JPH051968B2

JPH051968B2 -

Info

Publication number: JPH051968B2
Application number: JP23875786A
Authority: JP
Inventors: Tetsuya Kuroki; Tadanobu Kawamura
Original assignee: Hitachi AIC Inc
Current assignee: Lincstech Circuit Co Ltd
Priority date: 1986-10-07
Filing date: 1986-10-07
Publication date: 1993-01-11
Also published as: JPS6393106A

Description

【発明の詳細な説明】（産業上の利用分野）本発明は、複合電子部品に関し、特に、コンデ
ンサ素子と他の電子部品とを接続した複合電子部
品に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a composite electronic component, and particularly to a composite electronic component in which a capacitor element and other electronic components are connected.

（従来の技術）金属化紙や金属化フイルムを巻回してコンデン
サ素子とし、このコンデンサ素子にダイオードや
抵抗等の電子部品を接続したものを金属ケースに
収納し絶縁油等の含浸剤を含浸した複合電子部品
は、電子レンジ等の電気機器等に多く利用されて
いる。(Prior technology) Metallized paper or film is wound to form a capacitor element, and electronic components such as diodes and resistors are connected to this capacitor element, which is housed in a metal case and impregnated with an impregnating agent such as insulating oil. Composite electronic components are often used in electrical equipment such as microwave ovens.

ところで、従来、このような複合電子部品は、
コンデンサ素子が金属ケースに接触して絶縁不良
とならないように、コンデンサ素子の両端部を絶
縁紙からなるキヤツプで被つている。しかしこの
絶縁紙製のキヤツプはコンデンサ素子両端部への
取り付けが困難である。そのため、代りに、第６
図に示す通りの形状からなる、プラスチツク製の
キヤツプ３０を用いるようになつてきた。 By the way, conventionally, such composite electronic components are
To prevent the capacitor element from contacting the metal case and causing poor insulation, both ends of the capacitor element are covered with caps made of insulating paper. However, this insulating paper cap is difficult to attach to both ends of the capacitor element. Therefore, instead of the sixth
Plastic caps 30 having the shape shown in the figures have come to be used.

このキヤツプ３０は、基板３１の周辺にかつ両
側に側壁３２を設け、基板３１の片面にはコンデ
ンサ素子３３の端面を当接し、他方の面にはダイ
オードや抵抗等の他の電子部品３４及び絶縁紙３
５を介して金属製の蓋３６を当接している。 This cap 30 is provided with side walls 32 on both sides around a substrate 31, and has an end surface of a capacitor element 33 in contact with one side of the substrate 31, and other electronic components 34 such as diodes and resistors and other insulating components on the other side. paper 3
A metal lid 36 is in contact with the metal lid 36 via 5.

（発明が解決しようとする課題）しかし、このような構造のキヤツプ３０ではダ
イオードや抵抗の端子等が絶縁紙３５を介して蓋
３６に密着し易く、この蓋３６との間で放電し易
くなり、耐圧が低下する欠点があつた。(Problem to be Solved by the Invention) However, in the cap 30 having such a structure, terminals of diodes, resistors, etc. tend to come into close contact with the lid 36 through the insulating paper 35, and discharge easily occurs between the cap 30 and the lid 36. However, the drawback was that the withstand voltage decreased.

本発明の目的は、以上の欠点を改良し、耐圧を
向上しうる複合電子部品を提供するものである。 An object of the present invention is to provide a composite electronic component that can improve the above-mentioned drawbacks and improve the withstand voltage.

（課題を解決するための手段）本発明は、上記の目的を達成するために、コン
デンサ素子と他の電子部品を含浸剤とともに金属
ケースに収納した複合電子部品において、基板
と、この基板の周辺にかつ両側に設けた側壁と、
前記基板に設けた他の電子部品を配置できる段部
とからなるプラスチツク製のキヤツプをコンデン
サ素子に被せることを特徴とする複合電子部品を
提供するものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a composite electronic component in which a capacitor element and other electronic components are housed in a metal case together with an impregnating agent. Side walls provided on both sides,
The present invention provides a composite electronic component characterized in that a capacitor element is covered with a plastic cap consisting of a step portion on which other electronic components provided on the substrate can be placed.

また、本発明は、上記の目的を達成するため
に、コンデンサ素子と他の電子部品を含浸剤とと
もに金属ケースに収納した複合電子部品におい
て、基板と、この基板の周辺にかつ両側に設けた
側壁と、前記基板に設けた他の電子部品を配置で
きる段部と、この段部に設けた前記電子部品の端
子部が前記側壁に接触するのを防止できる隔離板
とからなるプラスチツク製のキヤツプをコンデン
サ素子に被せることを特徴とする複合電子部品を
提供するものである。 Further, in order to achieve the above object, the present invention provides a composite electronic component in which a capacitor element and other electronic components are housed in a metal case together with an impregnating agent, including a substrate and side walls provided around and on both sides of the substrate. and a plastic cap consisting of a stepped portion on which other electronic components provided on the board can be placed, and a separator that can prevent the terminal portion of the electronic component provided on this stepped portion from coming into contact with the side wall. The present invention provides a composite electronic component that is characterized by being placed over a capacitor element.

（作用）本発明によれば、他の電子部品をキヤツプの段
部に配置しているため、それ等の端子等がキヤツ
プに押し付けられて、蓋に密着することなく、蓋
との間に空間を保て絶縁距離を長くできるため
に、耐圧を向上できる。(Function) According to the present invention, since other electronic components are arranged on the stepped portion of the cap, their terminals, etc. are pressed against the cap and do not come into close contact with the lid, leaving a space between them and the lid. Since the insulation distance can be maintained and the insulation distance can be increased, the withstand voltage can be improved.

また、段部に隔離板を設け、電子部品の端子部
を側壁から離隔した場合には、隔離板と側壁との
間に含浸剤等が介在するために絶縁距離をより長
くでき、耐圧をより向上できる。 In addition, if a separator is provided at the step to separate the terminal part of the electronic component from the side wall, the insulation distance can be made longer because an impregnating agent is present between the separator and the side wall, and the withstand voltage can be further increased. You can improve.

（実施例）以下、本発明を図示の実施例に基づいて説明す
る。(Examples) The present invention will be described below based on illustrated examples.

第１図及び第２図において、１は金属ケースで
ある。２は、金属化フイルムを巻回したコンデン
サ素子であり、両端面にメタリコン３を形成して
いる。４はメタリコン３に接続したリード線であ
る。５はコンデンサ素子２の上端面に被せたプラ
スチツク製の小判形のキヤツプである。このキヤ
ツプ５は、第３図に示す通り、基板６と、この基
板６に設けたリード線４挿入用の孔７と、基板６
の一部に設けた段部８と、基板６の周辺にかつ両
側に形成した側壁９と、蓋１０側の側壁９の端面
に設けた自由に折り曲げうる舌片１１とからな
る。１２はコンデンサ素子２の下端面に被せたプ
ラスチツク製のキヤツプである。１３は、蓋１０
を貫通するリベツト１４により蓋１０に取り付け
た端子であり、リード線４を接続している。１５
は、ダイオードであり、アノード側を端子１３に
接続し、カソード側を蓋１０に接続している。１
６は、抵抗であり、端子１３に接続している。こ
れ等のダイオード１５と抵抗１６はともにキヤツ
プ５の段部８に配置している。１７はリベツト１
４により端子１２に取り付けた絶縁紙である。こ
の絶縁紙１７と蓋１０との間にはキヤツプ５に設
けた舌片１１を挿入している。１８は、蓋１０に
設けた含浸剤の注入口であり、半田１９により封
止している。金属ケース１内にはこの注入孔１８
から含浸剤を注入し充填している。 In FIGS. 1 and 2, 1 is a metal case. 2 is a capacitor element formed by winding a metallized film, and metallized silicone 3 is formed on both end faces. 4 is a lead wire connected to the metallic contact 3. Reference numeral 5 designates an oval-shaped plastic cap that covers the upper end surface of the capacitor element 2. As shown in FIG. 3, this cap 5 includes a board 6, a hole 7 for inserting the lead wire 4 provided in this board 6, and a board 6.
, a side wall 9 formed around the substrate 6 on both sides, and a freely bendable tongue piece 11 provided on the end surface of the side wall 9 on the lid 10 side. 12 is a plastic cap placed over the lower end surface of the capacitor element 2. 13 is the lid 10
This terminal is attached to the lid 10 by a rivet 14 passing through the terminal, and connects the lead wire 4. 15
is a diode whose anode side is connected to the terminal 13 and whose cathode side is connected to the lid 10. 1
6 is a resistor connected to the terminal 13. Both the diode 15 and the resistor 16 are arranged on the stepped portion 8 of the cap 5. 17 is rivet 1
4 is an insulating paper attached to the terminal 12. A tongue piece 11 provided on the cap 5 is inserted between the insulating paper 17 and the lid 10. Reference numeral 18 denotes an impregnating agent injection port provided in the lid 10 and sealed with solder 19. This injection hole 18 is located inside the metal case 1.
An impregnating agent is injected into the container.

