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JPH0528804B2 - - Google Patents
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JPH0528804B2 - - Google Patents

Info

Publication number
JPH0528804B2
JPH0528804B2 JP59250731A JP25073184A JPH0528804B2 JP H0528804 B2 JPH0528804 B2 JP H0528804B2 JP 59250731 A JP59250731 A JP 59250731A JP 25073184 A JP25073184 A JP 25073184A JP H0528804 B2 JPH0528804 B2 JP H0528804B2
Authority
JP
Japan
Prior art keywords
semiconductor device
cap
optical semiconductor
optical fiber
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59250731A
Other languages
Japanese (ja)
Other versions
JPS61128214A (en
Inventor
Atsushi Ichihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59250731A priority Critical patent/JPS61128214A/en
Publication of JPS61128214A publication Critical patent/JPS61128214A/en
Publication of JPH0528804B2 publication Critical patent/JPH0528804B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)

Description

【発明の詳細な説明】 〈産業上の利用分野〉 この発明は光半導体装置の光フアイバへの接続
機構に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a connection mechanism for an optical semiconductor device to an optical fiber.

〈従来の技術〉 従来、光フアイバを光半導体装置に接続するに
は、アダプターとして第5図に示すようなレセプ
タクルが用いられている。そしてこのレセプタク
ル2を用いるに際して、光フアイバ3にもこれを
覆う保護チユーブ4と光フアイバ3の動きを規制
するかしめリング5、エポキシ樹脂8と光フアイ
バ3とレセプタクル2を連結するねじカバー6と
を用意する必要がある。このようにした光フアイ
バ3をレセプタクル2の貫通孔2aの一方側に挿
入し、前記貫通孔2aの他方側に光半導体装置1
の樹脂本体を内装して、該光フアイバの先端と光
半導体装置1の樹脂本体に接近させ、前記ねじカ
バー6をレセプタクル2のねじ部2bに螺合させ
ることにより光フアイバ3と光半導体装置1とを
光結合させている。
<Prior Art> Conventionally, a receptacle as shown in FIG. 5 has been used as an adapter to connect an optical fiber to an optical semiconductor device. When using this receptacle 2, the optical fiber 3 is also provided with a protective tube 4 that covers it, a caulking ring 5 that restricts the movement of the optical fiber 3, an epoxy resin 8, and a screw cover 6 that connects the optical fiber 3 and the receptacle 2. It is necessary to prepare. The optical fiber 3 thus constructed is inserted into one side of the through hole 2a of the receptacle 2, and the optical semiconductor device 1 is inserted into the other side of the through hole 2a.
The optical fiber 3 and the optical semiconductor device 1 are connected by inserting a resin body therein, bringing the tip of the optical fiber close to the resin body of the optical semiconductor device 1, and screwing the screw cover 6 onto the threaded portion 2b of the receptacle 2. and optically coupled.

〈発明が解決しようとする課題〉 従つて、従来では、光半導体装置1と光フアイ
バ3とを接続されるために、上記のような複雑な
構造で且つ高価なアダプターを用いなければなら
なかつた。さらに光フアイバにも該アダプターに
対応するように加工する必要を生じるとともに、
これらの連結接続の作業が煩わしいという問題が
あつた。
<Problems to be Solved by the Invention> Therefore, in the past, in order to connect the optical semiconductor device 1 and the optical fiber 3, it was necessary to use an expensive adapter with a complicated structure as described above. . Furthermore, it becomes necessary to process the optical fiber so that it is compatible with the adapter, and
There was a problem that the work of connecting and connecting them was troublesome.

本発明は上記事情に鑑みて創案されたもので、
複雑高価なアダプターを必要とせず、簡便に連結
接続の作業ができるようにした光半導体装置の光
フアイバへの接続機構を提供することを目的とし
ている。
The present invention was created in view of the above circumstances, and
The object of the present invention is to provide a mechanism for connecting an optical semiconductor device to an optical fiber, which allows easy connection and connection work without requiring complicated and expensive adapters.

