JPH05461B2 - - Google Patents
Info
- Publication number
- JPH05461B2 JPH05461B2 JP1261127A JP26112789A JPH05461B2 JP H05461 B2 JPH05461 B2 JP H05461B2 JP 1261127 A JP1261127 A JP 1261127A JP 26112789 A JP26112789 A JP 26112789A JP H05461 B2 JPH05461 B2 JP H05461B2
- Authority
- JP
- Japan
- Prior art keywords
- foil
- capacitance
- less
- cathode foil
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- ing And Chemical Polishing (AREA)
Description
産業上の利用分野
この発明は電解コンデンサ陰極箔用アルミニウ
ム合金に関する。
従来の技術
アルミニウム電解コンデンサの静電容量を増大
してその性能を向上させるためには、陽極用アル
ミニウム箔のみならず陰極箔の静電容量も増大さ
せる必要がある。
このため一般に、陰極箔に化学的あるいは電気
化学的エツチング処理を施して実効面積を拡大し
単位体積当りの静電容量の増大を図ることが行わ
れており、さらに、このエツチング特性を改善す
べく陰極箔の材料組成の面からの研究がなされて
いる。そのようなエツチング特性を改善した陰極
箔として、従来、Cuを0.1〜0.5wt%程度添加含有
したアルミニウム合金陰極箔が知られている(例
えば特開昭56−133444号、特開昭62−149858号)。
発明が解決しようとする課題
ところが、Cuを含有した陰極箔を電解コンデ
ンサに用いると、箔中のCuが析出して洩れ電流
が増え、甚しくはコンデンサ本体の破損を引起こ
す場合があるという問題を生ずることが判明し
た。
この発明は、かかる事情に鑑みてなされたもの
であつて、高静電容量を保有するものでありなが
らもコンデンサに用いた場合の洩れ電流の増大が
破損を生じない陰極箔となしうる電解コンデンサ
陰極箔用アルミニウム合金の提供を目的とする。
課題を解決するための手段
上記目的を達成するために、この発明に係る陰
極箔用アルミニウム合金は、Ni:0.001〜0.005wt
%、Fe:0.05〜0.2wt%、Si:0.1wt%以下を含有
し、不可避不純物としてTi:0.0015wt%以下、
Cu、Mn、Mg、Cr、Zn、V、B:各0.005wt%
以下にそれらの含有量が規制され、残部がアルミ
ニウム及び前記以外の不可避不純物からなること
を特徴とする。
上記において、Niは、表面積拡大のためのエ
ツチング処理においてエツチング開始点を増大さ
せ、それにより拡面率の向上ひいては静電容量の
増大に寄与するものである。しかし、0.001wt%
(10ppm)未満の含有量ではその効果に乏しく、
逆に0.005wt%(50ppm)を超えると過度の表面
溶解により拡面率の向上を妨げ結果的に静電容量
の増大が図れなくなるとともに、腐食減量が多く
なつて機械的強度の低下をもたらす。
Feもまた、Niと同様にエツチング開始点を増
大して静電容量の増大に寄与するものである。し
かし、その含有量が0.05wt%(500ppm)未満で
は上記効果に乏しく、逆に0.2wt%(2000ppm)
を超えるとアルミニウム箔焼鈍後の結晶組織にお
ける立方体方位の結晶生成を抑制してエツチング
ピツトの成長を妨げ、静電容量を低下させる。
Feの特に好ましい含有量は0.05〜0.15wt%であ
る。
Siはエツチングの均一性と安定性に寄与するも
のであるが、0.1wt%(1000ppm)を超えるとそ
の効果がなく表面溶解量が多くなつて静電容量が
低下する。従つて0.1wt%以下の範囲で含有され
なければならず、好ましくは0.05wt%以下の範囲
で含有するのが良い。
上記各必須元素の他、エツチング特性の向上元
素として任意的にGa0.005〜0.02wt%(50〜
200ppm)を含有せしめても良い。
不可避不純物としてのMn、Mg、Cr、Zn、V、
Bはこれらが多量に含有されるとエツチング特性
が劣化して過度の表面溶解を招き静電容量が低下
する。従つてMn、Mg、Cr、Zn、V、Bはそれ
ぞれ0.005wt%(50ppm)以下に含有量が規制さ
れなければならない。特に好ましくは0.003wt%
以下に規制されるのが良い。同じく不可避不純物
としてのTiも静電容量の増大に対してその妨げ
となるため可及的減ずるのが望ましい。しかし、
0.0015wt%(15ppm)以下の範囲であればその弊
害が少ないため、Tiは0.0015wt%以下の範囲で
その含有が許容される。また不可避不純物として
のCuは、これが多量に含有されると電解コンデ
ンサに用いた場合に析出して洩れ電流の増加やコ
ンデンサ本体の破壊の危険があることから、かか
る危険のない0.005wt%(50ppm)以下に規制さ
れなければならなず、好ましくは0.002wt%以下
に規制されるのが良い。
この発明に係るアルミニウム合金の電解コンデ
ンサ陰極箔への製造は常法に従つて行えば良く、
例えばアルミニウム溶湯から縦型または横型の半
連続鋳造法によりスラブを鋳造したのち、このス
ラブを熱間圧延、冷間圧延さらに箔圧延により厚
さ30〜60μm程度の箔とすれば良い。こうして製
造した箔は、一般的には焼鈍処理により軟化させ
たのち電気化学的あるいは化学的エツチング処理
を施して箔表面の実効面積を拡大し電解コンデン
サ陰極箔とする。
発明の効果
この発明に係る電解コンデンサ陰極箔用アルミ
ニウム合金によれば、後述の実施例の参酌によつ
ても明らかなように、Cuを実質的に含まないも
のでありながらも大きな静電容量を有する陰極箔
の提供が可能となる。しかも、Cuを実質的に含
まないことにより、該陰極箔を電解コンデンサに
使用した場合にも従来のような洩れ電流の増大、
コンデンサの破損の危険を回避しうる。
実施例
次にこの発明の実施例を説明する。
下記第1表に示される成分量に調整されたアル
ミニウム溶湯から半連続鋳造法によりスラブを鋳
造し、これに常法による熱間圧延、冷間圧延、更
に箔圧延を施して厚さ50μmの箔を製作した。次
にこの箔に焼鈍処理を施して軟化させた後、これ
を7%塩酸、0.2%リン酸及び0.2%硝酸からなる
温度55℃±1℃の混合水溶液中に浸漬し、電流密
度60A/dm2の交流電流を通じて135秒間エツチ
ングを行い、陰極箔とした。
上記により得た各陰極箔につき、5%ホウ酸及
び5%クエン酸の混合水溶液(温度30℃)中に浸
漬し、交流万能ブリツジにて静電容量を測定し
た。その結果を同じく第1表に示す。
INDUSTRIAL APPLICATION FIELD This invention relates to an aluminum alloy for electrolytic capacitor cathode foil. Prior Art In order to increase the capacitance of an aluminum electrolytic capacitor and improve its performance, it is necessary to increase the capacitance of not only the anode aluminum foil but also the cathode foil. For this reason, the cathode foil is generally subjected to chemical or electrochemical etching treatment to expand the effective area and increase the capacitance per unit volume. Research has been conducted on the material composition of cathode foils. Aluminum alloy cathode foils containing approximately 0.1 to 0.5 wt% of Cu have been known as cathode foils with improved etching properties (e.g., JP-A-56-133444, JP-A-62-149858). issue). Problems to be Solved by the Invention However, when a cathode foil containing Cu is used in an electrolytic capacitor, the Cu in the foil may precipitate, increasing leakage current and even causing damage to the capacitor body. It was found that this occurs. The present invention has been made in view of the above circumstances, and provides an electrolytic capacitor that can be used as a cathode foil that does not cause damage due to increased leakage current when used in a capacitor, even though it has a high capacitance. The purpose is to provide an aluminum alloy for cathode foil. Means for Solving the Problems In order to achieve the above object, an aluminum alloy for cathode foil according to the present invention has a Ni content of 0.001 to 0.005wt.
%, Fe: 0.05 to 0.2wt%, Si: 0.1wt% or less, and Ti: 0.0015wt% or less as unavoidable impurities.
Cu, Mn, Mg, Cr, Zn, V, B: 0.005wt% each
The content thereof is regulated as follows, and the remainder consists of aluminum and other unavoidable impurities. In the above, Ni increases the etching starting point in the etching process for increasing the surface area, thereby contributing to an improvement in the area enlargement ratio and thus an increase in the capacitance. However, 0.001wt%
If the content is less than (10ppm), the effect will be poor,
On the other hand, if it exceeds 0.005 wt% (50 ppm), excessive surface dissolution prevents the improvement of the area expansion ratio, resulting in an inability to increase the capacitance, and increases corrosion loss, resulting in a decrease in mechanical strength. Like Ni, Fe also increases the etching starting point and contributes to increasing the capacitance. However, if the content is less than 0.05wt% (500ppm), the above effects will be poor;
If it exceeds this value, the formation of cube-oriented crystals in the crystal structure after annealing the aluminum foil is suppressed, the growth of etching pits is hindered, and the capacitance is reduced.
A particularly preferable content of Fe is 0.05 to 0.15 wt%. Si contributes to the uniformity and stability of etching, but if it exceeds 0.1 wt% (1000 ppm), it has no effect and the amount dissolved on the surface increases, resulting in a decrease in capacitance. Therefore, it must be contained in a range of 0.1 wt% or less, preferably 0.05 wt% or less. In addition to the above essential elements, Ga0.005~0.02wt% (50~
200ppm) may be included. Mn, Mg, Cr, Zn, V as inevitable impurities,
If a large amount of B is contained, the etching properties will deteriorate, resulting in excessive surface dissolution and a decrease in capacitance. Therefore, the content of each of Mn, Mg, Cr, Zn, V, and B must be regulated to 0.005 wt% (50 ppm) or less. Particularly preferably 0.003wt%
It is good to be regulated as follows. Similarly, Ti, which is an unavoidable impurity, also hinders the increase in capacitance, so it is desirable to reduce it as much as possible. but,
Ti content is allowed within a range of 0.0015 wt% or less because its harmful effects are small if it is within a range of 0.0015 wt% (15 ppm) or less. In addition, Cu is an unavoidable impurity, and if it is used in an electrolytic capacitor, if it is contained in a large amount, there is a danger that it will precipitate and increase leakage current or destroy the capacitor body. ) must be regulated below, preferably below 0.002wt%. The production of the aluminum alloy electrolytic capacitor cathode foil according to the present invention may be carried out according to a conventional method.
For example, after casting a slab from molten aluminum by a vertical or horizontal semi-continuous casting method, this slab may be hot-rolled, cold-rolled, and foil-rolled into a foil having a thickness of about 30 to 60 μm. The foil thus produced is generally softened by annealing and then electrochemically or chemically etched to enlarge the effective area of the foil surface, thereby forming an electrolytic capacitor cathode foil. Effects of the Invention According to the aluminum alloy for electrolytic capacitor cathode foil according to the present invention, as is clear from consideration of the examples described later, it has a large capacitance even though it does not substantially contain Cu. It becomes possible to provide a cathode foil having Moreover, since it does not substantially contain Cu, even when the cathode foil is used in an electrolytic capacitor, there is no increase in leakage current as in the conventional case.
The risk of damage to the capacitor can be avoided. Examples Next, examples of the present invention will be described. A slab is cast by a semi-continuous casting method from molten aluminum whose component amounts are adjusted to the content shown in Table 1 below, and then hot rolled, cold rolled, and then foil rolled by conventional methods to obtain a 50 μm thick foil. was produced. Next, this foil was annealed to soften it, and then immersed in a mixed aqueous solution of 7% hydrochloric acid, 0.2% phosphoric acid, and 0.2% nitric acid at a temperature of 55°C ± 1°C, with a current density of 60A/d. Etching was performed for 135 seconds using an alternating current of 2 to form a cathode foil. Each of the cathode foils obtained above was immersed in a mixed aqueous solution of 5% boric acid and 5% citric acid (temperature: 30°C), and the capacitance was measured using an AC universal bridge. The results are also shown in Table 1.
【表】
第1表に示される結果から明らなように、この
発明の合金によれば、それにより製造される陰極
箔の静電容量を、Cuの含有量を極めて低く抑え
つつも、非常に高いものにすることができること
を確認しえた。[Table] As is clear from the results shown in Table 1, according to the alloy of the present invention, the capacitance of the cathode foil manufactured using the alloy can be extremely reduced while keeping the Cu content extremely low. I was able to confirm that it can be made even higher.
Claims (1)
Si:0.1wt%以下を含有し、不可避不純物として
Ti:0.0015wt%以下、Cu、Mn、Mg、Cr、Zn、
V、B:各0.005wt%以下にそれらの含有量が規
制され、残部がアルミニウム及び前記以外の不可
避不純物からなることを特徴とする電解コンデン
サ陰極箔用アルミニウム合金。1 Ni: 0.001-0.005wt%, Fe: 0.05-0.2wt%,
Si: Contains 0.1wt% or less, as an unavoidable impurity
Ti: 0.0015wt% or less, Cu, Mn, Mg, Cr, Zn,
V, B: An aluminum alloy for electrolytic capacitor cathode foil, characterized in that their contents are regulated to 0.005 wt% or less, and the remainder consists of aluminum and other unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26112789A JPH03122239A (en) | 1989-10-05 | 1989-10-05 | Aluminum alloy for cathode foil of electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26112789A JPH03122239A (en) | 1989-10-05 | 1989-10-05 | Aluminum alloy for cathode foil of electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03122239A JPH03122239A (en) | 1991-05-24 |
| JPH05461B2 true JPH05461B2 (en) | 1993-01-06 |
Family
ID=17357474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26112789A Granted JPH03122239A (en) | 1989-10-05 | 1989-10-05 | Aluminum alloy for cathode foil of electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03122239A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2878487B2 (en) * | 1991-07-09 | 1999-04-05 | 昭和アルミニウム株式会社 | Aluminum alloy for cathode foil of electrolytic capacitor |
| JP2007058110A (en) | 2005-08-26 | 2007-03-08 | Fuji Electric Device Technology Co Ltd | Method for producing electrophotographic photoreceptor and electrophotographic photoreceptor |
| JP2008150692A (en) * | 2006-12-20 | 2008-07-03 | Mitsubishi Alum Co Ltd | Aluminum material for electrolytic capacitor electrode |
| JP4827103B2 (en) * | 2007-08-10 | 2011-11-30 | 三菱アルミニウム株式会社 | Method for producing aluminum foil for electrolytic capacitor electrode |
| JP5396156B2 (en) * | 2009-05-28 | 2014-01-22 | 三菱アルミニウム株式会社 | Aluminum alloy foil for electrolytic capacitor cathode and method for producing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5395265A (en) * | 1977-01-31 | 1978-08-21 | Mitsubishi Keikinzoku Kogyo | Aluminum anode foil for electrolytic capacitor and method of making same |
| JPS57110646A (en) * | 1980-12-26 | 1982-07-09 | Sumitomo Alum Smelt Co Ltd | High-purity aluminum alloy foil for anode of electrolytic capacitor |
| JPS63290239A (en) * | 1987-05-22 | 1988-11-28 | Toyo Alum Kk | Aluminum alloy foil for cathode of electrolytic condenser |
-
1989
- 1989-10-05 JP JP26112789A patent/JPH03122239A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03122239A (en) | 1991-05-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |