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JPH0560261B2 - - Google Patents
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JPH0560261B2 - - Google Patents

Info

Publication number
JPH0560261B2
JPH0560261B2 JP59139432A JP13943284A JPH0560261B2 JP H0560261 B2 JPH0560261 B2 JP H0560261B2 JP 59139432 A JP59139432 A JP 59139432A JP 13943284 A JP13943284 A JP 13943284A JP H0560261 B2 JPH0560261 B2 JP H0560261B2
Authority
JP
Japan
Prior art keywords
layout
chip
pads
lsi
buffers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP59139432A
Other languages
Japanese (ja)
Other versions
JPS6116558A (en
Inventor
Tsuneo Inubushi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP59139432A priority Critical patent/JPS6116558A/en
Publication of JPS6116558A publication Critical patent/JPS6116558A/en
Publication of JPH0560261B2 publication Critical patent/JPH0560261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/43Layouts of interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/932Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Description

【発明の詳細な説明】 <技術分野> 本発明はLSIのパツド配置方法に関し、特に計
算機を利用した自動レイアウト方式に従つたLSI
の設計において、チツプ周辺部に位置するパツド
の配置方法に関するものである。
[Detailed Description of the Invention] <Technical Field> The present invention relates to an LSI pad layout method, and particularly to an LSI pad layout method using a computer.
This relates to the method of arranging the pads located around the chip in the design of the chip.

<従来技術> 従来から用いられているLSIのレイアウト設計
の手法には、人手設計によるマニユアルレイアウ
ト方式と計算機による自動レイアウト方式があ
る。
<Prior Art> Conventionally used LSI layout design methods include a manual layout method using manual design and an automatic layout method using a computer.

近年LSIにおけるデザインルールが縮小され、
1チツプに内蔵される素子数が増加しており、開
発期間短縮の点からも人手設計によることが困難
になりつつある。このような背景から現在まで
に、レイアウトの自動化を図るための手法が種々
開発されており、例えば同じ高さのセルのみで構
成するポリセル方式、或いは任意の形状でも可能
なビルデイングブロツク方式等がその代表であ
る。
In recent years, design rules for LSI have been reduced,
The number of elements built into one chip is increasing, and it is becoming difficult to design them manually in order to shorten the development period. Against this background, various methods for automating layout have been developed to date, such as the polycell method, which consists only of cells of the same height, and the building block method, which allows layouts to be arranged in any shape. Representative.

一般に正方形或いは矩形状のLSIチツプは、チ
ツプ内部に論理ゲートやフリツプフロツプ等から
なる機能ブロツク部分が配置され、その周辺部分
には外部端子となるパツド、及び該パツドと上記
機能ブロツクとのインターフエイスとなるバツフ
アが配置される。このような特徴を有するLSIの
レイアウトを自動レイアウト方式で行う場合、パ
ツドが配置されるチツプ周辺部分とこれ以外の内
部部分では夫々配置及び配線の手法が相違する。
従つて従来から行われているレイアウト手法で
は、まずチツプ内部の配置及び配線を実施し、こ
の工程によつて得られた形状を考慮しながら周辺
部分にパツドを配置し、上記内部の機能ブロツク
との間で配線接続を行うレイアウト手法が採られ
ている。
In general, a square or rectangular LSI chip has a functional block part consisting of logic gates, flip-flops, etc. arranged inside the chip, and pads that serve as external terminals and interfaces between the pads and the above-mentioned functional blocks are arranged around the chip. A buffer will be placed. When an automatic layout method is used to layout an LSI having such characteristics, the placement and wiring methods are different between the chip peripheral area where pads are placed and the other internal areas.
Therefore, in the conventional layout method, the internal layout and wiring of the chip are first performed, and the pads are placed around the periphery while taking into account the shape obtained through this process, and the internal functional blocks and A layout method is adopted in which wiring connections are made between the two.

処で配置及び配線の自動化を図るためには、
LSIを構成する機能ブロツク相互の関係を決める
ために論理接続情報が必要である。しかし一般的
に上記配置及び配線のための論理接続情報は、レ
イアウト上で当該セルがどこに配置されるべきか
の情報を含んではいない。そのため内部部分から
配置及び配線を実施する場合には、パツドとの接
続関係を考慮して、当該パツドと内部部分とが互
いにどこで接続されるべきか、つまり内部部分の
配線取り出し口を仮想的に定義しなければならな
い。
In order to automate placement and wiring at
Logical connection information is necessary to determine the relationship between the functional blocks that make up the LSI. However, the logical connection information for placement and wiring generally does not include information on where the cell should be placed on the layout. Therefore, when placing and wiring from the internal part, consider the connection relationship with the pad and determine where the pad and the internal part should be connected to each other, that is, the wiring outlet of the internal part. must be defined.

図はチツプレイアウトを模型的に示す図で、チ
ツプ1の内部部分2に論理機能ブロツク3が配置
され、チツプ周辺部分4にパツド5が配置され、
パツド5を内部部分2と接続するために取り出し
口6が仮想端子として定義される。このような配
線取り出し口6の定義は通常レイアウトを行う段
階で実施されるが、レイアウトが決められた内部
部分を考慮しながらマニユアルによつて行うもの
であるため、レイアウト作業を一旦マニユアル作
業に切り換えねばならず、完全な自動レイアウト
が実施し得ず、計算機による利点を有効に活用し
得ていないという問題があつた。
The figure schematically shows the chip layout, in which a logic function block 3 is arranged in the internal part 2 of the chip 1, a pad 5 is arranged in the peripheral part 4 of the chip,
In order to connect the pad 5 with the inner part 2, an outlet 6 is defined as a virtual terminal. This kind of definition of the wiring outlet 6 is normally carried out at the stage of layout, but since it is done manually while taking into consideration the internal parts for which the layout has been determined, the layout work is temporarily switched to manual work. However, there was a problem in that a completely automatic layout could not be implemented and the advantages of computers could not be effectively utilized.

<発明の目的> 本発明は上記従来の自動レイアウト方式の特に
パツド配置方法における問題点に鑑みてなされた
もので、LSI設計時の論理入力からレイアウトま
でを完全自動化することができるLSIのパツド配
置方法を提供する。
<Object of the Invention> The present invention was made in view of the problems of the conventional automatic layout method, particularly in the pad placement method, and provides an LSI pad placement that can completely automate everything from logic input to layout during LSI design. provide a method.

<実施例> LSIのレイアウト設計において、チツプ内に内
蔵される回路は機能ブロツク毎に分けられ、該機
能ブロツクを単位としてチツプ内で占める位置及
び相互間の配線が決定される。区分された機能ブ
ロツクは、各機能ブロツクがもつ接続端子をもと
に相互の間が関係付けられて配線される。このよ
うな配線及び配置を設定するために論理接続情報
が必要になり、これは論理回路図を用いて示され
る。本実施例は論理接続情報を論理回路図によつ
て表現する過程で、同論理回路図の中にチツプ周
辺に配置すべきパツド及びパツドと論理回路との
インターフエイスになるバツフアに関するレイア
ウト情報をも描いて形成する。即ち、パツド及び
バツフアに関する、例えば次のレイアウト情報が
盛り込まれる。
<Embodiment> In the layout design of an LSI, the circuits built into a chip are divided into functional blocks, and the positions occupied within the chip and the wiring between them are determined with each functional block as a unit. The divided functional blocks are interconnected and wired based on the connection terminals each functional block has. In order to set such wiring and arrangement, logical connection information is required, and this is shown using a logic circuit diagram. In this embodiment, in the process of expressing logical connection information using a logic circuit diagram, layout information regarding pads to be placed around the chip and buffers that serve as interfaces between the pads and the logic circuit is also included in the logic circuit diagram. Draw and form. That is, for example, the following layout information regarding pads and buffers is included.

1 チツプの上下、左右の各辺どこに配置する
か、 2 各辺において各々はどの順序で並べるか、 3 パツド間隔は夫々どの位の距離を話すべき
か。
1. Where should the chips be placed on the top, bottom, left and right sides? 2. In what order should they be placed on each side? 3. How far should the pads be spaced?

