JPH0526598B2 - - Google Patents
Info
- Publication number
- JPH0526598B2 JPH0526598B2 JP59116978A JP11697884A JPH0526598B2 JP H0526598 B2 JPH0526598 B2 JP H0526598B2 JP 59116978 A JP59116978 A JP 59116978A JP 11697884 A JP11697884 A JP 11697884A JP H0526598 B2 JPH0526598 B2 JP H0526598B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder particles
- flux
- particles
- glycerin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams or slurries
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3485—Application of solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は微小回路などの半田付けにおいて用い
られるクリーム半田に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to cream solder used in soldering microcircuits and the like.
従来例の構成とその問題点
従来のクリーム半田は、拡大すると第１図に示
す様に、半田粒子１とフラツクス成分２とから成
つている。この様なクリーム半田では、半田粒子
１は混練直後では第１図に示す様に均一に分散し
ているが、時間の経過と共に第２図に示す様に比
重の大きい半田粒子１が沈澱してフラツクス成分
２と半田粒子１の分離が発生する。この様なクリ
ーム半田を使用する場合、半田粒子とフラツクス
成分の混合割合が不均一となり、クリーム半田塗
布量のバラツキや半田付け品質の低下の原因とな
つていた。また、従来より、フラツクスに水添ひ
まし油系やアマイド系の助剤を添加して、分離を
防ぐ方法もとられていたが、助剤が半田付け性を
低下させていた。Structure of the Conventional Example and its Problems Conventional cream solder consists of solder particles 1 and flux component 2, as shown in FIG. 1 when enlarged. In such cream solder, solder particles 1 are uniformly dispersed immediately after kneading, as shown in Figure 1, but as time passes, solder particles 1 with higher specific gravity settle as shown in Figure 2. Separation of flux component 2 and solder particles 1 occurs. When such cream solder is used, the mixing ratio of solder particles and flux components becomes uneven, causing variations in the amount of cream solder applied and deterioration of soldering quality. Additionally, conventional methods have been used to prevent separation by adding hydrogenated castor oil-based or amide-based auxiliary agents to the flux, but these auxiliary agents degrade solderability.
発明の目的
本発明は、上記従来の技術的欠点をなくし、半
田粒子とフラツクス成分が分離することのないよ
う均一に保ち、半田付け品質を向上させると共
に、被半田付け物に供給する場合の均一供給をも
可能にしたクリーム半田を提供するものである。Purpose of the Invention The present invention eliminates the above-mentioned conventional technical drawbacks, keeps solder particles and flux components uniform so as not to separate, improves soldering quality, and uniformly supplies solder particles to objects to be soldered. The present invention provides cream solder that can also be supplied.
発明の構成
本発明は、グリセリンを被覆した半田粒子とフ
ラツクスとから構成されており、半田粒子表面の
グリセリンが半田粒子同士の接近を防止し、半田
粒子を均一にフラツクス中に分散させるという効
果を有する。Structure of the Invention The present invention is composed of solder particles coated with glycerin and flux, and the glycerin on the surface of the solder particles prevents the solder particles from coming close to each other and has the effect of uniformly dispersing the solder particles in the flux. have
実施例の説明
第３図は本発明を説明するたの構成図である。
ここで、１は半田粒子、２はフラツクス、３は半
田粒子１の表面を覆つているグリセリンである。
本実施例によれば、半田粒子１の表面のグリセリ
ン３が半田粒子１同士が近接するのを防ぐため、
半田粒子１はフラツクス２中に均一に分散し、そ
の結果、半田粒子１は沈澱せず、フラツクスと半
田粒子の分離が発生しない。DESCRIPTION OF EMBODIMENTS FIG. 3 is a configuration diagram for explaining the present invention.
Here, 1 is a solder particle, 2 is a flux, and 3 is glycerin covering the surface of the solder particle 1.
According to this embodiment, the glycerin 3 on the surface of the solder particles 1 prevents the solder particles 1 from coming close to each other.
The solder particles 1 are uniformly dispersed in the flux 2, so that the solder particles 1 do not precipitate and no separation occurs between the flux and the solder particles.
実施例 １
クリーム半田組成比（重量％）
フラツクス 12％
但し、トールロジン 49％
ロジン変性マレイン酸樹脂20％
ジエチレングリコールモノブチ
ルエーテル 30％
塩酸アニリン １％
グリセリン ２％
Sn 63％、Pb 37％、300メツシユ以下の半田粒
子 86％
実施例 ２
クリーム半田組成比（重量％）
フラツクス 12％
但し、トールロジン 49％
重合ロジン 18％
ジエチレングリコールモノブチ
ルエーテル 32％
塩酸アニリン １％
グリセリン ２％
Sn 63％、Pb 37％、300メツシユ以下の半田粒
子 86％
発明の効果
以上、本発明によると、クリーム半田は、室温
で2000〜4000ポイズの粘度となり、20日経過後も
半田粒子の沈澱がみられなかつた。Example 1 Cream solder composition ratio (wt%) Flux 12% However, tall rosin 49% rosin modified maleic acid resin 20% diethylene glycol monobutyl ether 30% aniline hydrochloride 1% glycerin 2% Sn 63%, Pb 37%, 300 mesh or less Solder particles 86% Example 2 Cream solder composition ratio (wt%) Flux 12% However, tall rosin 49% polymerized rosin 18% diethylene glycol monobutyl ether 32% aniline hydrochloride 1% glycerin 2% Sn 63%, Pb 37%, 300 mesh or less Solder particles: 86% Effect of the Invention As described above, according to the present invention, the cream solder had a viscosity of 2000 to 4000 poise at room temperature, and no precipitation of solder particles was observed even after 20 days had passed.
第１図は従来技術によるクリーム半田の混錬直
後の状態を示す説明図、第２図は従来技術による
クリーム半田の混錬後の状態を示す説明図、第３
図は本発明の一実施例におけるクリーム半田の状
態を示す説明図である。
１……半田粒子、２……フラツクス、３……グ
リセリン。
FIG. 1 is an explanatory diagram showing the state of cream solder immediately after kneading according to the prior art, FIG. 2 is an explanatory diagram showing the state of cream solder after kneading according to the prior art, and FIG.
The figure is an explanatory diagram showing the state of cream solder in one embodiment of the present invention. 1...Solder particles, 2...Flux, 3...Glycerin.
Claims (1)
に於て、半田粒子の表面にグリセリンを被覆させ
たことを特徴とするクリーム半田。1. Cream solder consisting of solder particles and flux, characterized in that the surface of the solder particles is coated with glycerin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59116978A JPS60261689A (en) | 1984-06-07 | 1984-06-07 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59116978A JPS60261689A (en) | 1984-06-07 | 1984-06-07 | Cream solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60261689A JPS60261689A (en) | 1985-12-24 |
| JPH0526598B2 true JPH0526598B2 (en) | 1993-04-16 |
Family
ID=14700461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59116978A Granted JPS60261689A (en) | 1984-06-07 | 1984-06-07 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60261689A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2780474B2 (en) * | 1990-10-09 | 1998-07-30 | 松下電器産業株式会社 | Manufacturing method of cream solder |
| US5116433A (en) * | 1990-10-31 | 1992-05-26 | Motorola, Inc. | Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same |
| JP4811927B2 (en) * | 2006-03-23 | 2011-11-09 | ローム株式会社 | LED light emitting device and manufacturing method thereof |
-
1984
- 1984-06-07 JP JP59116978A patent/JPS60261689A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60261689A (en) | 1985-12-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |