JPH0519273B2 - - Google Patents
Info
- Publication number
- JPH0519273B2 JPH0519273B2 JP62059361A JP5936187A JPH0519273B2 JP H0519273 B2 JPH0519273 B2 JP H0519273B2 JP 62059361 A JP62059361 A JP 62059361A JP 5936187 A JP5936187 A JP 5936187A JP H0519273 B2 JPH0519273 B2 JP H0519273B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- base material
- paste
- printing
- tape base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 15
- 238000010304 firing Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 9
- 239000002003 electrode paste Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 238000009766 low-temperature sintering Methods 0.000 claims description 2
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 description 1
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明はチツプ状の導体ジヤンパーの製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing chip-shaped conductor jumpers.
従来の技術
従来のチツプジヤンパーは第２図に示すよう
に、分割用スリツトの入つた焼成済の板状アルミ
ナ基板１上のチツプ個片の上面に一次電極２を印
刷・焼成し、さらに一次電極２の中央部に絶縁保
護を目的にオーバーコート用ガラスペーストを印
刷・焼成して保護膜３を形成した後、長辺方向に
基板分割されたチツプ連基板の両側面部に端面電
極４を導体電極ペーストで印刷・焼成して形成し
た後、チツプ個片状に分割し、前記一次電極２、
及び端面電極４にメツキを施こす製法が採られて
いた。Conventional Technology As shown in FIG. 2, a conventional chip jumper is made by printing and firing a primary electrode 2 on the upper surface of each chip piece on a fired plate-like alumina substrate 1 with dividing slits, and then printing and firing the primary electrode 2. After forming a protective film 3 by printing and baking a glass paste for overcoat on the central part of the board for the purpose of insulation protection, end electrodes 4 are attached to both side parts of the chip series board divided in the long side direction using conductor electrode paste. After forming by printing and firing, the primary electrode 2 is divided into individual chips.
A manufacturing method has also been adopted in which the end face electrode 4 is plated.
発明が解決しようとする問題点
上記従来のチツプジヤンパーは、一次電極、オ
ーバーコートガラス保護膜、端面電極と３回にわ
たる焼成工程を必要とする。また端面電極の４角
のコーナーは直角であるため、導体電極膜厚が部
分的に薄くなり、はんだ喰われなどにより断線し
やすい性能上の欠点を有する。Problems to be Solved by the Invention The conventional chip jumper described above requires three firing steps: a primary electrode, an overcoat glass protective film, and an end electrode. In addition, since the four corners of the end electrode are right angles, the thickness of the conductor electrode becomes thin in some parts, which has a performance disadvantage in that the conductor electrode is easily broken due to solder eating or the like.
本発明はこのような問題点を解決し、製造が容
易で信頼性の高い方法を提供するものである。 The present invention solves these problems and provides a method that is easy to manufacture and highly reliable.
問題点を解決するための手段
この問題点を解決するために本考案は、低温焼
成用セラミツク材料を成形、押出された棒状のク
リーンテープ基材の両側面部、上面及び底面の一
部に同時に電極印刷、さらに上面にオーバーコー
トガラスの印刷を行つた後、これらを一回の同時
焼成で上面電極、端面電極、底面電極及びガラス
保護膜を構成したものである。さらにグリーンテ
ープ基材の成形は、押出しノズルの形状に応じて
任意の形状に押出せるため、本発明では、端面電
極の４角のコーナーを丸みをもたすことにより、
端面コーナー部の導体電極は均一な膜厚で構成で
きるため、角のはんだ喰われなどに伴う断線など
がなく、信頼性の高い端面電極を構成できる。さ
らに実装半田付性の信頼性も向上できる。Means for Solving the Problem In order to solve this problem, the present invention provides electrodes simultaneously on both sides, part of the top surface, and part of the bottom surface of a rod-shaped clean tape base material formed by molding and extruding ceramic material for low-temperature firing. After printing and further printing an overcoat glass on the top surface, the top electrode, end surface electrode, bottom surface electrode, and glass protective film were constructed by simultaneously firing them once. Furthermore, since the green tape base material can be extruded into any shape depending on the shape of the extrusion nozzle, in the present invention, by rounding the four corners of the end electrode,
Since the conductive electrodes at the corners of the end face can be constructed with a uniform film thickness, there is no disconnection due to solder eating at the corners, and a highly reliable end face electrode can be constructed. Furthermore, the reliability of mounting solderability can be improved.
