JPH053088B2 - - Google Patents
Info
- Publication number
- JPH053088B2 JPH053088B2 JP63146942A JP14694288A JPH053088B2 JP H053088 B2 JPH053088 B2 JP H053088B2 JP 63146942 A JP63146942 A JP 63146942A JP 14694288 A JP14694288 A JP 14694288A JP H053088 B2 JPH053088 B2 JP H053088B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- spacer
- printed
- pattern
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/703—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by spacers between contact carrying layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2211/00—Spacers
- H01H2211/006—Individual areas
- H01H2211/01—Ink
Landscapes
- Push-Button Switches (AREA)
Description
【発明の詳細な説明】
本発明は、可撓性の薄型キーボードスイツチ部
材の製造方法に係り、特に熱処理を行い半硬化さ
せたシリコーンゴム液を用いてスペーサー部を印
刷塗着させて形成したキーボードスイツチ用可撓
性基板を具えた可撓性の薄型キーボードスイツチ
部材の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a flexible thin keyboard switch member, and particularly to a keyboard formed by printing and applying a spacer portion using a silicone rubber liquid that has been semi-cured by heat treatment. The present invention relates to a method of manufacturing a flexible thin keyboard switch member provided with a flexible substrate for a switch.
従来のキーボードスイツチは、その基板として
の通常銅張フエノール樹脂積層板上への金メツキ
回路基板部と、接点部としての導電性ゴムとを対
向して組み合わせ、さらにその中間に、別個のス
ペーサー層を介在させたものが用いられ、いわゆ
る薄型にすることが極めて困難であり、又強いて
求めれば複雑精密にして極めて高価なものになつ
てしまう欠点があつた。さらに又この種の薄型の
ものであつても、従来のスペーサーとしてのシリ
コーンゴム印刷装着には、印刷時における厚みの
調整の困難、つまり印刷塗膜の厚みにバラツキが
大きく、しかも印刷後のシリコーンゴムの「の
り」の悪さなどを含む印刷性と問題があり、これ
が大きくこの製品製造の不良率に関係していた。
本発明は、以上のような欠点を除去するためにな
されたもので、極めて簡単な製造工程によつて、
スペーサー用としての特殊のシリコーンゴム塗膜
が持つている弾力性を少しも損なうことなく、印
刷時における印刷塗膜の厚みの調整及び印刷性を
向上したキーボードスイツチ用可撓性基板を具え
た可撓性薄型キーボートスイツチ部材の製造方法
を提供しようとするものである。 Conventional keyboard switches combine a gold-plated circuit board, usually on a copper-clad phenolic resin laminate as a substrate, with conductive rubber as a contact, and a separate spacer layer in between. It is extremely difficult to make a so-called thin type, and if forced to do so, it has the disadvantage that it becomes complicated and precise and extremely expensive. Furthermore, even with this type of thin spacer, conventional printing of silicone rubber as a spacer requires difficulty in adjusting the thickness during printing, in other words, there is large variation in the thickness of the printed film. There were problems with printability, including poor ``glue'' of the rubber, which had a large impact on the defective rate of this product.
The present invention was made in order to eliminate the above-mentioned drawbacks, and by using an extremely simple manufacturing process,
A flexible substrate for keyboard switches that allows adjustment of the thickness of the printed coating film during printing and improves printability without impairing the elasticity of the special silicone rubber coating film used for spacers. It is an object of the present invention to provide a method for manufacturing a flexible thin keyboard switch member.
本発明は、その実施例が第1a図ないし第4図
にみられるように、厚み25〜150μの一枚の可撓
性の、ポリエステル等の合成樹脂フイルム基板1
の片面に、(a)粒度0.1〜60μの黒鉛粉末、粒度0.1μ
以下のカーボンブラツク粉末及び粒度0.1〜60μの
銀粉末の1種または2種以上から成る微粉末20〜
80重量%と、(b)ポリウレタン樹脂、クロロプレン
ゴム、ポリエステル樹脂及びフエノール樹脂の1
種または2種以上から成るゴム系、熱可塑性樹脂
及び熱硬化性樹脂系有機結合剤5〜30重量%と、
(C)ジメチルスルホルムアミド、ジエチルカルビト
ール、ブチルカルビトール、イソホロン及びテレ
ピン油等の溶剤15〜80重量%とを混合(a+b+
c)溶解し、均一に分散せしめた見掛比重0.9〜
1.9、粘度150〜10000ポイズの懸濁液を使用して、
所望の接点パターン2をスクリーン印刷法にて印
刷し(第1a図は裏側から見たところ)、さらに
該接点パターン2の周辺近傍に同じく印刷により
スペーサー部層3をより厚く形成し(第2図は裏
面から見たところ)、他の一枚の可撓性の合成樹
脂フイルム基板の片面に、前記接点及びスペーサ
ーパターンCoに対応し重ね合わすべき所望の回
路パターンCiを同じくスクリーン印刷法にて印刷
し、両フイルム基板にそれぞれ位置合わせ用の孔
4を設け(第3a図及び第3b図)、該位置合わ
せ用の孔4により、前記接点部及びスペーサー部
Coと、前記回路部Ciとを重ね合わせ対向せしめ
る可撓性の薄型キーボードスイツチ部材(第4
図)の製造方法において、前記のそれぞれのフイ
ルム基板上に所望の回路及び接点パターン層を、
それぞれ印刷し温度95〜150℃で5〜20分間乾燥
して形成し、次いで、予め、50〜100℃にて1〜
10日間、熱処理し、半硬化させたシリコーンゴム
液を用いて、前記スペーサー部を、印刷塗着させ
90〜180℃の温度で10〜30分間乾燥して前記回路
及び接点パターン層2よりも厚い、25〜150μの
厚さのスペーサー部層3を形成せしめて構成する
ことを特徴とする。 As an embodiment of the present invention is shown in FIGS. 1a to 4, a flexible synthetic resin film substrate 1 made of polyester or the like having a thickness of 25 to 150 μm is used.
on one side of (a) graphite powder with a particle size of 0.1 to 60μ, a particle size of 0.1μ
Fine powder consisting of one or more of the following carbon black powder and silver powder with a particle size of 0.1 to 60μ 20~
80% by weight, and (b) 1 of polyurethane resin, chloroprene rubber, polyester resin, and phenolic resin.
5 to 30% by weight of a rubber-based, thermoplastic resin, and thermosetting resin-based organic binder consisting of one or more species;
(C) Mix with 15 to 80% by weight of a solvent such as dimethyl sulformamide, diethyl carbitol, butyl carbitol, isophorone, and turpentine oil (a+b+
c) Dissolved and uniformly dispersed apparent specific gravity 0.9~
1.9, using a suspension with a viscosity of 150-10000 poise,
A desired contact pattern 2 is printed by screen printing (FIG. 1a is a view from the back side), and a thicker spacer layer 3 is formed near the periphery of the contact pattern 2 by the same printing method (FIG. 2). (viewed from the back side), on one side of another flexible synthetic resin film substrate, a desired circuit pattern Ci to be overlapped corresponding to the contact point and spacer pattern Co is printed using the same screen printing method. Then, holes 4 for alignment are provided in both film substrates (FIGS. 3a and 3b), and the holes 4 for alignment allow the contact portion and the spacer portion to be aligned.
A flexible thin keyboard switch member (fourth
In the manufacturing method shown in Figure), desired circuit and contact pattern layers are formed on each of the above film substrates,
Each is printed and dried at a temperature of 95 to 150°C for 5 to 20 minutes, and then pre-printed at 50 to 100°C for 1 to 20 minutes.
The spacer part was printed and coated using a silicone rubber liquid that had been heat-treated and semi-cured for 10 days.
It is characterized in that it is dried at a temperature of 90 to 180° C. for 10 to 30 minutes to form a spacer layer 3 having a thickness of 25 to 150 μm, which is thicker than the circuit and contact pattern layer 2.
ここで用いるシリコーンゴム液とは、そのま
ま、又は硬化剤と共に、有機溶剤に分散させたワ
ニス状のジメチルポリシロキサン初期縮合物(重
合度5000〜10000)(粘度0.65〜10000cst(25℃))
を、予め温度50〜100℃にて1〜10日間、熱処理
し、縮合重合を進行させて半硬化状態にさせたシ
リコーンゴム液をいう。ジメチルポリシロキサン
は、ジメチルジクロロシラン〔(CH3)2SiCl2〕を
加水分解して得られたジメチルジヒドロキシシラ
ンを重合させて得られるものである。 The silicone rubber liquid used here is a varnish-like dimethylpolysiloxane initial condensate (degree of polymerization 5,000 to 10,000) (viscosity 0.65 to 10,000 cst (25°C)) dispersed in an organic solvent as it is or together with a curing agent.
It refers to a silicone rubber liquid that has been heat-treated in advance at a temperature of 50 to 100°C for 1 to 10 days to advance condensation polymerization and bring it into a semi-cured state. Dimethylpolysiloxane is obtained by polymerizing dimethyldihydroxysilane obtained by hydrolyzing dimethyldichlorosilane [(CH 3 ) 2 SiCl 2 ].
なお、このシリコーンゴム液は、さらに、最終
的には、加熱重合により主としてジメチルポリシ
ロキイサンから成る三次元的網状構成(部分的に
架橋結合を有するものを含む)を持つものにな
り、そのシリコーンゴムはすぐれた弾性のほか、
経時安定性、耐候性を有する。 Furthermore, this silicone rubber liquid will eventually have a three-dimensional network structure mainly composed of dimethylpolysiloxane (including one partially cross-linked) through thermal polymerization, and the silicone In addition to its excellent elasticity, rubber
Stable over time and weather resistant.
