JPH0545128B2 - - Google Patents
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- Publication number
- JPH0545128B2 JPH0545128B2 JP6813185A JP6813185A JPH0545128B2 JP H0545128 B2 JPH0545128 B2 JP H0545128B2 JP 6813185 A JP6813185 A JP 6813185A JP 6813185 A JP6813185 A JP 6813185A JP H0545128 B2 JPH0545128 B2 JP H0545128B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- temperature
- evaporation
- solid material
- period
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010894 electron beam technology Methods 0.000 claims description 13
- 239000011343 solid material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000009529 body temperature measurement Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 description 48
- 238000001704 evaporation Methods 0.000 description 22
- 230000008020 evaporation Effects 0.000 description 21
- 239000013078 crystal Substances 0.000 description 19
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000010355 oscillation Effects 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 238000005162 X-ray Laue diffraction Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/30—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of the effect of a material on X-radiation, gamma radiation or particle radiation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
【発明の詳細な説明】
[技術分野]
本発明は、真空中で固体材料の結晶成長を行つ
たり、蒸発させたりする場合に、固体材料の温度
を正確に計測する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for accurately measuring the temperature of a solid material when crystal growth or evaporation of the solid material is performed in a vacuum.
[従来技術]
従来、真空中での固体材料(以下基板と呼ぶ)
の結晶成長や蒸発においては、基板の表面温度を
計測するために熱電対やパイロメータが用いられ
ていた。以下、図面を参照して説明する。第2図
は、結晶成長や蒸発の装置の概略構成図であり、
1は基板、2は基板1を保持する基板ホルダ、3
は基板1を加熱するヒータ、4は熱電対、5はパ
イロメータ、6はパイロメータ用ののぞき窓、7
は結晶成長用材料のセル、8はそれぞれのセル7
のシヤツタ、9は真空槽である。[Prior art] Conventionally, solid materials in vacuum (hereinafter referred to as substrates)
During crystal growth and evaporation, thermocouples and pyrometers were used to measure the surface temperature of the substrate. This will be explained below with reference to the drawings. Figure 2 is a schematic diagram of the crystal growth and evaporation equipment.
1 is a substrate, 2 is a substrate holder that holds the substrate 1, 3
is a heater that heats the substrate 1, 4 is a thermocouple, 5 is a pyrometer, 6 is a pyrometer viewing window, 7
is the cell of crystal growth material, 8 is each cell 7
9 is a vacuum chamber.
基板1上に結晶を成長させるにあたり、基板1
の温度を成長前および成長中に正確に知る必要が
あるが、従来の熱電対またはパイロメータによる
方法では正確な値を得るのが困難であつた。まず
前者の熱電対の場合には、その動作原理から、正
確な値を求めるためには、熱電対先端の二種金属
融合部分が基板温度と一致しなければならない
が、そのためには当該部分を充分に良好な熱接触
状態で基板1もしくは基板ホルダ2に接触させね
ばならない。真空状態での良好な熱接触はネジ止
め等により実現されるが、その場合には、基板ホ
ルダ2の着脱に多大の手間がかかり、しかも、基
板ホルダ2を真空中で回転等させることが不可能
となる。結晶成長において、一様な成長層を得る
ためには、基板1の回転が極めて有力な手段であ
るが、熱電対を良好に熱接触させようとすると、
基板の回転技術と両立しない。一方、熱電対を基
板ホルダ2に接触させずに温度測定を行うと、真
空中であるために気体を介しての熱伝導が全く存
在せず、放射熱による伝導のみで基板ホルダ2と
の熱接触が行われるため熱電対の温度は基板ホル
ダ2の温度と大きく異なり±50℃以上の誤差を生
じることもある。 When growing crystals on the substrate 1, the substrate 1
It is necessary to accurately know the temperature before and during growth, but it has been difficult to obtain accurate values using conventional methods using thermocouples or pyrometers. First of all, in the case of the former type of thermocouple, due to its operating principle, in order to obtain an accurate value, the temperature of the two-metal fusion part at the tip of the thermocouple must match the substrate temperature. It must be brought into contact with the substrate 1 or the substrate holder 2 with sufficiently good thermal contact. Good thermal contact in a vacuum state can be achieved by screwing, etc., but in that case, it takes a lot of effort to attach and detach the substrate holder 2, and it is not necessary to rotate the substrate holder 2 in a vacuum. It becomes possible. In crystal growth, rotation of the substrate 1 is an extremely effective means to obtain a uniform growth layer, but if you try to make good thermal contact with the thermocouple,
Incompatible with substrate rotation technology. On the other hand, if the temperature is measured without bringing the thermocouple into contact with the substrate holder 2, there is no heat conduction through the gas because it is in a vacuum, and the heat transfer between the substrate holder 2 and the substrate holder 2 is caused only by conduction by radiant heat. Since contact is made, the temperature of the thermocouple is significantly different from the temperature of the substrate holder 2, and may cause an error of ±50° C. or more.
さらにまた、真空槽9に設けた窓からパイロメ
ータ5によつて基板1の表面温度を隔測する方法
は、結晶成長に伴なうのぞき窓6の汚れの影響を
大きく受ける。その汚れ具合によつては温度計測
が不能となる場合も多い。更には結晶表面からの
赤外線放射率が知られていないと正確な温度計測
を望めないにもかかわらず、成長した薄膜の赤外
線放射率の詳細な値そのものが未知である場合も
多い。 Furthermore, the method of remotely measuring the surface temperature of the substrate 1 using the pyrometer 5 through a window provided in the vacuum chamber 9 is greatly affected by dirt on the viewing window 6 due to crystal growth. Depending on how dirty it is, temperature measurement is often impossible. Furthermore, although accurate temperature measurement cannot be expected unless the infrared emissivity from the crystal surface is known, the detailed value of the infrared emissivity of the grown thin film itself is often unknown.
以上の理由により、従来技術では、基板温度を
正確に安定して求めることは不可能であつた。 For the above reasons, it has been impossible to accurately and stably determine the substrate temperature using the conventional techniques.
[発明の目的]
そこで、本発明の目的は、上述のような欠点を
取り除き、基板温度をより正確に再現性よく安定
に計測する方法を提供することにある。[Object of the Invention] Therefore, an object of the present invention is to eliminate the above-mentioned drawbacks and provide a method for stably measuring the substrate temperature more accurately and with good reproducibility.
[発明の構成]
かかる目的を達成するために、本発明は、電子
線を固体材料の表面に入射させ、固体材料の表面
で反射、回折あるいは散乱された電子線の強度の
時間変化あるいは固体材料に流れる吸収電流の時
間変化の周期を検出し、その周期から固体材料の
表面温度を求めることを特徴とする。[Structure of the Invention] In order to achieve the above object, the present invention makes an electron beam incident on the surface of a solid material, and changes over time the intensity of the electron beam reflected, diffracted, or scattered on the surface of the solid material, or It is characterized by detecting the period of time change of the absorbed current flowing through the sensor and determining the surface temperature of the solid material from the period.
[実施例]
以下に図面を参照して本発明を詳細に説明す
る。[Example] The present invention will be described in detail below with reference to the drawings.
第1図は本発明を実施する測定装置の構成の一
例を示す。この装置では、第2図の真空槽9に電
子銃10および蛍光スクリーン12を付加して設
ける。あるいはまた、電子増倍管18を蛍光スク
リーン12と併設またはその代わりに設けること
もできる。更に、電子銃10より出射されて基板
1の表面に入射する入射電子線11によりこの基
板1に流れる電流を計測する電流計22を蛍光ス
クリーン12および電子増倍管18と併設または
それらの代わりに設けることもできる。蛍光スク
リーン12を設けたときには、その前面にカメラ
またはレンズ13を配設し、カメラまたはレンズ
13の後方には光フアイバ15の一端を固定した
X−Yステージ14を配設する。光フアイバ15
の他端には光検出器16を配置する。電子増倍管
18を設けるときには、その出力電流を電流計1
9により計測する。光検出器16および電流計1
9および22の出力のうちの一つまたは複数をレ
コーダ17により記録することができる。レコー
ダ17の代わりに又はこれと併用してA−D変換
器20およびコンピユータ21の系列を設けるこ
ともできる。 FIG. 1 shows an example of the configuration of a measuring device implementing the present invention. In this apparatus, an electron gun 10 and a fluorescent screen 12 are additionally provided in the vacuum chamber 9 shown in FIG. Alternatively, the electron multiplier 18 can be provided alongside or in place of the fluorescent screen 12. Further, an ammeter 22 for measuring the current flowing through the substrate 1 due to the incident electron beam 11 emitted from the electron gun 10 and incident on the surface of the substrate 1 is installed alongside the fluorescent screen 12 and the electron multiplier 18 or instead of them. It is also possible to provide one. When the fluorescent screen 12 is provided, a camera or lens 13 is provided in front thereof, and an XY stage 14 to which one end of an optical fiber 15 is fixed is provided behind the camera or lens 13. optical fiber 15
A photodetector 16 is arranged at the other end. When installing the electron multiplier tube 18, its output current is measured by the ammeter 1.
Measure according to 9. Photodetector 16 and ammeter 1
One or more of the outputs 9 and 22 can be recorded by the recorder 17. A series of A/D converters 20 and computers 21 can also be provided instead of or in conjunction with the recorder 17.
以下、固体材料の基板1の材料として、GaAs
結晶を選んだ場合について説明する。また、第1
図に示した装置としては蛍光スクリーン12を用
いたものを例にとる。 Below, GaAs is used as the material for the solid material substrate 1.
Let us explain the case where crystals are selected. Also, the first
The device shown in the figure uses a fluorescent screen 12 as an example.
GaAs基板上に結晶を成長させるためには、基
板を約400℃以上に加熱する必要がある。半導体
レーザなどのデバイスを作るためには約700℃程
度の温度で結晶を成長させるのが最もよいとされ
ている。このような温度を測定するために、本発
明では、次のような方法を用いる。まず、電子線
10からの入射電子線11は基板表面で反射、回
折または散乱を受け、反射電子線および適当な回
折方向を得た回折電子線は蛍光スクリーン12上
にそれぞれ点像を映出する。これら点像をカメラ
またはレンズ13でX−Yステージ14上に結像
させ、そのうちの一点をX−Yステージ14から
光フアイバ15を介して光検出器16に供給す
る。光検出器16の出力の時間変化をレコーダ1
7により観察し、記録することができる。 In order to grow crystals on a GaAs substrate, it is necessary to heat the substrate to approximately 400°C or higher. To make devices such as semiconductor lasers, it is said that it is best to grow crystals at a temperature of about 700°C. In order to measure such temperature, the following method is used in the present invention. First, the incident electron beam 11 from the electron beam 10 is reflected, diffracted, or scattered on the substrate surface, and the reflected electron beam and the diffracted electron beam with appropriate diffraction directions project point images on the fluorescent screen 12. . These point images are formed on an X-Y stage 14 by a camera or lens 13, and one of the points is supplied from the X-Y stage 14 to a photodetector 16 via an optical fiber 15. The recorder 1 records the time change in the output of the photodetector 16.
7 can be observed and recorded.
基板1の温度を750℃とし、常にAsの分子線を
当てた状態で、回折像のうち強度の最も強い正反
射と0次ラウエ点が重なつたスペキユラ・スポツ
トと呼ばれる点の強度の時間変化を第3図に示
す。 Temporal change in intensity at a point called the specular spot, where the specular reflection with the highest intensity and the 0th-order Laue point overlap in the diffraction image, with the temperature of the substrate 1 set at 750°C and the As molecular beam always applied. is shown in Figure 3.
スペキユラ・スポツトの強度が成長時に振動す
ることは特願昭59−169125号(結晶成長膜厚制御
法および混晶組成比決定法)で知られているが、
成長停止後も時間的に振動しているのが分かる。
この成長停止後の振動の周期と基板温度との関係
を第4図の曲線Aに示す。この結果は、Asの分
子線の量が、分子線を横切る形で設置した真空計
により等価的に圧力として計測した値で4.8×
10-4Paのときのものである。この図から明らか
なように、振動の周期より逆に温度を知ることが
できる。コンピユータに第4図の特性曲線Aの結
果を記憶しておき、振動の周期をコンピユータに
より計測した場合、記憶結果と実測の周期との比
較をこのコンピユータによつて行なわせることに
より自動的に温度を計測できることはもちろんで
ある。この振動の1周期は、基板が1層(Gaと
Asの原子層の対を1つとして数えた層)蒸発す
るのに対応している。 It is known from Japanese Patent Application No. 59-169125 (Crystal Growth Film Thickness Control Method and Mixed Crystal Composition Ratio Determination Method) that the intensity of specular spots oscillates during growth.
It can be seen that it oscillates over time even after growth has stopped.
Curve A in FIG. 4 shows the relationship between the period of oscillation and the substrate temperature after the growth is stopped. This result shows that the amount of As molecular beam is equivalently measured as pressure by a vacuum gauge installed across the molecular beam, which is 4.8×
This is when the temperature was 10 -4 Pa. As is clear from this figure, temperature can be determined inversely from the period of vibration. When the results of the characteristic curve A in Figure 4 are stored in a computer and the period of vibration is measured by the computer, the computer automatically compares the stored results with the measured period and automatically adjusts the temperature. Of course, it is possible to measure One period of this oscillation consists of one layer of substrate (Ga and
(a layer in which a pair of As atomic layers is counted as one layer) corresponds to evaporation.
このことは、次のようにして知ることができ
る。まず、GaAsが蒸発する温度でも蒸発が殆ど
見られないAlAsをGaAsの基板上に充分厚く成長
させておく。次に、その上にGaAsをNd層成長
させる。その成長を停止した後の蒸発による振動
を観測すると、Ns回の振動ののち、振動現象が
生じなくなる。これは、Nd層のGaAsがすべて
蒸発し、AlAsの層が露出したためと考えられる
が、このときNsがNdと一致すれば、蒸発による
1回の振動がGaAs1層の蒸発に完全に対応して
いることになる。第5図の曲線aに成長層数Nd
が10のときの、結晶成長時の振動と蒸発時の振動
を示す。図より明らかなように、この場合はNd
とNsは完全に一致する。第6図は多数回の同様
の実験で求められたNdとNsとの関係を示す。図
からNsはNdと一致するか、あるいはたとえ異な
つてもたかだか1であることがわかる。この図に
示された点のなかで、NdとNsが一致しないもの
は、第5図の曲線aに示されているスペキユラ・
スポツトの強度変化において、Gaのシヤツタを
開放した時に生じる強度の減少が著しく、そのた
めに通常生ずる振動の第一周期の形が大きく崩れ
たことによる。このような場合を第5図の曲線b
に対して?印で示した。その補正を行つて正し
く、成長原子層の層数を求めれば、その値はNS
に一致する。以上のことから、Nsは蒸発した原
子層の層数に一致することが知れる。 This can be known as follows. First, AlAs, which hardly evaporates even at the temperature at which GaAs evaporates, is grown sufficiently thickly on a GaAs substrate. Next, a GaAs Nd layer is grown thereon. If we observe the oscillations caused by evaporation after the growth has stopped, the oscillation phenomenon will no longer occur after Ns oscillations. This is thought to be because all the GaAs in the Nd layer has evaporated and the AlAs layer has been exposed, but if Ns matches Nd at this time, one vibration due to evaporation will completely correspond to the evaporation of one GaAs layer. There will be. Curve a in Figure 5 shows the number of growth layers Nd
The vibrations during crystal growth and evaporation are shown when is 10. As is clear from the figure, in this case Nd
and Ns match perfectly. FIG. 6 shows the relationship between Nd and Ns obtained through a number of similar experiments. From the figure, it can be seen that Ns is the same as Nd, or even if they are different, it is at most 1. Among the points shown in this figure, those where Nd and Ns do not match are the specular points shown in curve a in Figure 5.
This is because the intensity change of the spot was markedly reduced when the Ga shutter was opened, and as a result, the shape of the normally occurring first period of vibration was greatly disrupted. In such a case, curve b in Figure 5
Against? Indicated with a mark. If the correct number of growth atomic layers is determined by correcting this, the value is NS
matches. From the above, it is known that Ns corresponds to the number of evaporated atomic layers.
したがつて、この事実を利用すれば、蒸発速度
から基板温度を知ることができる。第4図の曲線
Bには、第4図の曲線Aから得られた、基板温度
と蒸発速度との関係が示されている。この蒸発速
度は、Asの分子線の量が等価圧で4.8×10-4Paの
ときに測定されたものであり、As圧を変えると
蒸発速度も変わる。Asの分子線の量が等価圧で
8×10-5Paとした場合の実測例を第4図の点C
で示した。しかし、この蒸発速度と温度との関係
は、装置の構造に全く依らないため、何らかの方
法で正確に測定した基板温度と、蒸発速度との関
係を、種々のAsの分子線量のもとで求めておけ
ば、異なる装置の中での異なる状態の基板の温度
も正確に測定できる。更に基板温度の10度の上昇
に対して蒸発速度は70%程度もの増加が見られる
ため、極めて精密な温度測定値を算出することが
できる。 Therefore, by utilizing this fact, the substrate temperature can be determined from the evaporation rate. Curve B in FIG. 4 shows the relationship between substrate temperature and evaporation rate obtained from curve A in FIG. This evaporation rate was measured when the amount of As molecular beam was at an equivalent pressure of 4.8×10 -4 Pa, and changing the As pressure also changes the evaporation rate. An actual measurement example when the amount of As molecular beam is 8×10 -5 Pa in equivalent pressure is shown at point C in Figure 4.
It was shown in However, since this relationship between evaporation rate and temperature does not depend on the structure of the device, the relationship between the evaporation rate and the substrate temperature, which is accurately measured by some method, must be determined under various As molecular doses. By doing so, it is possible to accurately measure the temperature of substrates in different states in different devices. Furthermore, the evaporation rate increases by about 70% for a 10 degree rise in substrate temperature, making it possible to calculate extremely accurate temperature measurements.
以上では、回折像の中からスペキユラ・スポツ
トを取り出して温度を求めているが、蛍光スクリ
ーン12上のすべての点が、基板の蒸発時には強
度の時間変化を示し、その振動周期は1層の蒸発
時間に対応するため、いずれの点の振動周期を計
測対象としてもよい。さらにまた、基板を流れる
吸収電流においても同様の振動が存在することが
知られているため、電流計22を用いて振動を観
測してもよい。いずれの振動現象を採用する場合
においても、測定の対象は周期のみであるので、
スペキユラ・スポツトによる較正曲線を全く何ら
の変更もなしに利用できる。更に、蛍光スクリー
ン12から光検出器16に到る系統を用いる代わ
りに電子増倍管18と電流計19を利用して反射
または回折または散乱電子強度の時間変化を測定
することによつても同様の振動観測ができること
は言うまでもない。 In the above, the temperature is determined by extracting the specular spots from the diffraction image, but all the points on the fluorescent screen 12 show a time change in intensity during the evaporation of the substrate, and the oscillation period is the same as that of one layer of evaporation. In order to correspond to time, the vibration period at any point may be measured. Furthermore, since it is known that similar vibrations exist in the absorbed current flowing through the substrate, the vibrations may be observed using the ammeter 22. No matter which vibration phenomenon is used, the only object to be measured is the period.
The calibration curve from Specular Spot can be used without any modification whatsoever. Furthermore, instead of using the system from the fluorescent screen 12 to the photodetector 16, an electron multiplier 18 and an ammeter 19 may be used to measure the time change in reflected, diffracted, or scattered electron intensity. Needless to say, it is possible to observe the vibrations of
また、本発明の測定法はGaAsを基板とする場
合にのみ限られず、蒸発による電子線回折像の振
動現象が観測されるならば、いかなる固体材料に
も応用可能である。 Further, the measurement method of the present invention is not limited to the case where GaAs is used as a substrate, but can be applied to any solid material as long as the vibration phenomenon of the electron beam diffraction image due to evaporation can be observed.
[効果]
本発明による温度計測法によれば、非常に精度
高く温度を測定できるので、結晶の成長条件の詳
細な制御を大幅に容易にする。本発明が利用して
いる現象は基板表面の温度に直接依存する現象な
ので、基板ホルダ近傍の種々の温度不均一の影響
を受けないため、信頼性および安定性に秀れた測
定値を得ることができる。更にまた、得られる測
定値は、装置に依存する因子がなく、また振動の
観測対象として反射、回折または散乱電子線や吸
収電流のいずれを用いたか、またはどの回折電子
線を用いたかにも依存しないので、測定値は測定
の不遍性および客観性にも秀れている。[Effects] According to the temperature measurement method according to the present invention, temperature can be measured with very high accuracy, so detailed control of crystal growth conditions is greatly facilitated. Since the phenomenon used in the present invention is directly dependent on the temperature of the substrate surface, it is not affected by various temperature non-uniformities in the vicinity of the substrate holder, so it is possible to obtain measurement values with excellent reliability and stability. I can do it. Furthermore, the measured values obtained are independent of the equipment and are also dependent on whether reflection, diffraction, or scattered electron beams or absorption currents are used as the object of vibration observation, or which diffracted electron beams are used. Therefore, the measured values are excellent in uniformity and objectivity.
本発明により得られる高精度かつ高安定度の温
度測定値は、半導体レーザをはじめとする多くの
デバイスをばらつきなく生産するために、非常に
有用である。しかもまた、結晶成長中に結晶の再
蒸発が一切許されない種類のデバイスがあつたと
しても、成長の最初の段階で必ず行われる基板加
熱による表面清浄化の過程では、本発明計測法を
応用することができ、それによつて再現性および
長時間安定性に乏しい熱電対、パイロメータ等に
対して温度測定の較正を行えるので、本発明を応
用する効果は多大である。 The highly accurate and highly stable temperature measurement obtained by the present invention is extremely useful for producing many devices including semiconductor lasers without variation. Moreover, even if there is a type of device that does not allow any re-evaporation of the crystal during crystal growth, the measurement method of the present invention can be applied in the surface cleaning process by heating the substrate, which is always performed at the initial stage of growth. As a result, temperature measurement can be calibrated for thermocouples, pyrometers, etc., which have poor reproducibility and long-term stability, so the effects of applying the present invention are great.
第1図は本発明を実施するのに用いる測定装置
の構成の一例を示す構成図、第2図は従来の測定
装置の一例を示す構成図、第3図はスペキユラ・
スポツトの強度の時間変化の実測例を示す図、第
4図は振動数と基板温度との関係および蒸発速度
と基板温度との関係を示す特性図、第5図は結晶
成長時および蒸発時のスペキユラ・スポツトの強
度の時間変化を示す図、第6図は成長層数Ndと
蒸発によつて生じた振動の回数Nsとの関係を示
す特性図である。
1……基板、2……基板ホルダ、3……基板加
熱用ヒータ、4……熱電対、5……パイロメー
タ、6……のぞき窓、7……結晶成長用材料のセ
ル、8……セルのシヤツタ、9……真空槽、10
……電子銃、11……入射電子線、12……蛍光
スクリーン、13……レンズ、14……X−Yス
テージ、15……光フアイバ、16……光検出
器、17……レコーダ、18……電子増倍管、1
9……電流計、20……A−D変換器、21……
コンピユータ、22……電流計。
Fig. 1 is a block diagram showing an example of the structure of a measuring device used to carry out the present invention, Fig. 2 is a block diagram showing an example of a conventional measuring device, and Fig. 3 is a block diagram showing an example of a conventional measuring device.
Figure 4 shows an actual measurement example of the change in spot intensity over time. Figure 4 is a characteristic diagram showing the relationship between vibration frequency and substrate temperature and the relationship between evaporation rate and substrate temperature. Figure 5 is a graph showing the relationship between crystal growth and evaporation. FIG. 6 is a diagram showing the temporal change in the intensity of specular spots, and is a characteristic diagram showing the relationship between the number of grown layers Nd and the number of vibrations Ns caused by evaporation. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Substrate holder, 3... Heater for heating the substrate, 4... Thermocouple, 5... Pyrometer, 6... Peephole, 7... Cell for crystal growth material, 8... Cell Shutter, 9... Vacuum chamber, 10
... Electron gun, 11 ... Incident electron beam, 12 ... Fluorescent screen, 13 ... Lens, 14 ... X-Y stage, 15 ... Optical fiber, 16 ... Photodetector, 17 ... Recorder, 18 ...electron multiplier tube, 1
9... Ammeter, 20... A-D converter, 21...
Computer, 22...Ammeter.
Claims (1)
体材料の表面で反射、回折あるいは散乱された電
子線の強度の時間変化あるいは固体材料に流れる
吸収電流の時間変化の周期を検出し、その周期か
ら前記固体材料の表面温度を求めることを特徴と
する表面温度計測法。1. An electron beam is made incident on the surface of a solid material, and the period of the time change in the intensity of the electron beam reflected, diffracted, or scattered on the surface of the solid material or the time change of the absorbed current flowing through the solid material is detected, and the period is determined. A surface temperature measurement method characterized in that the surface temperature of the solid material is determined from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6813185A JPS61225625A (en) | 1985-03-29 | 1985-03-29 | Surface temperature measurement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6813185A JPS61225625A (en) | 1985-03-29 | 1985-03-29 | Surface temperature measurement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61225625A JPS61225625A (en) | 1986-10-07 |
| JPH0545128B2 true JPH0545128B2 (en) | 1993-07-08 |
Family
ID=13364878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6813185A Granted JPS61225625A (en) | 1985-03-29 | 1985-03-29 | Surface temperature measurement |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61225625A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007327766A (en) * | 2006-06-06 | 2007-12-20 | Central Res Inst Of Electric Power Ind | Temperature measuring device, temperature measuring method, and electron microscope |
| JP2012018937A (en) * | 2011-10-11 | 2012-01-26 | Central Res Inst Of Electric Power Ind | Temperature measurement device, temperature measurement method and electron microscope |
-
1985
- 1985-03-29 JP JP6813185A patent/JPS61225625A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007327766A (en) * | 2006-06-06 | 2007-12-20 | Central Res Inst Of Electric Power Ind | Temperature measuring device, temperature measuring method, and electron microscope |
| JP2012018937A (en) * | 2011-10-11 | 2012-01-26 | Central Res Inst Of Electric Power Ind | Temperature measurement device, temperature measurement method and electron microscope |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61225625A (en) | 1986-10-07 |
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