JPH0550131B2 - - Google Patents
Info
- Publication number
- JPH0550131B2 JPH0550131B2 JP58156580A JP15658083A JPH0550131B2 JP H0550131 B2 JPH0550131 B2 JP H0550131B2 JP 58156580 A JP58156580 A JP 58156580A JP 15658083 A JP15658083 A JP 15658083A JP H0550131 B2 JPH0550131 B2 JP H0550131B2
- Authority
- JP
- Japan
- Prior art keywords
- tool
- arm
- tool shaft
- lever
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
Landscapes
- Die Bonding (AREA)
Description
【発明の詳細な説明】
この発明は例えば半導体チツプのような小物部
品のマウント装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting device for small parts such as semiconductor chips.
半導体装置の組立作業において、チツプ部品と
言われる各種半導体素子、集積回路素子、各種受
動部品を供給トレイから基板等のパツケージ上へ
移送しマウントする作業があり、通常チツプマウ
ント装置と言われる装置を用いて行なう。チツプ
マウント装置は下方のXYテーブル上にパツケー
ジを置き、吸着ツールにチツプ部品を吸着し、チ
ツプ部品とパツケージはXYテーブルで位置を合
せ、吸着ツールで方向を合せる。吸着ツールはマ
ウント時に軸方向にチツプ部品とパツケージ間に
一定圧力を加えるように弾性支持して軸方向に移
動できるようになつている。 In the assembly work of semiconductor devices, there is work to transfer and mount various semiconductor elements called chip parts, integrated circuit elements, and various passive parts from a supply tray onto a package such as a board. Do it using The chip mount device places the package on the XY table below, picks up the chip parts with the suction tool, aligns the chip parts and the package with the XY table, and aligns the directions with the suction tool. The suction tool is elastically supported and movable in the axial direction so as to apply a constant pressure between the chip component and the package when mounted.
第3図は従来例のチツプマウント装置の一例で
あり、鎖線で囲まれたA部は後述される本発明の
実施例と同じである。 FIG. 3 shows an example of a conventional chip mount device, and a portion A surrounded by a chain line is the same as the embodiment of the present invention described later.
ボンデイングアーム1に固定された台座11に
ブツシユ2、ラジアル玉軸受23により枢着され
た従動側アーム28にはピン36が固定され、ピ
ン36はツール軸7に固定されたツールレバー3
7に固定されたブツシユ38に軸方向移動自在に
嵌入している。 A bush 2 is fixed to a pedestal 11 fixed to the bonding arm 1 , a pin 36 is fixed to a driven arm 28 pivoted by a radial ball bearing 23 , and the pin 36 is a tool lever 3 fixed to a tool shaft 7 .
It is fitted into a bush 38 fixed to 7 so as to be movable in the axial direction.
従動側アーム28はチツプ部品を回動してパツ
ケージと方向を合せる際に回されるもので、原動
側ピニオン28aの回動により従動側アーム28
がラジアル玉軸受23を中心に回動するとピン3
6を介してツールレバー37は回されツール軸7
を回動し、ツール軸7端に取付けた吸着ツール1
9は吸着しているチツプ部品を回動する。 The driven side arm 28 is rotated when rotating the chip component to align the direction with the package, and the driven side arm 28 is rotated by the rotation of the driving side pinion 28a.
When the pin rotates around the radial ball bearing 23, the pin 3
6, the tool lever 37 is turned and the tool shaft 7
Suction tool 1 attached to the end of the tool shaft 7 by rotating the
9 rotates the chip parts being sucked.
吸着ツール19の先端に吸着されたチツプ部品
がパツケージ上にマウントされるときにボンデイ
ングアーム1は圧縮ばね14に抗して下り、ボン
デイングアーム1に軸方向移動しないように枢着
されている従動側アーム28はボンデイングアー
ム1と共に下る。ツールレバー37はツール軸7
に固定しているから、従動側アーム28に固定し
ているピン36はブツシユ38中を下方に摺動す
る。チツプ部品のパツケージへのマウントが終る
とボンデイングアーム1、従動側アーム28は上
昇し、ピン36はブツシユ38中を上に向つて摺
動する。 When the chip component suctioned to the tip of the suction tool 19 is mounted on the package cage, the bonding arm 1 descends against the compression spring 14, and the driven side is pivoted to the bonding arm 1 so as not to move in the axial direction. The arm 28 descends together with the bonding arm 1. The tool lever 37 is the tool shaft 7
Since the pin 36 is fixed to the driven arm 28, the pin 36 slides downward in the bush 38. When the chip components are mounted on the package cage, the bonding arm 1 and the driven arm 28 rise, and the pin 36 slides upward in the bush 38.
何故にこの様な構成をとるかというに吸着ツー
ル19は軸方向に移動可能であつて、かつ回動さ
せる必要がある。この回動のために従動側アーム
28を設けてある。又吸着ツール19は回動位置
で上下動しなければならないのでツールレバー3
7を設けてある。尚又、従動側アーム28と吸着
ツール37は共に一体的に回転しなければならな
いので軸方向には相対変位可能で回動方向には剛
な連結手段が必要となる。 The reason why such a configuration is adopted is that the suction tool 19 is movable in the axial direction and needs to be rotated. A driven arm 28 is provided for this rotation. Also, since the suction tool 19 must move up and down in the rotation position, the tool lever 3
7 is provided. Furthermore, since both the driven arm 28 and the suction tool 37 must rotate together, a connecting means that is capable of relative displacement in the axial direction and is rigid in the rotating direction is required.
しかしながら、このような従来のチツプマウン
ト装置にあつてはツールレバー37がツール軸7
から長く延出しており、その端部でツールレバー
37に固定したブツシユ38と従動側アーム28
に固定したピン36が摺動するようになつていた
ため、ブツシユ38とピン36の摺動公定により
ツールレバー37もしくは従動側アーム28がた
わんで傾くとピン36とツールレバー37に固定
したブツシユ38との間にこじれが生じ動きが滑
らかでなくその上ツール圧接時の負荷が不安定で
あるという問題点があつた。 However, in such a conventional chip mount device, the tool lever 37 is connected to the tool shaft 7.
A bush 38 and a driven arm 28 are fixed to the tool lever 37 at their ends.
Since the pin 36 fixed to the tool lever 37 is designed to slide, when the tool lever 37 or the driven arm 28 bends and tilts due to the sliding relationship between the bush 38 and the pin 36, the pin 36 and the bush 38 fixed to the tool lever 37 There were problems in that the movement was not smooth and the load was unstable when the tool was pressed.
本発明は吸着ツールが円滑に軸方向に運動し且
つ正確なマウント圧力を生ずるチツプマウント装
置を提供することを目的とする。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip mounting device in which the suction tool moves smoothly in the axial direction and produces accurate mounting pressure.
本発明はチツプ部品を保持する吸着ツールを先
端に備え回転自在並びに軸方向に弾撥附勢された
ツール軸を備えたツール支持機構において、ツー
ル軸に対し回転自在の従動側アームとツール軸に
固定したツールレバーとをツール軸回動方向に剛
となりツール軸軸方向に相対変位自在となるよう
に板ばねにて連結したことを特徴とする部品マウ
ント装置である。 The present invention provides a tool support mechanism having a suction tool at the tip for holding a chip component, and a tool shaft that is rotatable and elastically biased in the axial direction. This component mounting device is characterized in that a fixed tool lever is connected by a plate spring so as to be rigid in the rotational direction of the tool shaft and relatively movable in the axial direction of the tool shaft.
以下図面に従つて本発明の実施例について説明
する。第1図は一部断面図で示す側面図、第2図
は第1図の平面図である。 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partially sectional side view, and FIG. 2 is a plan view of FIG. 1.
図示されない根本側が上下動するようになつて
いるボンデイングアーム1の先端に固定された台
座11にはブツシユ2が嵌入固定されている。ボ
ンデイングアーム1の先端は台座11と間隔をお
いて下の部材が突出し、下の部材にはハウジング
3が当接して止めねじ4により固定せられてい
る。ハウジング3とボンデイングアーム1の先端
の下の部材にあけられたブツシユ2と同心の孔に
は軸受5が圧入され、軸用止め輪6を軸受5の円
周溝に嵌め込むことにより軸方向の移動を止めら
れている。 A bush 2 is fitted and fixed to a pedestal 11 fixed to the tip of a bonding arm 1 whose base side (not shown) is movable up and down. A lower member protrudes from the tip of the bonding arm 1 at a distance from the pedestal 11, and a housing 3 abuts on the lower member and is fixed with a set screw 4. A bearing 5 is press-fitted into a hole concentric with the bush 2 that is drilled in the housing 3 and a member below the tip of the bonding arm 1, and by fitting a shaft retaining ring 6 into the circumferential groove of the bearing 5, the axial direction is adjusted. Movement is stopped.
