Chemical group OC1C=CC=CC1=C=O KFYLWBHJQAVNGU-UHFFFAOYSA-N 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000012669 compression test Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- PREYZPMNLOLYQD-UHFFFAOYSA-N (2-nitrophenyl)methoxy-triphenylsilane Chemical compound [O-][N+](=O)C1=CC=CC=C1CO[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 PREYZPMNLOLYQD-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- REIYHFWZISXFKU-UHFFFAOYSA-N Butyl acetoacetate Chemical compound CCCCOC(=O)CC(C)=O REIYHFWZISXFKU-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- QPAQOQRHCLJMIL-UHFFFAOYSA-N diethoxy(propan-2-yloxy)alumane Chemical compound CCO[Al](OCC)OC(C)C QPAQOQRHCLJMIL-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- OGPUONMCKFHQJB-UHFFFAOYSA-N phenyl(triphenylsilyl)methanone Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 OGPUONMCKFHQJB-UHFFFAOYSA-N 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- BJDCYOLBAMFSMI-UHFFFAOYSA-N tert-butylperoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OOC(C)(C)C)C1=CC=CC=C1 BJDCYOLBAMFSMI-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Description
〔発明の技術分野〕
本発明はパイプ、中空タンク、絶縁棒などに使
用される光硬化性エポキシ樹脂を用いた構造体の
製造方法に関する。
〔従来の技術的背景とその問題点〕
一般にパイプ、タンク、棒などに使用されてい
る合成樹脂としてはフエノール樹脂、ポリエステ
ル樹脂、エポキシ樹脂等が知られている。このう
ちとくに低粘度で含浸し易く接着性の良いものと
してエポキシ樹脂が主に用いられている。
これらの樹脂は通常加熱により硬化させるが、
加熱工程に長時間を要するため製造に長時間を費
やしていた。
また、パイプ、棒等を連続的に製造する際加熱
すると初期粘度が低下して組成物がたれ落ち易い
という問題点を有し、特にこの問題点は長尺状の
構造物を製造する場合には顕著であり不良品を多
く発生させる原因となつていた。
〔発明の目的〕
本発明は上記の問題点を解決し、光、特に紫外
線照射により速やかに硬化し、加熱による粘度低
下で発生するたれ落ちがない光硬化エポキシ樹脂
を用いた構造体の製造することを目的とする。
〔発明の概要〕
本発明はロービング状、より糸状、不織布状、
フイルム状のうち少なくとも1種の状態の基材
に、エポキシ樹脂、アルミニウム化合物、光照射
によりシラノール基を生ずるケイ素化合物を必須
成分とする組成物を含浸・塗布させてこの基材を
所望の形状とした後、光照射により硬化させるこ
とを特徴とする光硬化エポキシ樹脂を用いた構造
体の製造方法であり、本発明で用いる組成物は、
エポキシ樹脂;アルミニウム化合物;及び光照射
によつてシラノール基を生ずるケイ素化合物とか
ら成ることを特徴とする。
まず、本発明に用いるエポキシ樹脂としては、
一官能性エポキシ化合物及び多官能性エポキシ化
合物があげられる。一官能性エポキシ化合物とし
ては、エチレンオキシド、プロピレンオキシド、
ブチレンオキシド、スチレンオキシド、フエニル
グリシジルエーテル、ブチルグリシジルエーテル
等があげられる。また、多官能性エポキシ化合物
としては、特に限定されないが、例えば、ビスフ
エノールA型エポキシ樹脂;ビスフエノールF型
エポキシ樹脂;フエノールノボラツク型エポキシ
樹脂;脂環式エポキシ樹脂;トリグリシジルイソ
シアネート、ヒダントインエポキシ等の含複素環
エポキシ樹脂;水添ビスフエノールA型エポキシ
樹脂;プロピレングリコール−ジクリシジルエー
テル、ペンタエリスリトール−ボリグリシジルエ
ーテル等の脂肪族系エポキシ樹脂;芳香族、脂肪
族もしくは脂環式のカルボン酸とエピクロルヒド
リンとの反応によつて得られるエポキシ樹脂;ス
ピロ環含有エポキシ樹脂;o−アリル−フエノー
ルノボラツク化合物とエピクロルヒドリンとの反
応生成物であるグリシジルエーテル型エポキシ樹
脂;ビスフエノールAのそれぞれの水素基のo−
