JPH0521340B2 - - Google Patents
Info
- Publication number
- JPH0521340B2 JPH0521340B2 JP59280386A JP28038684A JPH0521340B2 JP H0521340 B2 JPH0521340 B2 JP H0521340B2 JP 59280386 A JP59280386 A JP 59280386A JP 28038684 A JP28038684 A JP 28038684A JP H0521340 B2 JPH0521340 B2 JP H0521340B2
- Authority
- JP
- Japan
- Prior art keywords
- heater plate
- thermocompression bonding
- silicone sheet
- workpiece
- crimping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明はフイルム基板と、太陽電池や液晶のガ
ラス面やベーク基板等を熱圧着し、双方の印刷又
は蒸着されたリードを接合する熱圧着装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thermocompression bonding device for thermocompression bonding a film substrate, a glass surface of a solar cell or liquid crystal, a baked substrate, etc., and bonding printed or vapor-deposited leads on both sides. It is something.
従来の技術
近年、熱圧着装置は、フイルム基板の増加とと
もに、フイルムと種々の機能部品（例えば太陽電
池、液晶ガラス等）の熱接合を行なうために必要
欠くべからざるものとなつており、より寿命が長
く補修が簡易な装置が要望されている。Conventional Technology In recent years, with the increase in the number of film substrates, thermocompression bonding equipment has become indispensable for thermally bonding films and various functional parts (e.g. solar cells, liquid crystal glass, etc.), and has become necessary for longer lifespans. There is a need for a device that lasts a long time and is easy to repair.
以下図面を参照しながら、上述した従来の熱圧
着装置の一例について説明する。 An example of the above-mentioned conventional thermocompression bonding apparatus will be described below with reference to the drawings.
第６図は従来の熱圧着装置の断面図を示すもの
である。また第２図は対象ワークの一例で、１は
液晶ガラス、２はフイルム基板である。第３図は
熱圧着後のワークを表わす側面図であり、フイル
ム端３において液晶ガラス１と熱圧着されてい
る。第６図において、４は液晶ガラス１とフイル
ム基板２を位置決め保持するパレツトである。５
は圧着ヒータ板であり、通電ホルダー６に取付け
られている。７は圧着ヒータ板５をバツクアツプ
する押しブロツクであり、シリンダ８によつて上
下可動に設けられている。また通電ホルダー６は
シヤフト９によつて押しブロツク７と連結されて
いる。１０はシリコンシート片であり、接着剤に
て圧着ヒータ板５の先端部に貼付けられている。 FIG. 6 shows a sectional view of a conventional thermocompression bonding device. Further, FIG. 2 shows an example of the target workpieces, in which 1 is a liquid crystal glass and 2 is a film substrate. FIG. 3 is a side view showing the workpiece after thermocompression bonding, in which the film edge 3 is thermocompression bonded to the liquid crystal glass 1. In FIG. 6, reference numeral 4 denotes a pallet for positioning and holding the liquid crystal glass 1 and the film substrate 2. 5
is a crimp heater plate, which is attached to the current-carrying holder 6. Reference numeral 7 denotes a push block for backing up the crimp heater plate 5, and is provided to be movable up and down by a cylinder 8. Further, the energizing holder 6 is connected to the push block 7 by a shaft 9. A silicone sheet piece 10 is attached to the tip of the pressure-bonding heater plate 5 with an adhesive.
以上のように構成された熱圧着装置について以
下その動作について説明する。 The operation of the thermocompression bonding apparatus configured as described above will be explained below.
シリンダ８によつて押しブロツク７が下降し、
同時に圧着ヒータ板５がフイルム基板２に当接す
るまで下降する。フイルタ基板２の表面には凹凸
があるが、シリコンシート片１０の弾性により、
凹凸部が全面液晶ガラス１に押付けられ、圧着ヒ
ータ板５の熱により、液晶ガラス１と、フイルム
基板２が熱圧着されるのである。 The push block 7 is lowered by the cylinder 8,
At the same time, the pressure-bonding heater plate 5 descends until it comes into contact with the film substrate 2. Although there are irregularities on the surface of the filter substrate 2, due to the elasticity of the silicon sheet piece 10,
The uneven portion is pressed against the entire surface of the liquid crystal glass 1, and the liquid crystal glass 1 and the film substrate 2 are thermocompression bonded by the heat of the pressure bonding heater plate 5.
発明が解決しようとする問題点
しかしながら上記のような構成では、シリコン
シート片１０は圧着ヒータ板５に接着されてお
り、熱圧着時以外でもシリコンシート片１０が直
かに圧着ヒータ板５に触れており、劣化が速い。
また接着剤が必要であり、シリコンシート片１０
の劣化、破損のたびに取りかえなければならない
という問題点を有していた。Problems to be Solved by the Invention However, in the above-described configuration, the silicone sheet piece 10 is bonded to the pressure-bonding heater plate 5, and the silicone sheet piece 10 directly touches the pressure-bonding heater plate 5 even during non-thermo-compression bonding. It deteriorates quickly.
Adhesive is also required, and 10 silicone sheet pieces are required.
The problem was that it had to be replaced every time it deteriorated or broke.
本発明は上記問題点に鑑み、シリコンシート片
をいちいち圧着ヒータ板に接着することなく、ま
た劣化がおこりにくく、たとえ劣化したとしても
簡単にシリコンシートのワークとの当接部を移動
することができるような熱圧着装置を提供するも
のである。 In view of the above-mentioned problems, the present invention eliminates the need to bond each piece of silicone sheet to a pressure-bonding heater plate, is less prone to deterioration, and even if it deteriorates, it is possible to easily move the part of the silicone sheet in contact with the workpiece. The purpose of this invention is to provide a thermocompression bonding device that can perform thermal compression bonding.
問題点を解決するための手段
上記問題点を解決するために本発明の熱圧着装
置は、対象ワークの保持部と、上下可動で圧着ヒ
ータ板が付設されている圧着ヘツド部と、保持部
および圧着ヘツド部の中間に位置し、熱圧着時の
み圧着ヒータ板とワークにはさまれる様に設置さ
れ、かつ巻取手段を持つたシリコンシートを備え
たものである。Means for Solving the Problems In order to solve the above-mentioned problems, the thermocompression bonding apparatus of the present invention comprises: a holding part for a target workpiece; a crimping head part which is movable up and down and is attached with a crimping heater plate; It is located in the middle of the crimping head section, is placed between the crimping heater plate and the workpiece only during thermocompression bonding, and is equipped with a silicone sheet having a winding means.
作 用
本発明は上記した構成によつて、従来圧着ヒー
タ板に接着剤でシリコンシートを貼つていたため
に生じるシリコンシートの劣化を抑制し、貼りか
える工数の無駄を低減することとなる。Effects The present invention, with the above-described configuration, suppresses the deterioration of the silicone sheet caused by conventionally pasting the silicone sheet on the pressure-bonded heater plate with an adhesive, and reduces the waste of man-hours for replacing the silicone sheet.
実施例
以下本発明の一実施例の熱圧着装置について、
図面を参照しながら説明する。Example Hereinafter, regarding a thermocompression bonding apparatus according to an example of the present invention,
This will be explained with reference to the drawings.
第１図は本発明の一実施例における熱圧着装置
の断面図を示す。第１図において、１１は液晶ガ
ラス１とフイルム基板２を位置決め保持するパレ
ツトである。１２は圧着ヒータ板であり、通常ホ
ルダー１３に取付けられている。１４は圧着ヒー
タ板１２をバツクアツプする押しブロツクであ
り、シリンダ１５によつて上下可動に設けられて
いる。また通電ホルダー１３はシヤフト１６によ
つて押しブロツク１４と連結されている。１７は
シリコンシートであり、押しブロツク１４と通電
ホルダー１３にそれぞれ取付けられた巻取りロー
ル１８ａ，１８ｂによつて両端部が巻取られ、ま
た非圧着時には圧着ヒータ板１２とワークに接続
せずに垂れ下がる様になつている。 FIG. 1 shows a sectional view of a thermocompression bonding apparatus in an embodiment of the present invention. In FIG. 1, reference numeral 11 denotes a pallet for positioning and holding the liquid crystal glass 1 and film substrate 2. As shown in FIG. Reference numeral 12 denotes a pressure-bonding heater plate, which is normally attached to a holder 13. Reference numeral 14 denotes a push block for backing up the crimp heater plate 12, and is provided so as to be movable up and down by a cylinder 15. Further, the energizing holder 13 is connected to the push block 14 by a shaft 16. 17 is a silicone sheet, both ends of which are wound up by take-up rolls 18a and 18b attached to the push block 14 and the current-carrying holder 13, respectively, and when not crimped, the sheet is not connected to the crimping heater plate 12 and the workpiece. It looks like it's hanging down.
以上のように構成された熱圧着装置について、
以下第４図及び第５図を用いてその動作を説明す
る。第４図は熱圧着時のワーク及び圧着ヘツド部
の斜視図を示し、第５図はその側面図を示すもの
であつて、圧着ヘツド部の下降により、シリコン
シート１７がフイルム端３の熱圧着部を覆う。そ
して圧着ヒータ板１２が下降して、シリコンシー
ト１７をはさみ込んでフイルム端３を加熱、圧着
するのである。熱圧着終了後、圧着ヘツド部が上
昇し、再びシリコンシート１７は圧着ヒータ板１
２より分離した状態を保つことになる。 Regarding the thermocompression bonding device configured as above,
The operation will be explained below using FIGS. 4 and 5. FIG. 4 shows a perspective view of the workpiece and the crimping head during thermocompression bonding, and FIG. 5 shows a side view thereof. cover the area. Then, the pressure-bonding heater plate 12 descends to sandwich the silicone sheet 17 and heat and pressure-bond the film end 3. After the thermocompression bonding is completed, the crimping head portion rises and the silicone sheet 17 is placed on the crimping heater plate 1 again.
2 will maintain a separate state.
以上のように本実施例によれば、ワークを位置
決め保持するパレツト１１と、上下可動で圧着ヒ
ータ板１２の中間に、圧着ヒータ板に接触しない
ようにシリコンシート１７を設け、熱圧着時の
み、圧着ヒータ板１２とワークにはさまれる様に
し、またシリコンシート１７はワークとの当接位
置が自由に変えられる様に、巻取ロール１８ａ，
１８ｂに巻かれて取付けられていることにより、
シリコンシート１７の劣化が抑制され、またシリ
コンシート１７のワークとの当接部がごく簡単に
移動することができる。 As described above, according to this embodiment, the silicone sheet 17 is provided between the pallet 11 that positions and holds the workpiece and the crimp heater plate 12 that is movable up and down so as not to contact the crimp heater plate, and only during thermocompression bonding. The silicone sheet 17 is placed between take-up rolls 18a, 18a and 18a so that it is sandwiched between the crimp heater plate 12 and the workpiece, and the position of contact with the workpiece can be freely changed.
By being wound around and attached to 18b,
Deterioration of the silicone sheet 17 is suppressed, and the contact portion of the silicone sheet 17 with the workpiece can be moved very easily.
発明の効果
以上のように本発明によれば、対象ワークを位
置決め保持する保持部と、上下可動で圧着ヒータ
板が付設されている圧着ヘツド部と、熱圧着時の
み圧着ヒータ板とワークにはさみ込まれる様に設
置されたシリコンシートを設けることにより、熱
によるシリコンシートの劣化が抑制され、またシ
リコンシートのワークとの当接部がごく簡単に移
動できる。そして従来例のようにシリコン片を圧
着ヒータ板に劣化のたびに接着しなければならな
い作業が不要となる。Effects of the Invention As described above, according to the present invention, there is a holding part that positions and holds the target workpiece, a crimping head part that is movable up and down and is attached with a crimping heater plate, and a crimping head part that is attached to the crimping heater plate and the workpiece only during thermocompression bonding. By providing the silicone sheet so as to be inserted into the workpiece, deterioration of the silicone sheet due to heat is suppressed, and the contact portion of the silicone sheet with the workpiece can be moved very easily. Further, unlike the conventional example, the work of adhering a silicone piece to the pressure-bonding heater plate every time it deteriorates is no longer necessary.
第１図は本発明の実施例における熱圧着装置の
断面図、第２図は対象ワークの一例を示す液晶ガ
ラスとフイルム基板の斜視図、第３図は熱圧着後
のワークの側面図、第４図は第１図の熱圧着動作
時の一部斜視図、第５図は第４図の側面図、第６
図は従来の熱圧着装置の断面図である。
１１……パレツト、１２……圧着ヒータ板、１
７……シリコンシート、１８ａ，１８ｂ……巻取
りロール。
Fig. 1 is a cross-sectional view of a thermocompression bonding apparatus in an embodiment of the present invention, Fig. 2 is a perspective view of a liquid crystal glass and a film substrate showing an example of the target workpiece, and Fig. 3 is a side view of the workpiece after thermocompression bonding. Figure 4 is a partial perspective view of the thermocompression bonding operation shown in Figure 1, Figure 5 is a side view of Figure 4, and Figure 6 is a side view of Figure 4.
The figure is a sectional view of a conventional thermocompression bonding device. 11...Pallet, 12...Crimping heater plate, 1
7... Silicon sheet, 18a, 18b... Winding roll.
Claims (1)
と、上下可動で圧着ヒータ板が付設されている圧
着ヘツド部と、上記保持部および圧着ヘツド部の
中間に位置し、熱圧着動作時のみ圧着ヒータ板と
ワークにはさまれる様に設置されたシリコンシー
トを備えたことを特徴とする熱圧着装置。 ２ シリコンシートは巻取手段に取付けられ、シ
リコンシートが、圧着ヘツド部と連動上下するよ
うに付設された特許請求の範囲第１項記載の熱圧
着装置。[Scope of Claims] 1. A holding part that positions and holds a target workpiece, a crimping head part that is movable up and down and is attached with a crimping heater plate, and a crimping head part that is located between the holding part and the crimping head part and that is capable of thermocompression bonding. A thermocompression bonding device characterized by being equipped with a silicone sheet installed so as to be sandwiched between a crimp heater plate and a workpiece only during operation. 2. The thermocompression bonding apparatus according to claim 1, wherein the silicone sheet is attached to a winding means, and the silicone sheet is attached so as to move up and down in conjunction with the compression bonding head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59280386A JPS61158153A (en) | 1984-12-28 | 1984-12-28 | Thermocompression bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59280386A JPS61158153A (en) | 1984-12-28 | 1984-12-28 | Thermocompression bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61158153A JPS61158153A (en) | 1986-07-17 |
| JPH0521340B2 true JPH0521340B2 (en) | 1993-03-24 |
Family
ID=17624297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59280386A Granted JPS61158153A (en) | 1984-12-28 | 1984-12-28 | Thermocompression bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61158153A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999027564A1 (en) | 1997-11-20 | 1999-06-03 | Matsushita Electric Industrial Co., Ltd. | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components |
| JP3889700B2 (en) | 2002-03-13 | 2007-03-07 | 三井金属鉱業株式会社 | COF film carrier tape manufacturing method |
| US7173322B2 (en) | 2002-03-13 | 2007-02-06 | Mitsui Mining & Smelting Co., Ltd. | COF flexible printed wiring board and method of producing the wiring board |
| JP2006142611A (en) * | 2004-11-18 | 2006-06-08 | Nitto Denko Corp | Composite sheet for thermocompression bonding and manufacturing method thereof |
| US7923846B2 (en) | 2007-11-16 | 2011-04-12 | Stats Chippac Ltd. | Integrated circuit package-in-package system with wire-in-film encapsulant |
| WO2010103998A1 (en) * | 2009-03-11 | 2010-09-16 | 信越化学工業株式会社 | Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module |
-
1984
- 1984-12-28 JP JP59280386A patent/JPS61158153A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61158153A (en) | 1986-07-17 |
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