JPH0524675B2 - - Google Patents
Info
- Publication number
- JPH0524675B2 JPH0524675B2 JP62272835A JP27283587A JPH0524675B2 JP H0524675 B2 JPH0524675 B2 JP H0524675B2 JP 62272835 A JP62272835 A JP 62272835A JP 27283587 A JP27283587 A JP 27283587A JP H0524675 B2 JPH0524675 B2 JP H0524675B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- chip
- mixed liquid
- sol
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Description
【発明の詳細な説明】
(a) 産業上の利用分野
この発明はLED等の光学素子の製造方法に関
し、特にチツプの封止方法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a method for manufacturing optical elements such as LEDs, and particularly to improvements in a method for sealing chips.
(b) 従来の技術
LEDなどの光学素子においては、チツプ表面
を覆う封止材として従来はもつぱら透光性樹脂
（クリアエポキシ樹脂等）が使用されていた。製
法はたとえば砲弾型のキヤステイングケースにク
リアエポキシ樹脂を流し込んでおき、この中に
LEDチツプがダイボンデイングされ更に金線が
ワイヤボンデイングされたリードフレームを挿入
し、熱硬化させた後キヤステイングケースより引
つ張りだすことによりチツプ周囲をエポキシ樹脂
で封止したり、またはTO―18型ステム電極に
LEDチツプをダイボンデイングし、さらにワイ
ヤボンデイング処理した後クリアエポキシ樹脂を
ステム電極上にポツテイングして熱硬化すること
によつてチツプ周囲を封止するようにしていた。(b) Conventional technology In optical elements such as LEDs, translucent resins (such as clear epoxy resins) have traditionally been used as a sealing material to cover the chip surface. For example, the manufacturing method is to pour clear epoxy resin into a shell-shaped casting case, and then
A lead frame with an LED chip die-bonded and a gold wire wire-bonded is inserted, heat-cured, and then pulled out of the casting case to seal the chip around with epoxy resin, or TO-18 type stem electrode
After die bonding the LED chip and wire bonding, clear epoxy resin was potted onto the stem electrode and cured with heat to seal the area around the chip.
(c) 発明が解決しようとする問題点
しかしながら一般に樹脂材は耐候性の点で問題
がある。特にエポキシ樹脂は紫外線に弱く透明で
あるものが変色したり、クラツクが発生したり、
また長時間の使用中に水分を吸収しチツプ自身に
悪影響を及ぼしたり、更にチツプの熱膨張係数が
樹脂の熱膨張係数と大きく異なつているために、
加熱処理して樹脂を硬化させるときにチツプに過
大な応力が加わりチツプの劣化やワイヤの断線な
どを引き起こす問題があつた。(c) Problems to be Solved by the Invention However, resin materials generally have problems in terms of weather resistance. In particular, epoxy resins are sensitive to ultraviolet rays and transparent materials may discolor or crack.
In addition, moisture may be absorbed during long-term use, which may have a negative effect on the chip itself, and the coefficient of thermal expansion of the chip is significantly different from that of the resin.
When the resin is cured by heat treatment, excessive stress is applied to the chip, causing problems such as chip deterioration and wire breakage.
この発明の目的は、上記の問題を一掃するため
にゾルガラスを加えて耐候性などの機能をアツプ
させたエポキシ樹脂を用いて光学素子を製造する
方法を提供することにある。 An object of the present invention is to provide a method for manufacturing optical elements using an epoxy resin to which sol glass is added to improve functions such as weather resistance, in order to eliminate the above-mentioned problems.
(d) 問題点を解決するための手段
この発明は、エチルシリケートを主成分として
これに有機溶媒を加えたゾル溶液をエポキシ樹脂
に加え、この混合液体で光学素子のチツプ周囲を
被い、ついで加熱処理を行つて縮合硬化させるこ
とを特徴とする。(d) Means for Solving Problems This invention involves adding a sol solution containing ethyl silicate as a main component and adding an organic solvent to the epoxy resin, covering the chip of the optical element with this mixed liquid, and then It is characterized by condensation hardening by heat treatment.