位にアリル基を有するジアリルビスフエノール化
合物とエピクロルヒドリンとの反応生成物である
グリシジルエーテル型エポキシ樹脂等があげら
れ、これらから選ばれた1種もしくは2種以上の
ものを任意に使用することが出来る。
本発明で用いる組成物の第2の成分であるアル
ミニウム化合物としては、アルミニウム原子にア
ルコキシ基、フエノキシ基、アシルオキシ基、β
−ジケトナト基、o−カルボニルフエノラト基な
どが結合した有機アルミニウムの錯体化合物であ
ることが好ましい。
ここで、アルコキシ基としては炭素数1〜10の
ものが好ましく、メトキシ、エトキシ、イソプロ
ボキシ、ブトキシ、ペントオキシなどがあげら
れ、フエノキシ基としては、フエノキシ基、o−
メチルフエノキシ基、o−メトキシフエノキシ
基、p−ニトロフエノキシ基、2,6−ジメチル
フエノキシ基などがあげられ、アシルオキシ基と
しては、アセタト、プロピオナト、イソプロピオ
ナト、ブチラト、ステアラト、エチルアセトアセ
タト、プロピルアセタト、ブチルアセトアセタ
ト、ジエチルマラト、ジピバロイルメタナトなど
の配位子があげられ、β−ジケトナト基として
は、例えば、アセチルアセトナト、トリフルオロ
アセチルアセトナト、ヘキサフルオロアセチルア
セトナト、
[Technical Field of the Invention] The present invention relates to a method of manufacturing a structure using a photocurable epoxy resin used for pipes, hollow tanks, insulating rods, etc. [Conventional technical background and problems thereof] Phenol resins, polyester resins, epoxy resins, etc. are known as synthetic resins generally used for pipes, tanks, rods, etc. Among these, epoxy resins are mainly used because they have a particularly low viscosity, are easy to impregnate, and have good adhesive properties. These resins are usually cured by heating,
Because the heating process takes a long time, manufacturing takes a long time. In addition, when continuously manufacturing pipes, rods, etc., there is a problem that when heated, the initial viscosity decreases and the composition tends to drip, and this problem is especially true when manufacturing long structures. This was remarkable and caused many defective products to be produced. [Objective of the Invention] The present invention solves the above-mentioned problems and manufactures a structure using a light-cured epoxy resin that cures quickly by light, especially ultraviolet irradiation, and does not drip due to viscosity reduction due to heating. The purpose is to [Summary of the invention] The present invention provides roving-like, strand-like, non-woven fabric,
At least one type of film-like base material is impregnated and coated with a composition containing as essential components an epoxy resin, an aluminum compound, and a silicon compound that generates silanol groups when irradiated with light, and the base material is shaped into a desired shape. This is a method for producing a structure using a photocurable epoxy resin, which is characterized in that the composition is cured by light irradiation.
