JPH054183B2 - - Google Patents
Info
- Publication number
- JPH054183B2 JPH054183B2 JP59255971A JP25597184A JPH054183B2 JP H054183 B2 JPH054183 B2 JP H054183B2 JP 59255971 A JP59255971 A JP 59255971A JP 25597184 A JP25597184 A JP 25597184A JP H054183 B2 JPH054183 B2 JP H054183B2
- Authority
- JP
- Japan
- Prior art keywords
- band
- shaped
- solder
- composite strip
- precious metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Coating With Molten Metal (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacture Of Switches (AREA)
Description
(産業上の利用分野)
本発明は、コネクター、スイツチ、継電器更に
は集積回路用リードフレーム等に用いるクラツド
帯材の製造方法に関する。
(従来技術とその問題点)
従来、ステンレス鋼、りん青銅、洋白等の帯状
金属材料をコネクター、スイツチ、継電器、リー
ドフレーム等に用いる場合は、予め前記帯状金属
材料に貴金属又は貴金属合金の帯状材を接合した
複合帯材をプレスで打抜き、その後端子部に電気
はんだめつきを施してから組立てるか、或いは前
記複合帯材をプレスで打抜いた後モールド成形
し、その後電気Sn又は電気はんだめつきを施し
てから組立てている。
ところで、これらの方法は、
次の組立工程ではんだめつきが粉状に剥れ易
く、貴金属又は貴金属合金を汚し易い。
曲げ加工等で電気はんだめつき面にひびが入
り易く、密着性が弱い。
電気はんだめつきした際の残留応力により台
材にひずみが生じる。
電気はんだめつき作業の工数が多く、特にモ
ールド品等では通電用のラツクがけ等の作業が
必要である。
作業工程が複雑で、連続化、自動化が困難で
ある。
等の問題点があつた。
一方、貴金属又は貴金属合金の帯状材を接合し
た複合帯材に電気Snめつきを施した複合帯状材
料を使用することが試みられているが、Snがホ
イスカーを生じ易いこと、合金電気めつきでは成
分比にバラツキが生じ易く、安定した成分の精度
のよいめつきを得ることが困難であること、電気
はんだめつきした複合帯状材料はプレス加工性が
悪く型寿命が短かいこと等の問題点がある為、殆
んど実用化されていない。
(発明の目的)
本発明は上記問題点を解決すべくなされたもの
で、はんだの密着性が良くて切断、曲げ加工等で
も剥れず、貴金属又は貴金属合金面も汚れず、帯
状金属材料にひずみが生ぜず、作業工程が簡単
で、連続して自動的に複合帯状材料を製造できる
方法を提供することを目的とするものである。
(発明の構成)
本発明の複合帯状材料の製造方法は、プレス加
工を施す複合帯状材料において、りん青銅、洋
白、ベリリウム銅、その他の銅系合金又はFe−
Ni,Fe−Ni−Co、ステンレス鋼等の鉄系合金の
帯状金属材料の表面長手方向に、Au,Ag,Pd,
Pt等の貴金属又はそれらの貴金属合金の帯状材
を接合した後、帯状金属材料の貴金属又は貴金属
合金の接合されていない一側端部の長手方向に、
はんだを溶融した槽中に侵漬し乍ら移動させ溶融
はんだを被覆することを特徴とする。
(実施例)
本発明の複合帯状材料の製造方法の一実施例を
図によつて説明する。第1図に示す如く厚さ0.7
mm、幅30mmのりん青銅より成る帯状金属材料1の
表面長手方向に、第2図に示す如く厚さ0.006mm、
幅2.0mmのAuより成る帯状材2を接合し、さらに
冷間圧延加工を施して第3図に示す如く帯状金属
材料1の厚さ0.25mm、帯状材2の厚さ0.002mmの
複合帯材3を作つた。次にSn65%−Pb35%のは
んだを溶融した槽に設けたスリツトに前記複合帯
材3を通して、一側端部を槽中の溶融はんだに浸
漬し乍ら移動させ、溶融はんだを被覆して第4図
に示す如く厚さ1μ、幅6mmのはんだ層4を一側
端部に設けた複合帯状材料3′を製造した。
この複合帯状材料3′の帯状金属材料1を検査
した処、何らひずみは無く、またはんだ層4の厚
さをベータースコープ(膜厚測定器)により測定
した処、下表に示す結果を得た。
(Industrial Application Field) The present invention relates to a method of manufacturing a clad strip material used for connectors, switches, relays, and lead frames for integrated circuits. (Prior art and its problems) Conventionally, when a band-shaped metal material such as stainless steel, phosphor bronze, or nickel silver is used for a connector, switch, relay, lead frame, etc., the band-shaped metal material is coated with a band of precious metal or precious metal alloy in advance. Either the composite strip material with the materials joined is punched out using a press, and then the terminals are electrically soldered before being assembled, or the composite strip material is punched out using a press and then molded, and then electrical Sn or electrical solder is applied. It is assembled after soldering. By the way, these methods tend to cause the solder to peel off into powder during the next assembly process, and tend to contaminate the precious metal or precious metal alloy. Electric soldering surfaces tend to crack during bending, etc., resulting in poor adhesion. Residual stress during electrical soldering causes distortion in the base material. Electrical soldering requires a large number of man-hours, especially for molded products, etc., which requires work such as racking for energization. The work process is complex and difficult to serialize and automate. There were other problems. On the other hand, attempts have been made to use a composite strip material made by bonding strips of noble metals or noble metal alloys and electroplating them with Sn, but the problem is that Sn tends to generate whiskers, and alloy electroplating is difficult. Problems include the fact that the component ratio tends to vary, making it difficult to obtain accurate plating with stable components, and composite strip materials soldered with electric solder have poor press workability and short mold life. Due to this problem, it is rarely put into practical use. (Purpose of the invention) The