JPH0561777B2 - - Google Patents

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a semiconductor sealing device.

(Prior Art) In a conventional semiconductor encapsulation device, a lead frame supplied for resin encapsulation and a resin tablet made of solidified resin powder are set into a mold by a transport mechanism (loader), and then the resin is sealed. It is known that it is sealed.

(Problems to be Solved by the Invention) However, the above semiconductor sealing device has the following problems.

Since the resin tablets are fed into the transport mechanism by dropping them from above to a predetermined position within the transport mechanism, the resin tablets, which are simply solidified resin powder, are brittle and often collapse. If the resin tablet collapses, the crushed resin powder contaminates the inside of the semiconductor sealing device. In particular, if it falls onto the lead frame or into the cavity of the mold, there is a problem that a defective product will be formed.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a semiconductor encapsulation device which can prevent damage to resin tablets and prevent the formation of defective products in a clean manner.

(Means for Solving the Problems) In order to solve the above problems, the present invention includes the following configuration.

That is, a placing part on which a resin tablet is placed at a predetermined position, a loader that can reciprocate between the upper part of the placing part and the upper part of the mold that performs resin sealing, and the loader. an accommodating section which is formed into a cylindrical shape with an open lower end surface and is capable of accommodating the resin tablet therein; a push-up mechanism that pushes up and feeds the resin tablet from below into the storage section; and a push-up mechanism that is provided on the loader and opens and closes the lower end surface of the storage section, allowing the resin tablet to enter in the open state, and the push-up mechanism that allows the resin tablet to enter in the closed state. The present invention is characterized by comprising a shutter that allows the resin tablets to pass through but prevents the contained resin tablets from falling, and a drive mechanism for reciprocating the loader.

(effect) The effect will be explained.

The resin tablet is fed from below into a housing provided in the loader by a push-up mechanism. Thereafter, the resin tablet whose shutter closes the housing part is supported within the housing part, so that no impact force or destructive force acts on the resin tablet during feeding and support of the resin tablet. Therefore, since the resin tablet does not collapse, it is possible to prevent staining due to resin powder and the occurrence of defective molded products caused by the staining.

(Embodiments) Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, the configuration will be explained.

FIG. 1 shows a front view of the semiconductor sealing device of this embodiment, and FIG. 2 shows a plan view thereof. To explain the outline of this apparatus, tablets for resin-sealing lead frames are fed from a hopper 10 and aligned at position B (hereinafter referred to as B station). The resin tablets aligned at station B are placed at position A (hereinafter referred to as
The lead frames 14 and the resin tablet are held in the mold 12 by a loader (not shown) at the A station. In the semiconductor sealing apparatus of this embodiment, an example will be given in which four rows of lead frames 14 are simultaneously sealed.

Next, each component will be explained in detail.

FIG. 3 shows a tablet loader 16 for aligning resin tablets at the B station.
The top view of the figure is shown. FIG. 4 is a side view showing a transport mechanism for transporting the tablet loader 16 from the B station to the A station.

The tablet loader 16 has a U-shape in plan, and two rows of eight tablet holders 18 are arranged on the top surface. The tablet holder 18 is formed into a cylindrical shape with both ends open, and is fitted and fixed on the upper surface of the tablet loader 16. Further, the tablet loader 16 is provided with a through hole 22 coaxially with the tablet holder 18 and having a diameter smaller than the inner diameter of the tablet holder 18 and smaller than the resin tablet 20.

Resin tablet 20 inserted from hopper 10
... are inserted into each tablet holder 18 one by one by a suitable dispensing mechanism (not shown). Since the resin tablets 20 have a larger diameter than the through holes 22, they do not fall out from inside the tablet holder 18.

The right end of the tablet loader 16 is connected to a drive section 28 of a rodless cylinder 26 installed on the main body 24.
It is attached to a support part 30 provided in
By supplying air from the end of the cylinder section 32, the drive section 28 can move in the left-right direction. At this time, both side edges of the tablet loader 16 are guided by roller guides 34 provided on the main body 24 on both upper and lower surfaces and side surfaces. When the drive part 28 of the rodless cylinder 26 moves to the right,
The tablet loader 16 also moves to the right together with the support section 30 provided on the drive section 28, allowing the tablet loader 16 to proceed to the A station.

FIG. 5 shows a side view of the A station. The tablet loader 16 is transported to the A station by the transport mechanism described above. The position of the tablet loader 16 at the A station is shown by a two-dot chain line 16a. In the figure, 36 is a push-up mechanism, and a cylinder device 40 whose lower end is fixed on a base 38
It consists of a movable plate 44 fixed to the upper end of the rod 42 of the cylinder device 40, and push-up rods 46 installed on the upper surface of the movable plate 44 with a predetermined gap. The push-up rods 46 are arranged to move upward all at once when the movable plate 44 moves upward due to the extension of the rod 42. The push-up rods 46 are formed to have a smaller diameter than the through holes 22 of the tablet loader 16, and the tablet loader 16 is located at position 1.
6a, the upwardly moved push-up rods 46 can pass through the through-holes 22 and the inside of the tablet holder 18.

Reference numeral 48 denotes a mounting section, and supports 50..., intermediate plate 5
2. The position is fixed with respect to the base 38 via the struts 54... A guide tube 56, which is open at both ends, extends downward from the lower surface of the mounting portion 48. The guide tubes 56 are fitted and fixed in through holes 58 provided in the mounting portion 48. Guide tube 56
The inner diameter of... is formed to a size that allows the resin tablet 20... to pass through. That is, when the tablet loader 16 is at the position 16a, when the push-up bars 46... are moved upward, the push-up bars 46...
Enter inside and push the resin tablet 20 upward. At this time, since the guide tubes 56 are provided to be located directly above the tablet holders 18, the resin tablets 20 pass through the guide tubes 56 and protrude from the upper surface of the mounting section 48. . Furthermore, the lead frames 14 sealed with resin are supplied to the mounting portion 48 from the lead frame supply mechanism 60 shown in FIG. 1 in four rows at predetermined positions. Although not shown, another set of placement units 48 is arranged parallel to the direction perpendicular to the plane of the paper in FIG.

FIG. 6 shows a plan view of the mounting section 48. The lead frames 14 supplied by the lead frame supply mechanism 60 are placed on grooves 62 formed on both sides of the rows of through holes 58 . Notches 64 are carved on both sides of the grooves 62, and these notches 64 are used as escape points through which claws forming the gripping mechanism of the loader, which will be described later, pass when gripping the lead frame 14. It is a notch. When the lead frames 14 are placed on the upper surface of the mounting section 48 and the resin tablets 20 are projected to the upper surface of the mounting section 48 through the through holes 58, these resin tablets 20...
It is necessary to transport the lead frame 14 to the mold 12. A loader is used for this transportation.

In FIG. 7, the loader 66 is connected to the resin tablet 20...
Indicates a state in which . When the loader 66 is positioned above the mounting portion 48, the holding mechanism is capable of holding the resin tablets 20. The holding mechanism will be explained with further reference to FIGS. 8 and 9.

FIG. 8 shows a bottom view of the loader 66, and FIG. 9 shows a plan view of the internal structure of the loader 66. On the lower surface of the loader 66, eight sets of frame portions 70, which are an example of a housing section, are provided in two rows in parallel, each having four rods 68 hanging thereon so that the resin tablets 20 can pass therethrough. The frame portion 70 is formed into a cylindrical shape with an open lower end surface, and has the resin tablet 20 inside.
It is now possible to accommodate.

