JPH0519840B2 - - Google Patents
Info
- Publication number
- JPH0519840B2 JPH0519840B2 JP59069349A JP6934984A JPH0519840B2 JP H0519840 B2 JPH0519840 B2 JP H0519840B2 JP 59069349 A JP59069349 A JP 59069349A JP 6934984 A JP6934984 A JP 6934984A JP H0519840 B2 JPH0519840 B2 JP H0519840B2
- Authority
- JP
- Japan
- Prior art keywords
- cover
- circuit board
- printed circuit
- board
- child
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電気機器分野等に用いられるカバーを
基板等に固定するためのカバー取付方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to a cover mounting method for fixing a cover used in the electrical equipment field to a substrate or the like.
従来の技術
従来よりプリント基板の導通部を絶縁するため
のカバーを基板等に固定する取付方法としては、
接着剤や溶着による方法またはカバーに設けた爪
を基板に差込む方法がとられていた。Conventional technology Conventionally, the mounting method for fixing a cover for insulating the conductive parts of a printed circuit board to a circuit board, etc. is as follows.
A method using adhesive or welding, or a method of inserting a claw provided on the cover into the board has been used.
以下、図面を参照しながら上記のような従来の
カバー取付方法について説明する。 The conventional cover mounting method as described above will be described below with reference to the drawings.
第１図および第２図は従来のカバー取付方法の
内、接着剤や溶着による第１の方法を示すもので
ある。 FIGS. 1 and 2 show a first method of attaching the cover using adhesive or welding.
第３図および第４図は従来のカバー取付方法の
内、カバーに設けた爪を親プリント基板に差し込
み固定する第２の方法を示すものである。 FIGS. 3 and 4 show a second method of conventional cover mounting methods in which claws provided on the cover are inserted into the parent printed circuit board and fixed.
第１図、第２図において１は子プリント基板、
２はカバー、３は親プリント基板、１ａは子プリ
ント基板１に設けられた突起、２ａは子プリント
基板１の突起１ａに挿入される位置決め用の孔、
３ａは子プリント基板１の別の突起１ｂを差込む
ための親プリント基板３に設けられた位置決め用
の孔、Ａは接着剤や溶着代である。 In Figures 1 and 2, 1 is a child printed circuit board;
2 is a cover, 3 is a main printed board, 1a is a protrusion provided on the child printed board 1, 2a is a positioning hole inserted into the protrusion 1a of the child printed board 1,
3a is a positioning hole provided on the parent printed circuit board 3 into which another protrusion 1b of the child printed circuit board 1 is inserted, and A is an adhesive or welding margin.
一方、第３図および第４図の場合において、４
は子プリント基板、５はカバー、６は親プリント
基板、５ａはカバー５に設けられた爪、６ａは親
プリント基板６に設けられた孔、６ｂは親プリン
ト基板６に設けられた子プリント基板４の位置決
め用の突起４ａを差込むための別の孔である。 On the other hand, in the case of Figures 3 and 4, 4
5 is a child printed board, 5 is a cover, 6 is a parent printed board, 5a is a claw provided on the cover 5, 6a is a hole provided in the parent printed board 6, and 6b is a child printed board provided in the parent printed board 6. This is another hole into which the positioning protrusion 4a of No. 4 is inserted.
発明が解決しようとする課題
しかしながら、このような従来の構成では、市
場での電気機器の修理等を行う場合困難であつ
た。Problems to be Solved by the Invention However, with such a conventional configuration, it is difficult to repair electrical equipment in the market.
すなわち、第１の取付方法では、カバー２を子
プリント基板１から取外す場合、先づＡ部分の接
着材や溶着を取外す必要があつた。 That is, in the first attachment method, when removing the cover 2 from the slave printed circuit board 1, it was first necessary to remove the adhesive or welding of the portion A.
また、第２の取付方法では、カバーの爪５ａを
親プリント基板６に差込む方法のため、カバー取
外しの際爪５ａを起して行うことによるサービス
性の悪さ等の問題点を有していた。 In addition, in the second mounting method, the claws 5a of the cover are inserted into the main printed circuit board 6, so there are problems such as poor serviceability due to raising the claws 5a when removing the cover. Ta.
本発明は、このような問題点を解決するもの
で、カバーの子プリント基板からの着脱を容易に
し、市場サービス性の向上した電気機器のカバー
取付方法を提供することを目的としたものであ
る。 The present invention has been made to solve these problems, and aims to provide a method for attaching a cover to an electrical device that facilitates attachment and detachment of the cover from the slave printed circuit board and improves market serviceability. .
課題を解決するための手段
この目的を達成するために本発明のカバー取付
方法は、親プリント基板と、この親プリント基板
に植設された子プリント基板と、この子プリント
基板の上辺側に設けられた突起と、前記子プリン
ト基板を覆うカバーと、このカバーの前記突起と
対向する位置に設けられた第１の孔とを備え、前
記子プリント基板の上辺側には、可とう性の部材
を設けるとともに、前記カバーの前記可とう性部
材と対向する位置に第２の孔を設け、前記可とう
性部材を前記カバーの第２の孔に貫通させ、その
後前記可とう性部材を折曲げて前記カバーを前記
子プリント基板に装着するものである。Means for Solving the Problems In order to achieve this object, the cover mounting method of the present invention includes a main printed circuit board, a child printed board embedded in the parent printed board, and a cover attached on the upper side of the child printed board. a cover that covers the slave printed circuit board; and a first hole provided in a position facing the protrusion of the cover; and a second hole is provided in the cover at a position facing the flexible member, the flexible member is passed through the second hole of the cover, and then the flexible member is bent. The cover is then attached to the slave printed circuit board.
作 用
この構成により、本発明のカバー取付方法は、
子プリント基板の上辺側に設けた可とう性部材
を、カバーの対向した位置に設けた第２の孔に貫
通させて前記カバーが前記子プリント基板から離
脱しないように折曲げる方法であるので、子プリ
ント基板とカバーとの着脱は前記可とう性部材の
折曲げ、あるいは、この折曲げの戻しのみの作業
で極めて簡単に行うことができる。したがつて、
電気機器のサービス性が向上する。Effect With this configuration, the cover mounting method of the present invention
This is a method in which a flexible member provided on the upper side of the secondary printed circuit board is passed through a second hole provided at an opposite position of the cover and bent so that the cover does not separate from the secondary printed circuit board. Attachment and detachment of the secondary printed circuit board and the cover can be carried out extremely easily by simply bending the flexible member or undoing the bending. Therefore,
Serviceability of electrical equipment will improve.
実施例
以下、本発明の一実施例について図面を参照し
ながら説明する。Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第５図および第６図は本発明の一実施例におけ
るカバーとプリント基板の可とう性を有する部材
との関係を示すものである。 5 and 6 show the relationship between the cover and the flexible member of the printed circuit board in one embodiment of the present invention.
第５図および第６図において、７は子プリント
基板、８はその子プリント基板７を覆うカバー、
９は子プリント基板７に固定された可とう性の材
料よりなる部材、１０は上記子プリント基板７を
固定する親プリント基板、８ａはカバー８に複数
個設けられた位置決め用の第１の孔、８ｂは同じ
くカバー８に設けられた上記部材９挿入用の第２
の孔、７ａはカバー８に設けられた位置決め用の
第１の孔８ａへ挿入される突起を示し、この突起
７ａは上記子プリント基板７の上面側に複数個設
けられている。７ｂは子プリント基板７の下面側
に設けられた突起で、この突起７ｂは親プリント
基板１０に設けられた位置決め用の孔１０ａに挿
入される。そして、上記部材９はカバー８の第２
の孔８ｂに挿入された後、曲折することにより子
プリント基板７を覆つたカバー８は親プリント基
板１０に固定される。 In FIGS. 5 and 6, 7 is a child printed board, 8 is a cover that covers the child printed board 7,
9 is a member made of a flexible material fixed to the child printed circuit board 7; 10 is a parent printed board to which the child printed board 7 is fixed; 8a is a plurality of first holes for positioning provided in the cover 8; , 8b is a second hole for inserting the member 9, which is also provided on the cover 8.
The hole 7a indicates a projection inserted into a first positioning hole 8a provided in the cover 8, and a plurality of projections 7a are provided on the upper surface side of the child printed circuit board 7. 7b is a protrusion provided on the lower surface side of the child printed board 7, and this protrusion 7b is inserted into a positioning hole 10a provided in the parent printed board 10. The member 9 is the second member of the cover 8.
After being inserted into the hole 8b, the cover 8 covering the child printed board 7 is fixed to the parent printed board 10 by bending.
以上のように構成された固定の方法を用いるこ
とにより、部材９の曲折を解除すればカバー８が
簡単に取外しができると共に固定強度が一定に保
たれるという本実施例の特有の効果を生むことが
できる。ここで、部材９とそれに対応する第２の
孔８ｂは１個とは限らなく、また突起７ａは１個
でもよいものである。 By using the fixing method configured as described above, the cover 8 can be easily removed by unbending the member 9, and the fixing strength can be kept constant, which is a unique effect of this embodiment. be able to. Here, the number of the member 9 and the corresponding second hole 8b is not limited to one, and the number of the protrusion 7a may be one.
発明の効果
以上のように本発明のカバー取付方法は、子プ
リント基板の上辺側に設けた可とう性部材を、カ
バーの対向した位置に設けた第２の孔に貫通させ
て前記カバーが前記子プリント基板から離脱しな
いように折曲げる方法であるので、子プリント基
板とカバーとの着脱は前記可とう性部材の折曲
げ、あるいは、この折曲げの戻しのみの作業で極
めて簡単に行うことができる。したがつて、電気
機器のサービス性が向上するという効果がある。Effects of the Invention As described above, in the cover mounting method of the present invention, the flexible member provided on the upper side of the child printed board is passed through the second hole provided at the opposite position of the cover, so that the cover is attached to the Since this is a method of bending the cover so that it does not separate from the sub-printed board, attaching and detaching the sub-printed board and the cover can be done extremely easily by simply bending the flexible member or undoing the bending. can. Therefore, there is an effect that the serviceability of electrical equipment is improved.
また接着剤や溶着代が不均一になつたりしてカ
バーの固定強度が一定にならなかつたり、さらに
は接着剤の飛散による美観をそこなうようなこと
はない。 Further, the fixing strength of the cover will not be constant due to non-uniformity of the adhesive or welding thickness, and furthermore, the aesthetic appearance will not be spoiled due to scattering of the adhesive.
更に、カバーと親プリント基板との結合爪を破
損することもない。 Furthermore, the connecting claw between the cover and the parent printed circuit board will not be damaged.
第１図は従来例のカバー取付方法を示す斜視
図、第２図は同分解斜視図、第３図は他の従来例
のカバー取付方法を示す斜視図、第４図は同分解
斜視図、第５図は本発明におけるカバー取付方法
の一実施例を示す斜視図、第６図は同分解斜視図
である。
７……子プリント基板、７ａ……突起、８……
カバー、８ｂ……第２の孔、９……可とう性を有
する部材。
FIG. 1 is a perspective view showing a conventional cover mounting method, FIG. 2 is an exploded perspective view, FIG. 3 is a perspective view showing another conventional cover mounting method, and FIG. 4 is an exploded perspective view. FIG. 5 is a perspective view showing an embodiment of the cover mounting method according to the present invention, and FIG. 6 is an exploded perspective view of the same. 7... Child printed circuit board, 7a... Protrusion, 8...
Cover, 8b...Second hole, 9...Flexible member.
Claims (1)
設された子プリント基板と、この子プリント基板
の上辺側に設けられた突起と、前記子プリント基
板を覆うカバーと、このカバーの前記突起と対向
する位置に設けられた第１の孔とを備え、前記子
プリント基板の上辺側には、可とう性の部材を設
けるとともに、前記カバーの前記可とう性部材と
対向する位置に第２の孔を設け、前記可とう性部
材を前記カバーの第２の孔に貫通させ、その後前
記可とう性部材を折曲げて前記カバーを前記子プ
リント基板に装着するカバー取付方法。1 A parent printed circuit board, a child printed board embedded in the parent printed board, a protrusion provided on the upper side of the child printed board, a cover covering the child printed board, and a cover facing the protrusion of the cover. A flexible member is provided on the upper side of the child printed circuit board, and a second hole is provided in the cover at a position facing the flexible member. A method for attaching a cover, comprising: penetrating the flexible member into a second hole of the cover, and then bending the flexible member to attach the cover to the slave printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59069349A JPS60213092A (en) | 1984-04-06 | 1984-04-06 | Method of mounting cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59069349A JPS60213092A (en) | 1984-04-06 | 1984-04-06 | Method of mounting cover |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60213092A JPS60213092A (en) | 1985-10-25 |
| JPH0519840B2 true JPH0519840B2 (en) | 1993-03-17 |
Family
ID=13399983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59069349A Granted JPS60213092A (en) | 1984-04-06 | 1984-04-06 | Method of mounting cover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60213092A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050024841A1 (en) * | 2003-07-31 | 2005-02-03 | Dobbs Robert William | Circuit board that comprises one or more mounting pins |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542375U (en) * | 1977-06-08 | 1979-01-09 | ||
| JPS5524875U (en) * | 1978-08-07 | 1980-02-18 |
-
1984
- 1984-04-06 JP JP59069349A patent/JPS60213092A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60213092A (en) | 1985-10-25 |
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