〈課題を解決するための手段〉 この発明に係る光半導体装置の光フアイバへの
接続機構は、光半導体装置と、弾性部材と、キヤ
ツプを具備しており、前記光半導体装置は透過性
樹脂からなる略円柱形状の本体と、本体に封止し
た半導体素子を含んでおり、かつ本体の上面中央
部には先端にテーパ面が形成された光フアイバの
外径より僅か大きい寸法の凹部と凹部の先端に形
成したテーパと凹部の底部に形成したレンズ部を
有しており、前記弾性部材は軸心方向にスリツト
を有する円筒形状であつて、その先端面は前記テ
ーパに密着嵌合するテーパが形成されているとと
もに、円筒の外径はキヤツプの開口部の径より僅
かに大径に形成されており、キヤツプは底部に開
口部を有する有底円筒状としてあり、弾性部材に
光フアイバを挿入した状態で弾性部材をキヤツプ
に挿入した状態で光半導体装置とキヤツプに設け
た連結手段によりキヤツプと光半導体装置を連結
させるようにしたことを特徴としている。
<Means for Solving the Problems> A connection mechanism for an optical semiconductor device to an optical fiber according to the present invention includes an optical semiconductor device, an elastic member, and a cap, and the optical semiconductor device is made of transparent resin. The main body has a generally cylindrical shape and a semiconductor element sealed in the main body, and the center of the upper surface of the main body has a recess with a size slightly larger than the outer diameter of the optical fiber and a tapered surface at the tip. The elastic member has a taper formed at the tip and a lens portion formed at the bottom of the recess, and the elastic member has a cylindrical shape with a slit in the axial direction, and the tip surface has a taper that tightly fits into the taper. The outer diameter of the cylinder is slightly larger than the diameter of the opening of the cap, and the cap has a bottomed cylindrical shape with an opening at the bottom, and the optical fiber is inserted into the elastic member. The cap and the optical semiconductor device are connected to each other by a connecting means provided on the optical semiconductor device and the cap while the elastic member is inserted into the cap in this state.

〈実施例〉 以下、図面を参照して本発明に係る一実施例を
説明する。
<Example> Hereinafter, an example according to the present invention will be described with reference to the drawings.

第1図はこの発明に係る光半導体装置の第1の
実施例の外観斜視図である。第2図aは第1図の
分解断面図、第2図bハ光フアイバを接続した場
合の断面図である。
FIG. 1 is an external perspective view of a first embodiment of an optical semiconductor device according to the present invention. FIG. 2a is an exploded sectional view of FIG. 1, and FIG. 2b is a sectional view when optical fibers are connected.

図において、10は光半導体装置、20は弾性
部材、30はキヤツプ、40は光フアイバをそれ
ぞれ示している。
In the figure, 10 is an optical semiconductor device, 20 is an elastic member, 30 is a cap, and 40 is an optical fiber.

光半導体装置10は本体11と、これに封止さ
れる光半導体素子12を備えている。
The optical semiconductor device 10 includes a main body 11 and an optical semiconductor element 12 sealed in the main body 11.

本体11は透過性を有する樹脂であつて、略円
柱形状に形成されている。そして円柱の周囲には
雄ネジ111が形成されている。上面すなわち、
光フアイバ側にはその中央部に光フアイバ40の
外径より僅かに大きい寸法の凹部112が形成さ
れている。凹部112の底部にはレンズ部112
Aが突出形成されている。このレンズ部112A
は光フアイバ40を接続したときに光半導体素子
12からの発光を効率よく光フアイバ40側に伝
達するのに役立つ。凹部112の先端にはテーパ
112Bが形成されている。光半導体素子12は
例えばLEDであつてもよい。
The main body 11 is made of transparent resin and has a substantially cylindrical shape. A male thread 111 is formed around the cylinder. The top surface, i.e.
A recess 112 having a size slightly larger than the outer diameter of the optical fiber 40 is formed in the center of the optical fiber side. A lens portion 112 is provided at the bottom of the recess 112.
A is formed protrudingly. This lens portion 112A
serves to efficiently transmit light emitted from the optical semiconductor element 12 to the optical fiber 40 side when the optical fiber 40 is connected. A taper 112B is formed at the tip of the recess 112. The optical semiconductor element 12 may be, for example, an LED.

