JPH0542156B2 - - Google Patents
Info
- Publication number
- JPH0542156B2 JPH0542156B2 JP63328857A JP32885788A JPH0542156B2 JP H0542156 B2 JPH0542156 B2 JP H0542156B2 JP 63328857 A JP63328857 A JP 63328857A JP 32885788 A JP32885788 A JP 32885788A JP H0542156 B2 JPH0542156 B2 JP H0542156B2
- Authority
- JP
- Japan
- Prior art keywords
- coverlay
- adhesive
- printed wiring
- flexible printed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
本発明に気泡残留、接着剤浸み出し及び、揮発
分による回路上の汚染なく均一にカバーレイを圧
着するために層状のシートを使用してフレキシブ
ルプリント配線板を製造する方法に関するもので
ある。
〔従来の技術〕
フレキシブルプリント配線板の製造工程は、ポ
リイミド等の耐熱フイルムと銅箔とを接着剤を介
して接着した後、銅をパターンニングし、その上
に耐熱フイルムを接着剤を介して熱圧着する。従
来、かかるカバーレイ熱圧着時に使用するクッシ
ョン材として、耐熱ゴム、クラフト紙、高融点熱
可塑性フイルムやそれらを組合わせたものが使用
されている。この方法では、カバーレイの端面の
部分が充分に埋め込めないため、接着剤の浸み出
し、揮発分による回路上の汚染が発生し、表面処
理ができない。
また、接着剤溶融粘度により、気泡が残留する
場合がある。
〔発明が解決しようとする課題〕
本発明は、気泡残留、接着剤浸み出し、揮発分
による回路上、汚染なく、均一にカバーレイを圧
着するフレキシブルプリント配線板の製造法を提
供することを目的とするものである。
本発明は、フレキシブルプリント配線板のプリ
ント回路面とカバーレイを圧着する工程におい
て、該カバーレイに塗布されている接着剤の溶融
開始温度より低い軟化点を有するエチレンメチル
メタアクリレートを中間層とし、該接着剤より溶
融開始温度より高い融点を有するポリプロピレン
又はポリメチルペンテンを上下の表面層とした３
層の複合シートをクツシヨン材として使用し、圧
着成形することを特徴とするフレキシブルプリン
ト配線板の製造方法である。
本発明において用いられる低軟化点を有する熱
可塑性樹脂としては、エチレンメチルメタアクリ
レート（EMMA）であり、高融点を有する熱可
塑性樹脂としては、ポリプロピレン（PP）又は
ポリメチルペンテン（PMP）である。低軟化点
を有するEMMAを中間層とし、高融点を有する
熱可塑性樹脂を上下の表面層として用い、PP−
EMMA−PP，PMP−EMMA−PPの３層複合
シートとされ、クツシヨン材として使用される。
〔作用〕
本発明において、低軟化点を有する部分は、接
着剤より低温で軟化し、カバーレイの端面、導体
露出部の埋め込む。従つて接着剤溶融時または揮
発分発生時には、導体上にカバーして接着剤の浸
み出し、揮発分による導体の汚染を防止する。
また、軟化後も適当な粘弾性を有することか
ら、気泡残留を防止する。
高軟化点を有する部分は、カバーレイ、導体と
層状シートの離型性を有する部分である。
図面により本発明を詳細に説明する。第１図及
び第２図に示したようにポリエステル、ポリイミ
ド等のベースフイルム１に接着剤２を介して銅箔
等を貼付し、エツチングにより得られた回路３を
有するフレキシブルプリント配線板８の回路３側
の上に接着剤４のついたカバーレイフイルム５か
らなるカバーレイ７をのせ、更にその上に上、下
表面層が該接着剤４の溶融開始温度より高い融点
を有する熱可塑性樹脂で、中間層が該接着剤４の
溶融開始温度より低い軟化点を有する熱可塑性樹
脂からなる３層複合シート６をクツシヨンとして
使用し、ステンレス鏡面板９で全層をはさんで加
熱、加圧し、カバーレイを熱圧着し、第１図に示
すようなカバーレイ付きフレキシブルプリント配
線板が作成される。
〔実施例〕
〔実施例 １〕
ベースフイルム１に接着剤２に介して、回路３
を有するフレキシブルプリント配線板８の上に接
着剤４のついたカバーレイフイルム５からなるカ
バーレイ７を上にのせて、さらに、上、下の表面
層をPP、中間層をEMMPからなる３層複合シー
ト６をクツシヨンとして、ステンレス鏡面板９で
はさんで加熱、加圧し、カバーレイを熱圧着した
第１図に示す様はフレキシブルプリント配線板を
作成した。その結果を表に示した。
〔実施例 ２〕
３層複合シートの上層をPP、下層をPMP、中
間層をEMMAとしたものを３層シートとして用
い、実施例−１と同様にカバーレイを熱圧着し、
フレキシブルプリント配線板を作成した。その結
果を表に示した。
〔比較例 １〕
第３図に示したように耐熱ゴムをクツシヨンと
して用い、カバーレイを熱圧着し、フレキシブル
プリント配線板を作成した。その結果を表に示し
た。
〔比較例 ２〕
第４図に示したようにクラフト紙をクツシヨン
材として用い、カバーレイを熱圧着し、フレキシ
ブルプリント配線板を作成した。その結果を表に
示した。
The present invention relates to a method for manufacturing a flexible printed wiring board using a layered sheet in order to uniformly press-bond a coverlay without leaving bubbles, adhesive oozing, or contaminating circuits due to volatile matter. [Prior art] The manufacturing process for flexible printed wiring boards involves bonding a heat-resistant film such as polyimide to a copper foil using an adhesive, patterning the copper, and then placing a heat-resistant film on top of the copper foil using an adhesive. Heat and press. Conventionally, heat-resistant rubber, kraft paper, high-melting point thermoplastic film, or combinations thereof have been used as cushioning materials for such coverlay thermocompression bonding. In this method, the end surface of the coverlay cannot be sufficiently buried, resulting in adhesive seepage and contamination of the circuit by volatile matter, making surface treatment impossible. Also, depending on the melt viscosity of the adhesive, bubbles may remain. [Problems to be Solved by the Invention] The present invention aims to provide a method for manufacturing a flexible printed wiring board in which a coverlay is uniformly crimped without contaminating the circuit due to residual air bubbles, adhesive seepage, or volatile matter. This is the purpose. The present invention provides an intermediate layer of ethylene methyl methacrylate having a softening point lower than the melting start temperature of the adhesive applied to the coverlay in the process of press-bonding the printed circuit surface of the flexible printed wiring board and the coverlay, Upper and lower surface layers are made of polypropylene or polymethylpentene, which has a melting point higher than the melting start temperature of the adhesive 3.
This method of manufacturing a flexible printed wiring board is characterized in that a composite sheet of layers is used as a cushion material and pressure-molded. The thermoplastic resin with a low softening point used in the present invention is ethylene methyl methacrylate (EMMA), and the thermoplastic resin with a high melting point is polypropylene (PP) or polymethylpentene (PMP). Using EMMA with a low softening point as the middle layer and thermoplastic resin with a high melting point as the upper and lower surface layers, PP-
It is a three-layer composite sheet of EMMA-PP and PMP-EMMA-PP, and is used as a cushion material. [Function] In the present invention, the portion having a low softening point softens at a lower temperature than the adhesive, and is embedded in the end face of the coverlay and the exposed portion of the conductor. Therefore, when the adhesive melts or volatile matter is generated, the conductor is covered to prevent the adhesive from seeping out and contaminating the conductor with volatile matter. Furthermore, since it has appropriate viscoelasticity even after softening, it prevents bubbles from remaining. The portion having a high softening point is a portion having mold releasability for coverlays, conductors, and layered sheets. The present invention will be explained in detail with reference to the drawings. As shown in FIGS. 1 and 2, a circuit of a flexible printed wiring board 8 having a circuit 3 obtained by attaching a copper foil or the like to a base film 1 made of polyester, polyimide, etc. via an adhesive 2 and etching it. A coverlay 7 consisting of a coverlay film 5 with an adhesive 4 attached is placed on the side 3, and the upper and lower surface layers are made of a thermoplastic resin having a melting point higher than the melting start temperature of the adhesive 4. A three-layer composite sheet 6 whose middle layer is made of a thermoplastic resin having a softening point lower than the melting start temperature of the adhesive 4 is used as a cushion, and the entire layer is sandwiched between stainless steel mirror plates 9 and heated and pressurized. The coverlay is thermocompression bonded to produce a flexible printed wiring board with a coverlay as shown in FIG. [Example] [Example 1] A circuit 3 is attached to a base film 1 via an adhesive 2.
