JPH0534409B2

JPH0534409B2 -

Info

Publication number: JPH0534409B2
Application number: JP1133378A
Authority: JP
Inventors: Naoyuki Kanehara; Michihiro Kosaka
Original assignee: Dowa Mining Co Ltd
Current assignee: Dowa Holdings Co Ltd
Priority date: 1989-05-26
Filing date: 1989-05-26
Publication date: 1993-05-24
Also published as: JPH032341A

Description

[Detailed description of the invention]

(イ) 技術分野本発明は、導電用リード材等に要求される高い
導電率と高強度を兼備し、かつはんだ付け後の経
時変化に対し、はんだ付け部の剥離により電気伝
導性が損なわれることのないはんだ耐候性に優れ
た銅合金に関するものである。 (ロ) 従来技術電気または電子工業の急速な進歩に伴ない使用
されるリード材、特に銅系合金のリード材におい
ては、電気及び熱の伝導性が良好なことのみでな
く、高強度かつ良好な繰返し曲げ性、耐軟化性、
めつき性やはんだ付け性等の諸特性を兼備したリ
ード材であることが必要であり、しかも製造が容
易でコスト的にも安価であることが重要である。従来使用されてきたリード材としての銅系合金
としては、リン青銅、錫入銅、CDA−194等が良
く知られているが、リン青銅は高価なSnを合金
元素として６〜８重量％含有し、高強度ではある
が導電性や耐軟化性が充分でない。また、錫入銅は導電性は良いが耐軟化性と強度
がリン青銅より劣り、またCDA−194は強度、耐
軟化性及び導電性は前二者の中間に位置するが、
その強度とめつき性において充分でない。近来、上記の要望を満たすべく各種合金が開発
され、例えば本出願人の提案に係る特許第
1457743号がある。この合金は良好な熱放散性と
電気伝導性を有し、高強度かつ良好な繰返し曲げ
性、耐軟化性、めつき性、はんだ付け性を兼備し
ており、リード材、コネクター材等に使用されて
いる。しかしながら、使用環境が高温でかつ銅合金部
材にNiメツキ等が施されていない場合、はんだ
付け後の経時変化ではんだ接合面に脆弱層が発生
することがわかり、使用範囲が限定されるように
なつた。 (ハ) 発明の開示本発明はこのような実情に鑑み、上記特許第
1457743号銅合金（以下、「特許1457743号合金」
という）の改良を目的とし、更に厳しい環境下で
各種用途に使用できる銅合金、特にはんだ付け部
の剥離が発生しない銅合金を提供するものであ
る。上記特許1457743号合金のはんだ耐候性につい
て詳細な検討を行なつた結果、次の事柄が判明し
た。即ち、 () 銅合金によく見られる現象であるが、Cuと
Snとの相互拡散により化合物が形成されてボ
イドが生じること、 () 剥離面にFeが偏在しており、剥離を助長し
ていること、 () 上記（）、（）の現象は特許1457743号
合金に特徴的なものであつて、通常の銅合金と
はんだ間の剥離とは発生機構が異なること、等
が考えられる。この対策として、本発明者らはFeが偏在した
場合に銅合金とはんだ接合境界面のCu−Sn化合
物の形成を抑制できる元素に関して検討を加えた
結果、高強度、高電気伝導性、良好な繰返し曲げ
性、耐軟化性、メツキ性及びはんだ付け性を兼備
した上記特許1457743号合金のはんだ耐候性を改
善させるに必要な元素としてZnを発見し、本発
明合金を開発するに至つたのである。即ち、本発明合金は、重量％でNi：0.05〜0.40
％、Ｂ：0.005〜0.06％、Fe：0.50〜1.50％、Sn：
0.50〜1.50％、Ｐ：0.01％〜0.1％、Zn：0.05〜0.1
％未満、残部がCuおよび不可避不純物からなり、
マトリツクス中にFe−Ni−Ｐ系化合物が分散析
出した組織を有する銅合金であつて導電率が40％
IACS以上、引張強さが55Kgｆ／mm²以上であるこ
とを特徴とする高強度高導電性銅合金である。本発明合金の諸特性は、該合金の製造に際して
時効処理を実施することにより更に有利に発揮さ
れる。これは特許1457743号合金と同様の析出物
が形成されるためであり、更に該合金のはんだ耐
候性を向上させる役目を果すZnは、これら化合
物の形成を妨害することなく、また溶解鋳造性、
熱間加工性及び冷間加工性等も阻害しないのであ
る。従つて、本発明者らが意図した結晶構造を形成
し得て、本発明合金は良好な製造性と優れた経済
性を有しているのである。本発明合金の添加元素の添加理由並びにその含
有量の限定理由を説明すると次の通りである。 (1) Ｂについて、ＢはＰと共に本発明合金の溶製時における溶
湯の脱酸に重要な役割を果し、品質良好なイン
ゴツトを製造するのに寄与する。後記する比較例のNo.８のＢ無添加の試料と本
願発明合金の比較からも明らかなように、Ｂの
添加によつて伸びが改善される。これはＢの脱
酸効果により、銅マトリツクス中の溶質酸素原
子が減少して、加工時の転位との相互作用が減
少することがその主要因であると考えられる。Ｂが0.005重量％未満では脱酸効果が十分で
はない。また、Ｂが多くなれば脱酸効果は向上
するが、ＢのCu中への固溶限は室温で0.06重量
％近傍であり、この固溶限を越えるとCuとＢ
の化合物が形成されてかえつて加工性が劣化す
るようになる。従つて、本発明合金において、
Ｂの添加量は0.005〜0.06重量％とした。 (2) Niについて、 NiはCuマトリツクス中に固溶し、機械的強
度及び耐軟化性、更には耐食性を向上させる
が、0.05重量％未満ではその効果は充分ではな
い。一方、0.40重量％を越えて含有すると、導
電率の低下が顕著となる。従つてNi含有量は
0.05〜0.40重量％とした。 (3) Feについて、銅マトリツクス中に過飽和に固溶したFeは
時効によりNiおよびＰと化合物を形成して銅
マトリツクス中に析出し、強度を向上させる。
また、高温加熱時の結晶粒の粗大化を阻止して
耐軟化性を向上させる。 Fe含有量が0.50重量％未満では前記化合物の
銅マトリツクス中への析出が十分ではなく、強
度と耐軟化性の改善効果が不充分となる。ま
た、Fe含有量が1.50重量％を越えると導電性が
低下して加工性も悪くなる。従つて、本発明合金においてFeは0.50〜1.50
重量％含有させる。 (4) Snについて、 Snは銅マトリツクス中に固溶して強度と耐
軟化性を向上させる。しかし、Sn含有量が0.50
重量％未満ではこの強度と耐軟化性の向上効果
が充分でなく、一方Sn含有量が1.50重量％を越
えると導電性が悪くなり、また熱間加工性も悪
くなる。この理由から、Sn含有量は0.50〜1.50
重量％とする。 (5) Ｐについて、Ｐは溶製時の溶湯の脱酸効果と共に、Sn、
Feの酸化防止効果も有する。従つて、品質良
好なインゴツトを得るうえで重要な働きをす
る。そして、銅マトリツクス中に過飽和に固溶し
たＰはFeおよびNiと化合物を形成し、前述の
ように析出硬化に寄与する。Ｐ含有量が0.01重
量％未満では脱酸効果が十分でなく0.10重量％
を越えると導電性が低下する。このため、Ｐ含
有量は0.01〜0.10重量％とした。 (6) Znについて、 Znは銅マトリツクス中に固溶し、他の添加
元素と化合物を形成しない。Znは蒸気圧が高
くて酸化し易いため、ＢおよびＰと同様に脱酸
効果があり、また溶解中の溶湯を保護する役目
を果す。従つて、添加元素の損失が減少し、成
分コントロールがし易くなる。更に、Znははんだ付け後の経時変化におい
て反応界面即ち銅合金とはんだとの接合界面に
優先的に拡散移動し、CuとSnとの間の化合物
の形成を抑制する。前述のように本発明合金に
おいてFeが反応界面にも移動してくるが、Zn
の移動速度の方が大で、従つてFeの偏在によ
る接着強度の低下が生じない。つまり、Znは自ら拡散することにより、Cu
−Sn間の反応を抑制するのみでなく、Feの偏
在を抑制する効果を発現させ、本発明合金のは
んだ耐候性を向上させるのである。この効果は、Znが0.05重量％未満では不充分
であり、また0.1重量％以上添加してもはんだ
耐候性向上の効果が飽和し、また脱Zn現象や
応力腐食、割れ感受性の増大、電気伝導性を低
下させる傾向がある。以上のように、本発明合金は重量％でNi：0.05
〜0.40％、Ｂ：0.005〜0.06％、Fe：0.50〜1.50％、
Sn：0.50〜1.50％、Ｐ：0.01〜0.10％並びにZnを
0.05〜0.1％未満をCuに含有させたことに特徴が
あり、これによつてリード材等に要求される強
度、導電性、耐軟化性、加工性並びにはんだ付け
性、はんだ耐候性等を兼備した点で、従来材には
ない優れた効果を発揮するのである。そして、これらの特性はFe−Ni−Ｐ系の微細
な化合物を銅マトリツクス中に析出させる時効処
理によつて有利に達成されるのである。次に、本発明を実施例により具体的に説明す
る。 (ニ) 実施例実施例１供試した合金の成分組成を第１表および第２表
に示す。第１、２表中の試料No.１〜No.16の合金は、いず
れも高周波大気溶解炉で溶製し、カーボン鋳型に
鋳造した。このインゴツトを850℃で熱間圧延して板圧８
mmの熱延板とし、この熱延板を通常の酸洗処理し
た後、冷間圧延して板圧４mmの冷延板とした。次
いで、この冷延板を500℃で30分の時効処理を行
つた。そして、酸洗処理した後、再び冷間圧延し
て板圧２mmの冷延板とし、500℃で30分の時効処
理を行つた。その後酸洗し、最終仕上げ圧延して0.4mmの冷
延板とし、次に375℃で30分のひずみ取り焼鈍を
行い仕上げた。このようにして得られた各合金の引張強さ、伸
び、導電率、軟化温度、繰返し曲げ、及びはんだ
付性を測定し、その結果を第１表に、またはんだ
耐候性試験の結果を第２表に併記した。引張強さと伸びの測定はJIS−Z2241に従い、
導電率の測定はJIS−H0505の方法によつた。軟化温度は試料を200℃から600℃の各温度で30
分間加熱したときの加熱後の硬さが仕上げ冷延板
の硬さの80％となるときの温度とした。繰返し曲げは90°曲げ（Ｒ＝0.4）を行つた後、
曲げ戻しを行なつてその時点で１回とし、試験片
が破断するまでの回数をもつて繰返し曲げ回数と
した。はんだ付け性ははんだ濡れ広がり試験を行な
い、はんだ濡れ面積が95％以上を「良」とした。はんだ耐候性試験は供試材に共晶はんだをはん
だ付けし、150℃大気中で所定時間保持した後、
メツキ密着性試験機（JIS−H8504）により剥離
の状態を観察した。剥離が起きる回数を剥離発生回数とした。ま
た、各保持時間につき各５個のサンプルの平均回
数とした。また、比較合金として第１表及び第２表に示す
成分組成の合金についても本発明合金と同様に製
造および諸測定試験を行ない、その結果を第１表
及び第２表に併記した。第１表の結果から明らかなように、本発明合金
であるNo.１〜No.４は引張り強度が55Kg／mm²以上、
導電率は40％以上の高い値を示し、かつ充分な耐
軟化性を有し、繰返し曲げ回数も多く、はんだ付
け性も「良」である。これに対して、比較合金No.５とNo.６に示される
ように、本発明合金の成分組成範囲よりＰの多い
合金は過剰のＰのために導電率が低く、かつ伸び
が低くて繰返し曲げ性に劣り、はんだ付け性も
「不良」である。 No.７に示すFeの少ない比較合金は引張強度が
著しく低く、導電率も低い。また、Ｂが無添加の
No.８合金は前述したように伸びが低い。また、
Snの少ないNo.９合金は強度が低く、Znの多いNo.
10合金は導電率が本発明合金に比べて劣つてい
る。以上のように、本発明合金は高強度、高導電
率、耐軟化性、繰返し曲げ性及びはんだ付け性を
兼備した極めて優れた銅基合金であることが分
る。次に、本発明合金ならびに比較合金のはんだ剥
離試験を行なつた結果を第２表に併記したが、こ
の結果から次のことが分る。本発明合金である試料No.14〜No.16は100時間で
も全くはんだが剥離せず、524時間でNo.14合金は
14回、No.15合金は16回であり、Zn量の比較的多
いNo.16合金では16回曲げを行なつても全く剥離が
生じない。これに対して、本発明合金のZn組成範囲より
少ない（即ちZnが0.05％以下）No.11〜No.13合金で
は100時間で20回未満ではんだが剥離してしまう。この結果から、前記した通りZnがはんだ耐候
性を向上させる元素であることが分る。通常電子部品用として信頼性の要求される基準
としては、大気中150℃で100時間の保持条件で剥
離の発生しない材料を合格としていることからし
ても、本発明合金がはんだ耐候性に優れている合
金であることが分る。 (a) Technical field The present invention has both high conductivity and high strength required for conductive lead materials, etc., and also has a material that does not lose electrical conductivity due to peeling of the soldered part due to changes over time after soldering. This relates to a copper alloy that has excellent solder weather resistance. (b) Prior art With the rapid progress of the electrical and electronic industries, lead materials, especially copper-based alloy lead materials, have not only good electrical and thermal conductivity, but also high strength and good conductivity. Repeated bendability, softening resistance,
It is necessary that the lead material has various properties such as plating and soldering properties, and it is also important that it be easy to manufacture and inexpensive. Phosphor bronze, tinned copper, CDA-194, etc. are well known as copper-based alloys that have traditionally been used as lead materials, but phosphor bronze contains 6 to 8% by weight of expensive Sn as an alloying element. Although it has high strength, it does not have sufficient conductivity or softening resistance. In addition, although tinned copper has good conductivity, its softening resistance and strength are inferior to phosphor bronze, and CDA-194 is between the former two in terms of strength, softening resistance, and conductivity.
Its strength and adhesion are insufficient. Recently, various alloys have been developed to meet the above requirements.For example, the patent No.
There is number 1457743. This alloy has good heat dissipation and electrical conductivity, as well as high strength and good repeated bending, softening resistance, plating and soldering properties, and is used for lead materials, connector materials, etc. has been done. However, if the usage environment is high and the copper alloy component is not plated with Ni, etc., it has been found that a brittle layer will form on the solder joint surface due to changes over time after soldering, and the range of use will be limited. Summer. (c) Disclosure of the invention In view of the above circumstances, the present invention is based on the above-mentioned patent no.
Copper alloy No. 1457743 (hereinafter referred to as "Patent No. 1457743 alloy")
The purpose of the present invention is to provide a copper alloy that can be used for various purposes in even harsher environments, especially a copper alloy that does not cause peeling at soldered parts. As a result of a detailed study on the solder weather resistance of the above-mentioned patent No. 1457743 alloy, the following matters were found. That is, () This is a phenomenon often seen in copper alloys, but when Cu and
Compounds are formed due to interdiffusion with Sn, resulting in voids. () Fe is unevenly distributed on the peeled surface and promotes peeling. () The above phenomena () and () are described in Patent No. 1457743. It is thought that this is a characteristic of the alloy, and that the mechanism of occurrence is different from that of normal peeling between copper alloys and solder. As a countermeasure to this, the present inventors investigated elements that can suppress the formation of Cu-Sn compounds at the copper alloy and solder joint interface when Fe is unevenly distributed. Zn was discovered as an element necessary to improve the solder weathering resistance of the above-mentioned patent No. 1457743 alloy, which has repeated bending properties, softening resistance, plating properties, and solderability, and led to the development of the alloy of the present invention. . That is, the alloy of the present invention has Ni: 0.05 to 0.40 in weight%.
%, B: 0.005-0.06%, Fe: 0.50-1.50%, Sn:
0.50~1.50%, P: 0.01%~0.1%, Zn: 0.05~0.1
%, the remainder consists of Cu and unavoidable impurities,
A copper alloy with a structure in which Fe-Ni-P compounds are dispersed and precipitated in the matrix, and has an electrical conductivity of 40%.
It is a high-strength, highly conductive copper alloy characterized by a tensile strength of IACS or higher and a tensile strength of 55 Kgf/mm ² or higher. The various properties of the alloy of the present invention can be more advantageously exhibited by carrying out an aging treatment during production of the alloy. This is due to the formation of precipitates similar to the alloy of Patent No. 1457743, and Zn, which plays a role in improving the solder weathering resistance of the alloy, does not interfere with the formation of these compounds and also improves melting and casting properties.
It does not inhibit hot workability, cold workability, etc. Therefore, the crystal structure intended by the present inventors can be formed, and the alloy of the present invention has good manufacturability and excellent economic efficiency. The reasons for adding the additive elements to the alloy of the present invention and the reasons for limiting their contents are as follows. (1) Regarding B, B, together with P, plays an important role in deoxidizing the molten metal during melting of the alloy of the present invention, and contributes to producing ingots of good quality. As is clear from a comparison of Comparative Example No. 8, which will be described later, with no B added and the alloy of the present invention, the addition of B improves elongation. The main reason for this is thought to be that the number of solute oxygen atoms in the copper matrix decreases due to the deoxidizing effect of B, which reduces interaction with dislocations during processing. If B is less than 0.005% by weight, the deoxidizing effect will not be sufficient. In addition, as B increases, the deoxidizing effect improves, but the solid solubility limit of B in Cu is around 0.06% by weight at room temperature, and if this solid solubility limit is exceeded, Cu and B
compounds are formed, which actually deteriorates processability. Therefore, in the alloy of the present invention,
The amount of B added was 0.005 to 0.06% by weight. (2) Regarding Ni, Ni dissolves in solid solution in the Cu matrix and improves mechanical strength, softening resistance, and corrosion resistance, but if it is less than 0.05% by weight, the effect is not sufficient. On the other hand, if the content exceeds 0.40% by weight, the conductivity will decrease significantly. Therefore, the Ni content is
The content was 0.05 to 0.40% by weight. (3) Regarding Fe, Fe, which is supersaturated in solid solution in the copper matrix, forms a compound with Ni and P by aging and precipitates in the copper matrix, improving strength.
It also prevents coarsening of crystal grains during high-temperature heating and improves softening resistance. If the Fe content is less than 0.50% by weight, the precipitation of the compound into the copper matrix will not be sufficient, and the effect of improving strength and softening resistance will be insufficient. Furthermore, if the Fe content exceeds 1.50% by weight, the conductivity will decrease and the workability will also deteriorate. Therefore, in the alloy of the present invention, Fe is 0.50 to 1.50
% by weight. (4) Regarding Sn, Sn dissolves in solid solution in the copper matrix to improve strength and softening resistance. However, the Sn content is 0.50
If the Sn content is less than 1.50% by weight, the effect of improving strength and softening resistance will not be sufficient, while if the Sn content exceeds 1.50% by weight, the electrical conductivity and hot workability will deteriorate. For this reason, the Sn content is between 0.50 and 1.50
Weight%. (5) Regarding P, P has a deoxidizing effect on the molten metal during melting, as well as Sn,
It also has the effect of preventing Fe from oxidizing. Therefore, it plays an important role in obtaining ingots of good quality. Then, P dissolved in supersaturated solid solution in the copper matrix forms a compound with Fe and Ni, contributing to precipitation hardening as described above. If the P content is less than 0.01% by weight, the deoxidizing effect will not be sufficient and the P content will be reduced to 0.10% by weight.
If the value exceeds 100%, the conductivity decreases. Therefore, the P content was set to 0.01 to 0.10% by weight. (6) Regarding Zn, Zn is a solid solution in the copper matrix and does not form compounds with other additive elements. Since Zn has a high vapor pressure and is easily oxidized, it has a deoxidizing effect like B and P, and also serves to protect the molten metal during melting. Therefore, loss of added elements is reduced and composition control becomes easier. Furthermore, Zn preferentially diffuses and moves to the reaction interface, that is, the bonding interface between the copper alloy and the solder as time passes after soldering, thereby suppressing the formation of a compound between Cu and Sn. As mentioned above, in the alloy of the present invention, Fe also migrates to the reaction interface, but Zn
The moving speed of is higher, so there is no decrease in adhesive strength due to uneven distribution of Fe. In other words, by diffusing Zn by itself, Cu
This not only suppresses the reaction between -Sn but also exerts the effect of suppressing the uneven distribution of Fe, thereby improving the solder weather resistance of the alloy of the present invention. This effect is insufficient if Zn is less than 0.05% by weight, and if it is added more than 0.1% by weight, the effect of improving solder weather resistance is saturated, and Zn removal phenomenon, stress corrosion, increased cracking susceptibility, and electrical conductivity. It tends to reduce sex. As described above, the alloy of the present invention has Ni: 0.05% by weight.
~0.40%, B: 0.005~0.06%, Fe: 0.50~1.50%,
Sn: 0.50~1.50%, P: 0.01~0.10% and Zn
It is characterized by containing less than 0.05 to 0.1% Cu, which provides the strength, conductivity, softening resistance, processability, solderability, and solder weather resistance required for lead materials, etc. In this respect, it exhibits superior effects not found in conventional materials. These properties can be advantageously achieved by aging treatment in which fine Fe--Ni--P compounds are precipitated in the copper matrix. Next, the present invention will be specifically explained using examples. (d) Examples Example 1 The compositions of the alloys tested are shown in Tables 1 and 2. The alloys of samples No. 1 to No. 16 in Tables 1 and 2 were all melted in a high-frequency atmospheric melting furnace and cast into carbon molds. This ingot was hot-rolled at 850℃ to obtain a plate thickness of 8
This hot-rolled sheet was subjected to a normal pickling treatment, and then cold-rolled to obtain a cold-rolled sheet with a sheet thickness of 4 mm. Next, this cold-rolled sheet was subjected to aging treatment at 500°C for 30 minutes. After pickling, the material was cold-rolled again to obtain a cold-rolled sheet with a sheet thickness of 2 mm, and then aged at 500° C. for 30 minutes. Thereafter, it was pickled and final rolled into a cold rolled sheet of 0.4 mm, and then strain relief annealed at 375°C for 30 minutes for finishing. The tensile strength, elongation, electrical conductivity, softening temperature, repeated bending, and solderability of each alloy thus obtained were measured, and the results are shown in Table 1, and the results of the solder weathering test are shown in Table 1. Both are listed in Table 2. Measurement of tensile strength and elongation follows JIS-Z2241.
The conductivity was measured according to the method of JIS-H0505. The softening temperature is 30°C at each temperature from 200℃ to 600℃.
The temperature was set at which the hardness after heating when heated for 1 minute was 80% of the hardness of the finished cold-rolled sheet. After repeatedly bending 90° (R = 0.4),
The bending was performed once, and the number of times until the test piece broke was counted as the number of repeated bending. For solderability, a solder wetting and spreading test was conducted, and a solder wetting area of 95% or more was considered "good." In the solder weathering test, eutectic solder was soldered to the test material, and after holding it in the atmosphere at 150℃ for a specified period of time,
The state of peeling was observed using a plating adhesion tester (JIS-H8504). The number of times peeling occurred was defined as the number of times peeling occurred. Moreover, the number of times of each five samples was averaged for each holding time. In addition, as comparative alloys, alloys having the compositions shown in Tables 1 and 2 were manufactured and subjected to various measurement tests in the same manner as the alloys of the present invention, and the results are also shown in Tables 1 and 2. As is clear from the results in Table 1, alloys No. 1 to No. 4 of the present invention have a tensile strength of 55 Kg/mm ² or more,
It exhibits a high electrical conductivity of 40% or more, has sufficient softening resistance, can be repeatedly bent many times, and has "good" solderability. On the other hand, as shown in Comparative Alloys No. 5 and No. 6, alloys containing more P than the composition range of the present invention alloys have low conductivity and low elongation due to the excess P, and are repeatedly It has poor bendability and poor solderability. The comparative alloy with less Fe shown in No. 7 has extremely low tensile strength and low electrical conductivity. In addition, B is additive-free
As mentioned above, No. 8 alloy has low elongation. Also,
No. 9 alloy with less Sn has lower strength, while alloy No. 9 with more Zn has lower strength.
The electrical conductivity of the 10 alloy is inferior to that of the invention alloy. As described above, it can be seen that the alloy of the present invention is an extremely excellent copper-based alloy that has high strength, high electrical conductivity, softening resistance, repeated bendability, and solderability. Next, the results of a solder peeling test for the alloys of the present invention and comparative alloys are listed in Table 2, and the following can be seen from the results. Samples No. 14 to No. 16, which are alloys of the present invention, showed no solder peeling at all even after 100 hours, and alloy No. 14 did not peel off after 524 hours.
14 times, and 16 times for No. 15 alloy. No. 16 alloy, which has a relatively large amount of Zn, does not peel off at all even if it is bent 16 times. On the other hand, in alloys No. 11 to No. 13 whose Zn composition is lower than the Zn composition range of the present invention alloy (ie, Zn is 0.05% or less), the solder peels off less than 20 times in 100 hours. This result shows that Zn is an element that improves solder weather resistance as described above. The alloy of the present invention has excellent solder weather resistance, considering that the standards that normally require reliability for electronic parts require materials that do not peel off after being held at 150°C in the atmosphere for 100 hours. It can be seen that the alloy is made of

【表】【table】

【表】 (ホ) 発明の効果以上から明らかなように、本発明合金は高強
度、高導電性、耐軟化性を有し、かつ繰返し曲げ
性およびはんだ付け性に優れており、更に優れた
はんだ耐候性を有しているので、電気・電子用材
料として最適な銅合金を提供することができる。特に、本発明合金ははんだ耐候性に優れている
ので、激しい環境下での使用に充分に耐え、かつ
安価で高性能であるので、リード材やコネクター
等として好適な銅合金である。[Table] (E) Effects of the Invention As is clear from the above, the alloy of the present invention has high strength, high conductivity, and softening resistance, and has excellent repeated bendability and solderability. Since it has solder weather resistance, it can provide a copper alloy that is optimal as an electrical/electronic material. In particular, the alloy of the present invention has excellent solder weather resistance, can withstand use in harsh environments, is inexpensive, and has high performance, so it is a copper alloy suitable for lead materials, connectors, and the like.

Claims

[Claims]

1 Weight% Ni: 0.05%~0.40%, B: 0.005~
0.06%, Fe: 0.50~1.50%, Sn: 0.50~1.50%,
P: 0.01 to 0.1%, Zn: 0.05 to less than 0.1%, the balance
A copper alloy consisting of Cu and unavoidable impurities, having a structure in which Fe-Ni-P compounds are dispersed and precipitated in a matrix, and having an electrical conductivity of 40% IACS or more,
A high-strength, highly conductive copper alloy characterized by a tensile strength of 55 Kgf/mm ² or more.