ブツシユ2と軸受5によりツール軸7が軸承さ
れている。ツール軸7にはつば8が設けられ、つ
ば8と軸受5との対向面には夫々軸受レース溝が
設けられ多数のボール9が円周上に配されてい
る。ハウジング3の軸受5が嵌入する孔と同心の
めねじにはつまみを備えた負荷調整ねじ10が螺
着され、負荷調整ねじ10と負荷調整ねじ10の
ねじ部の内周に回転自在に嵌入するスラストリン
グ12の端面との対向面間にはボール13が嵌入
している。スラストリング12とツール軸のつば
8には圧縮ばね14の両端が当接し、ツール軸7
のつば8をボール9を介して軸受5に押圧してい
る。 A tool shaft 7 is supported by a bush 2 and a bearing 5. The tool shaft 7 is provided with a collar 8, and bearing race grooves are provided on the opposing surfaces of the collar 8 and the bearing 5, respectively, and a large number of balls 9 are arranged on the circumference. A load adjustment screw 10 with a knob is screwed into a female thread concentric with the hole into which the bearing 5 of the housing 3 is inserted, and is rotatably fitted into the load adjustment screw 10 and the inner periphery of the threaded portion of the load adjustment screw 10. A ball 13 is fitted between the end surface of the thrust ring 12 and the opposing surface. Both ends of the compression spring 14 are in contact with the thrust ring 12 and the collar 8 of the tool shaft, and the tool shaft 7
The collar 8 is pressed against the bearing 5 via the ball 9.
ボンデイングアーム1端にねじ込んだ真空用継
手15とツール軸7の行き止りの中心孔16間を
連通するようにアーム1、軸受5の貫通孔17が
ツール軸7の円周溝18に通じ、円周溝18から
ツール軸7の中心孔16に半径方向の孔が通ず
る。ツール軸7端には先端に吸着口19aを設け
た吸着ツール19が嵌入し、止めねじ20により
固定されている。 The through hole 17 of the arm 1 and bearing 5 communicates with the circumferential groove 18 of the tool shaft 7 so that the vacuum joint 15 screwed into the end of the bonding arm 1 and the dead-end center hole 16 of the tool shaft 7 communicate with each other. A radial hole leads from the circumferential groove 18 to the center hole 16 of the tool shaft 7 . A suction tool 19 having a suction port 19a at its tip is fitted into the end of the tool shaft 7, and is fixed with a set screw 20.
第2図は第1図の平面図である。ツール軸7の
上端にはツールレバー21の根本の直径方向のす
り割り溝を両側に備えた孔が嵌入し、該すり割り
溝を引き寄せるレバー固定ねじ22により固定さ
れている。ブツシユ2の外径側にはラジアル玉軸
受23がブツシユ2の段部からカラー24,25
を軸方向に交互に挿入して嵌め込まれ、端部に嵌
入したカラー26を止めねじ27によりブツシユ
2に固定してラジアル玉軸受23は軸方向移動を
止められている。ラジアル玉軸受23の外輪には
従動側アーム28が嵌入して、該アーム28は回
動自在に支持されている。 FIG. 2 is a plan view of FIG. 1. A hole with slotted grooves in the diameter direction on both sides of the base of the tool lever 21 is inserted into the upper end of the tool shaft 7, and is fixed by a lever fixing screw 22 that pulls the slotted grooves. A radial ball bearing 23 is installed on the outer diameter side of the bush 2 from the stepped portion of the bush 2 to the collars 24 and 25.
The radial ball bearing 23 is prevented from moving in the axial direction by alternately inserting and fitting the collars 26 in the axial direction, and fixing the collars 26 fitted at the ends to the bush 2 with setscrews 27. A driven arm 28 is fitted into the outer ring of the radial ball bearing 23, and the arm 28 is rotatably supported.
U字形に折り曲げた板ばね29の一端はばね止
板31とツールレバー21に挾持され、ばね止板
31と板ばね29の孔を挿通して小ねじ32をツ
ールレバー21にねじ込むことにより固定され、
板ばね29の他端は従動側アーム28に当接する
ばね止板33とばね止板34に挾持され、ばね止
板34、板ばね29、ばね止板33の孔を挿通し
て小ねじ35を従動側アーム28にねじ込むこと
により固定されている。 One end of the leaf spring 29 bent into a U-shape is held between the spring stopper plate 31 and the tool lever 21, and is fixed by inserting the hole in the spring stopper plate 31 and the leaf spring 29 and screwing a machine screw 32 into the tool lever 21. ,
The other end of the leaf spring 29 is held between a spring stop plate 33 and a spring stop plate 34 that come into contact with the driven arm 28, and a small screw 35 is inserted through the holes of the spring stop plate 34, the leaf spring 29, and the spring stop plate 33. It is fixed by screwing into the driven arm 28.
真空用継手15からの空気吸引により吸着ツー
ル19の吸着口19aまでの空気は吸引され、チ
ツプ部品は吸着ツール19に吸引される。そして
パツケージ上のマウント位置へボンデイングアー
ム1の回動により移動し図示されないXYテーブ
ルにより、パツケージとチツプ部品の位置が合せ
られる。 The air up to the suction port 19a of the suction tool 19 is suctioned by air suction from the vacuum joint 15, and the chip parts are suctioned into the suction tool 19. The bonding arm 1 is then moved to a mounting position on the package by rotation, and the package and chip components are aligned by an XY table (not shown).
従動側アーム28は図示されないが他の伝導機
構により駆動される原動側ピニオン28aの回動
により回されるもので、従来側アーム28が回さ
れるとラジアル玉軸受23を介してブツシユ2上
で回動する。従動側アーム28の回動は板ばね2
9が回動方向に対しては剛性が大きいから板ばね
29を介してツールレバー21を回動してツール
軸7を所定角度回動してチツプ部品とパツケージ
の方向を合す。 Although not shown, the driven side arm 28 is rotated by the rotation of a driving side pinion 28a driven by another transmission mechanism, and when the conventional side arm 28 is rotated, it is rotated on the bush 2 via the radial ball bearing 23. Rotate. The rotation of the driven arm 28 is caused by the leaf spring 2.
Since the tool lever 9 has a high rigidity in the direction of rotation, the tool lever 21 is rotated via the leaf spring 29, and the tool shaft 7 is rotated by a predetermined angle to align the chip component and the package.
チツプ部品とパツケージの方向が一致するとア
ーム1が下降することにより吸着ツール19はチ
ツプ部品をパツケージ上に接近させつづいて圧接
する。ツール軸7は移動止められアーム1は尚下
るから負荷調整ねじ10は下り、ボール13、ス
ラストリング12を介して圧縮ばね14は圧縮さ
れ、又板ばね29は上下間が開く。チツプ部品の
パツケージへのマウントが終りアーム1が上昇す
ると圧縮ばね14、板ばね29は復元し、ツール
軸7とアーム1との関係は第1図の関係位置とな
る。 When the directions of the chip part and the package match, the arm 1 is lowered, and the suction tool 19 brings the chip part close to the top of the package and continues to press the chip part. Since the tool shaft 7 is stopped moving and the arm 1 is still lowered, the load adjusting screw 10 is lowered, the compression spring 14 is compressed via the ball 13 and the thrust ring 12, and the upper and lower portions of the leaf springs 29 are opened. When the mounting of the chip parts on the package cage is finished and the arm 1 is raised, the compression spring 14 and the leaf spring 29 are restored, and the relationship between the tool shaft 7 and the arm 1 becomes the relative position shown in FIG.
チツプ部品とパツケージ間の圧接力は圧縮ばね
14と板ばね29(正負何れにも設計できる)の
合力により定まり、圧接力は負荷調整ねじ10を
ねじ込み圧縮ばね14を圧縮すると大きくなり、
逆に負荷調整ねじ10をゆるめると圧縮ばね14
はのびて圧接力は小さくなる。板ばね29は従動
側アーム28、ツールレバー21間の回転力の伝
達を目的とするものでありばね定数が小さくツー
ル軸7に推力を殆んど与えないが、板ばね29を
チツプ部品とパツケージ間の圧接力を与えるよう
にしてよい。 The pressure contact force between the chip component and the package is determined by the resultant force of the compression spring 14 and the leaf spring 29 (which can be designed to be either positive or negative), and the pressure contact force increases when the load adjustment screw 10 is screwed in and the compression spring 14 is compressed.
Conversely, when the load adjustment screw 10 is loosened, the compression spring 14
As it stretches, the pressure force decreases. The leaf spring 29 is intended to transmit rotational force between the driven arm 28 and the tool lever 21, and has a small spring constant and hardly applies thrust to the tool shaft 7. It may be arranged to apply a pressing force between the two.
実施例は板ばね29をU字形状としたがU字形
状に限定される訳ではなく、従動側アーム28と
ツールレバー21が回動に対して剛に作用し、か
つツール軸7の軸方向移動を許すような形状であ
ればよく、取付端の位置は限定がない。 Although the leaf spring 29 is U-shaped in the embodiment, it is not limited to the U-shape, and the driven side arm 28 and the tool lever 21 act rigidly against rotation, and the axial direction of the tool shaft 7 The position of the mounting end is not limited as long as it has a shape that allows movement.