弾性部材20は例えば配管等の接続に使用され
るフエルールのような形状をしている。すなわ
ち、軸心方向にスリツトを有する略円筒状をして
いるものである。そしてその先端(光半導体装置
側)には前記テーパ112Bに密着嵌合するテー
パ21が形成されている。円筒の外径はキヤツプ
30の開口部31の径より僅かに大きい径になつ
ている。
The elastic member 20 has a shape like a ferrule used for connecting piping, etc., for example. That is, it has a substantially cylindrical shape with a slit in the axial direction. A taper 21 is formed at its tip (optical semiconductor device side) to tightly fit into the taper 112B. The outer diameter of the cylinder is slightly larger than the diameter of the opening 31 of the cap 30.

キヤツプ30は有底円筒状に形成されており、
底には開口部31が開設されており、円筒の内面
には、前記雄ネジ111に螺合する雌ネジ32が
形成されている。雄ネジ111と雌ネジ32で連
結手段を構成する。光フアイバ40を接続するに
は、まず光フアイバ40を前記弾性部材20に挿
入した状態で弾性部材20を開口部31に挿入す
る。このとき、開口部31の径を弾性部材20の
外径より少し小さくしているので、弾性部材20
は開口部31によつて内径側に圧縮される結果、
弾性部材20に挿入されている光フアイバ40に
キツチリと嵌入でき、抜けにくい状態に保持され
る。
The cap 30 is formed into a cylindrical shape with a bottom,
An opening 31 is formed at the bottom, and a female thread 32 that is screwed into the male thread 111 is formed on the inner surface of the cylinder. The male thread 111 and the female thread 32 constitute a connecting means. To connect the optical fiber 40, first, the optical fiber 40 is inserted into the elastic member 20, and then the elastic member 20 is inserted into the opening 31. At this time, since the diameter of the opening 31 is made slightly smaller than the outer diameter of the elastic member 20, the elastic member 20
As a result of being compressed inward by the opening 31,
The optical fiber 40 inserted into the elastic member 20 can be tightly fitted into the optical fiber 40 and held in a state where it is difficult to come out.

雄ネジ111と雌ネジ32を螺合することによ
り、本体11は光フアイバ40側に前進し、光フ
アイバ40の先端は前記レンズ部112Aに当接
する状態になる(第2図b参照)。接続を密にす
るため、さらに螺合を続け、これで光フアイバ4
0の接続が完了する。
By screwing together the male screw 111 and the female screw 32, the main body 11 moves forward toward the optical fiber 40, and the tip of the optical fiber 40 comes into contact with the lens portion 112A (see FIG. 2b). Continue screwing further to make the connection tighter, and now the optical fiber 4
0 connection is completed.

第3図は他の実施例の外観斜視図であつて、第
3図aは光半導体装置50、第3図bはキヤツプ
60を示している。すなわち、光半導体装置50
の側面には複数個の突起51,51が形成されて
おり、一方キヤツプ60の側面には突起51,5
1に係合する鍵状溝61が形成されている。この
場合には連結手段は突起51と鍵状溝61であ
る。すなわち、突起51を鍵状溝61に嵌入させ
ると、光フアイバ40の先端が丁度レンズ部11
2Aに圧着されるようにしてある。なおこの実施
例では弾性部材20は前記のものと変わらない。
FIG. 3 is an external perspective view of another embodiment, in which FIG. 3a shows an optical semiconductor device 50, and FIG. 3b shows a cap 60. That is, the optical semiconductor device 50
A plurality of protrusions 51, 51 are formed on the side surface of the cap 60, while protrusions 51, 51 are formed on the side surface of the cap 60.
1 is formed with a key-shaped groove 61 that engages with 1. In this case, the connecting means are the protrusion 51 and the key-shaped groove 61. That is, when the protrusion 51 is inserted into the key-shaped groove 61, the tip of the optical fiber 40 is just aligned with the lens portion 11.
It is designed to be crimped to 2A. In this embodiment, the elastic member 20 is the same as the one described above.

第4図は他の実施例の図面であつて、第4図a
は光半導体装置70の外観斜視図、第4図bは分
解断面図である。
FIG. 4 is a drawing of another embodiment, and FIG.
4 is an external perspective view of the optical semiconductor device 70, and FIG. 4b is an exploded sectional view.

すなわち、光半導体装置70の側面には、凹溝
71が周設されており、キヤツプ80の内面に
は、凸脈81が周設されている。連結手段はこの
場合には、凹溝71と凸脈81である。凹溝71
を凸脈81に係合させることで、光フアイバ40
の接続が完了する。この実施例においても弾性部
材20は前記と同じものである。
That is, a groove 71 is provided around the side surface of the optical semiconductor device 70, and a protrusion 81 is provided around the inner surface of the cap 80. In this case, the connecting means are the grooves 71 and the ribs 81. Concave groove 71
By engaging the convex vein 81, the optical fiber 40
connection is completed. In this embodiment as well, the elastic member 20 is the same as described above.

〈発明の効果〉 この発明に係る光半導体装置の光フアイバへの
接続機構は、光半導体装置とキヤツプと弾性部材
を用いており、キヤツプと光半導体装置を弾性部
材を介在させて連結手段で相互に連結している。
<Effects of the Invention> The connection mechanism of the optical semiconductor device to the optical fiber according to the present invention uses the optical semiconductor device, the cap, and the elastic member, and the cap and the optical semiconductor device are interconnected by the connecting means with the elastic member interposed. is connected to.

また光フアイバは弾性部材に挿入され、連結手
段により光フアイバは圧着された状態で、レンズ
部に当接される基本構成となつている。
The basic configuration is such that the optical fiber is inserted into the elastic member, and is pressed against the lens portion by the connecting means.

それ故、従来の装置に比較して構造が簡単で、
安価に製造できるという利点がある。また殆どワ
ンタツチで光フアイバの接続ができるので、大変
に都合のよいものである。
Therefore, the structure is simpler than conventional equipment,
It has the advantage of being cheap to manufacture. Additionally, optical fiber connections can be made with just one touch, which is extremely convenient.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図から第4図にかけては本発明に係る図面
であつて、第1図はこの発明に係る光半導体装置
の第1の実施例の外観斜視図、第2図aは第1図
の分解断面図、第2図bは光フアイバを接続した
場合の断面図、第3図は他の実施例の外観斜視図
であつて、第3図aは半導体装置50、第3図b
はキヤツプを示している。第4図aは半導体装置
70の外観斜視図、第4図bは分解断面図であ
る。第5図は従来技術にかかる図面であつて、光
フアイバを接続した状態の断面図である。 10……半導体装置、11……半導体素子、1
11……雄ネジ、112……凹部、112A……
レンズ部、112B……テーパ、20……弾性部
材、21……テーパ、30……キヤツプ、40…
…光フアイバ、50……半導体装置、51……突
起、60……キヤツプ、61……鍵状溝、70…
…半導体装置、71……凹溝、80……キヤツ
プ、81……凸脈。
1 to 4 are drawings according to the present invention, in which FIG. 1 is an external perspective view of a first embodiment of an optical semiconductor device according to the present invention, and FIG. 2a is an exploded view of FIG. 1. A cross-sectional view, FIG. 2b is a cross-sectional view when an optical fiber is connected, FIG. 3 is an external perspective view of another embodiment, FIG. 3a is a semiconductor device 50, and FIG.
indicates a cap. FIG. 4a is an external perspective view of the semiconductor device 70, and FIG. 4b is an exploded sectional view. FIG. 5 is a diagram related to the prior art, and is a sectional view of a state in which optical fibers are connected. 10...Semiconductor device, 11...Semiconductor element, 1
11...male thread, 112...recess, 112A...
Lens portion, 112B... Taper, 20... Elastic member, 21... Taper, 30... Cap, 40...
...Optical fiber, 50...Semiconductor device, 51...Protrusion, 60...Cap, 61...Key-shaped groove, 70...
...Semiconductor device, 71...Concave groove, 80...Cap, 81...Convex vein.

Claims (1)

【特許請求の範囲】 1 光半導体装置と、弾性部材と、キヤツプを具
備しており、前記光半導体装置は透過性樹脂から
なる略円柱形状の本体と、本体に封止した半導体
素子を含んでおり、かつ本体の上面中央部には先
端にテーパ面が形成された光フアイバの外径より
僅か大きい寸法の凹部と凹部の先端に形成したテ
ーパと凹部の底部に形成したレンズ部を有してお
り、前記弾性部材は軸心方向にスリツトを有する
円筒形状であつて、その先端面は前記テーパに密
着嵌合するテーパが形成されているとともに、円
筒の外径はキヤツプの開口部の径より僅かに大径
に形成されており、キヤツプは底部に開口部を有
する有底円筒状としてあり、弾性部材に光フアイ
バを挿入した状態で弾性部材をキヤツプに挿入し
た状態で光半導体装置とキヤツプに設けた連結手
段によりキヤツプと光半導体装置を連結させるよ
うにしたことを特徴とする光半導体装置の光フア
イバへの接続機構。 2 前記連結手段は、前記光半導体装置の側面に
形成した雄ネジとキヤツプの内面に形成した雌ネ
ジであることを特徴とする請求項第1項記載の光
半導体装置の光フアイバへの接続機構。 3 前記連結手段は、前記光半導体装置の側面に
形成した複数個の突起とキヤツプの周面に形成し
た前記突起に係合する鍵状溝であることを特徴と
する請求項第1項記載の光半導体装置の光フアイ
バへの接続機構。 4 前記連結手段は、光半導体装置の側面に周設
した凹溝とこの凹溝に係合するキヤツプの内面に
周設した凸脈であることを特徴とする請求項第1
項記載の光半導体装置の光フアイバへの接続機
構。
[Scope of Claims] 1. The optical semiconductor device includes an optical semiconductor device, an elastic member, and a cap, and the optical semiconductor device includes a substantially cylindrical main body made of a transparent resin and a semiconductor element sealed in the main body. At the center of the upper surface of the main body, there is a concave portion having a size slightly larger than the outer diameter of the optical fiber and having a tapered surface formed at the tip thereof, a taper formed at the tip of the concave portion, and a lens portion formed at the bottom of the concave portion. The elastic member has a cylindrical shape with a slit in the axial direction, and its distal end surface is formed with a taper that closely fits into the taper, and the outer diameter of the cylinder is smaller than the diameter of the opening of the cap. The cap is formed with a slightly larger diameter, and the cap has a bottomed cylindrical shape with an opening at the bottom, and when the optical fiber is inserted into the elastic member and the elastic member is inserted into the cap, the optical semiconductor device and the cap can be connected. 1. A connection mechanism for connecting an optical semiconductor device to an optical fiber, characterized in that the cap and the optical semiconductor device are connected by a connecting means provided. 2. A connection mechanism for an optical semiconductor device to an optical fiber according to claim 1, wherein the connecting means is a male screw formed on a side surface of the optical semiconductor device and a female screw formed on an inner surface of a cap. . 3. The connecting means is a key-shaped groove that engages with a plurality of protrusions formed on the side surface of the optical semiconductor device and the protrusion formed on the peripheral surface of the cap. Mechanism for connecting optical semiconductor devices to optical fibers. 4. Claim 1, wherein the connecting means is a groove formed around the side surface of the optical semiconductor device and a convex vein formed around the inner surface of the cap that engages with the groove.
A connection mechanism for connecting the optical semiconductor device to an optical fiber as described in 2.
JP59250731A 1984-11-27 1984-11-27 Optical semiconductor device Granted JPS61128214A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59250731A JPS61128214A (en) 1984-11-27 1984-11-27 Optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59250731A JPS61128214A (en) 1984-11-27 1984-11-27 Optical semiconductor device

Publications (2)

Publication Number Publication Date
JPS61128214A JPS61128214A (en) 1986-06-16
JPH0528804B2 true JPH0528804B2 (en) 1993-04-27

Family

ID=17212200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59250731A Granted JPS61128214A (en) 1984-11-27 1984-11-27 Optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS61128214A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0344973A (en) * 1989-07-13 1991-02-26 Mitsubishi Electric Corp Semiconductor optical device
WO2005078807A1 (en) * 2004-02-17 2005-08-25 Matsushita Electric Industrial Co., Ltd. Photoelectric conversion plug and photoelectric conversion module using it, and production method for photoelectric conversion plug
JP4687877B2 (en) * 2005-04-28 2011-05-25 スタンレー電気株式会社 LED lamp

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138891A (en) * 1979-04-18 1980-10-30 Fujitsu Ltd Light semiconductor device
JPS56145014U (en) * 1980-03-31 1981-11-02
GB2079966B (en) * 1980-07-07 1984-07-25 Hewlett Packard Co Housing for interfacing a semiconductor device with a fibre optic cable
US4391487A (en) * 1981-01-07 1983-07-05 Gte Laboratories Incorporated Optical fiber centering device
JPS6188106U (en) * 1984-11-14 1986-06-09

Also Published As

Publication number Publication date
JPS61128214A (en) 1986-06-16

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