A coverlay 7 consisting of a coverlay film 5 coated with an adhesive 4 is placed on top of a flexible printed wiring board 8 having an adhesive 4, and further three layers are formed, the top and bottom surface layers being PP and the middle layer being EMMP. The composite sheet 6 was used as a cushion, heated and pressed between stainless steel mirror plates 9, and a coverlay was thermocompression bonded to produce a flexible printed wiring board as shown in FIG. The results are shown in the table. [Example 2] A three-layer composite sheet in which the upper layer is PP, the lower layer is PMP, and the middle layer is EMMA is used as a three-layer sheet, and a coverlay is thermocompression bonded in the same manner as in Example-1.
A flexible printed wiring board was created. The results are shown in the table. [Comparative Example 1] As shown in FIG. 3, a heat-resistant rubber was used as a cushion and a coverlay was thermocompression bonded to produce a flexible printed wiring board. The results are shown in the table. [Comparative Example 2] As shown in FIG. 4, a flexible printed wiring board was prepared by using kraft paper as a cushion material and bonding a coverlay by thermocompression. The results are shown in the table.
本発明により、気泡残留、接着剤浸み出し及び
揮発分による導体上の汚染のないカバーレイの均
一な圧着が可能となり、フレキシブルプリント配
線板のカバーレイ圧着のための製造法として好適
である。
The present invention enables uniform crimping of a coverlay without residual air bubbles, adhesive seepage, or contamination of conductors by volatile matter, and is suitable as a manufacturing method for crimping a coverlay of a flexible printed wiring board.
第１図は本発明により得られたフレキシブルプ
リント配線板の断面図。第２図は本発明の方法を
示すカバーレイ熱圧着の構成を示す断面図。第３
図は比較例１におけるカバーレイ熱圧着を構成を
示す断面図。第４図は比較例２におけるカバーレ
イ熱圧着を構成を示す断面図である。
FIG. 1 is a sectional view of a flexible printed wiring board obtained according to the present invention. FIG. 2 is a sectional view showing the structure of a coverlay thermocompression bonding method according to the present invention. Third
The figure is a sectional view showing the structure of coverlay thermocompression bonding in Comparative Example 1. FIG. 4 is a sectional view showing the structure of coverlay thermocompression bonding in Comparative Example 2.
Claims (1)
面とカバーレイを圧着する工程において、該カバ
ーレイに塗布されている接着剤の溶融開始温度よ
り低い軟化点を有するエチレンメチルメタアクリ
レートを中間層とし、該接着剤より溶融開始温度
より高い融点を有するポリプロピレン又はポリメ
チルペンテンを上下の表面層とした３層の複合シ
ートをクッション材として使用し、圧着成形する
ことを特徴とするフレキシブルプリント配線板の
製造方法。1. In the process of press-bonding the printed circuit surface of the flexible printed wiring board and the coverlay, an intermediate layer made of ethylene methyl methacrylate having a softening point lower than the melting start temperature of the adhesive applied to the coverlay, A method for producing a flexible printed wiring board, characterized in that a three-layer composite sheet with upper and lower surface layers made of polypropylene or polymethylpentene having a melting point higher than the melting start temperature is used as a cushioning material and pressure-molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32885788A JPH02177497A (en) | 1988-12-28 | 1988-12-28 | Manufacture of flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32885788A JPH02177497A (en) | 1988-12-28 | 1988-12-28 | Manufacture of flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02177497A JPH02177497A (en) | 1990-07-10 |
| JPH0542156B2 true JPH0542156B2 (en) | 1993-06-25 |
Family
ID=18214867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32885788A Granted JPH02177497A (en) | 1988-12-28 | 1988-12-28 | Manufacture of flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02177497A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5093897B2 (en) * | 2008-05-13 | 2012-12-12 | サン・トックス株式会社 | Coverlay film thermocompression sheet |
| JP5613918B2 (en) * | 2009-06-12 | 2014-10-29 | 株式会社フジクラ | Manufacturing method of flexible printed circuit board |
| US9363890B2 (en) | 2010-12-27 | 2016-06-07 | Kuraray Co., Ltd. | Circuit board and method of manufacturing same |
| KR101713785B1 (en) * | 2016-09-30 | 2017-03-08 | (주)레온 | A Manufacturing Method Of Enhanced High Transparency Transparent Film |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245133A (en) * | 1985-08-23 | 1987-02-27 | Hitachi Ltd | Pellet mounting method |
-
1988
- 1988-12-28 JP JP32885788A patent/JPH02177497A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02177497A (en) | 1990-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090625 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090625 Year of fee payment: 16 |