上記パツド及びバツフアのレイアウト情報を含
ませて描いた論理回路図に基き、チツプサイズを
最小にすると共に、効率的な相互配線を施こすこ
とができるチツプ内における機能ブロツク、バツ
フア及びパツドのレイアウトが決定される。
Based on the logic circuit diagram drawn including the above pad and buffer layout information, the layout of functional blocks, buffers, and pads within the chip is determined to minimize the chip size and enable efficient interconnection. be done.

上記パツド及びバツフアに関するレイアウト情
報を含んだ論理回路図を作成することにより、従
来の内部部分のレイアウト完成後にパツドを配置
及び配線する方法とは全く逆に、パツド配置を先
に実行し、その後に配線関係が最適になるように
内部部分のレイアウトを実施することが可能とな
り、同時にレイアウト直前に必要とされていた仮
想端子を定義する情報入力が不要になる。
By creating a logic circuit diagram that includes layout information regarding the pads and buffers mentioned above, pad placement can be performed first, and then It becomes possible to layout internal parts so that wiring relationships are optimized, and at the same time, it becomes unnecessary to input information defining virtual terminals, which was required immediately before layout.

<効果> 以上本発明によれば、LSIのレイアウト設計工
程中に作成する論理回路図に、パツド及びバツフ
アのレイアウト上での配置情報を盛り込むことに
より、計算機を利用して自動レイアウトを行う場
合にも、論理入力からレイアウトまで完全自動化
を図ることができる。
<Effects> According to the present invention, information on the placement of pads and buffers on the layout is included in the logic circuit diagram created during the LSI layout design process, thereby making it possible to perform automatic layout using a computer. It is also possible to fully automate everything from logic input to layout.

【図面の簡単な説明】[Brief explanation of the drawing]

図は従来のLSIレイアウト方法を説明するため
の図である。 1……チツプ、2……内部部分、3……機能ブ
ロツク、4……周辺部分、5……パツド。
The figure is a diagram for explaining a conventional LSI layout method. 1... Chip, 2... Internal part, 3... Function block, 4... Peripheral part, 5... Pad.

Claims (1)

【特許請求の範囲】[Claims] 1 機能ブロツクをチツプ中心部分に、パツト及
びバツフアをチツプ周辺部分に位置させてLSIの
レイアウトを決定する方法において、機能ブロツ
ク相互間の接続情報となる論理回路図に、上記パ
ツド及びバツフアのレイアウト情報を併せもたせ
て形成し、該論理回路図に基づき、機能ブロツク
並びにパツド及びバツフアのレイアウトを決定す
ることを特徴とする、LSIのパツド配置方法。
1. In a method of determining the LSI layout by placing the functional block in the center of the chip and the pads and buffers in the periphery of the chip, the layout information of the pads and buffers mentioned above is added to the logic circuit diagram, which is the connection information between the functional blocks. 1. A method for arranging pads for an LSI, characterized in that the layout of functional blocks, pads, and buffers is determined based on the logic circuit diagram.
JP59139432A 1984-07-03 1984-07-03 Arranging method of pad for lsi Granted JPS6116558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59139432A JPS6116558A (en) 1984-07-03 1984-07-03 Arranging method of pad for lsi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59139432A JPS6116558A (en) 1984-07-03 1984-07-03 Arranging method of pad for lsi

Publications (2)

Publication Number Publication Date
JPS6116558A JPS6116558A (en) 1986-01-24
JPH0560261B2 true JPH0560261B2 (en) 1993-09-01

Family

ID=15245055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59139432A Granted JPS6116558A (en) 1984-07-03 1984-07-03 Arranging method of pad for lsi

Country Status (1)

Country Link
JP (1) JPS6116558A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1352988A (en) * 1971-12-30 1974-05-15 Ibm Method for fabricating integrated circuits

Also Published As

Publication number Publication date
JPS6116558A (en) 1986-01-24

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