JPH0533147B2 - - Google Patents
Info
- Publication number
- JPH0533147B2 JPH0533147B2 JP60147243A JP14724385A JPH0533147B2 JP H0533147 B2 JPH0533147 B2 JP H0533147B2 JP 60147243 A JP60147243 A JP 60147243A JP 14724385 A JP14724385 A JP 14724385A JP H0533147 B2 JPH0533147 B2 JP H0533147B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- thermal head
- image signal
- drive
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 230000008054 signal transmission Effects 0.000 claims 1
- 230000007547 defect Effects 0.000 description 7
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は発熱低抗体を直接駆動する複数個のド
ライバICを搭載したサーマルヘツドの製造方法
に関し、特にサーマルヘツド基板が任意の位置か
ら所定の寸法に切断されても、所定の電気的機能
を容易に復帰できるサーマルヘツドの製造方法を
得ることを目的としたものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a thermal head equipped with a plurality of driver ICs that directly drive a heat-generating low antibody, and in particular, the present invention relates to a method for manufacturing a thermal head equipped with a plurality of driver ICs that directly drive a heat-generating low antibody. The object of the present invention is to provide a method for manufacturing a thermal head that can easily restore a predetermined electrical function even if it is cut to size.
従来、サーマルヘツド基板は、製造前に予め
B4版、A4版、A5版等の寸法に設計されているも
のであり、また製造は各々の種類の生産管理に基
づいて、各々の寸法のサーマルヘツド基板毎に行
なわれるものである。
Traditionally, thermal head boards are pre-processed before manufacturing.
It is designed to have dimensions such as B4 size, A4 size, A5 size, etc., and manufacturing is performed for each thermal head board of each size based on each type of production control.
上述した従来のサーマルヘツドは、予めパタン
設計時に基板の寸法、画像信号入力位置等が定め
られているので、サーマルヘツドは製造後に任意
の位置から切断されて、より小判のサーマルヘツ
ド基板（例えばB4版からA4版のサーマルヘツド
基板）へは転用され得ないという欠点がある。従
つて、サーマルヘツド基板、例えばB4版サーマ
ルヘツド基板、内に欠陥があり而もこの基板の
A4版相当領域においては無欠陥であつても、こ
の基版は画像信号入力位置等の関係からA4版サ
ーマルヘツドへの転用ができず、不良基板として
廃棄せざるを得ないものである。従つて製造され
るサーマルヘツドは、高い付加価値を添加された
後に不良品として廃棄されるために、高価となら
ざるを得なかつた。
In the conventional thermal head described above, the board dimensions, image signal input position, etc. are predetermined at the time of pattern design, so the thermal head can be cut from an arbitrary position after manufacturing to create a smaller thermal head board (for example, B4 The drawback is that it cannot be used from A4 size thermal head boards. Therefore, even if there is a defect in the thermal head board, such as a B4 version thermal head board,
Even if there are no defects in the area corresponding to A4 size, this base plate cannot be used as an A4 size thermal head due to the image signal input position, etc., and has no choice but to be discarded as a defective board. Therefore, the manufactured thermal heads have no choice but to be expensive because they are discarded as defective products after adding high value.
本発明のサーマルヘツドの製造方法はたとえ大
判のサーマルヘツド基板内に欠陥が存在した場合
であつても、この基板の小判領域においては無欠
陥である場合には、この基板を小判のサーマルヘ
ツド基板として応用するものであり、もつて高い
付加価値が添加された後に廃棄されるサーマルヘ
ツド基板数を最小にするものである。
In the thermal head manufacturing method of the present invention, even if a defect exists in a large thermal head substrate, if there is no defect in the small area of this substrate, this substrate can be converted into a small thermal head substrate. The purpose is to minimize the number of thermal head substrates that are discarded after adding high added value.
このために本発明は、例えば本願出願人により
先に出願された特願昭60−80813にあるように、
規則的にあるいは周期的に基板上に配置されてい
るIC駆動用導電体（外部端子導電体）のうち少
なくとも一つを、新たな画像信号供給用導電体と
して応用するものであり、更に接近して配置され
ている導電体、例えば記録電流接地導電体を２分
割してその一方を駆動用ICの画像信号入力電極
あるいはこの電極に接続されるべき導電体と接続
し而も前記新たな画像信号供給導電体として応用
される駆動用導電体とも接続させ、もつて基板部
への端子導出数を少なくすることを特徴とするも
のである。 For this purpose, the present invention provides, for example, as described in Japanese Patent Application No. 60-80813 previously filed by the applicant of the present application.
At least one of the IC driving conductors (external terminal conductors) arranged regularly or periodically on the substrate is applied as a new image signal supply conductor, and even closer. A conductor, for example, a recording current ground conductor, is divided into two parts and one of them is connected to the image signal input electrode of the driving IC or the conductor to be connected to this electrode, and the new image signal is It is characterized in that it is also connected to a driving conductor applied as a supply conductor, thereby reducing the number of terminals led out to the substrate portion.
従つて本発明のサーマルヘツドの製造方法は単
一セツトのフオトマスクによつて大判と小判のサ
ーマルヘツドとを標準的なパタンにより共通に製
造することができ、大判→小判あるいは小判→大
判へのサーマルヘツドの転用を容易にする効果を
も発揮する、故に、製造されるサーマルヘツドは
生産管理が容易になると共に製造歩留りも向上
し、低価格になると共に生産の自由度も高まるも
のである。 Therefore, the thermal head manufacturing method of the present invention can commonly manufacture large-sized and small-sized thermal heads using a standard pattern using a single set of photomasks, and the thermal head can be changed from large to small or from small to large. It also has the effect of facilitating the repurposing of the head. Therefore, the manufactured thermal head becomes easier to manage, has an improved manufacturing yield, is lower in price, and has an increased degree of freedom in production.
第１図は本発明の一実施例の要部を示す模式的
平面図である。
FIG. 1 is a schematic plan view showing essential parts of an embodiment of the present invention.
サーマルヘツド基板へ搭載されるべき任意の数
量のICをここでは１〜５とする。サーマルヘツ
ド駆動用ICの電極を例えばＶ，Ｉ，Ｇ，CL及び
画像信号入力電極Pi、画像信号出力電極Po、記
録電流接地電極PGとすると、これらの電極は
各々相対応する基板上の導電体ｖ，ｉ，ｇ，cl，
pi（又はpo），pg等へボンデイングワイヤｗ等に
より接続される。これらの導電体は所望により周
期的にあるいは各IC毎に規則的に基板上に配置
される。サーマルヘツド初段の駆動用ICにおい
ては、画像入力電極Piは基板上の画像信号供給導
電体ｐ１と電気的に接続される。該ICの画像出
力信号はIC内のシフトレジスタを通過した後に
画像信号出力電極（Po）に出力され、ボンデイ
ング・ワイヤ等によつて基板上の導電体po（＝pi）
へ伝達され、更に次段のICの画像信号入力電極
Piへ伝達される。 Here, the arbitrary number of ICs to be mounted on the thermal head board is 1 to 5. For example, if the electrodes of the thermal head driving IC are V, I, G, CL, image signal input electrode Pi, image signal output electrode Po, and recording current ground electrode PG , these electrodes are connected to conductive wires on the corresponding substrate. body v, i, g, cl,
It is connected to pi (or po), pg, etc. by bonding wire w, etc. These conductors are arranged on the substrate periodically or regularly for each IC as desired. In the first-stage driving IC of the thermal head, the image input electrode Pi is electrically connected to the image signal supply conductor p1 on the substrate. The image output signal of the IC is output to the image signal output electrode (Po) after passing through a shift register in the IC, and is connected to the conductor po (=pi) on the board by bonding wire etc.
The image signal is transmitted to the next stage IC's image signal input electrode.
Transmitted to Pi.
さてここで、例えば製造されたB4版サーマル
ヘツドの搭載IC３が駆動すべき発熱抵抗体列あ
るいは搭載IC３内に欠陥が存在したとする。こ
の場合には、従来例においては、搭載IC４が独
立した画像信号供給導電体ｐ１を具備していない
ために、他の領域（例えばA4版相当領域）に欠
陥が存在しないとしても、このサーマルヘツドは
製品として応用することができないものであつ
た。 For example, suppose that there is a defect in the heating resistor array to be driven by the mounted IC 3 of the manufactured B4 thermal head or in the mounted IC 3. In this case, in the conventional example, since the mounted IC 4 does not have an independent image signal supply conductor p1, this thermal head could not be applied as a product.
しかしながら本発明においては、第１図に示す
ように、IC４をサーマルヘツドの新な初段の駆
動用ICとし、このIC４に画像信号供給導電体を
具備させるものであり、予め欠陥の存在が判明し
ている前段のIC（IC３）領域の画像信号出力用電
極Poを相対応する基板上の導電体po′とは電気的
に接続しないものである。 However, in the present invention, as shown in FIG. 1, IC4 is used as a new first-stage driving IC of the thermal head, and this IC4 is equipped with an image signal supply conductor, so that the presence of defects is known in advance. The image signal output electrode Po in the previous IC (IC3) area is not electrically connected to the corresponding conductor po' on the substrate.
即ち、本発明においては、隣接して配置されて
いる基板上の導電体は、例えば記録電流接地導電
体pgを２つに分割し、一方は本来の記録電流接
地導電体pg′として機能させ、他方は新たな画像
信号供給導電体ｐ１′として機能させるものであ
る。導電体ｐ１′は、ボンデイングワイヤｗ等に
より前記導電体po′と接続され、更にはIC４上の
画像信号入力用電極へと接続される。また導電体
ｐ１′の他端は基板上の端子部へは導出されずに、
隣接して配置されているIC駆動用導電体、例え
ばｃ１′とボンデイングワイヤ等により接続され
る。即ち導電体ｃ１′は新たな画像信号供給導電
体の外部導出用端子として機能することになる。 That is, in the present invention, the conductors on the substrates arranged adjacent to each other, for example, divide the recording current grounding conductor pg into two parts, one of which functions as the original recording current grounding conductor pg', The other one is made to function as a new image signal supply conductor p1'. The conductor p1' is connected to the conductor po' by a bonding wire w or the like, and is further connected to an image signal input electrode on the IC4. In addition, the other end of the conductor p1' is not led out to the terminal part on the board,
It is connected to an adjacent IC driving conductor, for example c1', by a bonding wire or the like. That is, the conductor c1' functions as a new terminal for leading the image signal supply conductor to the outside.
本発明はこのように、規即的にあるいは周期的
に基板上に配置されている記録電流接地導電体を
複数個に分割してその一つを新たな画像信号供給
導電体として利用し、而もこの導電体の端子部へ
の導出には隣接して配置されているIC駆動用導
電体の内の一つを転用して利用するものである。
従つて本発明のサーマルヘツドは、外部への導出
端子数を増やすことなく、任意の所望とするIC
へ容易に画像信号を供給し、該ICの前段に相当
するまでのサーマルヘツド領域内にたとえ欠陥が
存在したとしても、サーマルヘツドは小判のサー
マルヘツドとして応用することができるようにす
るものである。 In this way, the present invention divides the recording current grounding conductor, which is regularly or periodically arranged on the substrate, into a plurality of parts and utilizes one of them as a new image signal supplying conductor, and In order to lead out the conductor to the terminal portion, one of the adjacent IC drive conductors is used.
Therefore, the thermal head of the present invention can be used with any desired IC without increasing the number of lead-out terminals to the outside.
Even if a defect exists in the thermal head area up to the front stage of the IC, the thermal head can be applied as a small-sized thermal head. .
以上説明したように本発明は、規則的にあるい
は周期的に基板上に配置されているIC駆動用導
電体を新たな画像信号供給導電体として転用し、
而も前記駆動用ICに近接して配置されている導
電体、例えば記録電流接地導電体を複数個に分割
し、その一つを駆動用ICの画像信号入力用電極
と接続し、もつてサーマルヘツド基板外部への端
子導出数を増やすことなく、任意の所望とする
ICへ容易に画像入力信号を供給するものである。
従つて本発明は大判から小判、あるいは小判から
大判へのサーマルヘツドの転用を容易ならしめ、
種々の寸法のサーマルヘツド基板を標準的な大判
のパタンにより製造することを可能ならしめ、而
も従来は不良品として廃棄せざるを得ない欠陥品
を小判のサーマルヘツド基板へ転用し、もつて高
い付加価値を添加された後に廃棄される基板数を
最小にするものである。このために製造されるサ
ーマルヘツドは生産の自由度が高くなると共に高
製造歩留りとなる。
As explained above, the present invention repurposes IC driving conductors that are regularly or periodically arranged on a substrate as new image signal supply conductors,
In addition, a conductor placed close to the drive IC, such as a recording current ground conductor, is divided into a plurality of parts, one of which is connected to the image signal input electrode of the drive IC, and the thermal Any desired number can be achieved without increasing the number of terminals led out to the outside of the head board.
This allows image input signals to be easily supplied to the IC.
Therefore, the present invention facilitates the conversion of a thermal head from a large size to a small size or from a small size to a large size,
It has become possible to manufacture thermal head substrates of various sizes using standard large-sized patterns, and it has also made it possible to convert defective products that would otherwise have had to be discarded as defective products into small-sized thermal head substrates. This minimizes the number of substrates that are discarded after adding high value. Thermal heads manufactured for this purpose have a high degree of freedom in production and a high manufacturing yield.
本発明が上記の効果を呈する以上、製造される
サーマルヘツドは解像度、寸法、端子配列等の形
状や材質、駆動用ICの機能、搭載・接続方法、
駆動用電極数等は何ら制限を受けるものではな
く、基板上の導電体構成も単層導電体配線に制限
を受けるものではない。また実効的に不要となつ
たサーマルヘツドの基板領域は必ずしも所望とす
る基板から切断・除去する必要はなく、機能的に
除去することも当然可能であり、あるいは一部不
要領域は実装・搭載のために基板上に残しておい
てよいことは勿論である。本発明においては、当
然のことながら、導電体を分割する方法や分割
数、あるいは分割された導電体をIC駆動用導電
体を接続する方法等は何ら制限を受けるものでは
なく、而も分割された導電体上に絶縁層を介して
駆動用ICを搭載することも当然できるものであ
る。また本発明のサーマルヘツドの製造方法は複
数個の画像信号供給導電体を具備することもでき
る。 As long as the present invention exhibits the above-mentioned effects, the manufactured thermal head will have resolution, dimensions, shape and material such as terminal arrangement, function of driving IC, mounting/connection method, etc.
There are no restrictions on the number of drive electrodes, and the conductor structure on the substrate is not limited to single-layer conductor wiring. In addition, it is not necessarily necessary to cut or remove the thermal head board area that is no longer effectively needed from the desired board, but it is naturally possible to remove it functionally, or some unnecessary areas can be removed from the desired board by mounting or mounting. Of course, it may be left on the substrate for this purpose. Naturally, in the present invention, there are no restrictions on the method of dividing the conductor, the number of divisions, or the method of connecting the divided conductor to the IC driving conductor. Of course, it is also possible to mount a driving IC on the conductor with an insulating layer interposed therebetween. Further, the method for manufacturing a thermal head of the present invention can also include a plurality of image signal supply conductors.
第１図は本発明のサーマルヘツドの要部を模式
的に示した図である。
１〜５……IC、PG……記録電流接地電極、Pi
……画像信号入力用電極、Po……画像信号出力
用電極、Ｖ，Ｇ，Ｉ，CL……駆動用ICの電極、
ｖ，ｇ，ｉ，cl……IC駆動用導電体（外部端子導
電体）、pg……記録電流接地導電体、Pi（＝po）
……画像信号入（出）力用導電体、ｐ１，ｐ１′
……画像信号供給導電体、ｗ……ボンデイング・
ワイヤ。
FIG. 1 is a diagram schematically showing the main parts of the thermal head of the present invention. 1~5...IC, P G ...Recording current ground electrode, Pi
... Image signal input electrode, Po ... Image signal output electrode, V, G, I, CL ... Drive IC electrode,
v, g, i, cl...IC driving conductor (external terminal conductor), pg...recording current grounding conductor, Pi (=po)
...Conductor for image signal input (output), p1, p1'
...Image signal supply conductor, w...Bonding/
wire.
Claims (1)
信号を次段の駆動ICへ伝達する画像信号出力電
極とを有する駆動ICを複数個配置し、かつ前記
駆動ICに近接して、前記駆動ICの外部端子接続
用導電体を規則的にあるいは周期的に基板上に配
置するサーマルヘツドの製造方法において、 前記複数個の駆動ICのうち少なくとも一つの
駆動ICの前記画像信号出力電極を次段の駆動IC
の前記画像信号入力電極に接続せず、かつ前記少
なくとも一つの駆動ICと前記次段の駆動ICとの
双方に近接する少なくとも一つの導電体にスリツ
トを設けて複数の導電体片に分割し、該導電体片
の一つを前記次段の駆動ICの前記画像信号入力
電極に接続して前記次段の駆動ICの画像信号供
給用導電体として、前記少なくとも一つの駆動
ICを前記信号の伝達経路から切り離す事を特徴
とするサーマルヘツドの製造方法。[Scope of Claims] 1. A plurality of drive ICs each having an image input electrode and an image signal output electrode that transmits a signal input to the image input electrode to the next stage drive IC, and close to the drive IC. In the method for manufacturing a thermal head, the conductor for external terminal connection of the drive IC is arranged regularly or periodically on the substrate, wherein the image signal of at least one drive IC among the plurality of drive ICs is The output electrode is connected to the next stage drive IC.
providing a slit in at least one conductor not connected to the image signal input electrode and close to both the at least one drive IC and the next-stage drive IC, dividing it into a plurality of conductor pieces; One of the conductor pieces is connected to the image signal input electrode of the next-stage drive IC to serve as a conductor for supplying an image signal to the next-stage drive IC.
A method for manufacturing a thermal head, characterized in that an IC is separated from the signal transmission path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60147243A JPS627568A (en) | 1985-07-03 | 1985-07-03 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60147243A JPS627568A (en) | 1985-07-03 | 1985-07-03 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS627568A JPS627568A (en) | 1987-01-14 |
| JPH0533147B2 true JPH0533147B2 (en) | 1993-05-18 |
Family
ID=15425817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60147243A Granted JPS627568A (en) | 1985-07-03 | 1985-07-03 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS627568A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787199B2 (en) * | 1991-03-29 | 1995-09-20 | ローム株式会社 | Head drive IC and head substrate |
-
1985
- 1985-07-03 JP JP60147243A patent/JPS627568A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS627568A (en) | 1987-01-14 |
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