JPH0522322B2 - - Google Patents
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- Publication number
- JPH0522322B2 JPH0522322B2 JP58222187A JP22218783A JPH0522322B2 JP H0522322 B2 JPH0522322 B2 JP H0522322B2 JP 58222187 A JP58222187 A JP 58222187A JP 22218783 A JP22218783 A JP 22218783A JP H0522322 B2 JPH0522322 B2 JP H0522322B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- film
- lubricant
- friction
- phosphate ester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electroplating Methods And Accessories (AREA)
- Contacts (AREA)
Description
【発明の詳細な説明】
技術分野
本発明は液体潤滑剤をすず系めつき膜に塗布し
たコネクタ用すず系めつき接点に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a tin-plated contact for a connector in which a liquid lubricant is applied to a tin-plated film.
技術の背景
コネクタ用接点材料は、一般に摩擦係数が小さ
く、かつ耐久性のある金属めつき膜で、基材金属
の表面を被覆することによつて構成されている。
この構成においても、もしめつき膜が基材金属に
比べて軟らかいならば、めつき膜を適当に薄くす
ることによつてめつき膜の摩擦係数をより一層小
さくすることができる。これは軟らかい金属(こ
こではめつき膜に相当する)の薄膜があたかも潤
滑剤のごとく作用するために生じ、この現象が金
属薄膜潤滑効果として一般に広く知られている。
このような金属薄膜による潤滑効果は、一般に、
軟質金属の薄膜で表面を被覆した硬質金属を相互
に接触させて滑らせる場合に現われる現象であつ
て、摩擦係数は、被覆が厚い場合に比べて小さく
なる。TECHNICAL BACKGROUND Contact materials for connectors are generally constructed by coating the surface of a base metal with a metal plating film that has a low coefficient of friction and is durable.
Even in this configuration, if the plating film is softer than the base metal, the friction coefficient of the plating film can be further reduced by appropriately thinning the plating film. This occurs because the thin film of soft metal (corresponding to the plating film here) acts as if it were a lubricant, and this phenomenon is generally widely known as the metal thin film lubrication effect.
Generally, the lubricating effect of such a thin metal film is
This is a phenomenon that occurs when hard metals whose surfaces are coated with a thin film of soft metal are brought into contact with each other and slid, and the coefficient of friction is smaller than when the coating is thick.
コネクタ用接点材料のめつき膜には、一般に金
を使用しているが、価格の高騰によりすず系金属
の使用が行なわれるようになつた。 Gold is generally used for the plating film of contact materials for connectors, but due to rising prices, tin-based metals have come to be used.
従来技術と問題点
すず系接点の構成は、りん青銅などの基材にニ
ツケルまたは銅などの下地めつき膜を形成した上
に、すず系金属薄膜をめつきする。ここで、すず
系めつき膜は、現在、一般にコネクタ用として用
いられているすず、鉛5重量%を含むすず、鉛10
重量%を含むすず、あるいは鉛40重量%を含むす
ずなど、すべてのすず鉛合金を含む。すずまたは
すず鉛合金は、下地金属より軟らかいので、金属
薄膜潤滑効果を示す。しかし、すずまたはすず鉛
合金は金に比べて摩擦係数が大きく、従つて摩擦
が著しい。接点は挿抜寿命が重要であるので、多
少摩耗してもめつき膜を保持できるように、従来
のすず系接点のコネクタは膜厚を5〜10μmとし
ている。Prior Art and Problems A tin-based contact is constructed by forming a base plating film of nickel or copper on a base material such as phosphor bronze, and then plating a tin-based metal thin film. Here, the tin-based plating film includes tin containing 5% by weight of tin and lead 10%, which is generally used for connectors at present.
Includes all tin-lead alloys, such as tin containing % lead by weight or tin containing 40% lead by weight. Tin or tin-lead alloys are softer than the underlying metal and exhibit a metal thin film lubrication effect. However, tin or tin-lead alloys have a higher coefficient of friction than gold, and therefore cause significant friction. Since the insertion and removal life of contacts is important, conventional connectors with tin-based contacts have a film thickness of 5 to 10 μm so that the plating film can be maintained even after some wear.
またすずの酸化によつてフレツテイング腐食す
る欠点がある。なお金属めつき膜の摩擦を小さく
するため、あるいはフレツテイング腐食を防止す
るために、液体潤滑剤を塗布することが行なわれ
るが、従来の接点では、液体潤滑剤の塗布に際し
て、ずすまたはすず鉛合金めつき膜厚さについて
考慮することはなかつた。 It also has the disadvantage of fretting corrosion due to tin oxidation. Liquid lubricant is applied to reduce the friction of the metal plating film or to prevent fretting corrosion, but in conventional contacts, when applying liquid lubricant, tin or tin-lead is used. No consideration was given to the thickness of the alloy plating film.
発明の目的
本発明の目的は、液体潤滑剤をすずまたはすず
鉛合金めつき膜に塗布したコネクタ用すずまたは
すず鉛合金めつき接点の摩擦係数を低下させるこ
とである。OBJECTS OF THE INVENTION It is an object of the present invention to reduce the coefficient of friction of tin or tin-lead alloy plated contacts for connectors in which a liquid lubricant is applied to the tin or tin-lead alloy plated film.
発明の構成
本発明の上記目的は、すずまたはすず鉛合金め
つき膜の厚みを2〜4μmとし、すず系接点用とし
て最適な液体潤滑剤をすずまたはすず鉛合金めつ
き膜に塗布したことを特徴とするコネクタ用すず
系めつき接点によつて達成される。Structure of the Invention The above object of the present invention is to set the thickness of the tin or tin-lead alloy plating film to 2 to 4 μm, and to coat the tin or tin-lead alloy plating film with a liquid lubricant most suitable for tin-based contacts. This is achieved by the characteristic tin-based plated contacts for connectors.
液体潤滑剤はポリフエニルエーテルを基材と
し、親油基にベンゼン環を有するりん酸エステル
型界面活性剤を0.5重量%以上添加することとす
る。 The liquid lubricant is based on polyphenyl ether, and 0.5% by weight or more of a phosphate ester type surfactant having a benzene ring in the lipophilic group is added.
りん酸エステル型界面活性剤がりん酸モノエス
テル、りん酸ジエステルおよび微量のりん酸トリ
エステルからなる混合物とすることができる。 The phosphate ester type surfactant can be a mixture of a phosphoric monoester, a phosphoric diester, and a trace amount of a phosphoric triester.
たとえば、りん酸モノエステルは下式で表わさ
れ、
またりん酸ジエステルは
で表わされ、ここで、Rは炭素数8〜30のアルキ
ルフエニル基である。 For example, phosphoric acid monoester is represented by the following formula, Also, phosphoric acid diester Here, R is an alkylphenyl group having 8 to 30 carbon atoms.
りん酸エステル型界面活性剤をトリエタノール
アミンて中和して添加することが有利である。 It is advantageous to add the phosphate ester type surfactant after neutralization with triethanolamine.
実施例 1
接点はりん青銅基材に、銅またはニツケルを厚
み2μmにめつきして下地とし、この上にすず膜を
厚み3μmめつきして接点ピンを形成し、荷重150g
を加えて挿抜5回後の摩擦係数を測定した。Example 1 The contact was made by plating copper or nickel to a thickness of 2 μm on a phosphor bronze base material, and a contact pin was formed by plating a tin film to a thickness of 3 μm on top of this, and the load was 150 g.
The friction coefficient was measured after 5 insertions and withdrawals.
第1図において、曲線a,bとも、●印は下地
を銅、○印は下地をニツケルとした。曲線aは、
すずめつき膜に潤滑剤を塗布した接点材料、曲線
bは潤滑剤を塗布しない試料であり、a,bと
も、すず膜厚を変えて試験した。 In FIG. 1, for both curves a and b, the base is copper for the circles marked with black, and the base is nickel for the circles marked with ○. Curve a is
A contact material with a tinned film coated with a lubricant, curve b is a sample without a lubricant applied, and both a and b were tested with different tin film thicknesses.
潤滑剤として、ポリフエニルエーテルに対し、
親油基にベンゼン環を有するりん酸エステル型の
界面活性剤(東邦化学製GAFAC RE−610)を
1重量%添加したものを使用した。この潤滑剤
は、すず系接点用として最適なものの1つであ
る。 For polyphenyl ether as a lubricant,
A phosphoric acid ester type surfactant (GAFAC RE-610 manufactured by Toho Chemical Co., Ltd.) having a benzene ring in its lipophilic group was added in an amount of 1% by weight. This lubricant is one of the best for tin-based contacts.
すず膜厚が1〜4μmの範囲では、摩擦係数が小
さいが、4μmを超えると、曲線a,bとも増加を
始め、曲線aは7μmを、曲線bは5μmを超えると
摩擦係数はほぼ一定の高い値を示す。このよう
に、下地めつき膜がニツケルであつても銅であつ
ても、厚み4μmまでは摩擦係数が同様な傾向を示
す。 The friction coefficient is small when the tin film thickness is in the range of 1 to 4 μm, but when it exceeds 4 μm, both curves a and b begin to increase, and when curve a exceeds 7 μm and curve b exceeds 5 μm, the friction coefficient remains almost constant. Indicates a high value. In this way, whether the base plating film is made of nickel or copper, the coefficient of friction shows the same tendency up to a thickness of 4 μm.
第2図は、第1図のニツケルめつき下地膜に、
すず膜厚を変えてめつきした接点の上に、第1図
と同じ潤滑剤を塗布した試料aと、塗布しない試
料bとについて、挿抜回数5,50,100回後の摩
擦係数を測定した結果を示す。挿抜5回(○印)
は、第1図に示した結果である。挿抜50回(□
印)および100回(×印)後の摩擦係数は、潤滑
剤塗布試料aでは、5回(○印)と変らないが、
潤滑剤を塗布しない場合は、すず膜厚1〜4μmの
試料で、低い摩擦係数は挿抜回数の増加とともに
増加する。これに対して潤滑剤塗布のすずめつき
膜の摩擦係数は、すず膜厚が1〜4μmの範囲では
小さく、4μmを超えると増加を始めることが確認
できた。また、この潤滑剤を塗布したすずめつき
膜の摩擦係数は、挿抜100回後においても、初期
のそれと同等であることを確認した。 Figure 2 shows the nickel plating base film shown in Figure 1.
The friction coefficient was measured after 5, 50, and 100 insertions and withdrawals for sample a, in which the same lubricant as shown in Figure 1 was applied on contacts plated with different tin film thicknesses, and sample b, in which no lubricant was applied. Show the results. Insertion and removal 5 times (○ mark)
are the results shown in FIG. Insertion and removal 50 times (□
The coefficient of friction after 100 times (marked with a mark) and 100 times (marked with an x) is the same as after 5 times (marked with an ○) for lubricant coated sample a, but
When no lubricant is applied, the low friction coefficient increases with the increase in the number of insertions and withdrawals for samples with a tin film thickness of 1 to 4 μm. On the other hand, it was confirmed that the friction coefficient of the tin-plated film coated with lubricant is small when the tin film thickness is in the range of 1 to 4 μm, and begins to increase when the tin film thickness exceeds 4 μm. It was also confirmed that the friction coefficient of the tinted film coated with this lubricant was the same as the initial value even after 100 insertions and withdrawals.
実施例 2
潤滑剤として、実施例1で用いた界面活性剤を
トリエタノールアミンで中和したものを1重量%
添加したポリフエニルエーテルを使用したことの
他は実施例1と同様にして、測定を行つたとこ
ろ、実施例1と同様な結果を得た。なお、この潤
滑剤も、すず系接点用として最適なものの1つで
ある。Example 2 As a lubricant, 1% by weight of the surfactant used in Example 1 was neutralized with triethanolamine.
Measurements were carried out in the same manner as in Example 1 except that the added polyphenyl ether was used, and the same results as in Example 1 were obtained. Note that this lubricant is also one of the most suitable for tin-based contacts.
なお、これらの実施例で、膜厚1μmにおいて
は、挿抜100回後の摩擦痕の一部に下地Ni膜が露
出している部分が観察できた。そこで、膜厚は2
〜4μmが望ましい。 In addition, in these Examples, when the film thickness was 1 μm, a portion where the underlying Ni film was exposed could be observed in a part of the friction trace after 100 insertions and withdrawals. Therefore, the film thickness is 2
~4μm is desirable.
発明の効果
本発明によつて、接点の摩擦を、多数回の挿抜
の後まで低く保持することができ、多数の接点を
有するコネクタでも挿抜力が小さくて済むので、
素子を高密度に実装した電子機器に用いる多ピン
のコネクタを実現することができる。Effects of the Invention According to the present invention, the friction of the contacts can be kept low even after many times of insertion and removal, and the insertion and removal force can be small even in a connector having a large number of contacts.
It is possible to realize a multi-pin connector for use in electronic devices in which elements are mounted at high density.
