JPH0528556B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an imaging device such as a video camera.

[Conventional technology]

4 and 5 are a front sectional view and a plan sectional view showing a conventional video camera. In the figures, 1 is a case of the video camera, 2 is a front lens protruding to the front of the case 1, and 3 is a front sectional view. A front lens flange fixed to the rear end of the lens 2, 4 a spacer integrally formed at the rear of the front lens flange 3, 5 a cylindrical rear lens flange attached to the spacer 4, 6 a spacer 4 and the rear A rear lens flange mounting screw 7 for fixing the lens flange 5 is a rear lens assembled inside the rear range flange 5.

8 is a crystal filter built into the rear end of the rear lens 7 inside the rear lens flange 5; 9 is a light shielding ring provided at the rear end of the crystal filter 8; 10
11 is an image sensor board to which the solid-state image sensor 10 is attached; 12 is a signal amplification board located at the rear of the image sensor board 11; 13 is an image sensor board 11 and a lead wire electrically connecting the signal amplification board 12;
Reference numeral 14 denotes a cylindrical shield case made of a metal plate with one end closed, in which the image pickup element board 11 and the signal amplification board 12 are housed, and both boards 11 and 12 are shielded from the outside.

Reference numeral 15 denotes a shielding partition plate which is brazed into the shield case 14 and placed between the image sensor board 11 and the signal amplification board 12.
1 and 12 are shielded, and the image sensor board 11
This prevents interference radio waves from entering the signal amplification board 12. 16 is a tripod mounting member provided at the bottom of the case 1; 17 is a tripod mounting member fixing screw that fixes the front lens flange 3 and the tripod mounting member 16 to each other; and 18 is a countersunk screw that fixes the tripod mounting member 16 to the case 1. , 19 is a tripod mounting screw hole formed in the tripod mounting member 16, and 20 is a tripod mounting member 1.
A locking recess 21 is formed in the bracket 6 and is fixed to the inside of the case 1 with a fixing screw 23, and the front lens flange 3 is fixed to the bracket 21 with a fixing screw 22.

In FIG. 5, 24 is the rear lens flange 5.
25 is a shield case fixing screw that fixes the shield case 14, and 25 is an image sensor board fixing screw that fixes the image sensor board 11 to the rear lens flange 5.
Reference numeral 26 denotes a claw provided on the shield case 14 with a portion bent inward and facing each other, and the signal amplification board 12 is supported by this claw 26. 30 is a circuit component attached to the image sensor board 11 and the signal amplification board 12 in order to process the signal from the solid-state image sensor 10.

Here, the positional relationship between the front lens 2, the rear lens 7, and the solid-state image sensor 10 is a factor that determines the focal length. 3, and the image sensor substrate 11 is securely fixed to the rear lens flange 5.

Next, the operation will be explained. In Figure 4,
Light incident from the front of the front lens 2 passes through the front lens 2, the rear lens 7, the crystal filter 8, and the light shielding ring 9, and reaches the solid-state image sensor 10. The image projected on this solid-state image sensor 10 is read by an image sensor board 11 and converted into an electrical signal, and the signal is sent to a signal amplification board 12 through a lead wire 13. The signal sent to the signal amplification board 12 is amplified inside the signal amplification board 12 and becomes an output signal.

At this time, if the interference radio waves generated by the signal amplification board 12 enter the image sensor board 11, it will have an adverse effect such as generating output signal noise of the video camera, so there is a shield between the image sensor board 11 and the signal amplification board 12. A partition plate 15 is arranged and electrically connected to the shield case 14 by soldering to prevent interference waves from the signal amplification board 12 from entering the image pickup element board 11. The tripod mounting member 16 is provided for mounting a video camera on a tripod or the like, and the male screw of the tripod is screwed into the tripod mounting screw hole 19, and the pin provided on the tripod is inserted into the detent recess 20. .

[Problem that the invention seeks to solve]

A conventional video camera is constructed as described above, and the case 1 accommodates the front lens flange 3, the rear lens flange 5, etc., and is arranged almost parallel behind the rear lens flange 5 to connect the image sensor board 11 and the signal. Since a space for arranging the amplification board 12 is required, the case becomes large and the internal utilization rate is low.

Furthermore, the shielding partition plate 15 is placed between the two boards 11 and 12 in the shielding case 14 and is brazed to the shielding case 14, which makes the structure of the shielding case 14 complicated. There was a drawback.

This invention was made in order to eliminate the above-mentioned drawbacks, and by reducing the distance between the boards placed inside the case without causing mutual electromagnetic interference, it achieved overall miniaturization. An object of the present invention is to provide an imaging device that can perform

[Means for solving problems]

An imaging device according to the present invention includes a first imaging device having an imaging element provided on a first surface perpendicular to a lens optical axis.
an image sensor substrate, a second image sensor substrate connected to the first image sensor substrate and arranged substantially parallel to the optical axis, and each substrate for the first image sensor substrate and the second image sensor substrate. and a shield member having a conductive surface facing each other on both sides, and the shield member is attached to the lens barrel.

[Effect]

According to this invention, since the second image sensor substrate disposed substantially parallel to the lens optical axis is surrounded by the shield members provided on both sides of the second image sensor substrate to face each other, there is a gap between the first and second image sensor substrates. Mutual electromagnetic interference will not occur even if the devices are placed close together.
Therefore, the overall size and weight of the imaging device can be reduced.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS A video camera showing an embodiment of the present invention in the drawings will be described below. In Figure 1, 1
10 are the same as the conventional device described above. 1
1a is a first image sensor substrate to which the solid-state image sensor 10 is attached; 11b is a second image sensor substrate disposed on the radial side of the rear lens flange 5 substantially parallel to the lens optical axis;
An image sensor board 12 is a signal amplification board placed along and opposite the second image sensor board 11b.

Reference numeral 13a indicates an upper lead wire whose both ends are connected to each of the first image sensor substrate 11a and the signal amplification board 12, and 13b indicates a lower lead whose both ends are connected to each of the first image sensor substrate 11a and the second image sensor substrate 11b. Line 14 is a shield case as a shield member that covers the first image sensor substrate 11a, the second image sensor substrate 11b, and the signal amplification board 12, and is molded from synthetic resin and is connected to both the substrates 11a, 11b.
It has a conductive surface with nickel plating applied to both sides, giving it an electrical shielding effect.
It is arranged along the inner surface of case 1, which serves as a lens barrel. 14a is a screw hole provided in the shield case 14, and 16 is a tripod mounting member disposed at the end of the case 1 on the front lens 2 side, which is formed integrally with the front lens flange 3.

18 is a countersunk screw that fixed the tripod mounting member 16 to the case 1; 19 is a tripod mounting screw hole formed in the tripod mounting member 16; and 20 is a side part of the tripod mounting screw hole 19 formed in a part of the case 1. anti-rotation recess,
A front flange fixing screw 23a passes through the case 1 and is screwed into the end of the front lens flange 3, which fixes the front lens flange 3 to the case 1. 23b is a shield case fixing screw screwed into the screw hole 14a through the case 1 in order to fix the shield case 14 to the case 1; 25b is a shield case fixing screw that fixes the second image sensor board 11b to the rear lens flange 5; 2 Image sensor board fixing screw.

In FIG. 2, reference numeral 25a denotes a first image sensor substrate fixing screw that fixes the solid-state image sensor 10 and the first image sensor substrate 11a to the rear lens flange 5, and 27a
27b is an end on the solid-state image sensor 10 side, which is a rib provided on the outer surface of the rear lens flange 5 along the first image sensor substrate 11a, and 27b is an end on the outer surface of the rear lens flange 5 with the second image sensor substrate 11b. This is a rib that stands up along the signal amplification board 12 (see FIG. 3). The rear lens flange 5 and ribs 27a, 27b are molded from synthetic resin and plated with nickel, providing an electrical shielding effect and shielding between the respective substrates 11a, 11b, 12. .

In FIG. 3, reference numeral 28 denotes a screw hole provided at the tip of the rib 27b. A shield case fixing screw 29 passing through the shield case 14 is screwed into this screw hole 28, and the shield case 14 is attached to the rib 27b.
Fixed. 30a is a circuit component attached to the signal amplification board 12, 30b is a second image sensor board 1
This is a circuit component attached to 1b.

In FIG. 1, light incident from the front of the front lens 2 passes through the front lens 2, the rear lens 7, the crystal filter 8, and the light shielding ring 9, and reaches the solid-state image sensor 10. The image projected on the solid-state image sensor 10 is the first image sensor substrate 11a and the second image sensor substrate 11 connected by the lower lead wire 13b.
b is called and converted into an electrical signal, and the signal is sent to the signal amplification board 12 through the lead wire 13a. The signal sent to the signal amplification board 12 is amplified inside the signal amplification board 12 and becomes an output signal.

Here, the signal amplification board 12 and the second image sensor board 1
1b is arranged on the radially outer side of the cylindrical rear lens flange 5 along its axial direction. Since the space in which the substrates 12 and 11b are arranged is a space that has not been used conventionally, the dimensions of the case 1 in the axial direction of the rear lens 7 can be changed without changing the dimensions of the case 1 in the radial direction of the rear lens 7. The dimensions can be shortened, and the case 1 can be made smaller and lighter.

Ribs 27a, 2 along the respective substrates 11a, 11b, 12 are provided on the outer surface of the rear lens flange 5.
7b is erected, and the rear lens flange 5 and the ribs 27a, 27b are provided with an electrical shielding effect to shield the substrates 11a, 11b, 12. Therefore, the shielding between the substrates 11a, 11b, 12 is can be easily performed, and the structure of the shield case 14 can be simplified.

In this embodiment, the image sensor substrate 11 is divided into two image sensor substrates: a first image sensor substrate 11a and a second image sensor substrate 11b.
Although it is divided into two pieces, it can also be divided into a larger number of pieces, and the number of ribs 27a will be correspondingly increased. Then, the first image sensor substrate 11a and the second
The image sensor substrate 11b can be made into one piece, and the solid-state image sensor 10 can be attached thereto. The spacer 4 can also be provided integrally with the rear lens flange 5.

A shield effect is provided to the rear lens flange 5, ribs 27a, 27b, and shield case 14 by plating with nickel, but plating with other metals may also be used. Further, a conductive paint may be applied. The shield case 14 can also be made of metal.

In this embodiment, a stand-alone video camera was described, but a video camera integrated with a video deck,
Alternatively, it may be a surveillance video camera or other electronic camera.

〔Effect of the invention〕

As described above, according to the present invention, the first lens having the imaging element provided on the surface perpendicular to the optical axis of the lens
By arranging the second image sensor substrate with respect to the image sensor substrate substantially parallel to the lens optical axis, it is possible to increase the utilization rate of the internal space of the lens barrel. Moreover, since both sides of the second image sensor substrate are surrounded by shield members, even if the first and second image sensor substrates are arranged close to each other, mutual electromagnetic interference will not occur. Therefore, the overall device can be made smaller and lighter while maintaining a sufficient shielding effect.

[Brief explanation of the drawing]

FIG. 1 is a front sectional view showing a video camera according to an embodiment of the present invention, FIG. 2 is a plan sectional view showing a video camera according to an embodiment of the invention with circuit components removed, and FIG. FIG. 4 is a front sectional view showing a conventional video camera, and FIG. 5 is a plan sectional view showing a conventional video camera. 1...Case, 2...Front lens, 3...Front lens flange, 5...Rear lens flange, 7
... Rear lens, 10 ... Solid-state image sensor, 11a
...First image sensor board, 11b... Second image sensor board, 12... Signal amplification board, 14... Shield case, 27a, 27b... Rib. In addition, in the figure,
The same reference numerals indicate the same or equivalent parts.

Claims (1)

[Scope of Claims] 1. A first image sensor substrate having an image sensor provided on a first surface perpendicular to the lens optical axis;
A second image sensor substrate connected to the image sensor substrate and arranged substantially parallel to the optical axis, and a conductive surface facing both sides of each substrate with respect to the first image sensor substrate and the second image sensor substrate. What is claimed is: 1. An imaging device comprising: a shield member having a shield member, the shield member being attached to the lens barrel. 2. Claim 1, wherein the lens member is made of a resin material that has been subjected to conductive back surface treatment.
The imaging device described in Section 1.