作 用
本発明は低温焼成セラミツク基材を用い、かつ
棒状に連続押出し成形したグリーンテープ基材に
連続して、電極ペースト、及びガラスペーストを
印刷後、同時に一回の焼成でもつて一次電極、端
面電極、ガラス保護膜を形成できるものであり、
端面電極は押出し成形の形状により信頼性の高い
ものが得られる。Function The present invention uses a low-temperature firing ceramic base material, and after printing an electrode paste and a glass paste continuously on a green tape base material that is continuously extruded into a bar shape, the primary electrode and the end surface can be printed simultaneously in one firing. It can form electrodes and glass protective films.
The end face electrode has a highly reliable shape due to extrusion molding.
実施例
本発明の一実施例の製造方法を第１図に示す製
造工程順に説明する。Example A manufacturing method according to an example of the present invention will be explained in the order of manufacturing steps shown in FIG.
まず、低温焼結用セラミツクガラス粉末（CaO
−PbO−B2O3−SiO2系）を潤滑剤（ダイナマイ
トグリセリン）、バインダ、及び水と共に混練し、
真空上練の後、成形ノズル５より押出し、グリー
ンテープ基材６を形成する。 First, ceramic glass powder for low temperature sintering (CaO
-PbO- B2O3 -SiO2 system ) is kneaded with a lubricant (dynamite glycerin), a binder, and water,
After vacuum kneading, it is extruded from a molding nozzle 5 to form a green tape base material 6.
その後、乾燥されたグリーンテープ基材６の両
側面部、上面及び底面の一部に電極を印刷し乾燥
する。さらにその上面の中央部に絶縁保護膜とし
て、オーバーコートガラスを同様に印刷し乾燥す
る。その後、分割用のスリツト溝１１を形成す
る。 Thereafter, electrodes are printed on both side surfaces, a portion of the top surface, and a portion of the bottom surface of the dried green tape base material 6 and dried. Furthermore, an overcoat glass is printed in the same manner as an insulating protective film on the center of the upper surface and dried. Thereafter, slit grooves 11 for division are formed.
そして、これら電極、ガラス及びグリーンテー
プ基材６を900℃のピーク温度で20分間保持し、
同時に焼成し、端面電極７、上面電極８、底面電
極９、及びガラス保護膜１０を形成する。 Then, hold these electrodes, glass, and green tape base material 6 at a peak temperature of 900°C for 20 minutes,
Simultaneously firing is performed to form an end surface electrode 7, a top surface electrode 8, a bottom surface electrode 9, and a glass protective film 10.
さらに、前記同時焼成前に設けられたスリツト
溝１１に沿つて、チツプ個片に分割し、ニツケル
メツキ及びはんだメツキを行つた後、所望の抵抗
値に入つているか検査を行う。 Furthermore, the chips are divided into individual chips along the slit grooves 11 provided before the simultaneous firing, and after nickel plating and solder plating are performed, it is inspected to see if the desired resistance value is reached.
以上のようにして、チツプ個片の導通用電極と
して、上面、底面、端面の各電極７，８，９が構
成され、かつ上面に絶縁用及び耐湿性のガラス保
護膜が形成された導通用チツプジヤンパー１２が
得られる。 As described above, each of the electrodes 7, 8, and 9 on the top surface, bottom surface, and end surface is configured as a conduction electrode for each chip, and an insulating and moisture-resistant glass protective film is formed on the top surface. A chip jumper 12 is obtained.
なお前記電極は、空気焼成される銀、銀パラジ
ウム、銀白金などの電極ペーストを用いて構成で
きるが、窒素雰囲気で焼成される銅ペーストを用
いても、同様にチツプジヤンパーが形成できるも
のである。 The electrodes can be constructed using an air-fired electrode paste of silver, silver-palladium, silver-platinum, or the like, but a chip jumper can also be formed using a copper paste that is fired in a nitrogen atmosphere.
