JPH0542207B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a construction method for installing electrical wiring on the floor of a building or the like.

Prior Art Conventionally, in order to run electrical wiring on the floor of a building, a cylindrical half-shaped covering member made of a synthetic resin material is used on the floor, and the wiring arranged on the floor is covered with the covering member. It was then glued to the floor.

In such a first conventional technique, the covering member containing the wiring rises above the floor, which may cause pedestrians to trip over it or make it difficult to arrange and move various office equipment. There was a problem.

A second conventional technique that solves these problems is shown in FIG. For example, rectangular block-shaped floor members 2 are arranged and fixed at regular intervals on a floor 1 of a building, etc., and wiring 4 is installed in a gap 3 formed between each floor member 2. By laying floorboards 5 over the wiring 4 arranged in this way, a flat floor surface can be obtained.

In addition, as another third conventional technique, a technique is also used in which support legs 6 are arranged on the floor 1 as shown in FIG. ing. In such conventional technology, floor 1
Wiring is provided in the space between the facility board 7 and the facility board 7.

Problems to be Solved by the Invention In the second prior art, the floor member 2 having a ready-made shape as described above is used as a constituent unit, so depending on the shape and area of the room in which it is installed, the floor member 2 may be cut. There will be a need for processing. Such a floor member 2 is formed of, for example, lightweight concrete, and has the problem that such processing operations are unnecessarily time-consuming. Furthermore, due to the material it is made of, the floor member 2 is relatively heavy, making it inconvenient to handle and increasing manufacturing costs.

Furthermore, since the wiring is carried out using the gap 3 after the floor member 2 is placed and fixed on the floor 1, it is not possible to run the wiring in a straight line in the diagonal direction of the rectangular plate-shaped floor member 2. There was a problem that the length of 4 became unnecessarily large.

In the third conventional technique, although the problems of the second conventional technique are solved, the wiring 4 is covered from above, so if the wiring is carried out using the facility board 7, When attempting to add, reduce, or change the wiring, it is necessary to remove all the facility boards 7 at the target location in advance, and such wiring work requires unnecessary time and effort. There was a problem.

Other conventional examples include Utility Model Application No. 52-29722 and Utility Model Application No. 54-49126. All of these documents disclose a technique in which tiles in which cross-shaped grooves have been formed in advance are laid out on the floor, wiring is placed in the grooves, and then such tiles are covered with a lid. Even in such conventional examples, the problem of low workability at peripheral areas such as walls of rooms where tiles are installed cannot be solved.

In addition, if the wiring introduction position on the floor and the use position of the computer etc. are diagonal with respect to the tile arrangement direction, it is necessary to bend the wiring for each tile or take a circuitous route in an L-shape, which adds time and effort to the work process. In addition, there is a problem in that a large amount of wiring is wasted.

An object of the present invention is to provide a floor wiring method that solves the above-mentioned problems, significantly reduces work procedures and labor, and allows for much easier wiring changes after completion of construction. It is.

Means for Solving the Problems The present invention provides a flat floor member having at least thermoplasticity among thermoplasticity and plasticity on the floor surface, and an uninstalled area of the floor surface has a dimension shorter than that of the floor member. In the case of a part including a floor member, a step of applying heat or shear force to the floor member to divide it into a shape corresponding to the shape of the uninstalled area and constructing it; A step of rolling a groove forming means provided with a ring on an installed floor member to form a groove of a predetermined size in a direction corresponding to the wiring pattern; This is a floor wiring construction method characterized by including the step of installing floorboards on the floor.

Function According to the present invention, a flat floor member having at least thermoplasticity among thermoplasticity and plasticity is installed on the floor surface. At this time, when the uninstalled area of the floor includes a portion shorter than the floor member, heat or shear force is applied to the floor member to divide it into a shape corresponding to the shape of the uninstalled area and install. After installing the floor members on the floor surface in this way, a groove forming means having a heat generating ring that generates heat and is rotatable around a rotation axis in a substantially horizontal direction is installed on the installed floor members in accordance with the wiring mode. Form in the direction. Wiring is provided within this groove and a floorboard is installed on the floor member.

In addition, since the flooring material has at least thermoplasticity, heating means or plastic deformation means corresponding to its properties can be used to add grooves, or to connect locations where wiring is required using the shortest route. wiring can be formed.

In the present invention, even in such a case, the floor member is divided by heating or shearing force to install the floor member according to the shape of the uninstalled area. Therefore, there is no need to prepare in advance a separate part with a shape corresponding to the unequipped area, and furthermore, the work process is extremely simple because the flooring material can be easily processed by heating or shearing force. have.

Further, in the present invention, after the floor member has been installed on the floor surface as described above, by rolling the heating ring provided in the groove forming means on the floor member,
The grooves can be easily formed in the optimum direction corresponding to the wiring pattern. Therefore, compared to the case where, for example, cross-shaped grooves are formed in advance on the floor member, the effort of needlessly routing the wiring can be omitted, and the length of the wiring can also be shortened. Further, the wiring can be routed over the shortest distance from the point where the wiring is introduced onto the floor surface to the point where the wiring is taken out onto the floor.

Even if new grooves are required when wiring is changed or permanently installed after wiring has been installed, existing floor members can be replaced with separately prepared floors with multiple grooves. There is no need to replace the member, and new grooves can be easily formed using the groove forming means as described above. This makes it easy to add and change the wiring, and usability is greatly improved.

That is, the present invention uses thermoplastic or plastic material as the floor member, thereby improving the processing at the peripheral edge of the floor when laying the floor member on the floor surface, the formation process of grooves where wiring is applied, and The purpose is to make the most of the characteristics of such materials to easily and with high usability when adding or changing wiring.

Embodiment FIG. 2 is a perspective view showing a wiring state realized by a wiring method according to an embodiment of the present invention. This embodiment will be described with reference to FIG. In this embodiment, a flat floor member 11 having at least one of thermoplastic and plastic properties as described later is installed on a floor 10 of a building such as concrete, tile, or wood. The groove 12 corresponding to the desired wiring pattern is formed using a groove forming means that corresponds to at least one of thermoplasticity and plasticity. After the wiring 13 is arranged in this groove, the floor member 11 is placed on a floor board 14 made of wood or decorative plywood, for example.
Set up.

FIG. 1 is a perspective view of the floor member 11. The floor member 11 will be explained with reference to FIG. As described above, the floor member 11 has at least one of thermoplasticity and plasticity, and is formed into a flat plate shape. The material is, for example, foamed polystyrene resin, foamed polystyrene resin, foamed polyisocyanate resin, or various glass fiber reinforced thermoplastic resins (FRTP).

That is, if the floor member 11 is of a thermoplastic type, a groove forming means using heat generation as described later is used, and if it is a plastic type, a groove forming means using a physical cutting tool is used to form the thermoplastic. and plasticity, the above two types of groove forming means are used in combination as appropriate.

As described above, the floor wiring method of the present invention can easily perform wiring work when installing various electronic devices in a room of a building, for example. Wiring 13 used in such electronic equipment
The outer diameter of the floor member 11 is approximately 16 mm, so the thickness t of the floor member 11 is selected to be, for example, 20 mm, and the lateral length W and the longitudinal length L are selected as appropriate. Also, the width of the groove 12 formed in the floor member 11
D1 may be selected as appropriate depending on the outer diameter of the wiring 12 to be installed, for example, 16 mm, and the depth D2 of the groove 12 may be selected as appropriate, D2=t...(1) Of course, it is also good.

The above description of the external shape and various dimensions of the floor member 11 are merely examples, and do not limit the external shape and various dimensions of the floor member 11 of the present invention.

FIGS. 3 and 4 are a plan view and a sectional view of the floor 10 for explaining the procedure of the construction method of this embodiment. The wiring method of this embodiment will be explained with reference to FIGS. 3 and 4. As shown in FIG. 3 1 and FIG. 4 1, the placement positions of the electronic devices 15 to be interconnected, for example, on the floor 10 of a room in a building are determined. Next, Figure 3 2 and Figure 4 2
As shown in the figure, the floor member 11 described above is spread on the floor 10.

As explained with reference to FIG. 1, the floor member 11 is assumed to be standardized to a predetermined size and used. At this time, depending on the shape or area of the floor 10, the standardized floor member 11 may be too large or too small. As described above, the floor member 11 has at least one of thermoplasticity and plasticity, so if the above-mentioned excess or deficiency occurs, the floor member 11 can be thermally or physically processed to eliminate the need for wiring work. The work of spreading the floor 10 of the room without any gaps can be easily performed.

Next, as shown in FIGS. 3 and 4, grooves 12 are formed as appropriate in accordance with the installation position of the electronic device 15. This formation process will be described later. Next, as shown in FIGS. 3 and 4, the groove 1
After installing the predetermined wiring 14 in the floor member 11
The above-mentioned floor plate 14 is installed on top. As mentioned above, the floorboard 14 is supported in surface contact with the flat floor member 11, and even when various relatively heavy electronic devices are placed on the floorboard 14,
The type of floorboard 14 may be selected so that its compressive strength can withstand the maximum expected weight. This completes the wiring method of this embodiment.

FIG. 5 is a perspective view showing the principle of construction of the groove forming means 16 used to form the grooves 12 of the floor member 11, and FIG. 6 is a side view showing the state in which the groove forming means 16 is used. It is a diagram. Figures 5 and 6
The groove forming means 16 will be explained with reference to the drawings. Note that the groove forming means 16 of this embodiment is as follows:
The following description assumes that the floor member 11 has at least thermoplasticity.