present invention was made to solve the above-mentioned problems, and has good solder adhesion and does not peel off even during cutting, bending, etc., does not stain the noble metal or noble metal alloy surface, and does not cause strain on the band-shaped metal material. It is an object of the present invention to provide a method that can continuously and automatically manufacture a composite strip-shaped material without causing any problems, with a simple work process, and with a simple process. (Structure of the Invention) The method for producing a composite strip-shaped material of the present invention is to produce a composite strip-shaped material that is press-worked using phosphor bronze, nickel silver, beryllium copper, other copper alloys, or Fe-
Au, Ag, Pd,
After joining the band-shaped material of noble metal such as Pt or precious metal alloy thereof, in the longitudinal direction of one end of the band-shaped metal material where the noble metal or precious metal alloy is not joined,
The method is characterized in that the solder is immersed in a bath containing molten solder and moved while being covered with molten solder. (Example) An example of the method for manufacturing a composite strip material of the present invention will be described with reference to the drawings. Thickness 0.7 as shown in Figure 1
As shown in FIG.
Band-shaped materials 2 made of Au with a width of 2.0 mm are joined and further cold-rolled to obtain a composite strip with a thickness of 0.25 mm for the metal strip 1 and a thickness of 0.002 mm for the strip 2, as shown in Fig. 3. I made 3. Next, the composite strip 3 is passed through a slit provided in a tank in which 65% Sn-35% Pb solder is melted, and one end is dipped in the molten solder in the tank while being moved to cover it with molten solder. As shown in FIG. 4, a composite strip-shaped material 3' having a solder layer 4 having a thickness of 1 μm and a width of 6 mm provided at one end thereof was manufactured. When the band-shaped metal material 1 of this composite band-shaped material 3' was inspected, there was no distortion, and when the thickness of the solder layer 4 was measured using a Beta scope (film thickness measuring device), the results shown in the table below were obtained. .
【表】
次に、この複合帯状材料3′を、50mmの長さに
切断し、内側半径0.2mmで180度折り曲げ試験を行
つて、はんだ層4の表面を顕微鏡で20倍に拡大
し、観察した結果、ひび割れ、剥れ等は見られ
ず、はんだ層4の塑性変形は帯状金属材料1の表
面の変形に充分対応できることが確認された。
また、切断面を走査型電子顕微鏡にて50倍に拡
大して観察した結果、切断面に剥れ、欠けなどの
欠陥は見られず、むしろ切断面にはんだが幾分だ
れ込んでおり、Au面を汚染するはんだ粉の発生
が少ないことが確認された。
さらにAuの帯状材2の表面をEPMAで分析し
た結果、その表面にPb,Sn等の元素は検出され
ず、はんだによる汚染の心配の無いことが確認さ
れた。
そこで、前記第4図に示す複合帯状材料3′を、
例えば第5図に示す如く打ち抜き、切断等の加工
を行つて、コネクター用接触子5を製作した処、
何ら問題の無い品質良好なものが得られた。
なお、はんだの被覆は、帯状金属材料の貴金属
又は貴金属合金の接合されていない一側端部に限
らず両側端部に被覆していてもよいものである。
(発明の効果)
以上の説明で判るように本発明の複合帯状材料
の製造方法によれば、溶融はんだを被覆してなる
ので、はんだの密着性を高くできて、切断、曲げ
加工等を行つても剥れず、貴金属又は貴金属合金
面も汚れず、帯状金属材料にひずみが生ぜず、作
業工程も簡単化して品質の良好な複合材料を連続
して自動的に能率良く製造できるという効果があ
る。[Table] Next, this composite strip-shaped material 3' was cut into a length of 50 mm, a 180-degree bending test was performed with an inner radius of 0.2 mm, and the surface of the solder layer 4 was magnified 20 times with a microscope and observed. As a result, no cracks, peeling, etc. were observed, and it was confirmed that the plastic deformation of the solder layer 4 could sufficiently correspond to the deformation of the surface of the strip-shaped metal material 1. In addition, as a result of observing the cut surface with a scanning electron microscope at a magnification of 50 times, no defects such as peeling or chipping were observed on the cut surface, but rather some solder had soaked into the cut surface, and the Au It was confirmed that there was less solder powder that contaminated the surface. Furthermore, as a result of EPMA analysis of the surface of the Au strip material 2, no elements such as Pb or Sn were detected on the surface, confirming that there was no risk of contamination by solder. Therefore, the composite strip material 3' shown in FIG.
