JPH0529146B2 - - Google Patents

Description

[Detailed description of the invention]

(Industrial Application Field) The present invention relates to an electronic component mounting board on which electronic components are mounted and surface mounted on a printed wiring board.
Specifically, the present invention relates to an electronic component mounting board having an external connection terminal frame on a base material on which electronic components are mounted. (Prior Art) In recent years, electronic component mounting substrates on which electronic components are mounted and surface mounted on printed wiring boards are made from ceramic or plastic substrates.
Leaded or leadless chip carriers have been used. A common problem with these chip carriers is that it is difficult to increase the density of external connection terminals. JP-A-57-130454 and JP-A-59-
Publication No. 125641 discloses a leadless chip carrier made of ceramic as shown in FIGS. 14 and 15,
Further, Japanese Patent Application Laid-Open No. 60-249355 introduces a chip carrier with a plastic lead as shown in FIG. However, the conductor terminals for solder connection formed on the side surface of the ceramic leadless chip carrier are made of a conductor deposited or applied by plating or printing on the inner wall of the drilled through hole. With these manufacturing methods, there is a limit to the diameter that can be drilled, and the insulator between the holes cannot be made extremely thin, so the pitch of the side conductor terminal is 1.27 mm.
mm, and the inner diameter is generally 0.8 mm, making it extremely difficult to reduce the terminal pitch to 0.6 mm or less. On the other hand, chip carriers with plastic leads use a lead frame made by punching or chemical milling, and fix this to a plastic substrate with resin adhesive, or after mounting electronic components on the lead frame, A method has been adopted in which the entire part, except for the external terminal part, is molded with resin. In these chip carriers with leads, making the metal plate for the lead frame extremely thin deteriorates the adhesive strength or the rigidity of the mold, and to avoid this, relatively thick metal plates are used. Therefore, the terminal pitch is limited to about 0.6 mm, and in addition, because the part where the external leads of this leaded chip carrier are located is smooth, the external leads slip easily and are easily deformed by external forces in the lateral direction. There was a problem with causing it. For example, as shown in Japanese Patent Application Laid-Open No. 57-69765, in order to "satisfy all aspects of heat dissipation, miniaturization, thinning, and continuous productivity," A encapsulation of a semiconductor device has been proposed in which a semiconductor device is directly bonded to a substrate with good quality, and a flexible film on which a wiring conductor is formed is bonded to the substrate. According to this sealed body, some of the above problems were solved, but
Since the board itself was not designed with any ingenuity, it was not possible to easily clean the flux used in the process of mounting electronic components on the electronic component mounting board and to remove the cleaning liquid. (Problems to be Solved by the Invention) The present invention can easily achieve high density, which could not be achieved with the above-mentioned conventional techniques, without reducing reliability, and can also improve flux cleaning and
and the cleaning solution can be easily removed.
Moreover, it is an object of the present invention to provide a technique that can sufficiently cope with an increase in the number of external connection terminals. (Means for Solving the Problems) The means adopted by the present invention to solve the above-mentioned problems are as follows with reference numerals used in the examples: This is a board for mounting electronic components on the surface of which a conductor circuit 11 is formed, by fixing a frame 20 to the surface of the base material 10 and bending and fixing a part of the base material 10 around the frame 20. In the electronic component mounting board in which a part of the conductor circuit 11 is exposed to the outside and this exposed part is used as an external connection terminal, the frame 20 has a cutout part 21 on the surface that does not come into contact with the base material 10. It is assumed that the Next, the present invention will be explained in detail with reference to the drawings. As shown in FIGS. 1 and 2, in the electronic component mounting board 100 according to the present invention, a frame 20 is fixed on a base material 10 made of a flexible print material, and the surface of the base material 10 is A conductor circuit 11 formed on the frame body 20 is fixed so as to be exposed to the outside. The conductor circuit 11 exposed to the outside of the frame 20 forms an external connection terminal. The base material 10 is fixed from the outer surface to the bottom surface of the frame body 20, but if an external connection terminal is formed by the conductor circuit 11 of the base material 10 fixed to the frame body 20, it is fixed to the frame body 20. base material 10
The fixed position, fixed amount, etc. are not particularly limited. Although the material of the frame 20 is not particularly limited, defects due to mismatching of linear expansion coefficients can be prevented by matching the material of the printed wiring board on which the electronic component mounting board 100 is mounted.
Moreover, various shapes can be applied to the frame 20. For example, Figures 5a-d
There are the following types, and various types can be selected depending on the wiring pattern of the base material 10 to which the frame body 20 is fixed. Further, as shown in FIG. 6, the frame 20 for configuring the electronic component mounting board 100 of the present invention has a notch 21 on the surface that does not come into contact with the base material 10.
It is necessary to provide In the case of the frame 20 provided with such a notch 21, it is easy to clean the flux used in the process of mounting electronic components on the electronic component mounting board 100 and to remove the cleaning liquid from the notch 21. This is because the notch portion 21 becomes very effective. Further, as shown in FIG. 7, if the surface of the frame 20 to which the base material 10 is fixed is a curved surface, the frame 20
When fixing the base material 10 to the base material 10, there is no need to perform forced bending, and the reliability of the conductor circuit 11 serving as the external connection terminal can be further improved. Furthermore, as shown in FIG. 8, this frame 20 can also be used as a dam frame for the sealing resin 40 for sealing the mounted electronic components 30, eliminating the need to provide a separate dam frame. Further, as shown in FIG. 9, the frame body 20 is provided with a fitting part 23 into which the cap 22 is fitted, and the cap 2 seals the electronic component 30.
2 may be fitted together. Moreover, the electronic component mounting board 100 according to the present invention
In order to further enhance the heat dissipation effect of the electronic component 30, as shown in FIG.
A heat dissipation plate 1 is placed on the back surface of the electronic component mounting portion 12 formed in the
It is also possible to paste 3. In particular, by adjusting the coefficient of linear expansion of the heat sink 13 to that of the electronic component 30, good characteristics against thermal shock can be provided. Further, the electronic component mounting board 10 according to the present invention
0, as shown in FIG.
The electronic components 30 may be mounted on both sides of the board, and a double-sided through-hole board as shown in FIG. 12 or a multi-board board as shown in FIG. 13 may be used. Next, an example of the method for manufacturing the electronic component mounting board 100 according to the present invention will be described with reference to FIGS. 3 a to 4 f and 4 a to f. First, as shown in FIGS. 3a and 4a, openings 14 are made in the flexible substrate 10 that is continuously manufactured using sprocket holes for substrate conveyance and positioning provided in advance on both terminals. It is punched out and adhesive 15 is applied to one side. Next, as shown in FIGS. 3b and 4b, a copper foil 16 is placed on one surface of the base material 10 coated with the adhesive 15.
By hot-pressing and etching this copper foil 16, leads 11a protruding into the conductive circuit 11 and the opening 14 are formed, as shown in FIGS. 3c and 4c. Next, as shown in FIGS. 3 d and 4 d, a frame 20 coated with adhesive 15 in advance is pasted on the surface on which the conductor circuit 11 is not formed, and this adhesive 1
5 is semi-hardened. Then, as shown in Figures 3e and 4e,
The base material 10 is cut into a predetermined shape. Finally, as shown in Figures 3f and 4f,
The four ends of the base material 10 are bent along the frame 20, and the adhesive 15 is completely cured to be fixed to the frame 20. Of course, at the four corners of this frame 20, as shown in FIG.
Notches 21 are formed to facilitate the cleaning of flux used in the process of mounting electronic components on the 00 and the removal of cleaning liquid. (Action of the invention) By the present invention taking the above-mentioned means,
It has the following effects. That is, the base material 10 is wrapped around the frame body 20.
By bending the base material 10, a part of the conductive circuit 11 formed on the base material 10 is exposed, and this exposed portion becomes an external connection terminal. Further, the external connection terminal formed by exposing a part of the conductor circuit 11 is constituted by the conductor circuit 11 formed on the base material 10 fixed to the frame 20. Since the conductor circuit 11 is fixed to the base material 10, positional accuracy is not lost even when the conductor circuit 11 is bent or otherwise fixed to the frame 20. Furthermore, in the case of this electronic component mounting board 100, cuts are made at the four corners of the frame 20 on the surface where the four ends of the base material 10 do not come into contact, as shown in FIG. Since the notches 21 are formed, the flux used in the process of mounting electronic components on the electronic component mounting board 100 can be easily cleaned and the cleaning liquid can be easily removed by each of the notches 21. It is. (Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited to the following examples. Example 1 A polyimide film (manufactured by Toray Industries, Ltd.) was used as the base material 10 shown in FIGS. 3a and 4a. Also, the third
As the copper foil 16 shown in Figure b and Figure 4b, the thickness is
35μm rolled copper foil (manufactured by Nikko Grundfoil Co., Ltd.)
It was used. For the external terminal frame 20 shown in FIGS. 3d and 4d, polysulfon injection molded into the shape shown in the figures was used. Next, the composition of the adhesive 15 used for adhering the conductor circuit 11 to copper foil and for adhering the frame 20 will be shown. In the following compositions, all "parts" mean "parts by weight." 100 parts of bisphenol A type epoxy methacrylate resin (average molecular weight 1000, manufactured by Nippon U-Pica Co., Ltd., trade name Neopol 8104), 75 parts of diallyl phthalate (manufactured by Osaka Soda Co., Ltd.) as a copolymerizable crosslinking agent, and radical polymerization. 1.8 benzoyl peroxide as initiator
Let the mixed composition be (). Further, a composition obtained by mixing 100 parts of bisphenol A type epoxy resin (average molecular weight 380, manufactured by Yuka Ciel Co., Ltd., trade name E-828) and 4.0 parts of dicyandiamide as a hardening agent was designated as (), and the above composition () and () were mixed at a ratio of 2:1 and then kneaded using a three-roll mill to obtain an adhesive. Example 2 A single-sided copper-clad glass epoxy base material was used for the electronic component mounting board, and polyetherimide processed by injection molding was used for the external terminal frame. The same procedure as in Example 1 was conducted except that a double-sided roughened foil (manufactured by Nikko Gludfoil Co., Ltd.) having a thickness of 18 μm was used as the copper foil for the conductor circuit. Example 3 The same procedure as Example 1 was carried out except that an aluminum plate whose surface was covered with an insulating film was used as the electronic component mounting substrate. Comparative Example 1 As shown in FIG. 14, a ceramic leadless chip carrier in which a through hole was formed by drilling on the side surface, and a conductor was deposited or coated on the inner wall of the through hole by plating or printing to form an external terminal. Comparative Example 2 As shown in Figure 16, a lead frame made by punching or chemical milling is fixed to a plastic substrate with resin adhesive, or after electronic components are mounted on the lead frame, the external terminals of the lead frame are fixed. A chip carrier with a plastic lead made entirely of resin except for the parts. The results of evaluating the conductor width, external terminal pitch, and connection reliability of the above-mentioned Examples and Comparative Examples 1 and 2 are shown in the table. The connection reliability was evaluated using the following method. After 100 cycles of a thermal shock test of -65°C for 15 minutes, standing for 2 minutes, and 125°C for 15 minutes, continuity resistance was measured and the presence or absence of disconnection was evaluated.