It is characterized by consisting of an epoxy resin; an aluminum compound; and a silicon compound that generates silanol groups upon irradiation with light. First, as the epoxy resin used in the present invention,
Examples include monofunctional epoxy compounds and polyfunctional epoxy compounds. Monofunctional epoxy compounds include ethylene oxide, propylene oxide,
Examples include butylene oxide, styrene oxide, phenyl glycidyl ether, butyl glycidyl ether, and the like. The polyfunctional epoxy compound is not particularly limited, but includes, for example, bisphenol A epoxy resin; bisphenol F epoxy resin; phenol novolak epoxy resin; alicyclic epoxy resin; triglycidyl isocyanate, hydantoin epoxy Heterocyclic epoxy resins such as hydrogenated bisphenol A type epoxy resins; aliphatic epoxy resins such as propylene glycol-dicrycidyl ether and pentaerythritol-boriglycidyl ether; aromatic, aliphatic or alicyclic carboxylic acids Epoxy resin obtained by the reaction of and epichlorohydrin; Spiro ring-containing epoxy resin; Glycidyl ether type epoxy resin which is a reaction product of o-allyl-phenol novolak compound and epichlorohydrin; Each hydrogen group of bisphenol A o-
Examples include glycidyl ether type epoxy resins which are the reaction products of diallybisphenol compounds having an allyl group at the position and epichlorohydrin, and one or more selected from these can be used as desired. . The aluminum compound, which is the second component of the composition used in the present invention, has an alkoxy group, phenoxy group, acyloxy group, β
A complex compound of organoaluminum to which -diketonato group, o-carbonylphenolate group, etc. is bonded is preferable. Here, the alkoxy group preferably has 1 to 10 carbon atoms, such as methoxy, ethoxy, isoproboxy, butoxy, pentoxy, etc., and the phenoxy group includes phenoxy group, o-
Examples include methylphenoxy group, o-methoxyphenoxy group, p-nitrophenoxy group, 2,6-dimethylphenoxy group, and examples of acyloxy group include acetato, propionato, isopropionato, butyrate, stearato, and ethyl acetoacetate. , propyl acetato, butylacetoacetate, diethylmalato, dipivaloylmethanato, and the like; examples of the β-diketonato group include acetylacetonato, trifluoroacetylacetonato, hexafluoroacetylacetonato,
【式】【formula】
【式】【formula】
【式】などの配位子が
あげられ、o−カルボニルフエノラト基として
は、例えば、サリチルアルデヒダトがあげられ
る。
このようなアルミニウム化合物の具体例として
は、トリスメトキシアルミニウム、トリスエトキ
シアルミニウム、トリスイソプロポキシアルミニ
ウム、トリスフエノキシアルミニウム、トリスパ
ラメチルフエノキシアルミニウム、イソプロポキ
シジエトキシアルミニウム、トリスプトキシアル
ミニウム、トリスアセトキシアルミニウム、トリ
スステアラトアルミニウム、トリスフチラトアル
ミニウム、トリスプロビオナトアルミニウム、ト
リスイソプロビオナトアルミニウム、トリスアセ
チルアセトナトアルミニウム、トリストリフルオ
ロアセチルアセトナトアルミニウム、トリスヘキ
サフルオロアセチルアセトナトアルミニウム、ト
リスエチルアセトアセタトアルミニウム、トリス
サリチルアルデヒダトアルミニウム、トリスジエ
チルマロラトアルミニウム、トリスプロピルアセ
トアセタトアルミニウム、トリスブチルアセトア
セタトアルミニウム、トリスジビバロイルメタナ
トアルミニウム、ジアセチルアセトナトジビバロ
イルメタナトアルミニウム
Examples of the o-carbonylphenolate group include salicylaldehydato. Specific examples of such aluminum compounds include trismethoxyaluminum, trisethoxyaluminum, trisisopropoxyaluminum, trisphenoxyaluminum, trisparamethylphenoxyaluminum, isopropoxydiethoxyaluminum, trisputoxyaluminum, tris Aluminum acetoxy, aluminum trisstearato, aluminum aluminum trisphthylate, aluminum aluminum trisprobionato, aluminum aluminum trisisoprobionato, aluminum aluminum trisacetylacetonato, aluminum aluminum trifluoroacetylacetonato, aluminum aluminum trishexafluoroacetylacetonato, aluminum trisethyl acetoacetate Tatoaluminum, trissalicylaldehydatoaluminum, trisdiethylmalolatoaluminum, trispropylacetoacetatoaluminum, trisbutylacetoacetatoaluminum, trisdibivaloylmethanatoaluminum, diacetylacetonatodibivaloylmethanatoaluminum
本発明の実施例を図面に基づいて説明する。
実施例1〜6
本発明の実施例で使用した製造装置は、第1図
にその一部切欠要部上面図、第2図にその一部切
欠要部側面図で示したようにロービング供給機
1、樹脂含浸機2、ワインデイング本体3、紫外
線照射機4から構成される装置であり、この製造
装置でガラスロービング5を基材としてマンドレ
ル6を用いて中空パイプを製作した。
製作条件は次の通りである。
エポキシ樹脂としては、ERL4221(商品名、
UCC社製;脂環式、エポキシ当量145)、エピコ
ート828(商品名、シエル化学社製;ビスフエノー
ルA型、エポキシ当量190〜210)、エピコート
1001(商品名、シエル化学社製;ビスフエノール
A型、エポキシ当量450〜525、分子量900)、エピ
コート1004(商品名、シエル化学社製;ビスフエ
ノールA型、エポキシ当量900〜1000、分子量
1400)を使用し、有機アルミニウム化合物として
は、トリスイソプロポキシアルミニウム
(TIPA)、トリスエチルアセトアセタトアルミニ
ウム(TEAACA)、トリス−n−ブチルアセト
アセタトアルミニウム(TBAAA)、トリスサリ
チルアルデヒダトアルミニウム(TSAA)を使
用し、有機ケイ素化合物としては、トリフエニル
(o−ニトロベンジルオキシ)シラン
(TPONS)、トリフエニル(tert−ブチルペルオ
キシ)シラン(TPTBS)、トリフエニル(ベン
ゾイル)シラン(TPBZS)を用い、増感剤とし
てベンゾフエノンを用いた。これらの化合物を第
1表に示す組成(重量部で示す)に配合して実施
例1〜6の組成物を調整した。
ガラスロービング5はGYR−30FIWE(日東紡
(株)製)を8個ロービング供給機1にセツトし、こ
れをガイドレール7a,7bを通して樹脂含浸機
2に導入し、更にガイドレール7cを通してマン
ドレル6の末端の一方のピン付端板8に結びつけ
た。
マンドレル6は137mmφ×2100mmの寸法の鉄製
中空のものを用い、その末端にはガラスロービン
グ5をひつかけるためのピン付端板8を備えてい
る。
巻状態はトラバース9が90回転/分、マンドレ
ル6が25回転/分のスピードで45°のヘリカル巻
きと、トラバース9が88回転、マンドレル6が25
回転/分のスピードで88°のパラレル巻きを交互
に行なつた。
以上の条件にて、表1の実施例1〜6の組成物
を樹脂含浸機2に入れ、ロービング供給機1から
供給されたガラスロービング5に含浸せしめガイ
ドレール7cを経てマンドレル6のピン付端板8
に巻きつけた。この際マンドレル6には予め厚さ
25μmのポリエステル製フイルム(図示せず)を
巻きつけ、後で硬化させたパイプがマンドレル6
から抜き易いようにしておいた。
次にこのガラスロービング5をマンドレル6に
巻回しながらこれに約10cm隔ててセツトした
80w/cmの高圧水銀ランプ(図示せず)を装着し
た紫外線照射機4で紫外線を照射し、硬化反抗を
進めながら8重巻にしてパイプを製造した。その
後、マンドレル6をワインデイング機本体3から
はずし、150℃の乾燥炉(図示せず)中で1時間
処理し冷却した後、ピン付端板8を切り除き、マ
ンドレル6から中空状のパイプを抜き取つた。
得られたパイプを幅20mmに切り出し、第3図に
正面図で第4図に側面図で示した治具10にて引
張り試験を行なつた。
また、第5図に正面図で第6図に側面図で示し
た治具11にて圧縮試験を行なつた。
次に第7図に正面図で第8図に側面図で示した
治具12にてNOLリング試験を行なつた。
更に、幅200mmに切り出したパイプを第9図に
側面図で示した治具13にて座屈試験を行なつ
た。
以上の結果を表に併せて記す。
Embodiments of the present invention will be described based on the drawings. Examples 1 to 6 The manufacturing equipment used in the examples of the present invention was a roving feeder as shown in FIG. 1 as a top view of a partially cut away main part, and as shown in FIG. 2 as a side view of a partially cut away main part. 1. This is an apparatus consisting of a resin impregnation machine 2, a winding body 3, and an ultraviolet irradiation machine 4. With this manufacturing apparatus, a hollow pipe was manufactured using a mandrel 6 using a glass roving 5 as a base material. The manufacturing conditions are as follows. ERL4221 (product name,
Manufactured by UCC; alicyclic, epoxy equivalent: 145), Epicote 828 (trade name, manufactured by Ciel Chemical Co., Ltd.; bisphenol A type, epoxy equivalent: 190-210), Epicote
1001 (trade name, manufactured by Ciel Chemical Co., Ltd.; bisphenol A type, epoxy equivalent weight 450-525, molecular weight 900), Epicote 1004 (trade name, manufactured by Ciel Chemical Co., Ltd.; bisphenol type A, epoxy equivalent weight 900-1000, molecular weight
1400), and the organoaluminum compounds include trisisopropoxyaluminum (TIPA), trisethylacetoacetatoaluminum (TEAACA), tris-n-butylacetoacetatoaluminum (TBAAA), and trissalicylaldehydatoaluminum (TSAA). ), triphenyl(o-nitrobenzyloxy)silane (TPONS), triphenyl(tert-butylperoxy)silane (TPTBS), and triphenyl(benzoyl)silane (TPBZS) were used as organosilicon compounds, and a sensitizer was used. Benzophenone was used as the The compositions of Examples 1 to 6 were prepared by blending these compounds into the compositions shown in Table 1 (shown in parts by weight). Glass roving 5 is GYR-30FIWE (Nittobo
Co., Ltd.) is set in the roving feeder 1, introduced into the resin impregnation machine 2 through guide rails 7a and 7b, and then passed through the guide rail 7c to the end plate 8 with a pin at one end of the mandrel 6. tied together. The mandrel 6 is made of hollow iron and has dimensions of 137 mmφ x 2100 mm, and an end plate 8 with a pin is provided at its end for hooking the glass roving 5. The winding conditions are 45° helical winding with traverse 9 at 90 revolutions/min and mandrel 6 at 25 revolutions/min, and traverse 9 at 88 revolutions and mandrel 6 at 25 revolutions/min.
Alternating parallel windings of 88° were carried out at a speed of revolutions per minute. Under the above conditions, the compositions of Examples 1 to 6 in Table 1 were put into the resin impregnation machine 2, and impregnated into the glass roving 5 supplied from the roving supply machine 1. Board 8
wrapped around. At this time, the thickness of the mandrel 6 is set in advance.
A pipe wrapped with a 25 μm polyester film (not shown) and then cured is attached to a mandrel 6.
I made it easy to remove. Next, this glass roving 5 was wound around a mandrel 6 and set on it at a distance of about 10 cm.
The tube was irradiated with ultraviolet rays using an ultraviolet irradiator 4 equipped with a high-pressure mercury lamp (not shown) of 80 W/cm, and the pipe was manufactured by winding it in 8 layers while proceeding with curing reaction. Thereafter, the mandrel 6 is removed from the winding machine main body 3, and after cooling in a drying oven (not shown) at 150°C for 1 hour, the end plate 8 with pins is cut off, and the hollow pipe is removed from the mandrel 6. I pulled it out. The obtained pipe was cut to a width of 20 mm, and a tensile test was performed using a jig 10 shown in a front view in FIG. 3 and in a side view in FIG. In addition, a compression test was conducted using the jig 11 shown in a front view in FIG. 5 and in a side view in FIG. Next, a NOL ring test was conducted using the jig 12 shown in the front view in FIG. 7 and in the side view in FIG. Furthermore, a buckling test was conducted on a pipe cut to a width of 200 mm using jig 13 shown in a side view in FIG. The above results are also shown in the table.
【表】【table】
本発明の製造方法によれば、製造工程で粘度低
下によるたれ落ちがなく短時間に硬化する光硬化
エポキシ樹脂を用いた構造体を製造することがで
きる。
According to the manufacturing method of the present invention, it is possible to manufacture a structure using a photocurable epoxy resin that cures in a short time without dripping due to a decrease in viscosity during the manufacturing process.
図面は本発明の製造方法及びその製造方法で製
造された構造物の各種強度試験方法を示すもの
で、第1図は本発明の製造方法で用いた製造装置
の一部切欠要部上面図、第2図はその一部切欠要
部側面図、第3図は引張り試験の状態を示す正面
図、第4図はその側面図、第5図は圧縮試験の状
態を示す正面図、第6図はその側面図、第7図は
NOLリング試験の状態を示す正面図、第8図は
その側面図、第9図は座屈試験の状態を示す側面
図である。
1……ロービング供給機、2……樹脂含浸機、
3……ワインデイング機本体、4……紫外線照射
線、5……ガラスロービング、6……マンドレ
ル。
The drawings show the manufacturing method of the present invention and various strength testing methods for structures manufactured by the manufacturing method. Figure 2 is a partially cutaway side view of the main part, Figure 3 is a front view showing the state of the tensile test, Figure 4 is the side view, Figure 5 is a front view showing the state of the compression test, and Figure 6. is its side view, and Figure 7 is its side view.
FIG. 8 is a front view showing the state of the NOL ring test, FIG. 8 is a side view thereof, and FIG. 9 is a side view showing the state of the buckling test. 1... Roving supply machine, 2... Resin impregnation machine,
3...winding machine body, 4...ultraviolet radiation, 5...glass roving, 6...mandrel.
Claims (1)
ム状のうち少なくとも1種の基材に、エポキシ樹
脂、アルミニウム化合物、光照射によりシラノー
ル基を生ずるケイ素化合物を必須成分とする組成
物を含浸・塗布させてこの基材を所望の形状とし
た後、光反射により硬化させることを特徴とする
光硬化エポキシ樹脂を用いた構造体の製造方法。 2 基材がガラス、カーボン、ボロン、銅、鉄、
有機高分子材料のうち少なくとも1種の材質であ
ることを特徴とする特許請求の範囲第1項記載の
光硬化エポキシ樹脂を用いた構造体の製造方法。 3 アルミニウム化合物が有機アルミニウム化合
物である特許請求の範囲第1項記載の光硬化エポ
キシ樹脂を用いた構造体の製造方法。 4 ケイ素化合物が、ペルオキシシラン基、o−
ニトロベンジルオキシ基、α−ケトシリル基のい
ずれかを有するケイ素化合物である特許請求の範
囲第1項記載の光硬化エポキシ樹脂を用いた構造
体の製造方法。 5 アルミニウム化合物及び該ケイ素化合物の配
合量が、該エポキシ樹脂の重量に対し、それぞ
れ、0.001〜10重量%、0.1〜20重量%である特許
請求の範囲第1項記載の光硬化エポキシ樹脂を用
いた構造体の製造方法。[Scope of Claims] 1. A composition containing, as essential components, an epoxy resin, an aluminum compound, and a silicon compound that produces silanol groups when irradiated with light, in at least one base material selected from among roving, twine, nonwoven fabric, and film. A method for producing a structure using a photocurable epoxy resin, which comprises impregnating and coating a base material to form a desired shape, and then curing it by light reflection. 2 The base material is glass, carbon, boron, copper, iron,
2. A method for manufacturing a structure using a photocurable epoxy resin according to claim 1, wherein the photocurable epoxy resin is at least one organic polymer material. 3. A method for producing a structure using a photocurable epoxy resin according to claim 1, wherein the aluminum compound is an organic aluminum compound. 4 The silicon compound has a peroxysilane group, o-
A method for producing a structure using the photocurable epoxy resin according to claim 1, which is a silicon compound having either a nitrobenzyloxy group or an α-ketosilyl group. 5. Using the photocurable epoxy resin according to claim 1, wherein the aluminum compound and the silicon compound are blended in amounts of 0.001 to 10% by weight and 0.1 to 20% by weight, respectively, based on the weight of the epoxy resin. Method of manufacturing the structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18016483A JPS6072932A (en) | 1983-09-30 | 1983-09-30 | Production of structure containing photocurable epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18016483A JPS6072932A (en) | 1983-09-30 | 1983-09-30 | Production of structure containing photocurable epoxy resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6072932A JPS6072932A (en) | 1985-04-25 |
| JPH0517252B2 true JPH0517252B2 (en) | 1993-03-08 |
Family
ID=16078513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18016483A Granted JPS6072932A (en) | 1983-09-30 | 1983-09-30 | Production of structure containing photocurable epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6072932A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0753555B2 (en) * | 1986-12-27 | 1995-06-07 | 昭和高分子株式会社 | Method for immobilizing coating of linear bundle |
-
1983
- 1983-09-30 JP JP18016483A patent/JPS6072932A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6072932A (en) | 1985-04-25 |
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