72... are shutters, each with 8 holes 7
4... are transparently provided at the same intervals as the intervals of the frame parts 70...
It is a plate-like body. The holes 74 are formed with protrusions 76 that protrude inward. When the shutter 72 moves to the right by the length of the protrusion 76 with the push-up rod 46 pushing the resin tablet 20 into the frame 70 as shown in FIG. It becomes possible to support the resin tablets 20 from below, and even if the push-up rods 46 move downward, the resin tablets 20 are held by the loader 66. A drive mechanism for driving the shutters 72 in the left-right direction is shown in FIG. Shutter 72... Pin 78... installed upright on the top surface passes through elongated hole 80... and loader 6
It protrudes from the top of 6. These pins 78... have rotating pieces 84 that can be rotated in a plane via shafts 82...
One end is slidably hooked, and the rotating piece 8
4. The tip of a rod 88 of a cylinder device 86 fixed to the upper surface of the loader 66 is slidably hooked to the other end. Therefore, as the rods 88 expand and contract, the shutters 72 are driven in the left-right direction. Note that the side edges of the shutters 72 are supported and guided by hook members 90 to prevent them from falling downward. The loader 66, which holds the resin tablets 20 by housing the resin tablets 20 in the frames 70 and closing the shutters 72, moves the resin tablets 20 to the mold 12.
The resin tablets 20 are transported into the mold 12 by opening the shutters 72 and dropping the resin tablets 20 into the mold 12.
At this time, the resin tablets 20 are surely dropped by pushing the protruding rods 92 into the frame 70 from above. The ejection mechanism will be explained with reference to FIGS. 10 and 11.
The upper ends of the protruding rods 92 are fixed to a movable plate 94. The upper end of the inverted L-shaped link 96 is fixed to the movable plate 94, and the lower end is slidably hooked to a rotation link 100 that is rotatable about a shaft 98.
Further, the tip of the rod 104 of the cylinder device 102 is pivotally attached to the rotation link 100 by a shaft 106. Therefore, the rod 106 of the cylinder device 102
As the movable plate 94 expands and contracts, the movable plate 94 moves up and down, and the protruding rods 92 can also move up and down accordingly.

Next, the gripping mechanism for the lead frames 14 will be explained. In FIG. 8, numerals 108 are claws serving as a gripping mechanism, and are provided to grip the lead frames 14 on the mounting portion 48. that claw 1
The opening/closing movement mechanism of No. 08 will be explained with reference to FIG. 11. The claws 108 are rotatably attached to a shaft 110 fixed to the loader main body. However, the claws 108 are always urged in the closing direction by the pushing members 114 attached upwardly to the springs 112. Cylinder device 116
When the rods 118 push the bases 120 of the claws 108 downward against the biasing force of the springs 112, the claws 108 rotate around the shafts 110 and open. There is. In this way, the claws 108 of the loader 66 are connected to the lead frames 14...
It is now possible to grasp the

The loader 66 holds the lead frames 14 and the resin tablets 20 above the mounting section 48,
When releasing them on the mold 12, it is necessary to move the loader 66 itself up and down. The vertical movement mechanism will be explained with reference to FIG.

122 is a cylinder device, and its lower end is fixed to a connecting portion 124 that fits into a guide rail (described later) for reciprocating the loader 66 from above the mounting portion 48 to above the mold 12. Since the guide rail (described later) is fixed to the main body, the height position of the cylinder device 122 is constant. The upper end of the rod 126 of the cylinder device 122 is connected to the loader 6.
It is fixed to the frame 128 of No. 6, and the rod 126
The loader 66 can move up and down by expanding and contracting.

Next, a drive mechanism for reciprocating the loader 66 between the upper part of the mounting part 48 and the upper part of the mold 12 will be explained with reference to FIGS. 12 and 13.
The aforementioned connecting portion 124 is provided on one side of the loader 66, and is fitted into a fixed rail 130 so as to extend in the reciprocating direction of the loader 66. That is, the concave groove 136 of the fitting piece 134 provided on the outer side of the connecting portion 124 is slidably fitted into the protruding strip 132 provided protrudingly on the inner wall surface of the rail 130. As a result, the loader 66 The rail 130 is guided along the length of the rail 130. A cylinder device 138 fixed to the main body 140 serves as a driving means for reciprocating the loader 66.
The tip of the rod 140 is fixed to the connecting portion 124, and as the rod 140 expands and contracts, the loader 66 reciprocates.

Next, the operation of this semiconductor sealing device will be explained. When the resin tablets 20 are loaded from the hopper 10, the resin tablets 20 are inserted one by one into the tablet holders 18 of the tablet loader 16 by a distributing mechanism (not shown).

The rodless cylinder 26 is driven, and the drive unit 2
8 is driven in the direction of arrow A, the tablet loader 16 advances in the direction of arrow A (towards A station).

When the tablet loader 16 is located at a predetermined position 16a of the A station, the cylinder device 40 is driven, and the push-up rods 46 push up the resin tablets 20 to project them onto the placing section 48. At the same time, the lead frame 1 is supplied from the lead frame supply mechanism 60.
4... are sent to a predetermined position on the mounting section 48.

At this time, the cylinder device 122 of the loader 66, which is waiting above the loading section 48, is moved downward.
The resin tablet 20... enters the frame portion 70..., and the shutter 72... is closed by driving the cylinder device 86.... When the shutters 72 are closed, the cylinder device 40 lowers the push-up rods 46. On the other hand, the cylinder device 116 is driven to open the tips of the claws 108 and grip the lead frames 14 on the mounting section 48. The resin tablets 20 are housed and held in the frames 70, and the lead frames 14 are held in the claws 108.
When the loader 66 is gripped by the cylinder device 122, the loader 66 is raised by driving the cylinder device 122. When a predetermined height is reached, the cylinder device 138 is driven and the loader 66
is moved along the rail 130 to above the mold 12.

When the loader 66 reaches above the mold 12, the cylinder device 122 is driven and the loader 66 is lowered. Then, the cylinder device 116 is driven and the claws 108...
is opened and the lead frames 14 are set in the mold 12. At the same time, the cylinder devices 86 are driven, and when the shutters 72 are opened, the resin tablet 20 is opened.
... is also set into the mold 12.

Resin tablet 20... and lead frame 14...
When the loader 66 is set, the loader 66 rises and returns above the mounting portion 48 again in preparation for the next cycle. During this time, the mold 12 is closed, and the lead frame 14...
Resin sealing is performed.

Although various preferred embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and it goes without saying that many modifications can be made without departing from the spirit of the invention. be.

(Effects of the Invention) When the semiconductor sealing device according to the present invention is used, a resin tablet is fed from below into a housing provided in a loader by a push-up mechanism. After that, when the shutter closes the housing part, the resin tablet is supported within the housing part, so that during the feeding and support of the resin tablet, there is no impact force on the resin tablet.
Since no destructive force is applied, even fragile resin tablets will not collapse. Therefore, it is possible to reliably prevent staining of the inside of the apparatus due to falling resin powder and occurrence of molding defects due to falling resin powder.

Particularly, since the resin tablet is held in the storage part while being supported by a shutter, the resin tablet does not collapse during holding even if there is some variation in the size of the resin tablet.

[Brief explanation of the drawing]

Figure 1 is a front view of the semiconductor device of this embodiment, Figure 2 is a front view of the semiconductor device of this embodiment;
3 is a plan view of the tablet loader, FIG. 4 is a side view showing the transport mechanism of the tablet loader, and FIG. 5 is a side view showing the push-up mechanism.
Fig. 6 is a plan view of the loading section, Fig. 7 is a side view showing the state in which the resin tablet is fed into the loader, Fig. 8 is a bottom view of the loader, and Fig. 9 is a plan view showing the internal structure of the loader. Fig. 10 is a partial side view showing the internal structure of the loader, Fig. 11 is a partial front view thereof, Fig. 12 is a partial front view showing the drive mechanism of the loader, and Fig. 13 shows the vicinity of the rail. Partial side view. 12...Mold, 14...Lead frame, 20
... Resin tablet, 36 ... Push-up mechanism, 48 ...
...Placement section, 66...Loader, 72...Shutter,
108...Claw, 130...Rail, 138...Cylinder device.

Claims (1)

[Scope of Claims] 1. A mounting part on which a resin tablet is placed at a predetermined position, and a mounting part that is capable of reciprocating between the upper part of the mounting part and the upper part of a mold that performs resin sealing. a loader; a housing part provided on the loader and formed in a cylindrical shape with an open lower end surface and capable of accommodating the resin tablet therein; when the loader is positioned above the placement part;
a push-up mechanism for pushing up the resin tablet from below into the storage section from the mounting section; a push-up mechanism provided on the loader that opens and closes a lower end surface of the storage section, and allows the resin tablet to enter in the open state; A semiconductor encapsulation device comprising: a shutter that allows passage of the push-up mechanism in a closed state but prevents a housed resin tablet from falling; and a drive mechanism that causes the loader to reciprocate. .