第1図は、下地めつき膜をニツケル、または銅
としたときにすずめつき膜を有する接点材料の、
潤滑剤の有無に応じて、すずめつき膜厚と摩擦係
数との関係を示すグラフであり、第2図は下地め
つき膜をニツケルとし、すずめつき膜を有する接
点材料の、潤滑剤の有無に応じて、すずめつき膜
と摩擦係数との関係を、挿抜回数を変えて示すグ
ラフである。
a……潤滑剤を塗布した接点試料、b……潤滑
剤を塗布しない接点試料、●……銅めつき下地
膜、5回挿抜後、○……ニツケルめつき下地膜、
5回挿抜後、□……ニツケルめつき下地膜、50回
挿抜後、×……ニツケルめつき下地膜、100回挿抜
後。
Figure 1 shows the contact material with a tin-plated film when the base plating film is nickel or copper.
This is a graph showing the relationship between the tinted film thickness and the coefficient of friction depending on the presence or absence of lubricant. Figure 2 shows the relationship between the tinted film thickness and the coefficient of friction depending on the presence or absence of lubricant. Accordingly, it is a graph showing the relationship between the tinted film and the coefficient of friction by changing the number of insertions and withdrawals. a...Contact sample with lubricant applied, b...Contact sample without lubricant, ●...Copper plating base film, after insertion and removal 5 times, ○...Nickel plating base film,
After 5 insertions and removals, □...Nickel-plated base film, after 50 insertions and removals, ×...Nickel-plated base film, after 100 insertions and removals.
Claims (1)
つき膜を形成し、その上に厚み2〜4μmのすずま
たはすず鉛合金はんだ膜をめつきしてあり、この
はんだめつき膜に、ポリフエニルエーテルを基材
とし、親油基にベンゼン環を有するりん酸エステ
ル型界面活性剤を0.5重量%以上添加した液体潤
滑剤を塗布してあることを特徴とする コネクタ用すず系めつき接点。 2 りん酸エステル型界面活性剤がりん酸モノエ
ステル、りん酸ジエステルおよび微量のりん酸ト
リエステルからなる混合物である、特許請求の範
囲第1項記載のすず系めつき接点。 3 りん酸エステル型界面活性剤をトリエタノー
ルアミンで中和して添加した、特許請求の範囲第
1項記載のすず系めつき接点。[Claims] 1. A nickel or copper underplating film is formed on the contact substrate, and a tin or tin-lead alloy solder film with a thickness of 2 to 4 μm is plated thereon. For connectors, characterized in that a liquid lubricant made of polyphenyl ether as a base material and containing 0.5% by weight or more of a phosphate ester surfactant having a benzene ring in its lipophilic group is applied to the sticky film. Tin-based plated contacts. 2. The tin-based plated contact according to claim 1, wherein the phosphate ester type surfactant is a mixture of a phosphoric acid monoester, a phosphoric diester, and a trace amount of a phosphoric triester. 3. The tin-based plated contact according to claim 1, in which a phosphate ester type surfactant is added after being neutralized with triethanolamine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58222187A JPS60116795A (en) | 1983-11-28 | 1983-11-28 | Tinned contact for connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58222187A JPS60116795A (en) | 1983-11-28 | 1983-11-28 | Tinned contact for connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60116795A JPS60116795A (en) | 1985-06-24 |
| JPH0522322B2 true JPH0522322B2 (en) | 1993-03-29 |
Family
ID=16778517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58222187A Granted JPS60116795A (en) | 1983-11-28 | 1983-11-28 | Tinned contact for connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116795A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012201942A (en) * | 2011-03-25 | 2012-10-22 | Jx Nippon Mining & Metals Corp | Sn OR Sn ALLOY PLATED MATERIAL AND METHOD FOR PRODUCING THE SAME |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11217579A (en) * | 1998-02-04 | 1999-08-10 | Kanto Chem Co Inc | Treatment agent for electrical contacts |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5938316B2 (en) * | 1980-09-09 | 1984-09-14 | アルプス電気株式会社 | Multi-layer plating contacts |
-
1983
- 1983-11-28 JP JP58222187A patent/JPS60116795A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012201942A (en) * | 2011-03-25 | 2012-10-22 | Jx Nippon Mining & Metals Corp | Sn OR Sn ALLOY PLATED MATERIAL AND METHOD FOR PRODUCING THE SAME |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60116795A (en) | 1985-06-24 |
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