JPH0525835B2 - - Google Patents
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- Publication number
- JPH0525835B2 JPH0525835B2 JP2064599A JP6459990A JPH0525835B2 JP H0525835 B2 JPH0525835 B2 JP H0525835B2 JP 2064599 A JP2064599 A JP 2064599A JP 6459990 A JP6459990 A JP 6459990A JP H0525835 B2 JPH0525835 B2 JP H0525835B2
- Authority
- JP
- Japan
- Prior art keywords
- molecular beam
- beam source
- crucible
- source material
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、分子線エピタキシ装置の改良に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to improvements in molecular beam epitaxy equipment.
分子線エピタキシ装置は、急峻な界面及び高度
な膜厚制御性を要求される半導体素子用エピタキ
シヤル装置として重要視されており、従来の分子
線エピタキシ装置として第3図に示すものがあつ
た。図において、分子線エピタキシ装置は、反応
室であるベルジヤ12と、これの内部に収容され
た、分子線源るつぼ1、基板2を昇温加熱するた
めの基板ホルダー3、及び不純物ガスを吸着させ
るための液体窒素冷却トラツプ4a,4bと、上
記ベルジヤ12に接続された、真空排気系5、リ
ークバルブ6,及び基板移送用ゲートバルブ7a
とを備えている。また上記分子線源るつぼ1は加
熱用ヒータ8,熱電対9及び熱放射板10aを備
え、該るつぼ1内を所望の温度に制御できる構造
になつている。またこの分子線源るつぼ1にはる
つぼフランジ11が取り付けられており、このる
つぼフランジ11はベルジヤ12に固着されたる
つぼ用ポートフランジ13に着脱可能に取付られ
ている。
Molecular beam epitaxy equipment is regarded as important as an epitaxial equipment for semiconductor devices that requires a steep interface and high controllability of film thickness, and a conventional molecular beam epitaxy equipment is shown in FIG. 3. In the figure, the molecular beam epitaxy apparatus includes a bell jar 12 which is a reaction chamber, a molecular beam source crucible 1 housed inside this, a substrate holder 3 for heating a substrate 2, and a substrate holder 3 for adsorbing impurity gas. liquid nitrogen cooling traps 4a and 4b, a vacuum exhaust system 5, a leak valve 6, and a substrate transfer gate valve 7a connected to the bell gear 12.
It is equipped with Further, the molecular beam source crucible 1 is equipped with a heating heater 8, a thermocouple 9, and a heat radiation plate 10a, and has a structure in which the inside of the crucible 1 can be controlled to a desired temperature. Further, a crucible flange 11 is attached to this molecular beam source crucible 1, and this crucible flange 11 is detachably attached to a crucible port flange 13 fixed to a bell gear 12.
上記従来の分子線エピタキシ装置において、分
子線源材料14を分子線源るつぼ1に充填する場
合は、リークバルブ6から窒素ガスをベルジヤ1
2内に導入して真空を破り、分子線源るつぼ1
を、るつぼフランジ11をるつぼ用ポートフラン
ジ13から取り外すことにより大気中に取り出
し、大気中で分子線源材料14を分子線源るつぼ
1内に充填していた。 In the conventional molecular beam epitaxy apparatus described above, when filling the molecular beam source crucible 1 with the molecular beam source material 14, nitrogen gas is supplied from the leak valve 6 to the bell jar 1.
Break the vacuum by introducing the molecular beam into the molecular beam source crucible 1.
was taken out into the atmosphere by removing the crucible flange 11 from the crucible port flange 13, and the molecular beam source material 14 was filled into the molecular beam source crucible 1 in the atmosphere.
従来の分子線エピタキシ装置は以上のように構
成されているため、以下の欠点があつた。
Since the conventional molecular beam epitaxy apparatus is configured as described above, it has the following drawbacks.
() 真空を破ることにより、分子線源るつぼ
1,基板ホルダー3,液体窒素冷却トラツプ4
a,4b等の構成部材が汚染され、エピタキシ
ヤル膜の結晶性及び再現性に悪影響を及ぼす。() By breaking the vacuum, the molecular beam source crucible 1, substrate holder 3, liquid nitrogen cooling trap 4
Components such as a and 4b are contaminated, which adversely affects the crystallinity and reproducibility of the epitaxial film.
() 真空を破つた後再び結晶成長開始までに必
要な工程、即ちベルジヤ12のベーキング、分
子線源るつぼ1及び分子線源材料14の真空熱
処理等の工程により、均一週間の成長準備期間
を必要とするため、生産能率が低い。() A growth preparation period of a uniform week is required due to the steps necessary to start crystal growth again after breaking the vacuum, that is, baking the bell jar 12, vacuum heat treatment of the molecular beam source crucible 1 and the molecular beam source material 14, etc. Therefore, production efficiency is low.