The groove forming means 16 includes, for example, four wheels 17.
a, 17b, 17c, 17d (indicated by reference numeral 17 when collectively referred to), and this wheel 17a
-17d are fixed to housing 19 by legs 18a-18d. A handle 20 is provided on the housing 19 to facilitate the operation of the groove forming means 16 by an operator.

A support rod 21 hangs down from the housing 19, and a support crank 22a, 22b which is bifurcated, for example, is formed at the free end of the support rod 21, and a heat generating ring 23 is rotatably rotated around its axis between the support cranks 22a and 22b. provided. A heat generating mechanism (not shown) realized by, for example, a nichrome wire is provided inside the heat generating ring 23, and commercial AC power, for example, is taken in through the power line 24, and the heat generating mechanism energize the power.

Inside the housing 19, a heat generating ring 23 is mounted on the floor member 1.
1, a drive mechanism 25 realized by, for example, a worm mechanism is provided for displacing the support rod 21 in the vertical direction in FIG. As a result, vertical displacement of the support rod 21 can be realized. That is, handle 2
By the operation 6, the depth D2 of embedding the heat generating ring 23 into the floor member 11 can be controlled to a desired degree.

Floor member 11 installed on floor 10 in this way
On the other hand, it is possible to easily form the grooves 12 in a desired manner, and the work when wiring on the floor 10 is greatly improved. In other words, according to this embodiment, even after the wiring work is completed using the floor member 11 etc., when adding or changing the wiring, the groove forming means 16 as described above is used. As a result, new grooves 12 can be easily formed, and problems such as restrictions on wiring patterns as described in the prior art are solved, and furthermore, it is possible to remove the floor member 2 and redo or insert the wiring. This eliminates the need to spend time and effort.

As mentioned above, the floor member 11 of this embodiment is made of a foamable synthetic resin material, is extremely lightweight, and can be significantly reduced in cost. Furthermore, compared to the third prior art described in the prior art section, this method has an advantage in that the realized wiring state can be easily recognized visually.

In the above-mentioned embodiment, the floor member 11 was described as having at least thermoplasticity, but the floor member 11
may be of a type having only plasticity, in which case a sharp cutting tool may be used instead of the heating ring 23 of the groove forming means. Even with such a configuration, the same effects as those of the above-mentioned embodiments can be achieved.

The shape and material of the floor member 11 and the structure of the groove forming means 16 described in each of the above-mentioned embodiments are merely examples of the present invention. By using the member, grooves can be easily formed in the member, and the purpose is to make wiring work and maintenance work after wiring much easier.

Effects As described above, according to the present invention, a flat floor member having at least thermoplasticity among thermoplasticity and plasticity is installed on the floor surface. At this time, if the uninstalled area of the floor includes a portion shorter than the floor member, the floor member is divided into shapes corresponding to the shape of the uninstalled area by applying heat or shearing force and installed. After installing the floor components on the floor in this way,
A groove forming means including a heat generating ring that generates heat and is rotatable around a substantially horizontal axis of rotation is formed on the installed floor member in a direction corresponding to the wiring pattern. Wiring is provided within this groove and a floorboard is installed on the floor member.
In addition, since the flooring material has at least thermoplasticity, heating means or plastic deformation means corresponding to its properties can be used to add grooves, or to connect locations where wiring is required using the shortest route. wiring can be formed.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a floor member 11 according to an embodiment of the present invention, Fig. 2 is a perspective view showing a wiring state using the floor member 11, and Fig. 3 is a plan view showing the procedure of the construction method of this embodiment. 4 is a sectional view corresponding to FIG. 3, FIG. 5 is a perspective view showing the principle of the groove forming means 16, FIG. 6 is a side view of FIG. 5, and FIG. 7 is a typical conventional A perspective view of the technology, FIG. 8 is a perspective view of another prior art. 9... Floor, 11... Floor member, 12... Groove, 1
3... Wiring, 14... Floor plate, 16... Groove forming means, 23... Heat generating ring.

Claims (1)

[Claims] 1. A flat floor member having at least thermoplasticity among thermoplasticity and plasticity is installed on the floor surface,
When the uninstalled area on the floor includes a portion with a shorter dimension than the floor member, a step of applying heat or shear force to the floor member to divide it into a shape corresponding to the shape of the uninstalled area and install it, and generating heat. Then, a groove forming means equipped with a heat generating ring rotatable around a substantially horizontal axis of rotation is rolled on the installed floor member to form grooves of predetermined dimensions in a direction corresponding to the wiring mode. A method for wiring a floor, comprising: a step of wiring within the groove and installing a floorboard on the floor member.