(e) 作用
この発明においては、たとえば上述のキヤステ
イングケースを使用する場合、エチルシリケート
を主成分とした有機高分子のゾル溶液（以下ゾル
ガラスという）をエポキシ樹脂に加え混合液体と
して、これをキヤステイングケース内に入れてか
ら光学素子をその混合液体内に入れる。次に加熱
処理を行つて混合液を熱硬化する。この場合は、
エポキシ樹脂の活性基である―COOH基とゾル
ガラスの反応基である―OH基が熱硬化の縮合の
過程でエステル結合を引き起こし活性基が安定結
合することにより耐水性、耐熱性などのいわゆる
耐候性が著しく向上する要因を作る。(e) Effect In this invention, for example, when using the above-mentioned casting case, a sol solution of an organic polymer mainly composed of ethyl silicate (hereinafter referred to as sol glass) is added to the epoxy resin to form a mixed liquid, and this is used as a casting case. Once placed in the staying case, the optical element is placed in the mixed liquid. Next, heat treatment is performed to thermally harden the mixed liquid. in this case,
The COOH group, which is the active group of the epoxy resin, and the OH group, which is the reactive group of the sol glass, form ester bonds during the condensation process during thermosetting, and the active groups form stable bonds, resulting in so-called weather resistance such as water resistance and heat resistance. Create factors that will significantly improve
なお、ゾルガラスとエポキシ樹脂の混合割合は
エポキシ樹脂の種類により最適条件を選択する
が、ゾルガラス：エポキシ樹脂＝100以内：100
（重量比）の範囲内で決められる。このゾルガラ
スとエポキシ樹脂の混合液は粘度が400〜500cps
程度の粘性液体であるため従来のエポキシ樹脂な
どと同様に扱うことが出来る。そして加熱処理を
行つた後においては縮合硬化するために、樹脂を
使う上において問題となつた耐候性が著しく改善
される。TO―18タイプのLEDを製造する場合も
従来の樹脂を扱う場合と同じような作業となる。
すなわちゾルガラスを加えたエポキシ樹脂の混合
液体をTO―18ヘツダ上にポツテイングし、次い
で加熱処理を行つて硬化させる。 The optimum mixing ratio of sol glass and epoxy resin is selected depending on the type of epoxy resin, but sol glass: epoxy resin = within 100: 100
(weight ratio). This mixed solution of sol glass and epoxy resin has a viscosity of 400 to 500 cps.
Since it is a moderately viscous liquid, it can be handled in the same way as conventional epoxy resins. Since the resin is condensed and cured after heat treatment, the weather resistance, which has been a problem when using resins, is significantly improved. When manufacturing TO-18 type LEDs, the work is similar to when working with conventional resins.
That is, a mixed liquid of epoxy resin with sol glass added is potted onto a TO-18 header, and then heated and cured.
(f) 実施例
実施例として、砲弾型のLED素子の製造方法
について説明する。(f) Example As an example, a method for manufacturing a bullet-shaped LED element will be described.
ゾル化したエチルシリケートとしては、アルカ
リを全く含まないケイ酸モノマーを使用し、有機
高分子からなる溶媒を加える。溶媒としてはたと
えばエタノールやイソプロピルアルコールなどの
混合物が使用される。このゾルガラスは100℃〜
200℃程度の極めて低い温度で縮合硬化してガラ
ス化（ゲル化）する。あらかじめゾルガラスとし
てこのようにして低温度で硬化するようにエチル
シリケートを調整すると、エポキシ樹脂との混合
液体において加熱処理時にチツプに悪影響を及ぼ
すことがない。 As the solized ethyl silicate, a silicic acid monomer containing no alkali is used, and a solvent consisting of an organic polymer is added. For example, a mixture of ethanol, isopropyl alcohol, etc. is used as the solvent. This sol glass is 100℃~
Condensation hardens and vitrifies (gels) at an extremely low temperature of around 200℃. If ethyl silicate is prepared in advance as a sol glass so that it hardens at a low temperature, it will not have an adverse effect on the chips during heat treatment in a mixed liquid with an epoxy resin.