() 分子線源材料14の大気中での汚染物質は
真空熱処理だけでは完全には除去されず、この
問題は特に族元素の酸化物において顕著であ
り、さらに熱処理中の不純物ガスが成長を行な
うチヤンバー内に放出され、これらはエピタキ
シヤル膜の結晶性を悪くするとともにエピタキ
シヤル膜の表面の欠陥の原因ともなる。() Contaminants in the atmosphere of the molecular beam source material 14 cannot be completely removed by vacuum heat treatment alone, and this problem is particularly noticeable for oxides of group elements, and furthermore, impurity gases during heat treatment cause growth. Released into the chamber, these impair the crystallinity of the epitaxial film and also cause defects on the surface of the epitaxial film.
本発明はこのような従来の問題点を解決するた
めになされたもので、成長室内を大気にさらすこ
となくエピタキシヤル成長ができ、エピタキシヤ
ル膜の再現性、生産能率を向上でき、かつ該エピ
タキシヤル膜の品質を大きく向上できる分子線エ
ピタキシ装置を提供することを目的としている。 The present invention has been made to solve these conventional problems, and it is possible to perform epitaxial growth without exposing the inside of the growth chamber to the atmosphere, improve the reproducibility and production efficiency of epitaxial films, and improve the production efficiency of epitaxial films. The purpose of the present invention is to provide a molecular beam epitaxy device that can greatly improve the quality of the coating film.
本発明は、分子線エピタキシ装置において、真
空熱処理もしくは水素雰囲気内での熱処理により
高純度化した分子線源材料をエアーロツク方式に
より大気にさらすことなく分子線源るつぼに充填
する分子線源材料処理装置を設けたものである。
The present invention is a molecular beam epitaxy device in which a molecular beam source material highly purified by vacuum heat treatment or heat treatment in a hydrogen atmosphere is filled into a molecular beam source crucible using an air lock method without being exposed to the atmosphere. It has been established.
本発明に係る分子線エピタキシ装置では、分子
線源材料は、分子線源材料を高純度化するための
専用装置もしくは反応室と別に設けられた分子線
源供給装置内において予め高純度化され、しかる
後大気に触れることなく反応室内の分子線源るつ
ぼ内に充填される。
In the molecular beam epitaxy apparatus according to the present invention, the molecular beam source material is highly purified in advance in a dedicated device for highly purifying the molecular beam source material or in a molecular beam source supply device provided separately from the reaction chamber, Thereafter, it is filled into a molecular beam source crucible in a reaction chamber without being exposed to the atmosphere.
以下、この発明の実施例を分子線源材料として
Gaを例に取り図を用いて説明する。
Examples of this invention will be described below as molecular beam source materials.
This will be explained using a diagram, taking Ga as an example.
第1図及び第2図は本発明の一実施例を示す。
図において、第3図と同一符号は同一又は相当部
分を示し、30は分子線源供給装置であり、これ
の密閉容器である分子線源処理室16はゲート弁
7bを介してベルジヤ12に接続されている。2
0は真空排気バルブ、21は分子線源処理用るつ
ぼ取り出しポート、19は上記処理室16内に水
素ガスを供給するためのガス供給装置であり、こ
れは水素導入バルブ19a,水素放出バルブ19
bからなる。 1 and 2 show an embodiment of the present invention.
In the figure, the same reference numerals as in FIG. 3 indicate the same or equivalent parts, 30 is a molecular beam source supply device, and the molecular beam source processing chamber 16, which is a closed container thereof, is connected to the bell gear 12 via a gate valve 7b. has been done. 2
0 is a vacuum exhaust valve, 21 is a crucible extraction port for molecular beam source processing, and 19 is a gas supply device for supplying hydrogen gas into the processing chamber 16, which includes a hydrogen introduction valve 19a and a hydrogen discharge valve 19.
Consists of b.
また上記分子線源処理室16内には処理用るつ
ぼ15と、このるつぼ15に入れられた分子線源
材料14と熱処理するためのPBN製昇温炉17
a,昇温ヒータ17b、熱放射板17cからなる
加熱装置17及び熱処理中の放出ガスを吸着する
ための液体窒素トラツプ4cが配設されている。
そして上記処理用るつぼ15の底部には、小孔1
5aが形成されており、これは上記分子線源材料
14が溶融した際にこれを上記分子線源るつぼ1
内に落下させるためのものである。 Also, in the molecular beam source processing chamber 16, there is a processing crucible 15, and a PBN heating furnace 17 for heat-treating the molecular beam source material 14 placed in the crucible 15.
A heating device 17 consisting of a heating heater 17b, a heat radiation plate 17c, and a liquid nitrogen trap 4c for adsorbing gas released during heat treatment are provided.
A small hole 1 is provided at the bottom of the processing crucible 15.
5a is formed, which means that when the molecular beam source material 14 is melted, it is transferred to the molecular beam source crucible 1.
It is intended to be dropped inside.
また22aは上記処理用るつぼ15を移動する
移動棒であり、これは内部磁石22bと接続され
ており、またこの内部磁石22bは外部磁石22
cと磁気的に結合され、外部磁石22cを移動す
ることにより処理用るつぼ15を移動するるつぼ
挿入装置22が構成されている。 Further, 22a is a moving rod that moves the processing crucible 15, and this is connected to an internal magnet 22b, and this internal magnet 22b is connected to an external magnet 22.
A crucible insertion device 22 is magnetically coupled to the processing crucible 15 and moves the processing crucible 15 by moving the external magnet 22c.
次に動作について説明する。 Next, the operation will be explained.
まず分子線源材料を高純度化するには、取り出
しポート21を開いて処理用るつぼ15を取り出
し、これに分子線源材料14であるGaを充填し、
この処理用るつぼ15を再び処理室16中にセツ
トする。そして真空バルブ20を開いて処理室1
6を10-9torr台の真空度まで排気し、排気後昇温
ヒータ17bに電流を流して蒸発源材料Gaが約
950℃になるまで昇温する。約1時間経過後水素
導入バルブ19aを開いて水素ガスを該処理室1
6内に導入し、これと同時に真空排気バルブ20
を閉じる。そして分子線源処理室16の水素ガス
圧が大気圧以上になつた時に水素放出バルブ19
bを開く。その後Gaの量に応じた、例えば
Ga10gに対して24時間の熱処理を行なう。所定時
間経過後昇温ヒータ17bへの通電をやめ蒸発源
材料Gaを冷却して固化させれば、これにより該
分子線源材料14は高純度化されたこととなる。
その後水素放出バルブ19bを閉じ、さらに水素
導入バルブ19aをも閉じ、再び真空排気バルブ
20をいて分子線源処理室16を10-9torr台まで
排気する。 First, in order to highly purify the molecular beam source material, open the extraction port 21 and take out the processing crucible 15, fill it with Ga which is the molecular beam source material 14,
This processing crucible 15 is set in the processing chamber 16 again. Then, open the vacuum valve 20 and
6 is evacuated to a degree of vacuum on the order of 10 -9 torr, and after evacuation, a current is applied to the temperature rising heater 17b until the evaporation source material Ga is approximately
Raise the temperature until it reaches 950℃. After about 1 hour, open the hydrogen introduction valve 19a to supply hydrogen gas to the processing chamber 1.
6, and at the same time open the vacuum exhaust valve 20.
Close. When the hydrogen gas pressure in the molecular beam source processing chamber 16 exceeds atmospheric pressure, the hydrogen release valve 19
Open b. Then depending on the amount of Ga, e.g.
Heat treatment is performed on 10 g of Ga for 24 hours. After a predetermined period of time has elapsed, the supply of electricity to the temperature-raising heater 17b is stopped and the evaporation source material Ga is cooled and solidified, thereby making the molecular beam source material 14 highly purified.
Thereafter, the hydrogen release valve 19b is closed, and the hydrogen introduction valve 19a is also closed, and the vacuum exhaust valve 20 is turned on again to evacuate the molecular beam source processing chamber 16 to a level of 10 -9 torr.
次に上記高純度化された分子線源材料14を分
子線源るつぼ1内に充填するには、上記処理室1
6内を排気後分子線源移送用ゲートバルブ7bを
開き、外部磁石22cを操作することにより処理
用るつぼ15を分子線源るつぼ1内に挿入する。
そして加熱用ヒータ18を通電することにより分
子線源るつぼ1内の温度をGaの融点以上に昇温
する。すると液化されたGaは処理用るつぼ15
の底部に設けられた小孔15aから落下し、分子
線源るつぼ1内に充填される(第2図参照)。充
填後外部磁石22cを操作して処理用るつぼ15
を分子線源処理室16にもどし、分子線源移送用
ゲートバルブ7bを閉じると、これにより分子線
源材料の填は完了したこととなる。 Next, in order to fill the molecular beam source crucible 1 with the highly purified molecular beam source material 14, the processing chamber 1 is filled with the highly purified molecular beam source material 14.
6 is evacuated, the molecular beam source transfer gate valve 7b is opened, and the processing crucible 15 is inserted into the molecular beam source crucible 1 by operating the external magnet 22c.
Then, by energizing the heater 18, the temperature inside the molecular beam source crucible 1 is raised to a temperature higher than the melting point of Ga. Then, the liquefied Ga is transferred to the processing crucible 15.
It falls through a small hole 15a provided at the bottom of the molecular beam source crucible 1 and is filled into the molecular beam source crucible 1 (see FIG. 2). After filling, operate the external magnet 22c to open the processing crucible 15.
When the molecular beam source material is returned to the molecular beam source processing chamber 16 and the molecular beam source transfer gate valve 7b is closed, the loading of the molecular beam source material is completed.
このような本実施例では、密閉された処理室1
6において分子線源材料を予め高純度化し、これ
を大気に触れることなく分子線源るつぼ1内に供
給するようにしたので、以下の効果がある。 In this embodiment, the sealed processing chamber 1
In step 6, the molecular beam source material is highly purified in advance and is supplied into the molecular beam source crucible 1 without being exposed to the atmosphere, resulting in the following effects.
() ベルジヤ12内に大気が導入されることは
なく、従つて該ベルジヤ12内の構成部材が汚
染されるのを防止でき、エピタキシヤル膜の結
晶性、再現性に悪影響を及ぼすことはない。() Atmospheric air is not introduced into the bell gear 12, and therefore the constituent members in the bell gear 12 can be prevented from being contaminated, and the crystallinity and reproducibility of the epitaxial film will not be adversely affected.
() 結晶成長の再開までに必要な準備工程を大
幅に削減でき、生産能率を向上できる。() The preparatory steps required before restarting crystal growth can be significantly reduced, improving production efficiency.
() 分子線源材料が大気汚染されることはな
く、またベルジヤ12内で熱処理する必要もな
く、従つて汚染物質がベルジヤ12内に持ち込
まれたり、不純物ガスが該ベルジヤ12内に放
出されたりすることはないので、エピタキシヤ
ル膜の結晶性の低下、表面欠陥の発生を防止で
きる。() The molecular beam source material is not contaminated with the atmosphere, and there is no need for heat treatment within the bell gear 12, so that no contaminants are brought into the bell gear 12 or impurity gases are released into the bell gear 12. Therefore, deterioration of the crystallinity of the epitaxial film and generation of surface defects can be prevented.
なお、上記実施例では族元素を例にとつて説
明したが、本発明は上記族元素に限らずすべて
の元素を使用でき、族以外の分子線源材料は分
子線源るつぼ1内で溶融することなく固体のまま
充填されることとなる。 Although the above embodiments have been explained using group elements as examples, the present invention is not limited to the above-mentioned group elements and can use all elements, and molecular beam source materials other than the group elements are melted in the molecular beam source crucible 1. It will be filled as a solid without any problems.
また、上記実施例では水素雰囲気中で熱処理し
たが、水素処理を必要としない分子線源材料、例
えばAs,P等においては、分子線源処理室16
で真空加熱により高純度化すればよく、またその
処理温度は分子線源材料の酸化物を蒸発できる温
度に設定すればよい。 In addition, in the above embodiment, heat treatment was performed in a hydrogen atmosphere, but for molecular beam source materials that do not require hydrogen treatment, such as As and P, the molecular beam source processing chamber 16
High purity may be achieved by vacuum heating, and the processing temperature may be set to a temperature that allows evaporation of the oxide of the molecular beam source material.
また、予め高純度化された分子線源材料を分子
線源処理室16中の処理用るつぼ15に充填する
場合には、分子線源充填後、分子線源処理室16
を所定の真空度に排気後、熱処理することなく直
ちに分子線源るつぼ1に導入してもよい。 In addition, when filling the processing crucible 15 in the molecular beam source processing chamber 16 with molecular beam source material that has been highly purified in advance, after filling the molecular beam source material, the molecular beam source processing chamber 16
After being evacuated to a predetermined degree of vacuum, it may be immediately introduced into the molecular beam source crucible 1 without heat treatment.
さらにまた、本発明の考え方は分子線エピタキ
シに限らず、真空蒸着、電子ビーム蒸着、スパツ
タリング蒸着等における蒸着源高純度化にも適用
できるものである。 Furthermore, the concept of the present invention is applicable not only to molecular beam epitaxy but also to the purification of a deposition source in vacuum evaporation, electron beam evaporation, sputtering evaporation, and the like.
以上のように、この発明に係る分子線エピタキ
シ装置によれば、高純度化された分子線源材料を
大気にさらすことなく充填する分子線源処理装置
を設けたので、成長室内を大気にさらすことのな
いエピタキシヤル成長が可能となり、エピタキシ
ヤル成長の再現性、量産性を向上でき、かつ高品
質で表面欠陥の少ないエピタキシヤル膜を製造す
ることができる効果がある。
As described above, according to the molecular beam epitaxy apparatus according to the present invention, since the molecular beam source processing apparatus is provided that fills highly purified molecular beam source material without exposing it to the atmosphere, the inside of the growth chamber is exposed to the atmosphere. This has the effect of making it possible to perform epitaxial growth without any problems, improving the reproducibility of epitaxial growth and mass productivity, and producing a high-quality epitaxial film with few surface defects.
第1図はこの発明の一実施例による分子線エピ
タキシ装置の断面図、第2図はその分子線源材料
の分子線源るつぼへの充填状態を示す図、第3図
は従来の分子線エピタキシ装置の断面図である。
1……分子線源るつぼ、2……基板、7b……
ゲート弁(開閉蓋)、12……ベルジヤ(反応
室)、14……分子線源材料、15……処理用る
つぼ、15a……小孔、16……分子線源処理室
(密閉容器)、17……加熱装置、19……雰囲気
ガス供給装置、22……るつぼ挿入装置、30…
…分子線源供給装置。
FIG. 1 is a sectional view of a molecular beam epitaxy apparatus according to an embodiment of the present invention, FIG. 2 is a diagram showing the filling state of the molecular beam source material into a molecular beam source crucible, and FIG. 3 is a diagram showing a conventional molecular beam epitaxy apparatus. FIG. 2 is a cross-sectional view of the device. 1... Molecular beam source crucible, 2... Substrate, 7b...
Gate valve (opening/closing lid), 12... Belgear (reaction chamber), 14... Molecular beam source material, 15... Processing crucible, 15a... Small hole, 16... Molecular beam source processing chamber (closed container), 17... Heating device, 19... Atmospheric gas supply device, 22... Crucible insertion device, 30...
...Molecular beam source supply device.
Claims (1)
を基板上に結晶成長させる分子線エピタキシ装置
において、 上記基板を上記反応室へ搬送するためのポート
と、 上記反応室とゲート弁を介して接続された密閉
容器、 該密閉容器内に配設され、上記分子線源材料を
収容し溶解して分子線源るつぼ内に落下させる必
要のある分子線源材料に対する小孔をその底部に
有する処理用るつぼ、 上記密閉容器内に水素ガスを供給する雰囲気ガ
ス供給装置、 上記密閉容器内に設けられ上記処理用るつぼを
加熱する加熱装置、 上記ゲート弁を開けて上記処理用るつぼを上記
分子線源るつぼ内に挿入するるつぼ挿入装置から
なり、 分子線源材料および上記反応室内を大気にさら
すことなく上記分子線源るつぼ内に供給する分子
線源供給装置とを備えたことを特徴とする分子線
エピタキシ装置。[Scope of Claims] 1. A molecular beam epitaxy apparatus for growing crystals of a molecular beam material from a molecular beam source crucible on a substrate in a reaction chamber, comprising: a port for transporting the substrate to the reaction chamber; a closed container connected via a gate valve; a small hole for the molecular beam source material disposed in the closed container, which must contain the molecular beam source material, melt, and drop into the molecular beam source crucible; a processing crucible provided at the bottom thereof; an atmospheric gas supply device for supplying hydrogen gas into the sealed container; a heating device provided in the sealed container to heat the processing crucible; a crucible insertion device for inserting a molecular beam source material into the molecular beam source crucible, and a molecular beam source supply device for supplying molecular beam source material and the reaction chamber into the molecular beam source crucible without exposing the interior of the reaction chamber to the atmosphere. Features of molecular beam epitaxy equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2064599A JPH0350131A (en) | 1990-03-15 | 1990-03-15 | Device for molecular-beam epitaxy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2064599A JPH0350131A (en) | 1990-03-15 | 1990-03-15 | Device for molecular-beam epitaxy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0350131A JPH0350131A (en) | 1991-03-04 |
| JPH0525835B2 true JPH0525835B2 (en) | 1993-04-14 |
Family
ID=13262881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2064599A Granted JPH0350131A (en) | 1990-03-15 | 1990-03-15 | Device for molecular-beam epitaxy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350131A (en) |
-
1990
- 1990-03-15 JP JP2064599A patent/JPH0350131A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0350131A (en) | 1991-03-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |