JPH0545066B2 - - Google Patents
Info
- Publication number
- JPH0545066B2 JPH0545066B2 JP61105372A JP10537286A JPH0545066B2 JP H0545066 B2 JPH0545066 B2 JP H0545066B2 JP 61105372 A JP61105372 A JP 61105372A JP 10537286 A JP10537286 A JP 10537286A JP H0545066 B2 JPH0545066 B2 JP H0545066B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- outer frame
- horizontal
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体チツプを収容する中央凹みを
有するセラミツク基体と組合せて、前記基体内
の、半導体チツプと金属細線で接続される内部リ
ード部および、この内部リード部の外部への延長
体の外部リード部をもつ多数のリードが四角型の
外枠により一体に連結されたサーデイツプ（Cer
−DIP）型半導体装置用リードフレームに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention combines a ceramic base body having a central recess for accommodating a semiconductor chip, and an internal lead portion connected to the semiconductor chip within the base body by a thin metal wire. And a CerDip (Cerip) where a large number of leads having an external lead part which is an extension body of this internal lead part to the outside are connected together by a square outer frame.
-Relating to a lead frame for a DIP) type semiconductor device.
第２図ａは従来のサーデイツプ形半導体装置用
リードフレーム（サーデイツプ型リードフレーム
と略称する）の斜視図、同図ｂは側面図である。
これらの図において、半導体チツプを収容する中
央凹みを有するセラミツク基体（図示せず）の側
壁上面に配置される内部リード２と、その外方へ
の延長部の外部リード３とからなる多数のリード
１は、四角形の外枠８の一対の縦辺９によつて、
内部リード部を内側にして、外部リードの外端部
が一体に連結されている。なお、これらリードの
内部リード部２および、外枠８の横辺の中央部を
水平状態にし、両側の外部リード部はほぼ直角に
逆Ｕ字形に下方に曲げられている。
FIG. 2A is a perspective view of a conventional lead frame for a semiconductor device (hereinafter simply referred to as "Sardip type lead frame"), and FIG. 2B is a side view thereof.
In these figures, a large number of leads are shown, consisting of an inner lead 2 disposed on the top side wall of a ceramic substrate (not shown) having a central recess for accommodating a semiconductor chip, and an outer lead 3 extending outwardly from the inner lead 2. 1, by a pair of vertical sides 9 of a rectangular outer frame 8,
The outer ends of the outer leads are integrally connected with the inner lead portion facing inside. Note that the internal lead portions 2 of these leads and the central portions of the lateral sides of the outer frame 8 are in a horizontal state, and the external lead portions on both sides are bent downward at approximately right angles in an inverted U shape.
上記のような従来のサーデイツプ形リードフレ
ームにおいては、内部リード面と、外枠のリード
連結のない横辺の中央水平部とは同一平面上にあ
つて、前記内部リード部をセラミツク基体の側壁
上面に圧着する場合、または、この側壁上面にセ
ラミツクキヤツプを低融点ガラスで封止する場合
に、リードフレームの位置決め専用治具を用いて
位置合せを行う必要があつた。しかし、この治具
の精度はきびしいものが要求され、当然高価格と
なり、ひいては、パツケージ組立費用を増大させ
るという欠点があつた。
In the conventional ceramic base type lead frame as described above, the internal lead surface and the central horizontal part of the horizontal side of the outer frame with no lead connection are on the same plane, and the internal lead part is connected to the top surface of the side wall of the ceramic base. When crimping the lead frame, or when sealing the ceramic cap with low-melting glass on the upper surface of the side wall, it was necessary to align the lead frame using a jig dedicated to positioning the lead frame. However, this jig requires high precision and is naturally expensive, which has the disadvantage of increasing the cost of assembling the package.
上記問題点に対し本発明では、内部リード部と
外部リード部とからなる多数のリードを内側に置
いて一体に連結している四角形の外枠における、
前記リード連結部のない一対の横辺の中央部を、
前記内部リード部を水平にして両側の外部リード
部をほぼ直角に下方に逆Ｕ字形に曲げた場合の、
内部リードのリード面より一段下つた位置に置
き、かつ、この横辺の内側部に、このリードフレ
ームと組合せるセラミツク基体の外形の一部が嵌
まる凹部を設けて、この凹部にセラミツク基体の
一部を嵌合させることで正しい位置決めができる
ようにしている。
In order to solve the above problems, the present invention provides a rectangular outer frame in which a large number of leads consisting of an inner lead part and an outer lead part are placed inside and connected together.
The center part of the pair of horizontal sides without the lead connection part,
When the internal lead part is held horizontally and the external lead parts on both sides are bent downward at almost right angles into an inverted U shape,
A recess into which a part of the outer shape of the ceramic base to be combined with the lead frame fits is provided at a position one step below the lead surface of the internal lead and on the inside of this lateral side. Correct positioning is possible by partially fitting the parts.
つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.
第１図ａは本発明の一実施例の斜視図、同図ｂ
は側面図である。第１図ａ，ｂにおいて、内部リ
ード部２と外部リード部３とからなる多数のリー
ド１は、四角形の外枠４より一体に連結されてい
る。しかして、内部リード部２を水平にして、外
部リード部３は外枠の横辺６と共に両側にほぼ直
角に逆Ｕ字形に曲げられているが、外枠４の横辺
６の中央部は内部リード面より一段低い面、すな
わち、このリードフレームを組合せるセラミツク
基体の高さのほぼ1/2程度低い位置にある。さら
に、横辺６の内側面には、組合せるセラミツク基
体の外形の一部が嵌まる凹部７が設けられてい
る。よつて、セラミツク基体の外形の短辺部を凹
部７に嵌合させることにより正しい位置決めがで
きる。 FIG. 1a is a perspective view of an embodiment of the present invention, and FIG. 1b is a perspective view of an embodiment of the present invention.
is a side view. In FIGS. 1a and 1b, a large number of leads 1 consisting of an inner lead part 2 and an outer lead part 3 are integrally connected by a rectangular outer frame 4. As shown in FIGS. Thus, with the inner lead part 2 horizontal, the outer lead part 3 is bent into an inverted U shape at right angles to both sides along with the horizontal sides 6 of the outer frame 4, but the central part of the horizontal sides 6 of the outer frame 4 is It is located one step lower than the internal lead surface, that is, at a position approximately 1/2 lower than the height of the ceramic substrate to which this lead frame is assembled. Furthermore, a recess 7 is provided on the inner surface of the lateral side 6, into which a part of the outer shape of the ceramic substrate to be combined is fitted. Therefore, correct positioning can be achieved by fitting the short side of the ceramic base into the recess 7.
以上説明したように本発明は、サーデイツプ形
リードフレーム外枠の横辺をセラミツク基体の位
置決めのできる構造としていることにより、セラ
ミツク基体へのリードフレーム圧着、またはセラ
ミツクキヤツプを封止する際に、専用治具を不要
とする効果がある。また、リードフレーム圧着精
度またはキヤツプ封止精度を向上させる効果もあ
る。
As explained above, the present invention has a structure that allows the positioning of the ceramic substrate on the side sides of the outer frame of the ceramic substrate. This has the effect of eliminating the need for jigs. It also has the effect of improving lead frame crimping accuracy or cap sealing accuracy.
第１図ａ，ｂは、本発明のリードフレームの斜
視図、及び側面図、第２図ａ，ｂは従来のリード
フレームの斜視図及び側面図である。
１……リード、２……内部リード部、３……外
部リード部、４，８……外枠、５，９……外枠縦
辺、６，１０……外枠横辺、７……凹み。
1A and 1B are a perspective view and a side view of a lead frame of the present invention, and FIGS. 2A and 2B are a perspective view and a side view of a conventional lead frame. 1... Lead, 2... Internal lead part, 3... External lead part, 4, 8... Outer frame, 5, 9... Vertical side of outer frame, 6, 10... Horizontal side of outer frame, 7... dent.
Claims (1)
端側が一体に連結され、前記外枠の内側にある内
端部が自由端となつている多数のリードを有し、
かつ、このリードの内端側の内部リード部を中に
し、外端側の外部リード部を前記外枠の横辺と共
に逆Ｕ字形に折曲げた形のサーデイツプ型半導体
装置用リードフレームにおいて、前記外枠横辺の
水平部の面が前記内部リード面より一段下つた位
置にあり、かつ、この横辺水平部の内側部に、こ
のリードフレームの取付けられるセラミツク基体
の外形が嵌まる凹部が設けられていることを特徴
とするサーデイツプ型半導体装置用リードフレー
ム。1. It has a large number of leads whose outer ends are integrally connected by a pair of opposing vertical sides of a rectangular outer frame, and whose inner ends located inside the outer frame are free ends,
Further, in the lead frame for a deep dip type semiconductor device, the inner lead portion on the inner end side of the lead is inside and the outer lead portion on the outer end side is bent into an inverted U-shape together with the horizontal side of the outer frame. The surface of the horizontal part of the horizontal side of the outer frame is located at a position one step lower than the inner lead surface, and a recess into which the outer shape of the ceramic base to which the lead frame is attached is provided is provided inside the horizontal part of the horizontal side. A lead frame for a deep dip type semiconductor device, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61105372A JPS62261163A (en) | 1986-05-07 | 1986-05-07 | Lead frame for cerdip type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61105372A JPS62261163A (en) | 1986-05-07 | 1986-05-07 | Lead frame for cerdip type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62261163A JPS62261163A (en) | 1987-11-13 |
| JPH0545066B2 true JPH0545066B2 (en) | 1993-07-08 |
Family
ID=14405866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61105372A Granted JPS62261163A (en) | 1986-05-07 | 1986-05-07 | Lead frame for cerdip type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62261163A (en) |
-
1986
- 1986-05-07 JP JP61105372A patent/JPS62261163A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62261163A (en) | 1987-11-13 |
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