第１図は上記のゾルガラスをエポキシ樹脂に加
え混合液体として、これを使用して砲弾型の
LED素子を製造する方法を説明するための図で
ある。１は有機材料からなるキヤステイングケー
スであり、この中にゾル化した上記混合液体２を
注入する。一方フープ状に成形したリードフレー
ム３にチツプ４をダイボンデイングし、更にワイ
ヤ５をボンデイングしたチツプ部を別に形成して
おく。そしてこのチツプ部を上記溶液２内に挿入
し（第１図に示す状態）、この状態で100℃〜200
℃程度で数時間加熱する。すると混合液体が熱硬
化して完全に固化する。なお封止材にゾルガラス
を加えないエポキシ樹脂のみを使用する場合に
は、有機物のキヤステイングケースとエポキシ樹
脂の濡れ性が良いためにキヤステイングケース１
の内側に予め離形剤を塗布し、さらに相当大きな
引抜きの力で引つ張る必要があつたが、ゾルガラ
スは有機材料との濡れ性がよくないためゾルガラ
スとエポキシ樹脂との混合液体とした場合はエポ
キシ樹脂のみの場合に比し加熱処理後キヤステイ
ングケース１から比較的容易に引き出すことがで
きる。 Figure 1 shows the above-mentioned sol glass added to epoxy resin to form a mixed liquid.
FIG. 3 is a diagram for explaining a method of manufacturing an LED element. Reference numeral 1 denotes a casting case made of an organic material, into which the above-mentioned mixed liquid 2 which has been turned into a sol is injected. On the other hand, a chip 4 is die-bonded to a lead frame 3 formed into a hoop shape, and a chip portion to which a wire 5 is further bonded is separately formed. Then, insert this tip part into the above solution 2 (the state shown in Figure 1), and in this state
Heat at around ℃ for several hours. The mixed liquid is then thermally cured and completely solidified. In addition, when using only epoxy resin without adding sol glass as a sealing material, casting case 1 is used because the organic material has good wettability with the epoxy resin.
It was necessary to apply a mold release agent to the inside of the mold in advance and then pull it out with a considerable pulling force, but since sol glass does not have good wettability with organic materials, a mixed liquid of sol glass and epoxy resin was used. can be pulled out from the casting case 1 relatively easily after heat treatment, compared to the case where only epoxy resin is used.
本実施例で機能アツプ材として使用するゾルガ
ラスを熱硬化させて得たゲルガラスは、熱膨張係
数が５×10-6（１／℃）と、LEDチツプ素材であ
るGaAsの熱膨張ケース（６、８×10-6（１／℃）
に近いため、エポキシ樹脂との混合液体とするこ
とにより熱硬化時の膨張係数の差によるLEDチ
ツプに与える応力歪みの影響がエポキシ樹脂のみ
を使用する場合に比べ小さく、チツプに及ぼすス
トレスを緩和することができる。 The gel glass obtained by thermosetting the sol glass used as the functional enhancement material in this example has a thermal expansion coefficient of 5 × 10 -6 (1/℃), and the thermal expansion case of GaAs, which is the LED chip material (6, 8×10 -6 (1/℃)
Since the liquid is close to that of epoxy resin, by creating a mixed liquid with epoxy resin, the effect of stress and strain on the LED chip due to the difference in expansion coefficient during heat curing is smaller than when using only epoxy resin, reducing stress on the chip. be able to.
第２図はTO―18型のLED素子を示している。
このLED素子の製造も、エポキシ樹脂を使用す
る場合と同様に、図外のデイスペンサに上記ゾル
ガラスとエポキシ樹脂との混合液体を用意し、
LEDチツプとワイヤのボンデイングされたヘツ
ダ６の上に上記デイスペンサによつて適当量をポ
ツテイングする。そして100〜200℃程度で数時間
ほど加熱して硬化する。 Figure 2 shows a TO-18 type LED element.
In manufacturing this LED element, as in the case of using epoxy resin, a mixed liquid of the above-mentioned sol glass and epoxy resin is prepared in a dispenser (not shown).
An appropriate amount is potted onto the header 6 where the LED chip and wire are bonded using the dispenser. It is then heated at 100 to 200 degrees Celsius for several hours to harden.
上記のように簡単な工程によつてLEDチツプ
の封止を行うことができ、しかも封止剤としては
耐候性に非常に優れた、ゾルガラスとエポキシ樹
脂の混合液体を使用するために直射日光のもとで
も長期間の使用が可能になる。 As mentioned above, LED chips can be encapsulated through a simple process, and because the encapsulating agent is a mixed liquid of sol glass and epoxy resin, which has excellent weather resistance, it is protected against direct sunlight. It can be used for a long period of time even under the original conditions.
なお本発明はLED素子の他ホトダイオードな
どの受光素子にも勿論適用することができる。 Note that the present invention can of course be applied to light receiving elements such as photodiodes in addition to LED elements.
(g) 発明の効果
以上のようにこの発明によれば、常温でエチル
シリケートを主成分としたゾルガラスとエポキシ
樹脂の混合粘性液体を使用するために作業性が非
常に良い。また、この混合液体は100℃〜200℃程
度の熱処理で硬化させることができる。このよう
に比較的低温で硬化できるチツプへの悪影響を防
ぐことができ、品質を悪化させない。また、ゾル
ガラスはもともと有機材料との漏れ性がよくない
ために、本発明のようにエポキシ樹脂との混合液
体を有機材料からなるキヤステイングケースに入
れて封止材の成形を行う場合には、エポキシ樹脂
のみを使用する場合に比べて成形部をキヤステイ
ングケースから容易に引き出すことができる。加
熱処理後一旦固化すれば、封止材料が機能アツプ
するために従来のような樹脂で生じた耐候性が悪
いといつた問題を大きく改善できる。すなわち長
期の使用中に、特に高温で且つ太陽直射光のもと
で長時間使用しても封止材の変色やクラツク発生
を生じることがなく、また水分を吸収してチツプ
劣化を引き起こすこともない。すなわち耐候性に
優れたものとなる。このため太陽直射光のもとで
直接使用することができ封止材を樹脂で形成した
光学素子を室外使用する場合に必要であつたカー
ボネート板などを設ける必要がなくなるなど、発
行装置全体を低コストで簡単な構成にすることが
できる。(g) Effects of the Invention As described above, according to the present invention, workability is very good because a viscous liquid mixture of sol glass and epoxy resin, which is mainly composed of ethyl silicate, is used at room temperature. Moreover, this mixed liquid can be hardened by heat treatment at about 100°C to 200°C. In this way, it is possible to prevent adverse effects on the chips, which can be cured at relatively low temperatures, and the quality does not deteriorate. Furthermore, since sol glass originally has poor leakage properties with organic materials, when molding a sealing material by placing a mixed liquid with an epoxy resin in a casting case made of an organic material as in the present invention, The molded part can be pulled out from the casting case more easily than when only epoxy resin is used. Once the sealing material is solidified after heat treatment, the functionality of the sealing material is increased, which greatly improves the problem of poor weather resistance caused by conventional resins. In other words, during long-term use, especially at high temperatures and under direct sunlight, the encapsulant will not discolor or crack, and it will not absorb moisture and cause chip deterioration. do not have. In other words, it has excellent weather resistance. As a result, it can be used directly under direct sunlight, and there is no need to install a carbonate plate, etc., which is necessary when using an optical element whose sealant is made of resin outdoors, making the entire issuing device much cheaper. It can be configured easily and at low cost.
第１図、第２図は本発明によつてLED素子を
製造する方法について説明するための図である。
FIGS. 1 and 2 are diagrams for explaining a method of manufacturing an LED element according to the present invention.
Claims (1)
機溶媒を加えたゾル溶液をエポキシ樹脂に加え、
この混合液体で光学素子のチツプ周囲を被い、つ
いで加熱処理を行つて縮合硬化させることを特徴
とする光学素子の製造方法。1. Adding a sol solution containing ethyl silicate as the main component and adding an organic solvent to the epoxy resin,
A method for producing an optical element, which comprises covering the chip of the optical element with this mixed liquid, and then performing a heat treatment to condense and harden it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62272835A JPH01115129A (en) | 1987-10-28 | 1987-10-28 | Manufacture of optical element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62272835A JPH01115129A (en) | 1987-10-28 | 1987-10-28 | Manufacture of optical element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01115129A JPH01115129A (en) | 1989-05-08 |
| JPH0524675B2 true JPH0524675B2 (en) | 1993-04-08 |
Family
ID=17519437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62272835A Granted JPH01115129A (en) | 1987-10-28 | 1987-10-28 | Manufacture of optical element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115129A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008005936A1 (en) * | 2008-01-24 | 2009-07-30 | Osram Opto Semiconductors Gmbh | Optoelectronic arrangement |
| JP2008208380A (en) * | 2008-05-26 | 2008-09-11 | Nippon Electric Glass Co Ltd | Luminescent color-converting member |
| JP5190680B2 (en) * | 2008-05-26 | 2013-04-24 | 日本電気硝子株式会社 | Luminescent color conversion member |
| JP6100140B2 (en) * | 2013-10-30 | 2017-03-22 | 愛三工業株式会社 | Liquid level detector |
-
1987
- 1987-10-28 JP JP62272835A patent/JPH01115129A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01115129A (en) | 1989-05-08 |
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