[Table] (Effects of the invention) (1) The external connection terminal is composed of a conductor circuit formed on a base material fixed to the frame; Therefore, positional accuracy is not lost even during bending or the like when fixing to the frame, and a highly reliable electronic component mounting board can be provided. (2) The conductor circuit that forms the external connection terminals can be formed from thin copper foil, allowing microfabrication of the conductor width to about 0.05mm, and the pitch of the external connection terminals to about 0.10mm. (3) Since the frame structure and material can be freely selected, if a large number of external connection terminals are required, the external connection terminal pitch can be designed according to the mounting technology.
Further, the linear expansion coefficient of the frame can be matched with that of the motherboard, etc., and a highly reliable electronic component mounting board can be provided. (4) The conductor circuit forming the external connection terminal is firmly fixed with adhesive, and there is no deformation of the external connection terminal. (5) Regarding this electronic component mounting board 100,
Since notches 21 are formed at each of the four corners of the frame 20, these notches 21 allow cleaning of flux used in the process of mounting electronic components on the electronic component mounting board 100. Also, the cleaning liquid can be easily removed. As described above, according to the present invention, high density can be easily achieved without reducing reliability, and an increase in the number of external connection terminals can be adequately coped with.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a board for mounting electronic components according to the present invention, FIG. 2 is a cross-sectional view showing a board for mounting electronic components according to the present invention, and FIGS. 3 a to 3 f are mounting electronic components according to the present invention. FIGS. 4a to 4f are partial sectional views corresponding to FIGS. 3a to 3f, and FIGS. 5a to 5d are perspective views illustrating the manufacturing method of the electronic component mounting board according to the present invention. 6 is a perspective view showing a frame having a notch, and FIGS. 7 to 13 are partial cross sections showing each embodiment of the electronic component mounting board according to the present invention. 14 is a perspective view showing a conventional ceramic leadless chip carrier,
FIG. 15 is a perspective view showing a conventional chip carrier made of ceramic with a heat sink, and FIG. 16 is a perspective view showing a conventional chip carrier made of plastic with leads. Explanation of symbols 100...Substrate for mounting electronic components, 1
0... Base material, 11... Conductor circuit, 12... Electronic component mounting part, 13... Heat sink, 14... Opening, 15... Adhesive,
16...Copper foil, 20...Frame, 21...Notch, 22
...Cap, 23...Mating part, 30...Electronic component, 4
0... Sealing resin, 210... Base material, 220... External terminal, 230... Chip terminal, 240... Wire bonding pad, 250... Heat sink, 260
...Mold resin.

[Claims]

1 An integrated circuit comprising a semiconductor body with first and second surface regions having adjacent surfaces, the first surface region being of a first conductivity type and having an insulated gate and a source and drain of a second conductivity type. at least one field effect transistor having a first electrode region adjacent to the surface and occupying a first surface portion of the surface; an integrated circuit for providing at least one further circuit element having a second electrode region adjacent to said surface and having a conductivity type opposite to that of said first electrode region within one surface portion; A method of manufacturing a circuit, wherein a pattern of conductive material is applied onto a first insulating layer already present over a portion of said first electrode region, simultaneously with a gate electrode of a field effect transistor. the pattern defining at least a first portion of the edge of a first opening to be used in a first doping process for providing a dopant for the second electrode region; a portion of the first insulating layer of the field effect transistor is removed and the first doping process is performed to form the second electrode region and the source and drain regions of the field effect transistor.

Claims (1)

The board for mounting electronic components according to any one of claims 1 to 4, characterized in that it is manufactured continuously using sprocket holes for positioning.