上記の実施例によれば、ダイオード１５と抵抗
１６とをキヤツプ５の段部８に配置するため、蓋
１０を金属ケース１に取り付ける際に蓋１０をキ
ヤツプ５に押し付けてもダイオード１５と抵抗１
６の各端子２７及び２８は絶縁紙１７に密着する
ことなく所定の空間を保持できる。また、ダイオ
ード１５と抵抗１６は、より低い位置に配置する
ため、含浸剤液中に浸漬し、冷却される。 According to the above embodiment, since the diode 15 and the resistor 16 are disposed on the stepped portion 8 of the cap 5, even if the lid 10 is pressed against the cap 5 when attaching the lid 10 to the metal case 1, the diode 15 and the resistor 1
Each of the terminals 27 and 28 of 6 can maintain a predetermined space without coming into close contact with the insulating paper 17. Further, since the diode 15 and the resistor 16 are arranged at a lower position, they are immersed in an impregnating agent liquid and cooled.

また、第４図は、本発明の他の実施例を示し、
第５図にも示す通り、キヤツプ２０の段部２１に
Ｌ字状の隔離板２２を設ける。そしてこの隔離板
２２の位置にダイオード２３のアノード側端子２
４を配置する。また、隔離板２２と側壁２５との
間の空間には含浸剤を充填しており、端子２４と
金属ケース２６の内面との間の絶縁距離をより長
くでき、耐圧を向上できる。なお、隔離板の形状
はアーチ状であつてもよい。 Further, FIG. 4 shows another embodiment of the present invention,
As shown in FIG. 5, an L-shaped separator 22 is provided on the stepped portion 21 of the cap 20. The anode side terminal 2 of the diode 23 is located at the position of this separator 22.
Place 4. Further, the space between the separator 22 and the side wall 25 is filled with an impregnating agent, so that the insulation distance between the terminal 24 and the inner surface of the metal case 26 can be made longer, and the withstand voltage can be improved. Note that the shape of the separator may be arch-like.

（発明の効果）以上の通り、本発明によれば、ダイオードや抵
抗等の電子部品をキヤツプの段部に配置すること
により金属ケースや蓋との絶縁距離を長くでき耐
圧を向上しうるとともに含浸液の冷却効果も利用
でき熱劣化を軽減できる。また、キヤツプの段部
に隔離板を設け、この隔離板の位置に放電をし易
い部品の端子を配置することにより絶縁距離をよ
り長くできるため、より耐圧を向上しうる複合電
子部品が得られる。(Effects of the Invention) As described above, according to the present invention, by arranging electronic components such as diodes and resistors on the stepped portion of the cap, the insulation distance from the metal case and lid can be increased, and the withstand voltage can be improved. The cooling effect of the liquid can also be used to reduce thermal deterioration. In addition, by providing a separator on the stepped portion of the cap and arranging the terminals of components that are prone to discharge at the separator, the insulation distance can be made longer, resulting in a composite electronic component that can further improve voltage resistance. .

[Brief explanation of the drawing]

第１図及び第２図は本発明の実施例の各々正面
断面図及び側面断面図、第３図は本発明の実施例
に用いるキヤツプの斜視図、第４図は本発明の他
の実施例の正面断面図、第５図は第４図の実施例
に用いるキヤツプの平面図、第６図は従来の複合
電子部品の側面断面図を示す。１……金属ケース、２……コンデンサ素子、
５，２０……キヤツプ、８，２１……段部、９，
２５……側壁、１４，２３……ダイオード、１５
……抵抗、２２……隔離板、２７，２８……端
子。 1 and 2 are a front sectional view and a side sectional view of an embodiment of the present invention, FIG. 3 is a perspective view of a cap used in an embodiment of the present invention, and FIG. 4 is another embodiment of the present invention. 5 is a plan view of a cap used in the embodiment of FIG. 4, and FIG. 6 is a side sectional view of a conventional composite electronic component. 1...Metal case, 2...Capacitor element,
5, 20... Cap, 8, 21... Stepped portion, 9,
25... Side wall, 14, 23... Diode, 15
...Resistor, 22...Separator, 27, 28...Terminal.

Claims

[Scope of Claims] 1. A composite electronic component in which a capacitor element and other electronic components are housed together with an impregnating agent in a metal case, comprising a substrate, side walls provided around and on both sides of the substrate, and other components provided on the substrate. 1. A composite electronic component characterized by covering a capacitor element with a plastic cap consisting of a step part on which an electronic component can be placed. 2. In a composite electronic component in which a capacitor element and other electronic components are housed in a metal case together with an impregnating agent, a substrate, side walls provided around the substrate on both sides, and other electronic components provided on the substrate can be arranged. 1. A composite electronic component, characterized in that a capacitor element is covered with a plastic cap made of a stepped portion and a separator that can prevent the terminal portion of the electronic component provided on the stepped portion from coming into contact with the side wall.