発明の効果
以上のように本発明は、チツプ個片用のテープ
基材が、連続的に成形押出しできると共に、電極
も上面、両側面からの塗布工法により連続印刷で
きる。さらに電極、ガラスともグリーンテープ基
材と同時焼成して形成できるため、生産性が高
く、製造コスト的にすぐれている。また、基材の
成形ノズルの４角に丸みをもたせることにより、
押出されたグリーンテープ基材の上面、底面の４
角の電極膜は均一で、信頼性の高いものが得られ
る。また、実装時のはんだ付性が容易になり、は
んだ付強度も向上できる。なお電極材料に銅ペー
ストを用い、窒素焼成することにより、電極の導
体抵抗値が小さく、かつはんだ喰われや銀のマイ
グレーシヨンなどがない品質の信頼性のより高い
ものが得られる。Effects of the Invention As described above, according to the present invention, the tape base material for individual chips can be continuously molded and extruded, and the electrodes can also be printed continuously by a coating method from the top and both sides. Furthermore, since both the electrode and the glass can be formed by co-firing with the green tape base material, productivity is high and manufacturing cost is excellent. In addition, by rounding the four corners of the molding nozzle of the base material,
4 on the top and bottom surfaces of the extruded green tape base material
The corner electrode film is uniform and highly reliable. Furthermore, solderability during mounting becomes easier, and soldering strength can also be improved. By using copper paste as the electrode material and firing it in nitrogen, it is possible to obtain a highly reliable electrode with a low conductor resistance value and no solder erosion or silver migration.
第１図は本発明の一実施例によるチツプジヤン
パーの製造工程図、第２図は従来のチツプジヤン
パーの製造工程図である。
５……成形押出しノズル、６……グリーンテー
プ基材、７……端面電極、８……上面電極、９…
…底面電極、１０……ガラス保護膜、１１……分
割用スリツト溝、１２……チツプジヤンパー。
FIG. 1 is a manufacturing process diagram of a chip jumper according to an embodiment of the present invention, and FIG. 2 is a manufacturing process diagram of a conventional chip jumper. 5... Molding extrusion nozzle, 6... Green tape base material, 7... End surface electrode, 8... Top surface electrode, 9...
...Bottom electrode, 10...Glass protective film, 11...Dividing slit groove, 12...Chip jumper.
Claims (1)
棒状のグリーンテープ基材の両側面部、及びそれ
らに接続して、上面、及び底面に導体電極ペース
トを印刷する工程と、前記上面電極の中央部をガ
ラスペーストで印刷する工程と、基材分割用スリ
ツトを形成したのち、前記グリーンテープ基材、
電極ペースト、ガラスペーストを空気中にて同時
焼成する工程と、メツキ準備工程である前記焼成
済基材を分割する工程と、前記電極部にメツキ膜
を形成する工程とを順次行うことを特徴とするチ
ツプジヤンパーの製造方法。 ２ 導体電極ペーストは銅であり、窒素雰囲気中
で同時焼成することを特徴とする特許請求の範囲
第１項記載のチツプジヤンパーの製造方法。[Scope of Claims] 1. A step of printing a conductive electrode paste on both side surfaces of a rod-shaped green tape base material molded and extruded from a ceramic material for low-temperature sintering, and on the top and bottom surfaces connected thereto; After printing the center part of the top electrode with glass paste and forming slits for dividing the base material, the green tape base material,
It is characterized by sequentially performing the step of simultaneously firing the electrode paste and the glass paste in air, the step of dividing the fired base material which is a plating preparation step, and the step of forming a plating film on the electrode part. A method for producing chippuji jumper. 2. The method for manufacturing a chip jumper according to claim 1, wherein the conductive electrode paste is made of copper and is co-fired in a nitrogen atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62059361A JPS63225484A (en) | 1987-03-13 | 1987-03-13 | Manufacturing method of chip jumper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62059361A JPS63225484A (en) | 1987-03-13 | 1987-03-13 | Manufacturing method of chip jumper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63225484A JPS63225484A (en) | 1988-09-20 |
| JPH0519273B2 true JPH0519273B2 (en) | 1993-03-16 |
Family
ID=13111051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62059361A Granted JPS63225484A (en) | 1987-03-13 | 1987-03-13 | Manufacturing method of chip jumper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63225484A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013131621A (en) * | 2011-12-21 | 2013-07-04 | Kyocera Corp | Multiple patterning wiring board, wiring board, and electronic device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4422464B2 (en) | 2003-11-12 | 2010-02-24 | 北陸電気工業株式会社 | Connector chip and manufacturing method thereof |
-
1987
- 1987-03-13 JP JP62059361A patent/JPS63225484A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013131621A (en) * | 2011-12-21 | 2013-07-04 | Kyocera Corp | Multiple patterning wiring board, wiring board, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63225484A (en) | 1988-09-20 |
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