JPH0548873B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a high-frequency heating device for a nuclear fusion device.

[Technical background of the invention]

Figure 8 shows the schematic configuration of the nuclear fusion device.
In the figure, 1 is a torus-shaped vacuum container that confines plasma 2 therein.

A blanket 3 is integrally formed inside the vacuum vessel 1 so as to surround the plasma 2. Inside the blanket 3, lithium as a tritium breeding material is contained, and a coolant flow path for cooling the lithium is provided.

The blanket 3 reacts high-energy neutrons emitted from the plasma 2 with lithium to generate tritium, and the thermal energy generated at this time is transferred to the outside via the coolant flowing in the coolant flow path. taken out.

A toroidal coil 4 provided in the toroidal direction of the vacuum container 1 , a main poloidal coil 5 provided in the poloidal direction of the vacuum container 1 , a sub-poloidal coil 6 , and a magnetic limiter coil 7 are provided around the vacuum container 1 . The poloidal coils 5 and 6 constitute a magnetic field generating coil. In addition, the magnetic limiter coil 7
is for controlling the shape of plasma 2 within vacuum vessel 1.

The coils 4, 5, 6, 7 and the vacuum container 1 are placed on a pedestal 8. The frame 8 is provided with a center support 9 that vertically passes through the center of the vacuum container 1, and a current transformer coil 10 is wound around the center support 9. The current transformer coil 10 generates a magnetic field inside the vacuum container 1 by passing a high voltage through the magnetic field generating coils (coils 4, 5, 6). Plasma 2 in vacuum container 1
is heated by the electric field generated by the magnetic field and reaches a high temperature.

A shield 11 is provided on the outer peripheral surface of the vacuum container 1 so as to surround the vacuum container 1 to prevent radiation from leaking to the outside.

A high frequency heating device 12 is arranged around the vacuum container 1 . This high frequency heating device 12 has a ninth
As shown in the figure, high frequency heating is performed via waveguide bundles 13 provided at multiple locations on the outer peripheral surface of the vacuum vessel 1 to further heat the plasma 2 or drive plasma current.

The front end of the high-frequency heating device 12 faces the plasma 2 and receives a high heat load from the plasma 2. Therefore, it is necessary to cool the waveguide bundle 13.

As shown in FIG. 10, the waveguide bundle 13 is cooled by making the wall of a part of the waveguide 14 thick and embedding a cooling pipe 15 therein, and by circulating a cooling medium through the cooling pipe 15. This is done by letting Note that there are also panels 16 in which cooling pipes 15 are embedded in the upper and lower surfaces and the intermediate portion of the waveguide bundle 13, respectively.
is arranged to prevent the waveguide bundle 13 from being heated. The cooling pipe 15 is disposed over the entire length of the waveguide bundle 13, and cooling of the waveguide bundle 13 is performed under the same conditions over the entire length.

On the other hand, the production of the waveguide bundle 13 requires a large number of waveguides 1
4 are bundled, the waveguides 14 are heated to a brazing temperature, and a brazing material is poured between each waveguide 14 to integrate them.

[Problems with background technology]

In the above-described high-frequency heating device, the waveguide 14
Since the waveguide bundle 13 is cooled by embedding the cooling pipe 15 therein, the waveguide 14 needs to be thick enough to embed the cooling pipe 15 therein.

In addition, since cooling is performed under the same conditions over the entire length of the waveguide bundle 13, it is necessary to set the cooling conditions based on the front end where the heat load is maximum, and as a result, a large amount of cooling medium is required. It is necessary to distribute it to

Furthermore, since the waveguide bundle 13 is manufactured by brazing, the waveguide 14 must be heated to the brazing temperature, which requires an expensive heating device and takes a long time to manufacture. It takes time.

Another problem is that even if the cooling pipe should break near the center of the waveguide bundle 13, only the broken part cannot be replaced.

[Purpose of the invention]

The present invention was made to solve these problems, and its purpose is to reduce the wall thickness of the waveguide and efficiently cool the waveguide bundle with a small amount of cooling medium. Another object of the present invention is to provide a high-frequency heating device for a nuclear fusion device, in which a waveguide bundle can be manufactured in a short time and at low cost, and a part of the cooling piping for cooling the waveguide bundle can be replaced.

[Summary of the invention]

To achieve the above object, the high frequency heating device of the present invention includes a cylindrical case, a front end shielding panel having a plurality of waveguide communication holes and shielding the front end of the cylindrical case, and a plurality of waveguides. one or more partition panels each having an insertion hole and partitioning the interior space of the cylindrical case into a plurality of sections in the longitudinal direction; and one or more partition panels having insertion holes that are inserted into the waveguide insertion hole and having an inner hole in the waveguide insertion hole. a plurality of waveguides whose respective tips are connected to the front end shielding panel; and a tip cooling channel for circulating a cooling medium between the front end shielding panel and an adjacent partition panel in the cylindrical case. and a rear cooling channel structure that allows a cooling medium to flow through the space after the partition panel adjacent to the front end shielding panel in the cylindrical case.

That is, by inserting a plurality of waveguides into the waveguide insertion holes provided in the partition panel, the plurality of waveguides are supported, and the internal space of the cylindrical cover is divided into a plurality of spaces in the longitudinal direction by the partition panel. The waveguide bundle has a structure in which the cooling medium is divided into sections and flows through a separate flow path for each section.

[Embodiments of the invention]

First, a first embodiment of the present invention is shown in FIGS. 1 to 6.

1 to 5 show a waveguide bundle 21 of a high-frequency heating device, and its configuration is as follows.

The front end of the rectangular cylindrical case 22 is a front end shielding panel 2.
3, and the inside of the case 22 is divided into multiple sections in the longitudinal direction by a plurality of partition panels 24a, 24b, and 24c (here, the partition panel 2
The space divided by 4a, 24b, 24c,
A first space 25a, a second space 25b, a third space 25c, and a fourth space 25d are defined from the tip side. ).

The front end shielding panel 23 is provided with a plurality of waveguide communication holes (square holes) 26 arranged in a matrix in both directions. Moreover, each partition panel 24a, 24b,
24c, a plurality of waveguide insertion holes (square holes) 27 are provided vertically and horizontally in a matrix (see FIGS. 2 to 5). And each waveguide insertion hole 27
Each tubular waveguide 28 is inserted through. Note that the shape and dimensions of the waveguide insertion hole 27 are set to be substantially the same as the shape and dimensions of the outer cross section of the waveguide 28. The tip of each waveguide 28 is connected to the front end shielding panel 23 by electron beam welding from the front with its inner hole aligned with the waveguide communication hole 26.

Coolant flow holes 29a and 29b are provided at the four corners of the most advanced partition panel 24a. A coolant supply pipe 30a and a coolant outflow pipe 30b, which are disposed through the second and subsequent partition panels 24b and 24c, are fitted into each of the circulation holes 29a and 29b, and are connected by welding. The pipes 30a and 30b constitute a tip cooling medium flow path structure.

Further, the second partition panel 24b includes the cooling medium supply pipe 30a and the cooling medium outflow pipe 30.
Coolant flow holes 31a and 31a are provided at the inner positions of b, respectively.
31b is provided. And each communication hole 31
a, 31b, the third partition panel 24b,
Cooling medium supply pipe 3 arranged to penetrate through 24c
2a and the coolant outflow pipe 32b are fitted and connected by welding, and these pipes 32a and 32b constitute a rear first coolant flow path structure.

Furthermore, the third partition panel 24c includes the cooling medium supply pipe 32a and the cooling medium outflow pipe 3.
Coolant flow holes 33 are provided at the inner positions of 2b, respectively.
a, 33b are provided. And each flow hole 3
A cooling medium supply pipe 34a and a cooling medium outflow pipe 34b are fitted into the cooling medium supply pipes 3a and 33b and are welded together, and these pipes 34a and 34b constitute a rear second cooling medium flow path structure.

As shown in FIG. 3, the most advanced partition panel 24a has small panels 24a1, 24a2, . It is connected by welding.

In manufacturing the above waveguide bundle 21,
Small panels 24a1, 24a as shown in FIG.
A structure is prepared in advance in which one waveguide 28 is inserted into each of 2... and connected by electron beam welding.

And these other partition panels 24b, 2
4c into the case 22, and further incorporate the coolant supply pipes 30a, 32a, 34a and the coolant outflow pipes 30b, 32b, 34b.

Therefore, the small panels 24a1, 24a2... are connected from the front by electron beam welding, and then the front end shielding panel 23 is connected to the front end of the cover 22 by electron beam welding to shield the front end of the cover 22. In addition, the front end of the waveguide 28 is connected to the front end shielding panel 2.
3, they are connected by electron beam welding through each waveguide communication hole 26 to complete the waveguide bundle 21.

Therefore, in the high frequency heating device equipped with the waveguide bundle 21 as described above, the cooling medium supply pipes 30a, 32
a, 34a through each space 25a, 25b, 25
The waveguide 28 can be cooled by allowing the cooling medium to flow independently into the spaces 25a, 25b, 25c, and 25d, and flowing out the cooling medium from the respective spaces 25a, 25b, 25c, and 25d through the cooling medium outflow pipes 30b, 32b, and 34b. can.

Therefore, according to the above configuration, the cooling medium supply pipes 30a, 32a, 34a and the outflow pipe 30b,
Since 32b and 34b are not embedded in the waveguide 28, the wall thickness of the waveguide 28 can be reduced.
Further, in the event that a part of the cooling piping is broken, it is also possible to replace only the broken piping.

In addition, the interior of the case 22 is divided into multiple spaces by partition panels, and the cooling medium is circulated independently through separate pipes for each space, so that the first space is where the tip of the waveguide, which has the largest heat load, is located. 2
The flow rate of the cooling medium to 5a can be increased, and the flow rate can be gradually decreased toward the rear. Therefore, the entire waveguide 28 can be efficiently cooled with a small flow rate of the cooling medium. Moreover, since the cooling medium is brought into direct contact with the waveguide, the cooling efficiency is also improved in this respect.

Furthermore, a partition panel 24 separates the waveguides 28 from each other.
a, 24b, and 24c, and no means such as brazing is used, so when integrating the waveguides,
There is no need for overheating, thus eliminating the need for an effective heating device, and the fabrication time of the waveguide bundle 21 can also be significantly reduced.

Furthermore, the most advanced partition panel 24a is a small panel 24a1 divided for each waveguide.
24a2... are connected by welding, so even if the interval between the waveguides 28 is narrow and there is a large distance between the front end shielding panel 23 and the partition panel 24a, the waveguide 28 and the partition can be easily connected. Panel 24
The connection to a can be easily made by electron beam welding. However, the distance between the waveguides 28 is wide, and the front end shielding panel 23 and the partition panel 2
4a, the most advanced partition panel 24a may also be integrated like the other partition panels.

Next, FIG. 7 shows a second embodiment of the present invention, in which the rear cooling medium flow path structure is constructed by cutting out part of the second and subsequent partition panels 24b and 24c to allow the cooling medium to flow. Roads 40a, 40b; 41a, 41
b.

That is, a rear first cooling medium flow path structure is formed in which the cooling medium flows into the first space 25a from the flow path 40a and flows out from the flow path 40b, and the cooling medium flows from the flow path 41a into the second space 25b. A rear second coolant flow path structure is formed that allows the coolant to flow in and flow out from the flow path 41b.

In this embodiment, the first opening space 25a and the second space 25b and subsequent spaces can be cooled independently, and piping can be largely omitted. Therefore, the second space 2
This is effective when there is no problem even if the cooling mediums are mixed after 5b.

〔Effect of the invention〕

As described above, according to the present invention, the wall thickness of the waveguide can be reduced, the waveguide bundle can be efficiently cooled with a small amount of cooling medium, and the waveguide bundle can be manufactured in a short time. It is possible to provide a high-frequency heating device for a nuclear fusion device, which can be performed at low cost and can also replace a part of the cooling piping that cools the waveguide bundle.

[Brief explanation of the drawing]

1 to 6 show one embodiment of the present invention, in which FIG. 1 is a perspective view partially showing a waveguide bundle, FIG. 2 is a longitudinal cross-sectional view of the waveguide bundle, and FIG. 3 is a longitudinal sectional view of the waveguide bundle. is the second
4 is a sectional view of FIG. 2, FIG. 5 is a sectional view of FIG. 2, FIG. 6 is a perspective view showing the relationship between the waveguide and the small panel, and FIG. 8 is a schematic diagram of each fusion device; FIG. 9 is a schematic diagram of a high-frequency heating device;
FIG. 0 is a perspective view of a waveguide bundle showing a conventional example. 21... Waveguide bundle, 22... Cylindrical case, 23
...Front end shielding panel, 24a, 24b, 24c...
...Partition panel, 26...Waveguide communication hole, 27...
Waveguide insertion hole, 28... Waveguide, 30a, 32
a, 34a...Cooling medium supply pipe, 30b, 32
b, 34b...Cooling medium outflow pipe.

Claims (1)

[Scope of Claims] 1. A cylindrical case, a front end shielding panel having a plurality of waveguide passage holes and shielding the front end of the cylindrical case, and a front end shielding panel having a plurality of waveguide insertion holes and shielding the front end of the cylindrical case. one or more partition panels that longitudinally divide the internal space of the shaped case; and a front end shielding panel that is inserted through the waveguide insertion hole and whose inner hole is aligned with the waveguide communication hole, and whose tip end is the front end shielding panel. a plurality of waveguides connected to the cylindrical case, a tip cooling medium flow path structure that allows a cooling medium to flow between the front end shielding panel in the cylindrical case and a partition panel adjacent thereto; 1. A high-frequency heating device for a nuclear fusion device, comprising a waveguide bundle including a rear coolant flow path structure that allows a coolant to flow through a space after a partition panel adjacent to a front end shielding panel. 2. The high-frequency heating device for a nuclear fusion device according to claim 1, wherein the most advanced partition panel is formed by welding and connecting small panels from the front side through which the waveguides are inserted one by one. 3. The high-frequency heating device for a nuclear fusion device according to claim 1, wherein the shape and dimensions of the waveguide insertion hole are substantially the same as the shape and dimensions of the outer cross section of the waveguide. . 4. The nuclear fusion device according to claim 1, wherein the tip coolant flow path structure includes a coolant supply pipe and a coolant outflow pipe that are arranged to penetrate the partition panel. high frequency heating device. 5. The rear cooling medium flow path structure includes a cooling medium supply pipe and a cooling medium outflow pipe that are arranged to penetrate through the second and subsequent partition panels. High frequency heating device for nuclear fusion equipment. 6. The high-frequency heating of the nuclear fusion device according to claim 1, wherein the rear cooling medium flow path structure is constructed by cutting out a part of the second and subsequent partition panels to form a flow path for the cooling medium. Device.