JPH0554280B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method of manufacturing a metal-based wiring board based on a metal plate.

[Background Art] Conventionally, in manufacturing this type of metal-based wiring board, as shown in FIG. Then, the hole wall surface of the through hole 4 is coated with an insulating resin 8 [FIG. 1b], and then a conductive layer 5 is formed in the through hole 4 by plating, and a circuit layer 7 is formed on the front and back surfaces of the metal plate 1. , the circuit layers 7 and 7 on the front and back sides were electrically connected [Fig. 1c], but in this manufacturing method, the conductive layer 5 formed in the through hole 4 and the base Since the insulation distance from the metal plate 1 cannot be maintained, insulation reliability is particularly low at the corners of the through-hole 4, making it difficult to stably mass-produce it.

[Object of the Invention] The present invention has been made in view of the above points, and provides a metal that improves insulation reliability between a conductive layer in a through hole and a metal plate, and that can be stably mass-produced. An object of the present invention is to provide a method for manufacturing a base wiring board.

[Disclosure of the Invention] That is, the method for manufacturing a metal-based wiring board according to the present invention includes forming an insulating layer 6 on both the front and back surfaces of the metal plate 1 in advance.
Using a copper-clad laminate 11 on which a copper foil 10 is laminated via a copper foil 10, a hole 2 large enough to provide a plurality of through holes 4 is bored in this, and then an insulating material 3 is inserted into the hole 2. and then forming a plurality of through holes 4 opening on the front and back surfaces of the insulating material 3,
Thereafter, a conductive layer 5 is formed in each through hole 4, and a circuit layer 7 is formed on the front and back surfaces of the insulating material 3, and the conductive layer 5 and the circuit layer 7 form a copper-clad laminate 11.
It is characterized by electrically connecting copper foils 10 on the front and back sides of the insulating material 3, and a conductive layer 5 formed in the through hole 4 by providing a through hole 4 in the insulating material 3.
The above object has been achieved by improving the insulation reliability between the metal plate 1 and the metal plate 1, and by making it easy to manufacture by using a pre-formed copper clad laminate 11.

The present invention will be explained in detail below with reference to Examples. The copper-clad laminate 11 is made by laminating copper foil 10 on both the front and back surfaces of a metal plate 1 with an insulating layer 6 of prepreg 9 interposed therebetween, and is manufactured in advance at a factory. A large hole 2 is bored in this copper-clad laminate 11 as shown in FIG. Fill with insulating material 3. When a glass epoxy substrate is used as the insulating material 3, a material having the same size as the hole 2 is inserted. Next, insulation material 3
After that, as shown in FIG.
A conductive layer 5 is formed by plating on the front and back surfaces of the insulating material 3, and a circuit layer 7 is formed by plating on the front and back surfaces of the insulating material 3.
10 is electrically connected.

By providing the through hole 4 in the insulating material 3, the conductive layer 5 provided on the inner wall surface of the through hole 4 and the metal plate 1 are reliably insulated by the insulating material 3, thereby improving reliability. It is something that can increase the In particular, even when a plurality of through holes 4, 4, . . . are provided in the insulating material 3, the insulation reliability does not deteriorate.

[Effects of the Invention] As described above, according to the present invention, it is possible to improve the insulation reliability between the conductive layers of each through hole and between the conductive layer of the through hole and the metal plate, and to achieve stable mass production. be able to. Furthermore, since a copper-clad laminate that has been mass-produced in advance or is commercially available is used, only the portion where the through hole is to be provided is processed, and the remaining portion does not need to be processed at all, which simplifies processing.

[Brief explanation of the drawing]

Figures 1a, b, and c are partially cutaway cross-sectional views showing the manufacturing method of a conventional metal-based wiring board, respectively;
Figures a and b are a front view and a cross-sectional view showing a manufacturing method according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a metal-based wiring board obtained by the same method. 1 is a metal plate, 2 is a hole, 3 is an insulating material, 4 is a through hole, 5 is a conductive layer, 6 is an insulating layer, 7 is a circuit layer,
10 is a copper foil, and 11 is a copper-clad laminate.

Claims (1)

[Claims] 1 Using a copper-clad laminate in which copper foil is laminated on both the front and back sides of a metal plate with an insulating layer interposed in between, holes large enough to accommodate multiple through holes are drilled in this, and then holes are drilled into the holes. is filled with an insulating material, then a plurality of through holes opening on the front and back surfaces of the insulating material are formed, and then a conductive layer is formed in each through hole and a circuit layer is formed on the front and back surfaces of the insulating material. A method for producing a metal-based wiring board, which comprises electrically connecting copper foils on the front and back sides of a copper-clad laminate using these conductive layers and circuit layers.