JPH0542511B2 - - Google Patents

Description

[Detailed description of the invention]

(Industrial Application Field) The present invention relates to a surface treatment method for wire materials, and particularly to a displacement plating method suitable for displacement copper plating of wire materials such as welding wires and bead wires. (Prior Art) Generally, wire materials, particularly welding wires, include a plating step during their manufacturing process, and electroplating, displacement plating, etc. have been conventionally employed in this plating step. All of these plating methods include a method in which the wire material is immersed while running in a treatment solution, or a method in which a coiled wire material is immersed in the treatment solution. For example, in the case of welding wire, the surface of the steel wire is plated with copper to improve conductivity, wear resistance of the power supply chip, feedability, rust resistance, etc., as is well known. Copper content is considered harmful to welding quality as it can cause cracks in the welded area, and it is preferable to keep the amount as small as possible as long as the above conditions are met. Conventionally, cyanide bath electroplating has been generally used as a plating method for this purpose, but in recent years, copper sulfate bath substitution plating has also been used due to cost considerations including pollution control. (Problems to be Solved by the Invention) The steps of these plating methods are as shown in FIG. 14 (electroplating) and FIG.
As illustrated in Fig. 5 (replacement plating), the wire 1 wound around the bobbin 2 is pulled out by a payout device, and the surface is pickled in a pickling tank 3 and a water washing tank 4 to remove scale, etc. After activating the surface of the wire, the wire is generally plated by being immersed in a plating bath 5 filled with a plating solution, washed with water in a washing bath 6, dried, and then wound up. However, the former method requires a long processing tank because it is necessary to ensure the immersion energization time, and on the other hand, it makes it difficult to increase the wire running speed, making it impossible to improve productivity. Naturally, electric plating inevitably increases the complexity and size of the electrical control system including the rectifier path 7, and the latter type of immersion displacement plating does not require a rectifier, but the required plating thickness (approximately 0.2 to 1.0μ)
A large treatment tank is essential to ensure the time required to complete the replacement. Furthermore, since a large amount of processing liquid is required, a large amount of cost is required for the main equipment, environmental protection equipment, etc., and in terms of plating quality, adhesion and
It is easy to cause unevenness in plating film thickness, etc., and requires careful management. One of the reasons for this is that in such a plating method, unless the plating liquid in the tank is stirred, the plating liquid 8 in the tank does not move as shown in FIG. Since a high concentration of iron ions remains, the adhesion of copper to the continuously fed wire is extremely reduced and the adhesion of the plating quality is impaired. However, in reality, this replacement progresses because the liquid around the wire is replaced to some extent by vibrations of the running wire and convection due to heat, but the difference is shown in Figure 16 to a greater or lesser extent. A cylindrical region 9 (within the dotted line) where the reaction rate is slow occurs or tends to occur around the wire. In any case, similar problems occur not only in welding wire but also in the above-mentioned plating method for other wire materials. The present invention was made in order to solve the problems of the prior art described above, and relates to a substitution plating method that is simpler than the electroplating method. The object of the present invention is to provide an economical method for surface treatment of a wire material, which can ensure good quality such as uniform plating film thickness, and which requires simple equipment. (Means for Solving the Problems) In order to achieve the above object, the present inventors have proposed that in both the conventional electroplating method and the displacement plating method, the periphery of the wire, including the deep concave part of the wire surface, As a result of extensive experimental research focusing on the important point of how quickly and efficiently the plating solution can be replaced, the present invention was achieved by discovering a new and efficient replacement plating method.
In short, the present invention uses a high-pressure pump to apply a jet-like jet flow of displacement plating liquid from a nozzle to a wire material running in a floating state when the impact pressure per unit area is 0.05 Kg/cm ² or more. It is intended to be sprayed on a target and not to be plated. The present invention will be explained in detail below based on examples. As mentioned above, in the method of the present invention, for a wire material (hereinafter referred to as wire) running in space at a predetermined speed,
The plating liquid supplied under pressure by a high-pressure pump or the like is sprayed continuously at high speed through a nozzle, and as a result, the liquid that has completed the substitution reaction is not stagnated around the wire, but is blown away by a high-speed jet or a jet jet. In addition, the cleaning and replacement of the deep concave portions of the wire surface is performed with shockingly fresh plating liquid. The cleaning and replacement effect is very large, and plating with good adhesion is completed instantly. In this regard, in the conventional immersion-type displacement plating method, for example, in the case of relatively inexpensive copper sulfate bath displacement plating applied to welding wire, the precipitated plating layer tends to be relatively coarse crystal grains, and the plating does not adhere tightly. Due to its inferior properties, there were problems in practical use. For this reason, attempts have been made for a long time to add various organic compounds such as gelatin, thiourea, phenols, and amino acids to make the precipitate particles denser, but concentration control is complicated and no definitive solution has been achieved. was not obtained. In contrast, the present invention succeeded in making the precipitate particles denser and improving the adhesion of plating by bringing the displacement plating liquid into contact with the wire at high speed and impact using the above plating liquid injection method. It is something. Furthermore, when performing displacement plating, it is desirable that the plating solution concentration is higher because the plating efficiency improves, but it is known that the higher the concentration, the more the adhesion tends to deteriorate. Taking copper substitution plating as an example, since the reduction rate of Cu ²⁺ is extremely high, the rate of iron eluting at the same time is also extremely high, and the resulting high concentration of Fe ⁺⁺ diffuses into the solution. The precipitate (FeSO ₄ ,
This is because the metal becomes Fe ₂ O ₃ ) and becomes trapped inside the copper, and the metal, including such precipitates, has a very rough structure, cannot form a strong bond with the underlying iron, and is easily peeled off. (“Metal surface technology”)
(See Vol. 26, No. 12 (1975), p. 595). However, according to the present invention, since the above-mentioned tendency is alleviated, the applicable concentration range can be expanded more than before, and the plating efficiency is also improved. Next, the process conditions of the method of the present invention will be specifically explained using displacement copper plating as an example. FIG. 1 shows an example of a displacement plating device used in carrying out the present invention, in which 1 is a wire running at an appropriate speed;
Reference numeral 10 denotes a nozzle for injecting a displacement plating liquid onto the wire, and one or more nozzles are arranged in the running direction of the running wire 1, and one or two or more nozzles are arranged at a predetermined angle in the radial direction. There is. 11 is a high pressure (for example, 0.5Kg/cm ² or more) applied through a pipe 11' so that the plating liquid sprayed from the nozzle 10 collides with the wire surface with a necessary impact pressure of 0.05Kg/cm 2 or more.
This is a pump that supplies the plating liquid at a rate of at least ² cm2), and circulates the plating liquid 8 that is normally stored in the lower part of the processing tank 5. In addition, 12 is a nozzle for washing or washing arranged in the washing tank 6, and a pump 13
water is sprayed onto the wire 1 immediately after plating. The direction of injection from the nozzle 10 is that of the running wire 1
Various aspects are possible depending on the running direction of the
The angle θ of the injection direction with respect to the wire running direction is 0°≦
It can be arbitrarily determined at θ≦180° (Fig. 2),
When 90°<θ≦180°, it can be said to be forward direction (same direction nozzle method), and when 0°≦θ<90°, it can be said to be reverse direction (counterflow nozzle method). It can be said that times are intersecting directions. In order to apply an effective impact force to the wire surface with the plating liquid, it is best to use the perpendicular direction (θ = 90°), and the relative speed can be increased by using a counterflow nozzle method that sprays the plating liquid in the opposite direction to the wire running direction. Therefore, the angle θ may be appropriately selected depending on the wire properties, feeding method, etc. It goes without saying that in the forward direction, the fuel is injected with a relative speed difference from the wire traveling speed. In addition, the nozzle is set at 1° in the wire running direction depending on the plating conditions such as the wire running speed and the predetermined plating thickness.
One or two or more can be appropriately selected and arranged in the wire radial direction. When arranging a plurality of nozzles in the radial direction of the wire, the nozzles can be selected in various directions such as two or three directions relative to the wire diameter, taking into consideration the cross-sectional shape of the wire. When there are two nozzles, the angle δ formed by each direction is approximately δ = 180° (the third
(Figure 4), when there are three pieces, approximately δ ₁ , δ ₂ , δ ₃ = 120° (Figure 4)
It is desirable to arrange the wires so that they form the same or substantially the same angle as shown in FIG. 4, so that the plating liquid can efficiently hit the entire surface of the wire as shown in FIG. In addition, regarding the wire running method, the above example shows a case where the wire runs straight, but the seventh
As shown in Figures a and b, in the case of a method in which a plurality of turn rollers 14 are arranged in the plating tank 5 to change the direction of the wire 1 multiple times, the plating liquid is sprayed onto the front and back surfaces of the wire. Multiple nozzles 1
In this case, the length of the plating tank 5 can be reduced. Furthermore, as shown in FIG. 8, it is also possible to run the wire 1 in a spiral pattern and inject the plating liquid from the nozzle 10 at the top, bottom, etc. of the spiral trajectory. The processing length in the direction of movement can be reduced. Note that the nozzle shown in the above nozzle wiring mode is an example in which the nozzle is placed on the outside of the running wire, and can be called a jet nozzle system. method is also possible. That is, as shown in FIG. 5, a pipe-shaped nozzle 10'
By passing the wire 1 through the center of the wire and increasing the relative speed by injecting the plating liquid 8 in the opposite direction (counterflow) to the running direction of the wire, it is possible to prevent the accumulation of iron ions and to always maintain a fresh plating liquid. This is a supply method. In addition, if one or more nozzles are provided so that the plating liquid is sprayed in the same direction as the wire running direction (forward flow), the spraying direction will be in the forward direction, so there will be a difference in speed relative to the wire running speed. It is best to inject it. In the case of a forward direction nozzle arrangement of such a nozzle center wire traveling method or in the case of a counterflow nozzle arrangement, the effect is smaller than that of the jet nozzle method. This is because the plating liquid injected from the nozzle forms a laminar flow that is almost parallel to the wire surface, so the agitation of the plating liquid is poor, activation of the wire surface and ion diffusion of the plating liquid are small, and it is not as effective as the jet nozzle method. Although it is difficult to obtain sufficient effects,
It is much superior to the conventional immersion plating method. In the case of the above-mentioned nozzle-centered wire traveling method, a pair of pipe-shaped nozzles 10' are arranged symmetrically opposite each other as shown in FIG. 6 in relation to the jetting direction of the plating liquid and the number of nozzles. A modified method is possible in which the wire 1 is run and the plating liquid 8 is sprayed in intersecting directions. In this case, the plating liquid is injected at high speed from each nozzle, and a completely turbulent flow (turbulent region 16) occurs at the part where the laminar region 15 of the opposing flow (downstream nozzle) and forward flow (upstream nozzle) collide, and the wire An instantaneous exchange of plating liquid is achieved over the entire circumference of the surface. As the ejected flows in both directions collide in this manner, the impact force activates the wire surface, and the generated turbulence increases the ion diffusion of the plating solution, resulting in high-speed and efficient plating. However, in the case of the nozzle-centered wire running system, it is necessary to provide a gap in the nozzle for the wire to pass through smoothly. is likely to intervene, so compared to the jet nozzle method, the plating efficiency tends to be lower than that of the jet nozzle method, or the plating efficiency tends to decrease due to oxidation of the wire base and deterioration of the plating solution. Since the wire runs in a narrow gap, the precipitated metal copper may grow on the nozzle end and cause flaws in the wire, so this point must be kept in mind. Furthermore, depending on the state of the nozzle arrangement, the injected plating liquid may reach a long distance and turn into mist, which may worsen the environment. Next, regarding the impact pressure of the plating liquid on the wire in each injection mode of the present invention, the higher the impact pressure is, the better, in order to achieve each effect of the above-mentioned injection, and 0.05
A value of Kg/ ^cm2 or higher is desirable. The higher the impact pressure, the better the plating adhesion. Depending on this impact pressure, the supply pressure, flow rate, etc. of the plating liquid by the pump are determined. Furthermore, when the present invention is applied to displacement copper plating such as welding wire, preferably CuSO ₄ .5H ₂ O is
A plating liquid having a specific gravity of <1.8 and a specific gravity of <1.8 is appropriately selected. This is because if the amount of CuSO ₄ .5H ₂ O is less than 5 g/l, the plating precipitation rate is too slow, and if the specific gravity is 1.8 or more, there is a risk of reprecipitation of dissolved salts. (Example) Next, an example of the present invention will be shown. Note that it goes without saying that the present invention is not limited only to this example. Example 1 In order to clarify the difference between the method of the present invention and the conventional method regarding displacement copper plating, displacement plating was carried out using the experimental method and conditions shown below. Note that the plating pre-treatment and post-plating treatment before and after plating were performed under the same conditions. The apparatus used in the experiment had the conventional apparatus configuration shown in FIG. 15, and a conventional immersion plating method (conventional method) was first performed. Thereafter, after draining the plating liquid from the plating bath 5 shown in the same figure, the nozzle 10' shown in FIG.
The nozzle center wire traveling method (method 1 of the present invention) was used as an example, and instead of the nozzle shown in FIG. Another example of the method of the present invention, the jet nozzle method (method 2 of the present invention), was carried out using a high-pressure pump. The experimental setting conditions for the conventional method and methods 1 and 2 of the present invention are shown in the following table.

[Table] (Note) * Length immersed in the plating liquid ** Length of the sprayed plating liquid in the wire direction The test wire to be plated is 2.0 which corresponds to JISYCW.
A steel wire of mmφ was used, and the plating liquid used had a specific gravity of 1.5.
Copper sulfate plating solution was used. The required plating time is the time during which the plating liquid is in contact with the above-mentioned plating liquid contact length l (substantially effective plating time), and the wire line speed (3
~250m/min) was calculated in l/L, and various settings were made by changing the wire running speed. The conventional method and methods 1 and 2 of the present invention were carried out under the above conditions, and the plating thickness was measured for the plating wire obtained when the plating time was changed, and the plating adhesion was measured for each plating measurement sample. The results are shown in Table 2, FIGS. 9 and 10. The plating adhesion was evaluated by winding the sample wire around its own radius as shown in Figure 11, and observing the peeling of the plating on the surface of the wound wire at a magnification of about 20 times. Evaluation was made at the appropriate judgment level. (Judgment level) ×× Peeling occurs in more than 15% of the visual field × 〃 8% 〃 △ 〃 4% 〃 〇 Traces of peeling are observed ◎ No defects

【table】

[Table] As is clear from Table 2 and Figure 9, both methods 1 and 2 of the present invention have a shorter plating time and better plating efficiency than the conventional method to obtain a predetermined plating thickness. In particular, method 2 of the present invention (jet nozzle method) is excellent and allows thick plating to be achieved within a short period of time. In addition, all of the methods of the present invention have excellent plating adhesion, and in particular, method 2 of the present invention allows plating with good adhesion up to a considerable plating thickness. Even with the conventional immersion plating method, the plating thickness is
If it is 0.1 to 0.2 μm, good adhesion can be obtained, but such thin plating is not desirable because it has poor rust resistance. Furthermore, since plating is a chemical reaction, the plating speed is naturally limited, but if a large diameter wire is plated and then drawn, the overall line speed can generally be increased. for example,
When plating with a large diameter of 4.0 to 8.0 mmφ, considering that the plating layer becomes thinner due to wire drawing, if the finished diameter is 1.0 to 2.0 mmφ, the plating thickness should be approximately 2 to 3 μm. be. In such cases, method 2 of the present invention is very advantageous. In the case of method 2 of the present invention, the plating adhesion cannot be said to be good as the plating thickness exceeds 2.4 μm, but if the plating thickness is less than this, the effective plating time is extremely short, 4 seconds or less. This enables efficient plating, and further thicker plating can be achieved by changing the shape and arrangement of the nozzle, the injection pressure of the plating liquid, the discharge flow rate, etc. Example 2 In the case of the method of the present invention, as described above, it is preferable that the impact pressure of the plating liquid on the wire be as high as possible from the viewpoint of improving plating adhesion. Therefore, the following experiment was conducted to investigate the relationship between impact pressure and plating adhesion. As shown in Fig. 12, when plating liquid is injected at a spray opening angle α from a nozzle placed a vertical distance a from the wire surface, the inclination angle of the spray center line with respect to the wire is θ (0 < θ < 90°). ), the impact pressure on the spray center line is f, and the spray cross-sectional area in the virtual plane on the vertical distance a from the nozzle to the wire surface is A (cm ² ), then the unit area impact pressure F (Kg/cm ² ) is: F=fy/A=f sinθ/A, the predetermined injection pressure is P (Kg/cm ² ), and the flow rate is Q.
(m ³ /sec), it can be expressed as follows. F=45.176CvCeQ√γ√Psinθ/A Where, Cυ: Flow velocity reduction coefficient in the atmosphere Ce: Impact reduction coefficient due to spray shape γ: Mass of unit volume of fluid (Kg/m ³ ) Note that Cυ and Ce are experimental As an example, Cυ changes depending on the vertical distance a from the nozzle to the wire surface when θ = 90°, as shown in the following table, and the plating liquid sprayed from the nozzle The flow velocity decreases due to air resistance.

[Table] In addition, Ce is the impact force attenuation coefficient determined by the spray cross-sectional shape and the spray opening angle α, and an example of the relationship is shown in the following table.

[Table] Now, in the above formula, the present invention method 2 of Example 1
per nozzle used, a=3.5cm, α=100°,
Set θ = 90°, A = 8 cm x 0.5 cm = 4 cm ² , keep the wire running speed constant, and vary the unit area impact pressure F by changing the injection pressure and flow rate as shown in Table 5. Then, substitution copper plating was carried out. In addition, the flow velocity attenuation coefficient Cυ in the atmosphere is calculated from the vertical distance a = 3.5 cm from the nozzle to the wire surface.
= 1, and the impact force attenuation coefficient Ce due to the spray shape was set to Ce = 0.87 based on the spray opening angle α = 100° for flat spray.

[Table] Each plating wire sample obtained in this example was examined for plating adhesion. In that case, the above-mentioned 10th
As is clear from the figure, the thicker the plating, the worse the plating adhesion. Therefore, in order to clarify the relationship between unit area impact pressure F and plating adhesion, a test was conducted on the side where the plating thickness was thicker. FIG. 13 shows the results of a test under the condition that the plating thickness was 2.4 μm. The evaluation criteria are the same as in the case of FIG. In Figure 13, the plating thickness is
It can be seen that even when the thickness is as large as 2.4 μm, the plating adhesion is not good when the unit area impact pressure F is 0.05 Kg/cm ² , but the plating adhesion can be improved as F becomes larger than this. . If the impact pressure F is less than this value, the plating is likely to peel off even though it is attached. For example, in the case of welding wire, the plating will peel off when the wire is fed, and shavings will accumulate inside the current-carrying tip, causing the wire to be fed. As the resistance increases, the conductivity deteriorates, causing practical problems. In addition, in the case of bead wire, the rubber and wire tend to separate due to tire vibrations, etc., and corrosive factors such as moisture that are blocked by the rubber come into contact with the wire, causing the wire to rust and deteriorate its durability. Therefore, it is undesirable. If we assume that F = 0 Kg/cm ² , the conditions will be the same as in the conventional immersion plating state, and as shown in the conventional method in Figure 10, such a thick plating thickness (2.4 μm) will increase over time. It is also difficult to obtain the same (see Fig. 9), and the plating adhesion is poor. As is clear from the above examples, in the present invention, the necessary plating can be completed instantly and it is possible to obtain a wire with excellent plating adhesion, but the plating liquid remains around the wire after plating. This will cause unnecessary metal copper to grow, so in order to prevent this, it is preferable to drain or clean the metal after plating as much as possible during the process, and immediately after plating, which is especially required for welding wire. A plating with good adhesion can be obtained. To give an example of this, in the case of the jet nozzle method shown in FIG. 1, a cleaning tank 6 is provided on the outlet side of the plating tank 5, and one or more similar nozzles 10' are arranged in the tank. If the wire is washed with jet water at a pressure, flow rate, etc. appropriate to the properties of the wire, and the wire is washed immediately after plating is completed, unnecessary growth of metal copper can be prevented. In addition, it has been confirmed in experiments that a predetermined plating adhesion can be obtained by washing with water within 3 seconds after spraying the final plating solution. In addition, when experiments were conducted under the following additional conditions, it was confirmed that similar effects could be obtained within such ranges. That is, the plating solution may contain various impurities from chemicals, wires, industrial water, equipment materials, etc., but it is desirable that the amount of these impurities be 5 g/or less. Impurities from chemicals (CuSO ₄ , FeSO ₄ , H ₂ SO ₄ ) include Ni, Pb, Zn, As, Mn,
These include Ti, Se, Hg, and various phosphates, nitrates, ammonium compounds, sulfates, and nitrogen compounds. Impurities from the wire include wire chemical components Mn, Si, Al, Ti, Cr, Ni, and surface deposits such as oils and fats. Impurities from industrial water include silicates such as Ca, Mg, Na, K, Fe, and Mn;
Inorganic compounds such as sulfates, chlorides, carbonates, bicarbonates and nitrates, silicates, sulfates, chlorides and nitrates of Al, or gases such as _O2 , _CO2 , _N2 . Impurities from equipment materials include those dissolved from equipment materials such as stainless steel, resin, and rubber. Further, the Fe ³⁺ content in the plating solution is preferably 50 g/or less. If this value is exceeded, the adhesion of plating tends to deteriorate, and it may be controlled to the above value by, for example, flowing an atmosphere for preventing oxidation. The Fe ³⁺ analysis method is based on JIS M 8853O-phenanthroline absorption spectrophotometry. The specific gravity of the plating liquid is 1.05 to 1.35 (20℃), and the viscosity is
1.30-3.50cp (20℃), PH is preferably 1.5 or less (20℃). Furthermore, as a wire, the tensile strength (TS)
Similar effects can be obtained even when applied to wires with a decarburization depth of 30 to 300 Kgf/mm ² or wires before plating where both the depth of decarburization and the depth of grain boundary oxidation are 0.50 mm or less. In addition, the length of the spray part L (the length of the wire that is directly hit by the spray liquid) and the length of the non-spray part L (the length of the wire that is not directly hit by the spray but is attached or immersed in the liquid) is calculated by the following formula: 0.005≦l/L+l It is desirable that the relationship satisfies ≦1. Note that L+l can be made as long as desired depending on the relationship between the amount of plating and the linear speed, but the same effect can be obtained as long as L+l≦200 m. In addition, although the above explanation mainly takes the case of displacement copper plating for welding wire as an example, it is not limited to displacement copper plating. A similar effect can be obtained if Furthermore, it goes without saying that welding wires may be not only solid wires but also flux-cored wires.Furthermore, welding wires are not limited to welding wires, but also furniture springs and cardboard fasteners that use bead wires or cutper coated wires. Needless to say, it can be applied to wire materials for various purposes such as gold, etc., and therefore, it can be applied to various shapes (circular, band-shaped, square, etc., as well as wire, hoop, pipe, etc.) and dimensions (0.2~ 6.4mm
φ), it can also be applied to wire material. Examples of materials include JIS Z 3312 (solid wire for mag welding of mild steel and high-strength steel), 3351 (wire for submerged arc welding of carbon steel and low alloy steel),
3316 (steel rods and wires for Teig welding of mild steel and low alloy steel), 3317 (solid wire for MAG welding of molybdenum steel and chromium molybdenum steel), JIS G 3502
(piano wire), 3505 (mild steel wire), 3506 (hard steel wire)
Examples include. (Effects of the Invention) As described in detail above, according to the present invention, displacement plating is performed instantly on the entire surface using the high-speed jet of plating liquid sprayed onto the running wire material or the pressure of the jet, thereby improving the adhesion. Since plating with excellent film thickness and uniform thickness can be obtained in a short time, there is no need for a long run like in conventional immersion plating, and it is economical because it can speed up the process without using more plating solution than necessary. especially
The above effect is remarkable in the case of plating with a film thickness of 0.2 μm or more. In particular, according to the method of spraying a jet jet of plating liquid in a direction that intersects with the direction in which the wire runs, the wire is run in a space where there is no plating liquid, which dramatically improves work efficiency, and the work environment is also good, so it is easy to maintain. Easy to manage. The present invention is particularly suitable for displacement copper plating of wire materials such as welding wires and bead wires.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing an example of a plating device for implementing the jet nozzle method which is one aspect of the present invention, FIG. 2 is an explanatory diagram showing the angle θ between the jetting direction from the nozzle and the wire running direction, Figures 3 and 4
The figure is an explanatory diagram showing the angle δ formed by the injection direction when there are two or three nozzles, and Figures 5 and 6 are nozzles and their arrangement for the nozzle center wire running system, which is an embodiment of the present invention. An explanatory diagram showing FIG. 7a,
b is a diagram showing an example of nozzle arrangement when the wire is run using turn rollers, a is a plan view, b is a side view, and FIG. 8 is a diagram showing an example of nozzle arrangement when the wire is run in a spiral shape. Explanatory diagram, Figure 9 and 1st
Figure 0 shows the invention method 1 (nozzle center wire running method)
Figure 11 shows the relationship between plating time, plating thickness, and plating adhesion between method 2 of the present invention (jet nozzle method) and conventional method (immersion plating method), and Fig. 11 shows the wire winding state used for determining plating adhesion. Explanatory diagrams, Figures 12a and 12b are diagrams illustrating how to determine the impact pressure of plating liquid injection in the present invention.
is a side view, b is a plan view, FIG. 13 is a diagram showing the relationship between unit area impact pressure and plating adhesion in the present invention, and FIGS. 14 to 16 are diagrams explaining the conventional plating method, FIG. 14 shows the case of electroplating, FIG. 15 shows the case of immersion plating, and FIG. 16 shows the state of the liquid around the wire. DESCRIPTION OF SYMBOLS 1... Line material (wire), 5... Plating tank, 6... Washing tank, 8... Plating liquid, 10... Jet nozzle, 1
0'... Pipe-shaped nozzle, 11, 13... Pump, 1
1'...pipe, 12...jet nozzle for water washing, 1
4... Turn roller, 15... Laminar region, 16... Turbulent region.

Claims (1)

[Scope of Claims] 1 A high-pressure pump is used to apply a specified displacement plating liquid from a nozzle to a wire material running in a suspended state at an impact pressure of 0.05 Kg/cm ² or more per unit area. A method for surface treatment of a wire material, characterized by spraying the surface of the wire material. 2. The method according to claim 1, wherein the injection is performed in a direction intersecting the running direction of the wire material. 3. The method according to claim 2, wherein the injection is performed such that the angle θ between the running direction of the wire material and the injection direction satisfies 0≦θ≦180°. 4. The method according to claim 2, wherein the injection is performed from two directions of the diameter of the wire material, and the injection is performed so that the angle between the two directions is approximately 180 degrees. 5. The method according to claim 2, wherein the injection is performed from three directions of the diameter of the wire material, and the angles formed by the three directions are approximately 120 degrees. 6. The method according to claim 1, wherein the injection is performed in a direction parallel to the running direction of the wire material. 7. The method according to claim 6, wherein the injection is performed at least in a direction opposite to the running direction of the wire material. 8. The method according to claim 7, wherein the injection is performed in a direction parallel to the running direction of the wire material and in a direction including both forward and reverse directions. 9. The displacement plating solution contains copper sulfate,
The method according to claim 1, wherein CuSO ₄ .5H ₂ O > 5 g/ and specific gravity < 1.8. 10. The method according to any one of claims 1 to 9, wherein the wire material is a welding wire.