JPH0529140B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and more particularly to a semiconductor device having a conductive protrusion supporting a film carrier lead for external extraction connected to an electrode terminal.

[Conventional technology]

Conventionally, this type of semiconductor device, as shown in FIG. 4, has a plurality of film carrier leads (hereinafter referred to as "leads") for connecting to the outside on the periphery of one principal surface of the semiconductor substrate _1a . Electrode terminals 2 and 3
and for preventing an electrical short circuit between the lead and the end of the semiconductor substrate _1a by supporting the lead between the electrode terminals 2 and 3 and one end of the semiconductor substrate _1a on the same main surface. One conductive projection 4 is provided for each electrode terminal 2, and two conductive projections _5a and _5b are provided for each electrode terminal 3.

Further, in a part of the periphery of one main surface of the semiconductor substrate 1 _a , there are characteristic testing elements 8 and 9 and characteristic testing electrode terminals 15 _a , 15 _b and 16 _a to 16 _c .

[Problem that the invention seeks to solve]

In the above-mentioned conventional semiconductor device, the characteristics of the characteristic testing element are tested by bringing the testing probe into contact with the characteristic testing electrode terminal. There is a drawback that a large number of characteristic testing elements and characteristic testing electrode terminals cannot be arranged in the area where a sufficient characteristic testing cannot be carried out.

[Means for solving problems]

The present invention provides at least a plurality of electrode terminals for connecting a film carrier lead for external lead provided on one main surface of a semiconductor substrate, and a plurality of electrode terminals connected to each of the electrode terminals between the electrode terminals and the periphery of the semiconductor substrate. A semiconductor device comprising a plurality of conductive protrusions supporting one film carrier lead for external extraction, the semiconductor device comprising: the electrode terminal and a characteristic testing wiring connected to the conductive protrusion. Ru.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of a first embodiment of the invention.

As shown in FIG. 1, a plurality of electrode terminals 2 for connecting leads to a peripheral portion of one main surface of a semiconductor substrate 1, a plurality of electrode terminals 3 for connecting leads for power application, and an electrode terminal. 2 and 3 and one end of the semiconductor substrate 1, there are conductive protrusions 4 for each electrode terminal 2 and conductive protrusions 5 _a and 5 _b for each electrode terminal 3 for supporting a lead. are doing.

The electrode terminal 2 and the conductive protrusion 4 are connected to the characteristic test element 8 by characteristic test wirings 6 _a and 6 _b , respectively, and the electrode terminal 3 and the conductive protrusions 5 a and 5 b are connected to the characteristic test wiring 7 _a and 7, respectively. _b and _7c are connected to the characteristic testing element 9.

FIG. 2 is a side view of the first embodiment in a characteristic testing state.

As shown in FIG. 2, the characteristics of the characteristic testing element 8 can be tested by bringing the characteristic testing probes 10 and 11 into contact with the electrode terminal 2 and the conductive protrusion 4.

FIG. 3 is a plan view of a second embodiment of the invention.

As shown in FIG. 3, a power wiring 12 extending toward the inside of the semiconductor substrate 1 is connected to an electrode terminal 3 to which a power supply lead is connected.
The conductive protrusion 5a has a connection point 13 with the power supply wiring 12.
A potential test wiring 14 is connected between the two.

Here, as in FIG. 2 described above, the electrode terminal 3
By bringing a characteristic testing probe into contact between the conductive protrusion 5a and the conductive protrusion 5a, the potential testing wiring 14 and the connection point 1 are connected.
Wiring resistance with up to 3 power supply wirings 12 can be measured. Furthermore, by applying power to the electrode terminal 3, the potential of the power supply wiring 12 at the connection point 13 can be measured using the conductive protrusion 5a.

〔Effect of the invention〕

As explained above, in the semiconductor device of the present invention, a special electrode terminal for characteristic testing can be provided in a limited area of a part of the semiconductor substrate by connecting the characteristic testing wiring to the electrode terminal and the conductive protrusion. Without,
This has the advantage that a wide variety of characteristic tests can be carried out.

[Brief explanation of drawings]

FIG. 1 is a plan view of the first embodiment of the present invention;
The drawings are a side view of the embodiment of FIG. 1 in a characteristic testing state, FIG. 3 is a plan view of the second embodiment of the present invention, and FIG. 4 is a plan view of an example of a conventional semiconductor device. 1, 1a... Semiconductor substrate, 2, 3... Electrode terminal,
4, 5 _a , 5 _b ... conductive protrusion, 6 _a , 6 _b , 7 _a to 7 _c
... Wiring for characteristic testing, 8, 9... Element for characteristic testing, 1
0, 11...probe for characteristic inspection, 12...power supply wiring, 1
3... Connection point, 14... Potential test wiring, 15 _a , 1
_5b , _16a to _16c ...electrode terminals for characteristic testing.

[Claims]

1 A vacuum chamber containing a wafer or other workpiece is provided with an introduction window on one side that guides laser light from the outside toward the surface of the workpiece, and an introduction window that guides the laser light from the surface when it is specularly reflected. The laser beam is provided with a window on the other side that guides the laser beam to the outside, and a detector that detects when the laser beam is diffusely reflected on the surface. A surface foreign object detection device consisting of a hollow or other cylindrical body with an inclined outer end surface.