前記の加熱処理を行なつたシリコーンゴム液
は、本発明においては、特に前記のスペーサーと
しての印刷塗膜の厚みにバラツキが少なく印刷厚
みの調整が容易で印刷性に優れた効果をもたらす
ことができる。 In the present invention, the silicone rubber liquid that has been subjected to the above heat treatment has the advantage that there is little variation in the thickness of the printed coating film used as the spacer, and the printing thickness can be easily adjusted, resulting in excellent printability. can.
この場合に、印刷した両基板1すなわち接点部
Coと回路部Ciとを、位置合わせ用孔4を利用し
て、重ね合わせた時、所望の回路部Ciと所望の接
点部Coとが、丁度上下に位置してスイツチとし
て作動できるように、上下に対向できる位置にな
る(第4図参照)。 In this case, both printed substrates 1, that is, the contact parts
When Co and the circuit part Ci are overlapped using the positioning hole 4, the desired circuit part Ci and the desired contact part Co are positioned exactly above and below so that they can operate as a switch. They will be in a position where they can face each other vertically (see Figure 4).
しかして、前記の懸濁液の組成(a+b+c)
において前記の黒鉛、カーボンブラツク、銀の組
成における数量限定、すなわち20〜80重量%の上
限及び下限を越える場合には、印刷に用いる懸濁
液の安定性及び印刷性のいわゆる「のり」と「稠
度」が共に悪くなり、特に下限未満では皮膜の導
電性が著しく悪く導通体としての性質を損ない、
また、上限を越える場合は、接着力が悪くなり不
可である。 Therefore, the composition of the suspension (a+b+c)
If the above-mentioned quantity limitations in the composition of graphite, carbon black, and silver exceed the upper and lower limits of 20 to 80% by weight, the so-called "glue" and "glue" in the stability and printability of the suspension used for printing may be affected. The conductivity of the film deteriorates, especially below the lower limit, and the conductivity of the film deteriorates, impairing its properties as a conductor.
Moreover, if it exceeds the upper limit, the adhesive strength will deteriorate and it will not be possible.
また、粒度に対しては、黒鉛及び銀粉末の場合
60μを越えると前記懸濁液の安定性、印刷のいわ
ゆる「のり」が悪くなり、接着も十分得られず、
また、印刷性が悪くなり、導電性が悪くなり不可
である。また、下限が0.1μ未満では普通工業的に
入手可能であり、懸濁液の粘度、稠度並びに印刷
性等から考えて好適なためである。カーボンブラ
ツク粉末の場合において、粒度0.1μ以下としたの
は、0.1μを越える粒度のものは普通入手が不可能
であり、また、カーボンブラツクの場合0.1μ以下
の粒子としたのは、前記黒鉛及び銀粉末と異な
り、粒子が鎖のように結合しているため粒子が細
かくても印刷性等好適であるためである。 In addition, regarding particle size, in the case of graphite and silver powder
If it exceeds 60μ, the stability of the suspension and the so-called "glue" of printing will deteriorate, and sufficient adhesion will not be obtained.
In addition, printability deteriorates and conductivity deteriorates, making it unsuitable. Further, if the lower limit is less than 0.1μ, it is usually commercially available and is suitable in view of the viscosity, consistency, printability, etc. of the suspension. In the case of carbon black powder, the particle size is 0.1μ or less because particles with a particle size larger than 0.1μ are not normally available, and in the case of carbon black, the particle size is 0.1μ or less because This is because, unlike silver powder, the particles are bonded together like a chain, so even if the particles are fine, they are suitable for printability, etc.
次に(b)前記有機結合剤としては、ポリウレタン
樹脂、例えば日本ポリウレタン株式会社製商品名
パラプレン22S、クロロプレンゴム、例えば昭和
ネオプレン株式会社製商品名ネオプレンWRT・
WD等、熱可塑性樹脂結合剤としては、ポリエス
テル樹脂、例えば日立化成株式会社製商品名エス
ペル1300、1311等、熱硬化性樹脂系結合剤として
フエノール樹脂、例えば住友デコレズ株式会社製
商品名PA−301等を用いることができる。 Next, (b) the organic binder includes a polyurethane resin, such as Paraprene 22S (trade name, manufactured by Nippon Polyurethane Co., Ltd.), and chloroprene rubber, such as Neoprene WRT (trade name, manufactured by Showa Neoprene Co., Ltd.).
As a thermoplastic resin binder such as WD, polyester resin such as Hitachi Chemical Co., Ltd., trade name ESPEL 1300, 1311, etc., as a thermosetting resin binder, phenol resin, such as Sumitomo Decorez Co., Ltd. trade name PA-301. etc. can be used.
しかし、この有機結合剤の数量限定、すなわち
5〜30重量%の下限未満になると、懸濁液の分散
安定性及び印刷の「のり」が良くなく、稠度も不
十分で印刷性も良くなく、不可である。上限を越
える場合には、稠度が高すぎて印刷性がかえつて
悪くなり、導電性が著しく悪くなるため不可であ
る。 However, if the quantity of this organic binder is limited, i.e., less than the lower limit of 5 to 30% by weight, the dispersion stability of the suspension and the printing "glue" will be poor, the consistency will be insufficient, and the printability will not be good. Not possible. If the upper limit is exceeded, the consistency is too high, which worsens the printability and significantly deteriorates the conductivity, so it is not acceptable.
以上述べた懸濁液の調整には前記組成原料(a)、
(b)、(c)を各々所定量ずつ混合(a+b+c)し、
溶解せしめ、分散して見掛比重0.9〜1.9、粘度
150〜10000ポイズの懸濁液を調整する。この場
合、生成した懸濁液の見掛け比重が0.9未満であ
つては、黒鉛、カーボンブラツク及び銀の粉末成
分が不足する結果を生じ、導電性が悪くなり、
1.9を越える場合は、液の分散性が悪くなり、安
定性が害され、かつ接着力が悪くなり不可であ
る。 To prepare the suspension described above, the composition raw material (a),
(b) and (c) are mixed in predetermined amounts each (a+b+c),
Dissolve and disperse to give an apparent specific gravity of 0.9 to 1.9 and a viscosity of
Adjust the suspension to 150-10,000 poise. In this case, if the apparent specific gravity of the resulting suspension is less than 0.9, the graphite, carbon black, and silver powder components will be insufficient, resulting in poor conductivity.
If it exceeds 1.9, the dispersibility of the liquid will be poor, the stability will be impaired, and the adhesive force will be poor, so it is not acceptable.
次にこの懸濁液を用いて所望の回路及び接点パ
ターンを印刷する絶縁基板としては、可撓性のポ
リエステルフイルム基板のほか、各種合成樹脂フ
イルムを使用することができる。この絶縁基板上
への回路及び接点パターンの印刷は前記懸濁液を
用いてスクリーン印刷にて容易に行うことができ
る。次にこの懸濁液にて所望の回路及び接点のパ
ターンを印刷し形成した基板の印画面を95〜150
℃の温度にて5〜20分間乾燥するが、95℃未満で
も、5分間未満でも、乾燥が不充分な危険があ
り、不可である。一方、20分間を越える必要はな
く、150℃ぽ越えると、基板自体に悪影響がでる
おそれがあり、不可である。 Next, as an insulating substrate on which desired circuits and contact patterns are printed using this suspension, various synthetic resin films can be used in addition to a flexible polyester film substrate. Printing of circuits and contact patterns on this insulating substrate can be easily performed by screen printing using the suspension. Next, use this suspension to print the desired circuit and contact patterns, and the printed surface of the formed board is 95 to 150
Drying is carried out at a temperature of 5 to 20 minutes at a temperature of 95°C, but drying at temperatures below 95°C or for less than 5 minutes is not possible as there is a risk of insufficient drying. On the other hand, it is not necessary to exceed 20 minutes, and exceeding 150 degrees Celsius may have an adverse effect on the substrate itself, so it is not possible.
次に前記接点パターンを形成したフイルム基板
表面上に、50〜100℃の温度で1〜10日間の熱処
理を行い、半硬化させたシリコーンゴム液を用い
て、所望のスペーサパターンを前記接点パターン
の周辺近傍に印刷し、90〜180℃の温度で10〜30
分間乾燥してスペーサー層3を形成するが、前記
シリコーンゴム液の熱処理温度及び日数の限定、
すなわち温度50〜100℃、日数1〜10日間の上限
及び下限を越える場合、半硬化性を持たせたシリ
コーンゴム液の特質が損なわれる。上限を越える
場合、熱処理したシリコーンゴムの殆どが硬化を
起こし、印刷の「のり」が悪くなり、稠度も不十
分で印刷性も良くなく不可であり、また、下限未
満では熱処理したシリコーンゴム液はほとんど硬
化せず、従来の一般に用いられているシリコーン
ゴムのように「のり」の悪さと、印刷厚みの調整
の困難などが生じ不可である。また、印刷してス
ペーサー部を形成するのに使用されるシリコーン
ゴム液は、その熱処理条件が非常に重要である。
なお、例えば、東レ・シリコーン株式会社製商品
名トーレ・シリコーンSE1700(ホワイト)等はこ
れを用いることができる。 Next, heat treatment is performed on the surface of the film substrate on which the contact pattern has been formed for 1 to 10 days at a temperature of 50 to 100°C, and a desired spacer pattern is formed on the contact pattern using a semi-cured silicone rubber liquid. Print near the periphery, 10-30 at a temperature of 90-180℃
The spacer layer 3 is formed by drying for minutes, but the heat treatment temperature and number of days of the silicone rubber liquid are limited;
That is, if the temperature exceeds the upper and lower limits of 50 to 100°C and the number of days is 1 to 10 days, the characteristics of the semi-curable silicone rubber liquid will be impaired. If the upper limit is exceeded, most of the heat-treated silicone rubber will harden, resulting in poor printing adhesion, insufficient consistency, and poor printability, and below the lower limit, the heat-treated silicone rubber liquid will It hardly cures, and unlike conventional silicone rubbers, it has poor adhesion and difficulty in adjusting printing thickness. Furthermore, the heat treatment conditions for the silicone rubber liquid used to form the spacer portion by printing are very important.
For example, Toray Silicone SE1700 (white) manufactured by Toray Silicone Co., Ltd. can be used.
なお、この工程で乾燥したシリコーンゴムのス
ペーサー部のパターンの塗膜は、25〜150μの厚
さが望ましい。この厚さ限定の上限及び下限を越
えるものに関しては次の理由によりキーボード用
スイツチ部材として不可である。まず、上限を越
える場合、回路部(Ci)と接点部(Co)の下り
重ね合わせの際(第4図参照)、スペーサー層3
の厚みが大きすぎるため、接点部を押圧してもそ
の回路Ciと接点部Coの上下通が困難になり、接
触不良を起こし、下限未満ではその両者の距離が
短かすぎるため、基板の少しの歪みでも自然接触
を起こす恐れがあるので、それぞれ不可である。
つまりスペーサー部としての作用をしないため不
可である。 The thickness of the silicone rubber spacer pattern coating film dried in this step is preferably 25 to 150 μm. Items exceeding the upper and lower limits of the thickness limit cannot be used as keyboard switch members for the following reasons. First, if the upper limit is exceeded, when the circuit part (Ci) and the contact part (Co) are stacked downward (see Figure 4),
Because the thickness of the circuit is too large, even if the contact part is pressed, it becomes difficult to pass the circuit Ci and the contact part Co up and down, causing a contact failure. Distortion may also cause natural contact, so each is not allowed.
In other words, it is not possible because it does not function as a spacer portion.
このようにして、前記の半硬化性シリコーンゴ
ム液を用いて、印刷塗着させたスペーサー部3を
一体として持つキーボードスイツチ用可撓性基板
が得られる。 In this way, a flexible substrate for a keyboard switch having integrally the spacer portion 3 printed and coated using the semi-curable silicone rubber liquid described above is obtained.
なお、接点部Coと回路部Ciとの導電部分を互
いに位置合わせするための位置合わせ用孔(第3
a図及び第3b図の参照記号4参照)を穿設する
ことによつて、確実な位置合わせができる。 Note that there is an alignment hole (third
Reliable positioning can be achieved by drilling holes (see reference symbol 4 in Figures 3a and 3b).
本発明に係るキーボードスイツチの作動は、第
4図に示す如く、接点部Coの導電部2を基板フ
イルム1の表面から、スペーサー層3の弾性に抗
して、矢印の方向に指等で押圧すると、下方の基
板フイルム1の回路部Ciの導電部2に容易確実に
接触し導通が行われ、押圧している指等を接点部
Coから離すと、スペーサー層3の弾性によつて
復元し、接点部Coの導電部2と回路部Ciの導電
部2と接触が容易確実に解除され離され復元され
る。 As shown in FIG. 4, the keyboard switch according to the present invention operates by pressing the conductive part 2 of the contact part Co from the surface of the substrate film 1 with a finger or the like in the direction of the arrow against the elasticity of the spacer layer 3. Then, the conductive part 2 of the circuit part Ci of the lower substrate film 1 is easily and reliably contacted and conduction is established, and the pressing finger etc. is connected to the contact part.
When separated from Co, it is restored by the elasticity of the spacer layer 3, and the contact between the conductive part 2 of the contact part Co and the conductive part 2 of the circuit part Ci is easily and reliably released, and they are separated and restored.
本発明に係る半硬化性シリコーンゴムをスペー
サーとして持つ可撓性の薄型キーボードスイツチ
部材は、通常キーボードスイツチとして極めてそ
の性能を満足し、勿論すべての実用試験に合格す
る。前記の半硬化性シリコーンゴム液を使用して
いるため、これによつて形成されるスペーサー層
が弾力性に富み、スクリーン印刷を用いて精密な
パターンを印刷できる上、従来の方式より良好な
キーボードスイツチ用可撓性基板が製造できる利
点がある。すなわち、薄型にして安価でしかも高
性能のキーボードスイツチ部材を得ることができ
る。 The flexible thin keyboard switch member having semi-hardened silicone rubber as a spacer according to the present invention extremely satisfies the performance as a normal keyboard switch, and of course passes all practical tests. Because the above-mentioned semi-curable silicone rubber liquid is used, the spacer layer formed by this is highly elastic, allowing precise patterns to be printed using screen printing, and the keyboard is better than conventional methods. There is an advantage that flexible substrates for switches can be manufactured. That is, it is possible to obtain a keyboard switch member that is thin, inexpensive, and has high performance.
以下図面で簡単に説明すると、第1a図は、ポ
リエステルフイルム基板1上に所定の接点パター
ンを印刷形成したときの裏側から見た斜視図を示
し、第1b図は導電性回路パターンを別のフイル
ム基板上に印刷したときの斜視図である。 Briefly explained below with reference to the drawings, Fig. 1a shows a perspective view from the back side when a predetermined contact pattern is printed and formed on a polyester film substrate 1, and Fig. 1b shows a conductive circuit pattern on another film. It is a perspective view when printing on a board|substrate.
第2図は、前記の半硬化性シリコーンゴム液
を、第1a図の接点部の周辺表面上にスペーサー
層3として印刷形成したものの裏側から見た斜視
図であり、第3a図及び第3b図はそれぞれ基板
に位置合わせ用孔4を穿設した接点部Co(裏面)
及び回路部(表面)を示す。重ね合わせて接点部
Coと回路部Ciとを互いに対向させ第4図にみら
れるように位置決めする。すなわち、矢印方向
(↓)に圧力を加えることによつてスペーサー層
3が十分なクツシヨンとして働き、かつ接点部
Coと回路部Ciとの導電部分2,2が互いに接触
し、回路に電流が流れる。 FIG. 2 is a perspective view of the semi-curable silicone rubber liquid printed and formed as a spacer layer 3 on the peripheral surface of the contact portion shown in FIG. 1a, viewed from the back side, and FIGS. 3a and 3b. are the contact parts Co (back side) with alignment holes 4 drilled in the respective boards.
and shows the circuit section (surface). Overlap the contact part
Co and the circuit section Ci are positioned so as to face each other as shown in FIG. In other words, by applying pressure in the direction of the arrow (↓), the spacer layer 3 acts as a sufficient cushion and the contact portion
The conductive parts 2, 2 of Co and circuit part Ci come into contact with each other, and current flows through the circuit.
以下さらに本発明を実施例について具体的に説
明する。 Hereinafter, the present invention will be further described in detail with reference to Examples.
実施例 1
(a)粒度0.1〜60μの黒鉛粉末30重量%及び粒度
0.1μ以下のカーボンブラツク15重量%と、(b)ポリ
ウレタン樹脂、すなわち日本ポリウレタン株式会
社製商品名パラプレン22S23重量%と、(c)イソホ
ロン27重量%とよりなる懸濁液(a+b+c)を
用いて、第1a図及び第1b図に示すように、そ
れぞれの基板1上に、接点及び回路パターンがそ
れぞれ独立して、スクリーン印刷法により、厚さ
125μのポリエステルフイルム基板1の片面上に
印刷し、温度100℃で15分間乾燥して導電部分2
を形成した。次に、接点パターンを印刷した基板
表面上に、温度90℃で、5日間熱処理し、半硬化
製にしたシリコーンゴム液すなわち、例えば東
レ・シリコーン株式会社製商品名トレー・シコー
ンSE−1700(ホワイト)を、例として第2図に示
すように、スクリーン印刷法にて100μの厚みを
持つスペーサー層3のパターンを印刷し、温度
150℃20分間乾燥し、スペーサー層3を形成させ
た。前記の如く導電性回路2を印刷し回路部Ci
と、前記の如くスペーサー層3を形成した接点部
Coとのポリエステルフイルム基板に、それぞれ
第3a図及び第3b図に示すように、位置合わせ
用孔4を穿孔した。最後に、前記の位置合わせ用
孔4を利用して、前記回路部Ciと、前記接点Co
とを所定位置に対向させて固定する。これにより
本発明の製造工程が完了する。Example 1 (a) 30% by weight of graphite powder with a particle size of 0.1 to 60μ and particle size
Using a suspension (a+b+c) consisting of 15% by weight of carbon black of 0.1 μ or less, (b) 3% by weight of a polyurethane resin, that is, 3% by weight of Paraprene 22S (trade name, manufactured by Nippon Polyurethane Co., Ltd.), and (c) 27% by weight of isophorone. , as shown in FIGS. 1a and 1b, contact points and circuit patterns are independently formed on each substrate 1 by screen printing to a thickness of
It is printed on one side of a 125μ polyester film substrate 1 and dried at a temperature of 100°C for 15 minutes to form a conductive part 2.
was formed. Next, on the surface of the substrate on which the contact pattern has been printed, heat treatment is performed at a temperature of 90°C for 5 days to make a semi-cured silicone rubber liquid, such as Toray Silicone Co., Ltd. trade name Tray Silicone SE-1700 (white). ), as shown in Figure 2, a pattern of the spacer layer 3 with a thickness of 100 μm is printed using the screen printing method, and the temperature is
It was dried at 150°C for 20 minutes to form a spacer layer 3. Print the conductive circuit 2 as described above and form the circuit part Ci.
and a contact portion on which the spacer layer 3 is formed as described above.
Positioning holes 4 were bored in the Co polyester film substrate as shown in FIGS. 3a and 3b, respectively. Finally, using the alignment hole 4, connect the circuit part Ci and the contact Co.
and fixed in a predetermined position facing each other. This completes the manufacturing process of the present invention.
この時、得られたキーボードスイツチ用可撓性
基板、すなわち、可撓性の薄型キーボードスイツ
チ部材は、すぐれた弾力性を示し、キーボードス
イツチとして十分な実用性を示した。第4図に示
すように矢印の方向に押圧するとスイツチが閉
じ、この押圧を開放するとスイツチが開く。ま
た、前述の如くシリコーンゴム液の熱処理により
半硬化性を持たせたことで、スペーサーの厚み調
整も良好であり、不良率の減少ももたらせた。本
発明の製造工程は印刷技術等により極めて簡単で
量産にも適し、安価にすむ。 At this time, the obtained flexible substrate for a keyboard switch, that is, a flexible thin keyboard switch member, exhibited excellent elasticity and exhibited sufficient practicality as a keyboard switch. As shown in FIG. 4, when pressed in the direction of the arrow, the switch closes, and when this pressure is released, the switch opens. Furthermore, as mentioned above, by imparting semi-curing properties to the silicone rubber liquid through heat treatment, the thickness of the spacer can be easily adjusted and the defect rate can be reduced. The manufacturing process of the present invention is extremely simple, suitable for mass production, and inexpensive due to printing technology.
なお、前記ポリウレタン樹脂の代わりに、クロ
ロプレンゴム(昭和ネオプレン株式会社製商品名
ネオプレンWRT)、ポリエステル樹脂(日立化
成株式会社製商品名エスペル1311)及びフエノー
ル樹脂(住友デコレズ株式会社製商品名PA−
301)を使用しても略々同様の良好な結果を得た。
何れにせよ本発明の奏する顕著な硬化が認められ
た。 In addition, instead of the polyurethane resin, chloroprene rubber (product name: Neoprene WRT, manufactured by Showa Neoprene Co., Ltd.), polyester resin (product name: ESPEL 1311, manufactured by Hitachi Chemical Co., Ltd.), and phenol resin (product name: PA-, manufactured by Sumitomo Decorez Co., Ltd.)
301), almost the same good results were obtained.
In any case, remarkable hardening achieved by the present invention was observed.
第1a図は本発明の一実施例における透明なフ
イルム基板上に印刷形成した接点パターンを裏側
から見た斜視図、第1b図は第1a図のものを平
行移動して重ね合わせるべき回路パターン部Ciを
形成した基板の斜視図、第2図は第1a図の接点
パターン周辺にさらにスペーサー層をより厚く形
成した接点部Coを裏から見た基板の斜視図、第
3a図は第2図の基板さらに位置合わせ用孔を形
成した基板の斜視図、第3b図はこの第3a図の
基板接点部Coを平行移動して重ね合わせるべき
回路パターン部Ciを形成した基板にさらに位置合
わせ用孔を形成した基板の斜視図、第4図は、第
3a図に示した基板接点部Coを平行移動し第3
b図に示した回路パターン部Ci上に、位置合わせ
して、重ね対向せしめた薄型キーボードスイツチ
部材を示す拡大断面略図である。
1……ポリエステルフイルム、2……導電部
分、3……スペーサー層、4……位置合わせ用
孔、Co……接点部、Ci……回路部。
Fig. 1a is a perspective view of a contact pattern printed and formed on a transparent film substrate according to an embodiment of the present invention, viewed from the back side, and Fig. 1b is a circuit pattern portion to be superimposed by translating the one in Fig. 1a. FIG. 2 is a perspective view of the substrate with a thicker spacer layer formed around the contact pattern shown in FIG. 1a, as seen from the back, and FIG. FIG. 3b is a perspective view of a substrate with alignment holes formed therein. The substrate contact portion Co shown in FIG. A perspective view of the formed substrate, FIG.
FIG. 4 is an enlarged schematic cross-sectional view showing the thin keyboard switch member aligned and stacked and facing each other on the circuit pattern portion Ci shown in FIG. DESCRIPTION OF SYMBOLS 1...Polyester film, 2...Conductive part, 3...Spacer layer, 4...Positioning hole, Co...Contact part, Ci...Circuit part.
Claims (1)
上に、(a)粒度0.1〜60μの黒鉛粉末、粒度0.1μ以下
のカーボンブラツク粉末及び粒度0.1〜60μの銀粉
末の1種または2種以上から成る微粉末20〜80重
量%と、(b)ポリウレタン樹脂、クロロプレンゴ
ム、ポリエステル樹脂及びフエノール樹脂の1種
または2種以上から成るゴム系、熱可塑性樹脂及
び熱硬化性樹脂系結合剤5〜30重量%と、(C)ジメ
チルホルムアミド、ジエチルカルビトール、ブチ
ルカルビトール、イソホロン及びテレピン油等の
溶剤15〜80重量%とを混合(a+b+c)溶解
し、均一に分散せしめた見掛比重0.9〜1.9、粘度
150〜10000ポイズの懸濁液を使用して、所望の接
点パターンをスクリーン印刷法にて印刷し、さら
に該接点パターンの周辺近傍に同じく印刷により
スペーサー部層を形成し、他の一枚の可撓性の合
成樹脂フイルム基板の片面上に、前記接点及びス
ペーサーパターンに対応し重ね合わすべき所望の
回路パターンを同じくスクリーン印刷法にて印刷
し、両フイルム基板にそれぞれ位置合わせ用の孔
を設け、該位置合わせ用の孔により、前記接点部
及びスペーサー部と、前記回路部とを重ね合わせ
対向せしめる可撓性の薄型キーボードスイツチ部
材の製造方法において、前記のそれぞれのフイル
ム基板上に所望の回路及び接点パターン層を、そ
れぞれ印刷し温度95〜150℃で5〜20分間乾燥し
て形成し、次いで、予め50〜100℃にて1〜10日
間、熱処理し、半硬化させたシリコーンゴム液を
用いて、前記スペーサー部を、印刷装着させ90〜
180℃の温度で10〜30分間乾燥して前記回路及び
接点パターン層よりも厚い、25〜150μの厚さの
スペーサー部層を形成せしめて構成することを特
徴とする可撓性の薄型キーボードスイツチ部材の
製造方法。1. On one side of a single flexible synthetic resin film substrate, one or two types of (a) graphite powder with a particle size of 0.1 to 60μ, carbon black powder with a particle size of 0.1μ or less, and silver powder with a particle size of 0.1 to 60μ are applied. 20 to 80% by weight of fine powder consisting of the above, and (b) a rubber-based, thermoplastic resin, and thermosetting resin-based binder consisting of one or more of polyurethane resin, chloroprene rubber, polyester resin, and phenol resin 5 ~30% by weight and (C) 15~80% by weight of a solvent such as dimethylformamide, diethyl carbitol, butyl carbitol, isophorone, and turpentine are mixed (a+b+c) and uniformly dispersed to give an apparent specific gravity of 0.9. ~1.9, viscosity
A desired contact pattern is printed by screen printing using a suspension of 150 to 10,000 poise, and a spacer layer is formed near the periphery of the contact pattern by the same printing method, and then a spacer layer is printed on another sheet of paper. On one side of a flexible synthetic resin film substrate, a desired circuit pattern to be overlapped corresponding to the contact point and spacer pattern is printed by the same screen printing method, and holes for positioning are provided in both film substrates, respectively. In the method for manufacturing a flexible thin keyboard switch member in which the contact portion and spacer portion and the circuit portion are overlapped and opposed to each other by the positioning holes, desired circuits and the like are formed on each of the film substrates. Contact pattern layers are formed by printing and drying at a temperature of 95 to 150°C for 5 to 20 minutes, and then using a semi-cured silicone rubber liquid that has been heat-treated in advance at 50 to 100°C for 1 to 10 days. Then, print and attach the spacer part 90~
A flexible thin keyboard switch characterized in that it is formed by drying at a temperature of 180°C for 10 to 30 minutes to form a spacer layer with a thickness of 25 to 150μ, which is thicker than the circuit and contact pattern layer. Method of manufacturing parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63146942A JPH01105422A (en) | 1988-06-16 | 1988-06-16 | Manufacture of flexible and thin keyboard switch member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63146942A JPH01105422A (en) | 1988-06-16 | 1988-06-16 | Manufacture of flexible and thin keyboard switch member |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56117525A Division JPS5818821A (en) | 1981-07-27 | 1981-07-27 | Method of producing flexible thin keyboard switch member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01105422A JPH01105422A (en) | 1989-04-21 |
| JPH053088B2 true JPH053088B2 (en) | 1993-01-14 |
Family
ID=15419061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63146942A Granted JPH01105422A (en) | 1988-06-16 | 1988-06-16 | Manufacture of flexible and thin keyboard switch member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01105422A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS597174B2 (en) * | 1979-10-20 | 1984-02-16 | 日本黒鉛工業株式会社 | Manufacturing method of keyboard for electronic desk calculator |
| JPS5691321A (en) * | 1979-12-26 | 1981-07-24 | Fujitsu Ltd | Method of manufacturing transparent switch |
-
1988
- 1988-06-16 JP JP63146942A patent/JPH01105422A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01105422A (en) | 1989-04-21 |
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