For example, as shown in FIG. 5, when a connector contact 5 is manufactured by punching, cutting, etc.,
A product of good quality and no problems was obtained. Note that the solder coating is not limited to one end of the band-shaped metal material where the noble metal or noble metal alloy is not joined, but may be applied to both ends. (Effects of the Invention) As can be seen from the above explanation, according to the manufacturing method of the composite strip material of the present invention, since it is coated with molten solder, the adhesion of the solder can be improved, and it is possible to perform cutting, bending, etc. The effect is that it does not peel off even when rubbed, does not stain the precious metal or precious metal alloy surface, does not cause distortion in the band-shaped metal material, and simplifies the work process so that high-quality composite materials can be manufactured continuously and automatically and efficiently. .
第1図乃至第4図は本発明の複合帯状材料の製
造方法の一実施例を示す工程図、第5図は第4図
の複合帯状材料より作つたコネクター用接触子の
斜視図である。
1 to 4 are process diagrams showing one embodiment of the method for manufacturing a composite strip-shaped material of the present invention, and FIG. 5 is a perspective view of a contact for a connector made from the composite strip-shaped material of FIG. 4.
Claims (1)
系合金又は鉄系合金の帯状金属材料の表面長手方
向に、Au,Ag,Pd,Pt等の貴金属又は貴金属
合金の帯状材を接合した後、帯状金属材料の貴金
属又は貴金属合金の接合されていない一側端部の
長手方向に、はんだを溶融した槽中に侵漬し乍ら
移動させ溶融はんだを被覆することを特徴とする
複合帯状材料の製造方法。1. In the composite band-shaped material to be pressed, after joining a band-shaped material of noble metal or precious metal alloy such as Au, Ag, Pd, or Pt in the longitudinal direction of the surface of the band-shaped metal material of copper-based alloy or iron-based alloy, the band-shaped metal material is A method for producing a composite band-shaped material, which comprises immersing one end of a material of a precious metal or a precious metal alloy in a longitudinal direction in which one side is not bonded into a bath containing molten solder and moving the material to cover it with molten solder. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25597184A JPS61135475A (en) | 1984-12-04 | 1984-12-04 | Production of compound material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25597184A JPS61135475A (en) | 1984-12-04 | 1984-12-04 | Production of compound material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61135475A JPS61135475A (en) | 1986-06-23 |
| JPH054183B2 true JPH054183B2 (en) | 1993-01-19 |
Family
ID=17286114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25597184A Granted JPS61135475A (en) | 1984-12-04 | 1984-12-04 | Production of compound material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61135475A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2746688B2 (en) * | 1989-09-22 | 1998-05-06 | 田中貴金属工業株式会社 | Method and apparatus for manufacturing solder-coated composite strip |
| JP2736589B2 (en) * | 1993-02-02 | 1998-04-02 | 日本航空電子工業株式会社 | Contact and manufacturing method thereof |
| JP2012009335A (en) * | 2010-06-25 | 2012-01-12 | Auto Network Gijutsu Kenkyusho:Kk | Method of manufacturing terminal fitting |
| JP5561540B2 (en) * | 2010-09-08 | 2014-07-30 | 株式会社オートネットワーク技術研究所 | Terminal fitting and method of manufacturing terminal fitting |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4313705Y1 (en) * | 1967-08-31 | 1968-06-11 | ||
| JPS543225A (en) * | 1977-06-08 | 1979-01-11 | Mitsubishi Electric Corp | Ac feeder |
| JPS5817677B2 (en) * | 1978-09-20 | 1983-04-08 | 同和鉱業株式会社 | Method for removing arsenic in aqueous solution |
| JPS5750776A (en) * | 1980-09-11 | 1982-03-25 | Nippon Acchakutanshi Seizo Kk | Contact for pressure contact connector and method of producing same |
| JPS5823182A (en) * | 1981-08-04 | 1983-02-10 | 株式会社日立製作所 | Method of manufacturing electrical contacts |
-
1984
- 1984-12-04 JP JP25597184A patent/JPS61135475A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61135475A (en) | 1986-06-23 |
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