JPH0558600B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] The present invention is a heat dissipation structure for electronic circuit components in an electronic device, which includes a heat dissipation structure for electronic circuit components in an electronic device.
A plurality of printed circuit boards having a circuit pattern surface and a component mounting surface are arranged so that the component mounting surfaces face each other, and electronic circuit components that require heat dissipation are mounted on the component mounting surfaces of the printed circuit boards. A heat transfer element is connected to the surface of the circuit component, a support block with good thermal conductivity is mounted on the component mounting surface of the printed circuit board, a heat dissipation fin is attached to the support block, and a shield is installed to cover the circuit pattern surface of the printed circuit board. The cover and the heat dissipation section side of the heat transfer element are both directly connected to the heat dissipation fins.

[Industrial application field]

The present invention relates to a heat dissipation structure for electronic circuit components in an electronic device, and more particularly to a heat dissipation structure for electronic components on a printed circuit board mounted in a casing.

Generally, in electronic devices such as control units, multiple printed circuit boards are mounted in parallel at intervals within a casing, and various electronic circuit components are mounted on the component mounting surface of the printed circuit board. has been done.

By the way, among electronic circuit components, high-density integrated circuit devices such as large-scale integrated circuit devices (LSI devices) are becoming more highly integrated and have higher power consumption. Therefore, when such a high-density integrated circuit element is mounted on a printed circuit board, there is a risk that reliability may be lowered due to an increase in temperature within the casing and heat of the element itself. Therefore, there is a need for a heat dissipation structure that can dissipate heat from high-density integrated circuit elements while suppressing thermal effects on other electronic circuit components within the casing, and which does not narrow the mounting area within the casing. Ru.

[Conventional technology]

The heat dissipation structure of electronic circuit components in a conventional electronic device is shown in FIG. 5. Referring to the figure, a plurality of printed circuit boards 3 are mounted in parallel at intervals in a casing 2 of the electronic device. . The printed circuit board 3 has a circuit pattern surface 3a and a component mounting surface 3b on the back side.
a is covered with a shield cover 4 attached to a printed circuit board 3.

A block 6 made of a material with good thermal conductivity is attached to the surface of an electronic circuit component 5 that requires heat radiation, such as an LSI element, mounted on the component mounting surface 3b of the printed circuit board 3. The heat dissipation part at the tip of the heat pipe 7 connected to the block 6 extends to the outside of the casing 2, and the heat pipe 7
A heat dissipation fin 8 located between two adjacent printed boards 3 and a heat dissipation fin 9 located outside the casing 2 are fixed to the heat dissipation portion.

[Problem that the invention seeks to solve]

In the conventional heat dissipation structure described above, since the heat dissipation fins 8 are provided between adjacent printed circuit boards 3, there is a drawback that the mounting area on the component mounting surface 3b of the printed circuit board 3 becomes narrow.

Remove the heat dissipation fins 8 between the printed circuit boards 3,
When only the heat dissipation fins 9 outside the casing 1 are used, the heat dissipation area decreases and heat dissipation becomes insufficient. Therefore, the shield cover 4 is attached to the heat pipe 7.
It is conceivable to use the shield cover 4 as a heat sink by connecting it to the heat sink of the circuit board 3, but in this case, in the conventional heat sink structure, the circuit pattern surface 3a and the component mounting surface 3b of two adjacent printed circuit boards 3
Since the shield cover 4 faces the shield cover 4, heat radiation from the shield cover 4 causes a temperature rise of the electronic circuit components on the adjacent printed circuit board 3.

[Means for solving problems]

In view of the above-mentioned problems, the present invention is capable of securing a sufficient heat dissipation area for heat dissipation from high-density integrated circuit elements, etc. without reducing the component mounting area of a printed circuit board in an electronic device. The purpose of this invention is to provide a heat dissipation structure that is less likely to have thermal effects on the electronic circuit components above.

In order to achieve the above object, the present invention is a heat dissipation structure for electronic circuit components in an electronic device, in which a plurality of printed circuit boards having a circuit pattern surface and a component mounting surface are installed in a casing of the electronic device. The heat transfer element is arranged so that the mounting surfaces face each other, and the heat transfer element is connected to the surface of the electronic circuit component that requires heat dissipation among the electronic circuit components mounted on the component mounting surface of the printed circuit board. A support block with good thermal conductivity is mounted on the support block, and a heat dissipation fin is attached to the support block, and the shield cover that covers the circuit pattern surface of the printed circuit board and the heat dissipation side of the heat transfer element are attached directly to the heat dissipation fin. Provided is a heat dissipation structure for electronic circuit components that is characterized by being connected.

[Effect]

According to the above means according to the present invention, heat generated in electronic circuit components that require heat radiation, such as high-density integrated circuit elements, is transmitted to the heat generating fins and the shield cover outside the casing via the heat transfer element, The heat will now be dissipated by the heat dissipation fins and shield cover. In this way, since the shield cover is used as a heat sink in addition to the heat dissipation fin, a sufficient heat dissipation area can be secured without the need to provide another heat dissipation fin between the printed circuit boards. Therefore, the mounting density of electronic circuit components on the printed circuit board can be increased by effectively using the component mounting surface of the printed circuit board. In addition, since the printed circuit board is mounted inside the casing so that the component mounting surfaces face each other, the shield covers that cover the circuit pattern surface of the printed circuit board face each other, and the electronic circuits on the printed circuit board due to heat dissipation from the shield cover. This means that the thermal influence on the components can be minimized.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

1 to 4 show one embodiment of the present invention. First, referring to FIGS. 1 and 2, the casing 11 of the electronic device is open at the front, and the upper and lower edges of the opening are provided with a plurality of vertically opposing slits 11.
a and 11b are respectively formed, and a plurality of printed circuit boards 12 are inserted into these upper and lower slits 11.
It can be inserted into the casing 11 through a and 11b.

The printed circuit board 12 has a circuit pattern surface 12a and a component mounting surface 12b on the back side thereof, and various electronic circuit components are mounted on the component mounting surface 12b. As can be seen from FIG. 2, the printed circuit board 12 is mounted in the casing 11 so that the component mounting surfaces 12b face each other.

Among the electronic circuit components mounted on the printed circuit board 12, for example, large-scale integrated circuit elements (LSI elements)
High-density integrated circuit elements such as the above consume a lot of power and generate a large amount of heat, so it is necessary to dissipate heat sufficiently so as not to have a thermal effect on other electronic circuit components. These electronic circuit components that require heat dissipation are numbered 1.
3.

As shown in FIGS. 1 and 3a and 3b, - the surface of the electronic circuit component 13 is made of a material with good thermal conductivity;
For example, a heat transfer block 14 made of aluminum, brass, etc. is attached, and the heat transfer block 14
A thin tubular heat pipe 15 in which a working fluid is injected is connected to. Although one heat pipe 15 may be connected to each heat transfer block 14, one heat pipe 15 may be connected to a plurality of heat transfer blocks 14, as shown in FIG. 3a. .

The heat dissipation part of the heat pipe 15 is the printed circuit board 12
A heat radiation fin 16 located outside the front side of the casing 11 is connected to the heat radiation portion of the heat pipe 15 .

To explain in more detail, here, a support block 17 is fixed on the component mounting surface 12b at the front end of the printed circuit board 12.
The heat dissipating end of the heat pipe 15 is engaged with the groove 17a formed in the groove 17a.

As can be seen from FIGS. 1 and 4, the heat dissipation fin 16 has inner brackets 18 on both left and right sides of its rear part.
and an outer flange 19, and the inner bracket 18 is formed with a groove 18a that can be engaged with the heat dissipating end of the heat pipe 15.

A support block 17 at the front end of the printed circuit board 12 is inserted between the inner bracket 18 and the outer bracket 19, and the groove 1 of the support block 17 is inserted into the support block 17.
7a and the groove 18a of the inner bracket 18, the heat dissipating portion of the heat pipe 15 fits into the hole.

On the other hand, the outer bracket 19 and the printed circuit board 12
A front end portion of a shield cover 20 that covers the circuit pattern surface 12a of the printed circuit board 12 is interposed between the circuit pattern surface 12a and the circuit pattern surface 12a.

The tightening bolts 21 are attached to through holes formed in the outer bracket 19, and slits 20a, 12c, and 17b formed in the shield cover 20, printed circuit board 12, and support block 17, respectively (Fig. 3a,
b) and a through hole formed in the inner bracket 18, and is threaded into the nut 22. By tightening the bolts 21 and nuts 22, the brackets 18 and 19 are tightened, the heat radiation fins 16 are firmly connected to the front end of the printed circuit board 12, and the heat radiation portion of the heat pipe 15 is connected to the heat radiation fins 16. and shield cover 20
thermally connected to the

In this way, the shield cover 20 also functions as a heat sink, so the shield cover 20
is preferably made of a material with good thermal conductivity.
Further, since the support block 17 and the bolts 21 serve to thermally connect the heat dissipation section of the heat pipe 15 and the shield cover 20, it is preferable that these parts are also made of materials with good thermal conductivity.

In the heat dissipation structure for electronic circuit components in an electronic device having the above configuration, heat generated in the electronic circuit component 13 that requires heat dissipation passes through the heat transfer block 14 as a heat transfer element and the heat pipe 15 to the outside of the casing 11. are transported to the heat dissipation fins 16 and the shield cover 20, and these heat dissipation fins 16
Heat is radiated by the shield cover 20 and the shield cover 20.

In this way, since the shield cover 20 is used as a heat sink in addition to the heat dissipation fins 16, it is not necessary to provide another heat dissipation fin between the printed circuit boards 12, and a sufficient heat dissipation area can be secured. When heat dissipation fins are provided between the printed circuit boards 12, the area where components can be mounted on the printed circuit board is narrowed by the heat dissipation fins. Printed circuit board 12 by effectively using surface 12b
The mounting density of electronic circuit components on the top can be increased.

On the other hand, the printed circuit board 12 is mounted in the casing 11 so that the component mounting surfaces 12b face each other, and the circuit pattern surface 1 of the printed circuit board 12
Shield covers 20 that cover 2a face each other. Therefore, the thermal influence on the electronic circuit components on the printed circuit board 12 due to heat radiation from the shield cover 20 can be minimized.

Although the illustrated embodiments have been described above, the present invention is not limited to the embodiments described above, and various changes can be made to the constituent elements within the scope of the invention described in the claims. can.
For example, one of the inner bracket 18 or outer bracket 19 may be separated from the heat sink fin 16 to provide greater clamping force. Further, the front end portion of the shield cover 20 may extend to the component mounting surface 12b side of the printed circuit board 12. Further, in the above embodiment, the heat dissipation fins are attached to the front ends of the two printed circuit boards 12, but the heat dissipation fins may be attached to each printed circuit board. Furthermore, the radiation fins may be attached to the outer wall of the casing. Heat transfer block 13
Although the heat pipe 15 is best for effectively transmitting the heat to the radiation fins 16 and the shield cover 20, a rod having good thermal conductivity may be used instead of the heat pipe.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, heat generated in electronic circuit components that require heat dissipation, such as high-density integrated circuit elements, passes through the heat transfer element and reaches the heat dissipation fins outside the casing. The heat is transmitted to the shield cover, and is radiated by these heat radiation fins and the shield cover. In this way, since the shield cover is used as a heat sink in addition to the heat dissipation fin, a sufficient heat dissipation area can be secured without the need to provide another heat dissipation fin between the printed circuit boards. Therefore, the mounting density of electronic circuit components on the printed circuit board can be increased by effectively using the component mounting surface of the printed circuit board. In addition, since the printed circuit board is mounted inside the casing so that the component mounting surfaces face each other, the shield covers that cover the circuit pattern surface of the printed circuit board face each other, and the electronic circuits on the printed circuit board due to heat dissipation from the shield cover. This means that the thermal influence on the components can be minimized. Therefore, we provide a heat dissipation structure for electronic circuit components that can sufficiently dissipate heat while suppressing thermal effects on other electronic circuit components within the casing and without narrowing the mounting area of the printed circuit board. It becomes possible.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of a heat dissipation structure for electronic circuit components in an electronic device showing an embodiment of the present invention, Fig. 2 is a view of the heat dissipation structure shown in Fig. 1 viewed from the front of the casing, and Fig. 3a. 3b is a perspective view showing the heat dissipation structure shown in FIG. 1 in the middle of being assembled, and FIG.
This figure is a perspective view of the heat dissipation fin shown in FIG. 1, and FIG. 5 is a plan view of the inside of a casing showing the heat dissipation structure of electronic circuit components in a conventional electronic device. In the figure, 11 is a casing, 12 is a printed circuit board, 12a is a circuit pattern surface, 12b is a component mounting surface, 13 is an electronic circuit component, 14 is a heat transfer block, 15 is a heat pipe, 16 is a heat radiation fin, 2
0 indicates a shield cover.

Claims (1)

[Scope of Claims] 1. A heat dissipation structure for electronic circuit components in an electronic device, which includes a plurality of printed circuit boards 12 having a circuit pattern surface 12a and a component mounting surface 12b inside a casing 11 of the electronic device. The printed circuit board 1 is arranged such that the component mounting surfaces 12b face each other.
The heat transfer elements 14 and 15 are connected to the surface of the electronic circuit component 13 that requires heat dissipation among the electronic circuit components mounted on the component mounting surface 12b of the printed circuit board 12, and the component mounting surface 12b of the printed circuit board 12 is provided with thermal conductivity. A support block 17 with a good quality is mounted, and a heat dissipation fin 16 is attached to the support block 17, and a shield cover 20 covering the circuit pattern surface 12a of the printed circuit board 12 and a heat transfer element 1 are installed.
A heat dissipation structure for an electronic circuit component, characterized in that the heat dissipation portion sides of Nos. 4 and 15 are both directly connected to a heat dissipation fin 16. 2. In the heat dissipation structure for an electronic circuit component according to claim 1, the attachment of the heat dissipation fin 16 to the support block 17, the shield cover 20 to the heat dissipation fin 16, and the heat dissipation parts of the heat transfer elements 14 and 15 are provided. A heat dissipation structure for an electronic circuit component, characterized in that the connection to the side is made by a tightening bolt 21 having good thermal conductivity. 3. In the heat dissipation structure for an electronic circuit component according to claim 1 or 2, the component mounting surface 1
This electronic circuit component mounting structure is characterized in that both ends of the heat dissipation fins 16 are attached to the ends of two adjacent printed circuit boards 12 with the fins 2b facing each other. 4. In the heat dissipation structure for an electronic circuit component according to claim 1, the heat transfer element further includes a heat pipe 15, and the heat pipe 15 is thermally connected to the surface of the electronic circuit component 13 that requires heat dissipation. 1. A heat dissipation structure for an electronic circuit component, characterized by comprising a heat transfer block 14 for discharging heat.