JPH0546720B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a delivery technique, in particular a technique for delivering an article so as to accommodate it in a container, for example,
In the manufacturing of semiconductor devices, semiconductor devices (hereinafter referred to as
It is called IC. ) in a cleaning container.

[Background technology]

In the manufacture of semiconductor devices, when cleaning an IC before forming a solder layer on the IC lead frame,
There are cases where the IC is housed in a cleaning jig, but
In such a case, the inventor of the present invention has revealed that if the IC is transferred to the jig manually, it takes time, resulting in a decrease in productivity.

[Purpose of the invention]

An object of the present invention is to automatically and accurately transfer a semiconductor device removably mounted on a carrier and housed in a magazine to a cleaning jig without damaging the semiconductor device. The objective is to provide a delivery device.

Another object of the present invention is to transfer the semiconductor devices from the magazine to the cleaning jig without changing the posture or hand direction of the semiconductor devices, thereby eliminating the need for aligning the semiconductor devices in the subsequent process. An object of the present invention is to provide a delivery device that can improve productivity.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the delivery device of the present invention includes first and second tables arranged in parallel, a beam constructed so as to cross over the first and second tables, and a first and second table arranged in parallel. A delivery section consisting of a suction head suspended from a beam so as to be movable in parallel between the tables, and a plurality of carriers disposed at one end of the first table and housing a plurality of carriers on which a plurality of semiconductor devices are removably mounted. A magazine is placed on the first table, and by moving the magazine vertically and in a horizontal direction intersecting the longitudinal direction of the first table,
a loader section that positions the magazine with respect to the table and moves the carrier in the magazine in and out of the first table; By supporting a plurality of cleaning jigs equipped with holding grooves for individually holding semiconductor devices, and moving these cleaning jigs vertically and in a horizontal direction intersecting the longitudinal direction of the second table, The carrier includes a plurality of relief holes for individually holding a plurality of semiconductor devices, and a pair of relief holes protruding around each of the relief holes. The second table of the delivery section includes a pin that fits into the semiconductor device and a plurality of small transport holes used for the transport operation of the carrier, and the second table of the delivery section includes a pin that fits into the semiconductor device and a second table that is held by a suction head and is moved in parallel from the first table. a guide groove for guiding the semiconductor device toward the cleaning jig; a guide recess carved in the center of the second table in the moving direction of the semiconductor device; and a guide groove located within the guide recess. a pusher that feeds the semiconductor device into the holding groove in the cleaning jig along the same line, and an unloader unit that detects the position of the holding groove in the cleaning jig and aligns the holding groove with the guide groove. The structure includes a photosensor for controlling the positioning operation of the cleaning jig.

〔Example〕

FIG. 1 is a perspective view showing a delivery device that is an embodiment of the present invention, FIG. 2 is a schematic perspective view for explaining its operation, FIG. 3 is a plan view showing an IC, and FIG.
The figure is a partially cutaway front view, FIG. 5 is a plan view showing the carrier, FIG. 6 is a partial sectional view taken along the - line in FIG. 1, and FIGS. 7, 8, 9, and 10. These are partially omitted partial cross-sectional views for explaining the operation.

In this embodiment, this delivery device includes a loader section 1 that takes out a carrier carrying an IC as an article to be delivered from a magazine and delivers it to a delivery section 2, and a container for cleaning the IC from the delivery section 2. It is provided with an unloader part 3 that is received within the tool.

As shown in FIGS. 3 and 4, the IC 4 as an article to be delivered is equipped with a package 5, and the package 5 has a heat sink 6 on its upper surface.
is installed protrudingly. The package 5 is fixed to the lead frame 7 via a sealing glass 8,
Small holes 9 for positioning are provided at the four corners of the lead frame 7.
are drilled in each.

As shown in FIG. 5, the carrier 10 is formed into a substantially rectangular plate body, and has a plurality of relief holes 11 as holding portions arranged at equal intervals in the longitudinal direction. A small hole 12 for transporting the carrier itself is bored on both sides in the width direction of each relief hole 11, and a pair of positioning pins 13 are provided at positions 45 degrees apart from each other in the small hole 12. They are each drilled so that the small holes 9 of the holes 9 can be inserted thereinto.

In manufacturing a semiconductor device, the IC 4 is placed on the carrier 10 with the heat sink 6 facing upward at each relief hole 11, and is positioned and held by fitting each small positioning hole 9 to each pin 13. Hereinafter, the carrier 10 holding the IC4 upward in this manner will be referred to as a real carrier 10a, and the carrier 10 not holding the IC4 will be referred to as an empty carrier 10b.

A plurality of carriers 10 are arranged horizontally in a shelf-like manner and accommodated in a magazine. Hereinafter, the magazine that accommodates the real carrier 10a will be referred to as an actual magazine 14a, and the magazine that accommodates the empty carrier 10b that does not hold the IC4 will be referred to as an empty magazine 14b.

The real magazines 14a are sequentially supplied to the loader section 1, and the loader section 1 delivers the real carriers 10a one by one from the real magazines 14a to the delivery section 2, and transfers the empty carriers from which IC4 has been delivered. 10b to the original magazine. Further, the loader section 1 is configured to be filled with empty carriers 10b and send out the empty magazines 14b to another location.

The unloader section 3 is equipped with pitch feeding devices 17 that hold a plurality of cleaning jigs 15 at the top, bottom, left and right. The cleaning jig 15 is formed in the shape of a substantially rectangular parallelepiped box with one side open, and a plurality of holding grooves 16 are formed on the inner surface of a pair of side walls so that a plurality of ICs 4 can be arranged and held in a shelf-like manner. They are arranged and engraved facing each other.

The delivery section 2 is interposed between the loader section 1 and the unloader section 3, and includes a carrier feeding table 18 (first table). This table 18 is configured to pitch the actual carrier 10a supplied from the loader section 1 by appropriate means (not shown).

On one side of the table 18, a guide table 19 (second table) serving as a guide for guiding the IC 4 is installed approximately parallel to the table 18.
Guide grooves 20 are provided on both sides of the unloader section 3 side end of the guide table 19 so as to slidably hold and guide both side edge portions of the lead frame 7 in the IC 4 . Guide groove 20
A photo sensor 21 is disposed facing the unloader section 3, and this photo sensor 21 is connected to the feeding device 1.
The holding groove 16 on the inner surface of the cleaning jig 15 that is pitch-fed in the vertical direction by the cleaning jig 7 is detected. This photosensor 21 is linked to a feeding device 17, which allows the feeding device 17 to align the holding groove 16 of the cleaning jig 15 accurately with the guide groove 20.

On the approximate center line of the upper surface of the guide table 19,
A guide recess 22 is opened in a direction perpendicular to the unloader part 3, and a pusher 23 is installed in this recess 22.
are slidably fitted. The pusher 23 is configured to be reciprocated by a drive device 24 such as a cylinder device, and is configured to push the IC 4 on the guide table 19 toward the unloader section 3 during the forward movement. Therefore, the pusher 23 substantially constitutes a carrying means for carrying the IC 4 into the cleaning jig 15.

A beam 25 is installed in the transfer section 2 so as to cross above the table 18 and the guide table 19, and a suction head 26 is attached to the beam 25.
is connected to both tables 18 by suitable means (not shown).
and 19, and is also moved up and down. Therefore, the suction head 26 suction-holds the IC 4 and transfers it from the table 18 onto the guide table 19 for delivery.

Next, the effect will be explained.

In the transfer section 2, the actual carrier 10a of the actual magazine 14a is supplied from the loader section 1 to a predetermined position on the table 18, and when it is positioned by an appropriate positioning means (not shown), as shown in FIG. Then, the suction head 26 installed on the beam 25 descends and picks up the actual carrier 10a located directly below.
The upper surface of the package 5 in the upper IC 4 will be attracted.

When the IC4 is held by suction, the suction head 26 rises, moves to the guide table 19, and descends, as shown in FIG.
Translated above.

When the transfer is completed, as shown in FIG.
Return to the specified position.

On the other hand, when the IC 4 is transferred to the guide table 19, the pusher 23 is moved in the direction of the unloader section 3 by the drive device 24, so that the IC 4 slides on the guide table 19 as shown in FIG. You will be moved.

As the pusher 23 moves forward, as shown in FIG.
The IC 4 is transferred to the holding groove 16 of the cleaning jig 15 through the cleaning jig 15, and the IC 4 is carried into the cleaning jig 15. At this time, the guide groove 20 and the holding groove 16 are accurately aligned due to the cooperation between the photosensor 21 and the feeding device 17, so the guide table 19 of the IC 4
The transfer from the cleaning jig 15 to the cleaning jig 15 is carried out smoothly.

When the carrying-in operation is completed, the pusher 23 is retracted by the drive device 24, as shown in FIG. Further, the feeding device 17 is operated and the cleaning jig 15 is raised by one pitch of the holding groove 16. At this time, the photosensor 21 detects the holding groove 16, thereby ensuring alignment between the guide groove 20 and the holding groove 16.

On the other hand, in the carrier feed table 18,
The real carrier 10a is sent by one pitch of IC4,
The next IC 4 is located directly below the suction head 26.

Thereafter, the operation of transferring the IC 4 to the cleaning jig 15 is continued by repeating the above operations.

When one cleaning jig 15 is filled with the IC 4 in the unloader section 3, the feeding device 17 of the unloader section feeds the jig 15 horizontally and moves the next jig 15 to face the guide table 19. urge

On the other hand, the empty carrier 10b, which has become empty after discharging the IC 4, is collected by the loader section 3, and returned to the original real magazine 14a in the loader section 1. Also,
In the loader section 1, when the real carrier 10a is exhausted and only the empty carrier 10b remains, the empty magazine 14b is sent to another location, and the real carrier 10a is supplied to the delivery section 2 from the next real magazine 14a. .

〔effect〕

(1) Pull out the carrier loaded with semiconductor devices from the magazine to the first table, hold the semiconductor devices on the carrier individually by the suction head of the transfer section and move them parallel to the second table, and then The semiconductor device is moved to the holding groove in the cleaning jig by the guide groove and the pusher provided on the second table, and the holding groove of the cleaning jig and the guide groove of the second table are connected to the photosensor. Therefore, accurate matching is always possible, and the semiconductor devices can be precisely and automatically placed in the cleaning jig without causing damage to the multiple semiconductor devices stored in the magazine while mounted on the carrier. can be delivered to.

(2) Since the semiconductor device is moved in parallel from the inside of the magazine in the loader section to the cleaning jig in the unloader section 3, the posture and hand direction may change due to rotational displacement of the semiconductor device during transportation, for example. never changes. Therefore, for example, the operation of aligning the semiconductor devices when transferring them from a cleaning jig to a subsequent marking or packaging process can be omitted, improving productivity.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a delivery device that is an embodiment of the present invention, FIG. 2 is a schematic perspective view for explaining its operation, FIG. 3 is a plan view showing an IC, and FIG.
The figure is a partially cutaway front view, FIG. 5 is a plan view showing the carrier, FIG. 6 is a partial sectional view taken along the line of FIG. 1, and FIGS. 7, 8, 9, and 10 are FIG. 3 is a partially omitted partial cross-sectional view for explaining the operation thereof. 1...Loader section, 2...Delivery section, 3...Unloader section, 4...IC (article to be delivered), 5...
... Package cage, 6 ... Heat sink, 7 ... Lead frame, 8 ... Sealing glass, 9 ... Positioning hole, 10 ... Carrier, 10a ... Actual carrier,
10b...Sky carrier, 11...Escape hole, 12...
...Conveyance hole, 13...Pin, 14a...Real magazine, 14b...Empty magazine, 15...Cleaning jig (container), 16...Holding groove, 17...Cleaning jig (container) feed Device, 18... Carrier feed table, 19... Guide table, 20... Guide groove, 21... Photo sensor, 22... Guide recess,
23... pusher, 24... drive device, 25...
Beam, 26...Suction head.

Claims (1)

[Scope of Claims] 1. First and second tables arranged in parallel, a beam constructed to cross over the first and second tables, and the first and second tables. a transfer section consisting of a suction head suspended from the beam so as to be movable in parallel between the two; and a plurality of carriers disposed at one end of the first table and housing a plurality of carriers on which a plurality of semiconductor devices are removably mounted. By moving the magazine vertically and in a horizontal direction intersecting the longitudinal direction of the first table, the magazine is positioned relative to the first table, and the magazine in the magazine is moved. a loader section for loading and unloading the carrier onto the first table; and a loader section arranged to face the loader section with the first and second tables interposed therebetween, and individually holding the semiconductor devices therein. The cleaning of the second table is performed by supporting a plurality of cleaning jigs provided with holding grooves and moving these cleaning jigs in the vertical direction and in the horizontal direction intersecting the longitudinal direction of the second table. The carrier includes a plurality of relief holes for individually holding the plurality of semiconductor devices, and a pair of relief holes protruding around each of the relief holes to hold the semiconductor devices. a pin that fits into the carrier, and a plurality of transport small holes used for the transport operation of the carrier; a guide groove for guiding the moved semiconductor device toward the cleaning jig; a guide recess carved in the center of the second table in the moving direction of the semiconductor device; a pusher that detects the position of the holding groove in the cleaning jig and moves the semiconductor device along the guide groove into the holding groove in the cleaning jig; and a photosensor for controlling a positioning operation of the cleaning jig by the unloader section so that the cleaning jig and the cleaning jig are aligned with each other and the guide groove.