以上のように本発明はチツプマウント装置のツ
ール軸とツール軸を回動させる従動側アーム間を
回動方向には剛に軸方向には変位を許すように板
面を含む平面がツール軸もしくはツール軸の延長
と交叉するような配置としたから、従動側アーム
からツール軸へは正確に角変位が伝えられ、ツー
ル軸とボンデイングアームの軸方向相対変位に対
しては円滑な運動が得られ、ツール軸の圧接荷重
に誤差を与える事が少ない。 As described above, the present invention is such that the plane including the plate surface is rigid in the rotational direction and allows displacement in the axial direction between the tool shaft of the chip mount device and the driven side arm that rotates the tool shaft. Since the arrangement is such that it intersects with the extension of the tool axis, angular displacement is accurately transmitted from the driven side arm to the tool axis, and smooth movement is obtained against relative axial displacement between the tool axis and the bonding arm. , there is little error in the pressure welding load of the tool shaft.
第1図は本発明の実施例の一部断面図で示す側
面図、第2図は第1図の平面図、第3図は従来例
の一部断面図で示す側面図である。
1……ボンデイングアーム、2……ブツシユ、
3……ハウジング、4……止めねじ、5……軸
受、6……軸用止め輪、7……ツール軸、8……
つば、9……ボール、10……負荷調整ねじ、1
1……台座、12……スラストリング、13……
ボール、14……圧縮ばね、15……真空用継
手、16……中心孔、17……貫通孔、18……
円周溝、19……吸着ツール、19a……吸着
口、20……止めねじ、21……ツールレバー、
22……レバー固定ねじ、23……ラジアル玉軸
受、24,25,26……カラー、27……止め
ねじ、28……従動側アーム、29……板ばね、
31……ばね止板、32……小ねじ、33,34
……ばね止板、35……小ねじ、36……ピン、
37……ツールレバー、38……ブツシユ。
FIG. 1 is a partially sectional side view of an embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a partially sectional side view of a conventional example. 1...Bonding arm, 2...Butsuyu,
3... Housing, 4... Set screw, 5... Bearing, 6... Shaft retaining ring, 7... Tool shaft, 8...
Collar, 9...Ball, 10...Load adjustment screw, 1
1...Pedestal, 12...Thrust ring, 13...
Ball, 14... Compression spring, 15... Vacuum joint, 16... Center hole, 17... Through hole, 18...
Circumferential groove, 19... Suction tool, 19a... Suction port, 20... Set screw, 21... Tool lever,
22... Lever fixing screw, 23... Radial ball bearing, 24, 25, 26... Collar, 27... Set screw, 28... Driven side arm, 29... Leaf spring,
31... Spring stop plate, 32... Machine screw, 33, 34
... Spring stop plate, 35 ... Machine screw, 36 ... Pin,
37...Tool lever, 38...button.
Claims (1)
え回動自在並びに軸方向に弾撥附勢されたツール
軸を備えたツール支持機構において、ツール軸に
対し回転自在の従動側アームとツール軸に固定し
たツールレバーとをツール軸回動方向に剛となり
ツール軸軸方向に相対変位自在となるように板ば
ねにて連結したことを特徴とする部品マウント装
置。1 In a tool support mechanism equipped with a suction tool at the tip that holds a chip component and a tool shaft that is rotatable and elastically biased in the axial direction, a driven side arm that can freely rotate with respect to the tool shaft and fixed to the tool shaft A component mounting device characterized in that the tool lever and the tool lever are connected by a leaf spring so as to be rigid in the rotational direction of the tool shaft and relatively movable in the axial direction of the tool shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156580A JPS6047431A (en) | 1983-08-26 | 1983-08-26 | Mounting device for part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156580A JPS6047431A (en) | 1983-08-26 | 1983-08-26 | Mounting device for part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6047431A JPS6047431A (en) | 1985-03-14 |
| JPH0550131B2 true JPH0550131B2 (en) | 1993-07-28 |
Family
ID=15630866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58156580A Granted JPS6047431A (en) | 1983-08-26 | 1983-08-26 | Mounting device for part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6047431A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62295431A (en) * | 1986-06-13 | 1987-12-22 | Nichiden Mach Ltd | Work pickup apparatus |
| US4799854A (en) * | 1987-07-20 | 1989-01-24 | Hughes Aircraft Company | Rotatable pick and place vacuum sense head for die bonding apparatus |
-
1983
- 1983-08-26 JP JP58156580A patent/JPS6047431A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6047431A (en) | 1985-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |