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JPH0528486B2 - - Google Patents
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JPH0528486B2 - - Google Patents

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Publication number
JPH0528486B2
JPH0528486B2 JP13050085A JP13050085A JPH0528486B2 JP H0528486 B2 JPH0528486 B2 JP H0528486B2 JP 13050085 A JP13050085 A JP 13050085A JP 13050085 A JP13050085 A JP 13050085A JP H0528486 B2 JPH0528486 B2 JP H0528486B2
Authority
JP
Japan
Prior art keywords
etching
aluminum foil
resistant
micropores
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13050085A
Other languages
Japanese (ja)
Other versions
JPS61288411A (en
Inventor
Tadao Fujihira
Shozo Umetsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Altemira Co Ltd
Original Assignee
Showa Aluminum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Aluminum Corp filed Critical Showa Aluminum Corp
Priority to JP13050085A priority Critical patent/JPS61288411A/en
Publication of JPS61288411A publication Critical patent/JPS61288411A/en
Publication of JPH0528486B2 publication Critical patent/JPH0528486B2/ja
Granted legal-status Critical Current

Links

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  • ing And Chemical Polishing (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Chemical Treatment Of Metals (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

産業上の利用分野 この発明は電解コンデンサ用アルミニウム電極
材の製造方法に関する。 従来の技術 電解コンデンサ用アルミニウム電極材として用
いられるアルミニウム箔は、可及的大きな表面積
を有して単位面積当りの静電容量の大きいもので
あることが要請される。このため、一般的に電気
化学的あるいは化学的なエツチング処理を施して
アルミニウム箔の実効表面積を拡大することが行
われており、更にこの拡面率の可及的増大を目的
として、エツチング孔をより多く、深く、太くす
ることに関して材料の改善、エツチング方法の改
善、箔の製造工程に関する研究等種々の研究がな
されている。 発明が解決しようとする問題点 ところが、実際上、従来既知のエツチング技術
においては、該してエツチング孔の発生部位が不
均一であり、またエツチング孔を多くしようとす
るとエツチング孔どうしが連通して粗大孔となつ
たり、アルミニウム箔表面の溶解が同時に進行し
て箔の機械的強度が損われるのみならず、エツチ
ング孔が深いものとならないというような欠点を
派生するため、結果において充分に期待されるよ
うな拡面率の増大効果を得ることが難しいという
問題点があつた。 この発明は、かかる問題点を解決し、アルミニ
ウム箔に所要の機械的強度を保有せしめつつ、多
数の深いエツチング孔を均一に形成することを可
能として、拡面率すなわち静電容量に優れたもの
となしうる電解コンデンサ用アルミニウム電極材
を得ることを目的としてなされたものである。 問題点を解決するための手段 この目的においてこの発明は、アルミニウム箔
の表面にエツチング処理に対して耐性を有する被
覆材を塗布したのち、レーザによる該被覆材の部
分的除去により、該表面に、エツチング処理に対
して耐性を有しかつエツチング核形成用の多数の
微細孔を有する耐性皮膜を一体的に付着形成する
ことを特徴とするものであり、これによりエツチ
ング孔の発生部位を予め決定してエツチング処理
時にアルミニウム箔の微細孔対応部分のみの侵食
を可能とし、もつて多数の深いエツチング孔を均
一に形成せしめうる電極材の製造に成功したもの
である。 前記被覆材はアルミニウム箔の表面に耐性皮膜
を形成するためのものであり、この耐性皮膜は、
後述するような電気化学的あるいは化学的なエツ
チング処理、あるいは反応性イオンエツチングな
どのドライエツチング処理を施す場合に、レーザ
によつて除去形成された微細孔対応部分を除いて
アルミニウム箔表面の侵食を防止するためのもの
である。従つて被覆材ひいては耐性皮膜はその性
質として、エツチング処理に対して耐性を有する
ものであること、即ち、電気化学的あるいは化学
的なエツチングの場合にあつては電解エツチング
液に対して非溶性かつ耐食性のものであること、
またドライエツチングにあつてはイオンなどに対
して不可侵性のものであることを条件とする。こ
のような被覆材の一例としては市販の半導体フオ
トマスク用レジストインキ等をあげうる。被覆材
の塗布厚さ、従つて耐性皮膜の皮膜厚さは特に限
定されるものではなく、エツチング時に微細孔対
応部分以外のアルミニウム箔表面の溶解ないしは
侵食を阻止しうる厚さであれば足り、またエツチ
ング後の皮膜の除去作業性等を考慮して適宜に設
定されるものである。また被覆材の塗布方法につ
いても、ロールコーター法、浸漬法等の既知の方
法を任意に採用しうる。なお被覆材によつては、
塗布後焼付等の硬化処理を施すこともある。 レーザによる被覆材の部分的除去は、被覆材に
エツチング核形成用の微細孔を所望のエツチング
パターンに形成するために行うものであり、レー
ザビームの照射によつて実行される。レーザの種
類としては、主に加工用レーザ、例えば炭酸ガス
レーザ、アルゴンレーザ等をあげうる。前記微細
孔の大きさは任意に設定可能であり、またその配
列も限定されるものではなく、縦横配列、ちどり
状配列その他の任意配列が可能である。このレー
ザによる除去作業によつて、アルミニウム箔表面
への多孔耐性皮膜の付着形成が完了する。 こうして製造された本発明に係る電極材には、
その後酸またはアルカリ浴中で電気化学的あるい
は化学的なエツチング処理、あるいは反応性イオ
ンエツチングなどのドライエツチング処理が施さ
れる。前者のエツチング処理を行う場合に用いる
エツチング液は特に限定されるものではなく、既
知のような2〜15%の塩酸水溶液、あるいは該溶
液に更にクロム酸、硫酸、蓚酸等の酸を添加した
水溶液等を任意に採択使用しうる。他のエツチン
グ処理条件、即ち、液温、電流密度、エツチング
時間などもすべて従来既知のエツチング処理条件
をそのまま採用しうる。またイオンエツチング処
理を行う場合にも従来既知の処理条件をそのまま
採用しうる。これらのエツチング処理により、ア
ルミニウム箔の耐性皮膜付着部の表面溶解ないし
は侵食を抑制しつつ、微細孔対応部分のみを集中
的に侵食することができ、深くて太いエツチング
孔の形成が可能となる。 エツチング処理を終えたアルミニウム箔には、
続いて、アルカリ液等を用いて、箔表面に付着し
ている耐性皮膜の除去処理が施され、アルミニウ
ム電極が完成する。 発明の効果 以上説明したようにこの発明によれば、アルミ
ニウム箔の表面にエツチング処理に対して耐性を
有する被覆材を塗布したのち、レーザによる該被
覆材の部分的除去により、アルミニウム箔表面
に、多数の微細孔を有する耐性皮膜を一体的に付
着形成せしめたアルミニウム電極材を製造するこ
とができる結果、該電極材にその後に施すエツチ
ング処理において、アルミニウム箔の耐性皮膜付
着部の表面溶解ないし侵食を該皮膜層によつて阻
止しながら、微細孔対応部分のみをエツチング核
として集中的に侵食せしめることが可能となる。
従つて、その結果、アルミニウム箔に多数の深く
て太いエツチング孔を均一に形成することがで
き、機械的強度を損うことなく、拡面率の著しく
高い、即ち静電容量の極めて大きい電気的特性に
優れた理想的なアルミニウム電極の提供が可能と
なり、アルミニウム電解コンデンサの重要課題で
あるより一層の小型化を実現しうるものとなる。
さらには、従来技術においてアルミニウム箔に厳
しく要求される表面特性その他の品質(材質)特
性が、本発明に用いるアルミニウム箔においては
ほとんど不要となるため、アルミニウム箔の製造
工程の簡素化、省略化が図れ、かつ材質的に安価
な箔を使用しうることによつてコストの低減をも
図ることができる。しかもこの発明では前記微細
孔の形成をレーザで行うものであるから、その形
成操作を正確かつ迅速に行いうるのはもとより、
微細孔の配列、大きさ等を自由に制御することが
できるため、益々高い拡面率を付与しうる性能的
に優れた電極材の製造が可能となるものである。 実施例 次にこの発明の実施例を比較例との対比におい
て示す。 純度99.99%、厚さ0.1mmの焼鈍アルミニウム箔
の表面に、アルカリ除去型アクリル系樹脂よりな
るレジストインキをロールコーター法により厚さ
5μmに塗布したのち、160℃×5分間焼付し硬化
せしめて、配表面にレジスト被覆層を形成した。
次いで、アルゴンレーザを用いてビーム径1μm、
除去間隔1μmの条件でレジスト皮膜除去を行うこ
とにより、直径1μmの微細孔が1μm間隔でちどり
状配置に形成された耐性皮膜を有する本発明に係
る電極材を得た。 上記の工程により得られた電極材に、エツチン
グ液:5wt%塩酸水溶液、温度:70℃、直流電流
密度:10A/dm2、エツチング時間:7分のエツ
チング条件のもとでエツチング処理を施した後、
室温、1wt%の水酸化ナトリウム水溶液に2秒浸
漬してレジスト剥離処理を行つた。 上記により得られたエツチング箔を硼酸浴中で
300Vに化成したのち、該箔の静電容量及び引張
強さを測定した。一方この結果を、前記と同一ア
ルミニウム材を使用しかつ同一のエツチング条件
でエツチングのみを施したアルミニウム箔(比較
例)のそれと比較した。 結果は下表のとおりであつた。
INDUSTRIAL APPLICATION FIELD This invention relates to a method of manufacturing an aluminum electrode material for an electrolytic capacitor. BACKGROUND OF THE INVENTION Aluminum foil used as an aluminum electrode material for electrolytic capacitors is required to have as large a surface area as possible and a large capacitance per unit area. For this reason, the effective surface area of the aluminum foil is generally expanded by electrochemical or chemical etching treatment, and etching holes are also added to increase the area expansion ratio as much as possible. In order to make the foil thicker, deeper, and thicker, various studies are being conducted, including improving materials, improving etching methods, and researching the manufacturing process of foil. Problems to be Solved by the Invention However, in practice, in the conventionally known etching techniques, the locations where etching holes are generated are generally non-uniform, and when attempting to increase the number of etching holes, the etching holes communicate with each other. Not only will the mechanical strength of the foil be impaired due to formation of coarse pores and melting of the surface of the aluminum foil will proceed at the same time, but the etching holes will not be deep enough, so the results are not fully expected. The problem was that it was difficult to obtain the effect of increasing the area expansion ratio. The present invention solves these problems and makes it possible to uniformly form a large number of deep etched holes while maintaining the necessary mechanical strength in aluminum foil, and has an excellent surface area ratio, that is, capacitance. The purpose of this work was to obtain an aluminum electrode material for electrolytic capacitors that could be used as an aluminum electrode material for electrolytic capacitors. Means for Solving the Problems For this purpose, the present invention applies a coating material that is resistant to etching treatment to the surface of an aluminum foil, and then partially removes the coating material using a laser to coat the surface of the aluminum foil. It is characterized by integrally depositing a resistant film that is resistant to etching treatment and has a large number of micropores for forming etching nuclei, thereby allowing the site where etching holes will occur to be determined in advance. The present invention has succeeded in manufacturing an electrode material that enables erosion of only the portions of the aluminum foil corresponding to the micropores during the etching process, thereby uniformly forming a large number of deep etching holes. The coating material is for forming a resistant film on the surface of the aluminum foil, and this resistant film is
When performing electrochemical or chemical etching treatment as described below, or dry etching treatment such as reactive ion etching, the surface of the aluminum foil is not eroded except for the portion corresponding to the micropores removed by the laser. This is to prevent this. Therefore, the coating material and therefore the resistant coating must by its nature be resistant to the etching process, i.e., in the case of electrochemical or chemical etching, it must be insoluble and insoluble in the electrolytic etching solution. be corrosion resistant;
In addition, dry etching requires that the material be invulnerable to ions and the like. An example of such a coating material is a commercially available resist ink for semiconductor photomasks. The coating thickness of the coating material, and thus the coating thickness of the resistant coating, is not particularly limited, as long as it is thick enough to prevent dissolution or erosion of the aluminum foil surface other than the portion corresponding to the micropores during etching. Further, it is appropriately set in consideration of the workability of removing the film after etching, etc. Further, as for the method of applying the coating material, any known method such as a roll coater method or a dipping method may be employed. Depending on the covering material,
After application, hardening treatment such as baking may be performed. Partial removal of the coating material by laser is performed in order to form micropores for forming etching nuclei in the coating material in a desired etching pattern, and is carried out by irradiation with a laser beam. Types of lasers include mainly processing lasers, such as carbon dioxide lasers and argon lasers. The size of the micropores can be arbitrarily set, and the arrangement thereof is not limited either, such as a vertical and horizontal arrangement, a zigzag arrangement, or any other arrangement. This laser removal operation completes the formation of a porous resistant film on the surface of the aluminum foil. The electrode material according to the present invention manufactured in this way includes:
Thereafter, an electrochemical or chemical etching treatment in an acid or alkaline bath, or a dry etching treatment such as reactive ion etching is performed. The etching solution used in the former etching process is not particularly limited, and may be a known 2 to 15% hydrochloric acid aqueous solution, or an aqueous solution to which an acid such as chromic acid, sulfuric acid, or oxalic acid is added. etc. may be adopted and used at will. All other etching processing conditions, ie, liquid temperature, current density, etching time, etc., can be employed as they are, as are conventionally known etching processing conditions. Also, when performing ion etching treatment, conventionally known treatment conditions can be used as they are. By these etching treatments, while suppressing surface dissolution or erosion of the portion of the aluminum foil to which the resistant film is attached, it is possible to intensively erode only the portions corresponding to the micropores, making it possible to form deep and thick etching holes. After the etching process, the aluminum foil is
Subsequently, the resistant film adhering to the foil surface is removed using an alkaline solution or the like to complete the aluminum electrode. Effects of the Invention As explained above, according to the present invention, after coating the surface of the aluminum foil with a coating material that is resistant to etching treatment, the coating material is partially removed using a laser, so that the surface of the aluminum foil is coated with a coating material that is resistant to etching. As a result of being able to manufacture an aluminum electrode material on which a resistant film with a large number of micropores is integrally adhered, surface dissolution or erosion of the resistant film attached part of the aluminum foil can be avoided during the subsequent etching treatment applied to the electrode material. This makes it possible to intensively erode only the portions corresponding to the micropores as etching nuclei while preventing this by the film layer.
Therefore, as a result, it is possible to uniformly form a large number of deep and thick etching holes in the aluminum foil, and it is possible to form an electrically It becomes possible to provide an ideal aluminum electrode with excellent characteristics, and it becomes possible to achieve further miniaturization, which is an important issue for aluminum electrolytic capacitors.
Furthermore, the surface characteristics and other quality (material) characteristics that are strictly required for aluminum foil in the conventional technology are almost unnecessary for the aluminum foil used in the present invention, so the manufacturing process of the aluminum foil can be simplified and omitted. By using a foil that is easy to use and is inexpensive in terms of material, it is possible to reduce costs. Moreover, in this invention, since the formation of the micropores is performed using a laser, the formation operation can not only be performed accurately and quickly, but also
Since the arrangement, size, etc. of the micropores can be freely controlled, it is possible to manufacture an electrode material with excellent performance that can provide an even higher area expansion ratio. Examples Next, examples of the present invention will be shown in comparison with comparative examples. A resist ink made of alkali-removable acrylic resin is applied to the surface of annealed aluminum foil with a purity of 99.99% and a thickness of 0.1 mm using a roll coater method.
After coating to a thickness of 5 μm, the resist was cured by baking at 160° C. for 5 minutes to form a resist coating layer on the surface.
Next, using an argon laser, the beam diameter was 1 μm.
By removing the resist film at a removal interval of 1 μm, an electrode material according to the present invention having a resistant film in which micropores with a diameter of 1 μm were formed in a staggered arrangement at 1 μm intervals was obtained. The electrode material obtained through the above process was subjected to etching treatment under the following conditions: etching solution: 5wt% hydrochloric acid aqueous solution, temperature: 70°C, DC current density: 10A/dm 2 , etching time: 7 minutes. rear,
The resist was removed by immersion in a 1 wt % aqueous sodium hydroxide solution for 2 seconds at room temperature. The etched foil obtained above was placed in a boric acid bath.
After converting to 300V, the capacitance and tensile strength of the foil were measured. On the other hand, this result was compared with that of an aluminum foil (comparative example) using the same aluminum material as above and etching only under the same etching conditions. The results were as shown in the table below.

【表】 上記の結果に示されるように、この発明によれ
ば、アルミニウム箔表面の耐性皮膜中に均一に設
けられた多数の微細孔に対応する部分のみをエツ
チング核として深く侵食するものとなし得ること
により、該アルミニウム箔の明らかな静電容量、
引張強さの改善効果を実現し得るものであつた。
[Table] As shown in the above results, according to the present invention, only the portions corresponding to the many micropores uniformly provided in the resistant film on the surface of the aluminum foil are etched deeply as etching nuclei. By obtaining the apparent capacitance of the aluminum foil,
It was possible to realize the effect of improving tensile strength.

Claims (1)

【特許請求の範囲】[Claims] 1 アルミニウム箔の表面にエツチング処理に対
して耐性を有する被覆材を塗布したのち、レーザ
による該被覆材の部分的除去により、該表面に、
エツチング処理に対して耐性を有しかつエツチン
グ核形成用の多数の微細孔を有する耐性皮膜を一
体的に付着形成することを特徴とする電解コンデ
ンサ用アルミニウム電極材の製造方法。
1. After applying a coating material that is resistant to etching treatment to the surface of an aluminum foil, the coating material is partially removed using a laser to coat the surface with
A method for manufacturing an aluminum electrode material for an electrolytic capacitor, which comprises integrally depositing a resistant film that is resistant to etching treatment and has a large number of micropores for forming etching nuclei.
JP13050085A 1985-06-14 1985-06-14 Manufacture of aluminum electrode material for electrolytic capacitor Granted JPS61288411A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13050085A JPS61288411A (en) 1985-06-14 1985-06-14 Manufacture of aluminum electrode material for electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13050085A JPS61288411A (en) 1985-06-14 1985-06-14 Manufacture of aluminum electrode material for electrolytic capacitor

Publications (2)

Publication Number Publication Date
JPS61288411A JPS61288411A (en) 1986-12-18
JPH0528486B2 true JPH0528486B2 (en) 1993-04-26

Family

ID=15035754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13050085A Granted JPS61288411A (en) 1985-06-14 1985-06-14 Manufacture of aluminum electrode material for electrolytic capacitor

Country Status (1)

Country Link
JP (1) JPS61288411A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4929679B2 (en) * 2005-10-26 2012-05-09 日本ケミコン株式会社 Method for producing aluminum etching foil

Also Published As

Publication number Publication date
JPS61288411A (en) 1986-12-18

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