JPH0561781B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC testing socket used for testing and measuring ICs.

[Conventional technology]

In recent years, with the mass production of ICs, various types of IC testing sockets have been provided and used.
SOP (Small Outline Package) type
There is something called an IC socket that has excellent features. To briefly explain this with reference to FIGS. 7 and 8, 1 is a socket body having a central protrusion 1a, guide holes 1b and slits 1c arranged symmetrically on the left and right; The terminal portion 2b is inserted through the base portion 2a and extends downward from the base portion 2a and protrudes from the lower surface of the socket body 1.
and extending upward from the base 2a to be inspected.
A contact pin is provided with a pair of clamping pieces 2c and 2d having a tip capable of clamping the lead terminal L of the IC package P, and 3 is a protrusion that is slidably inserted into the guide hole 1b and projects from the clamping piece 2d. 2d
It is an integral release body in which a pressing piece 3a having an inclined lower end surface that slides on is hung symmetrically, and when this releasing element 3 is pushed down, the inclined lower end surface of the pressing piece 3a presses the protrusion 2d' to release the clamping piece 2d. is bent against its tendency to the position shown by the chain line to allow loading of the IC package P, that is, placing the lead terminal L on the top surface of the clamping piece 2c, and when the pressure of the release body 3 is released. The clamping piece 2d pushes up the release body 3 with its own elasticity, returns to the position shown by the solid line, and clamps the lead terminal L with the tips of the integrated clamping pieces 2c and 2d, and loads the IC package P into the socket body. configured to complete.

[Problem that the invention seeks to solve]

By the way, when inspecting a high-density IC package using the IC inspection socket with the above structure,
Since the pitch width of the lead terminal L is narrow, for example, about 0.5 mm, the mechanical strength of the lead terminal itself must be small.
There was a problem in that the risk of deformation or damage when being held by the handles c and 2d increased.

In view of these circumstances, the present invention aims to solve the problem of high density
An object of the present invention is to provide a socket for IC inspection that does not cause deformation or damage to lead terminals even in the case of an IC package.

[Means and actions for solving problems]

The IC testing socket according to the present invention includes a socket body having a base on which the lead terminals of an IC package are placed, and a socket for inserting the lead terminals inserted into the socket body and placed on the base from above. and a contact pin formed with a contact piece that can be pressed with elasticity. Therefore, not only will the lead terminals not be bent or the contact surfaces damaged during mounting, but also the contact pins can be reliably contacted.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 to 6. Reference numeral 10 denotes a socket having a rectangular base 11 protruding from its center on which an IC package P is placed. The main body 12 is partitioned by arranging partition plates 13 having a wall thickness of 0.25 mm, for example, extending from each side of the base 11 to the end of the lower part 10a formed on each side of the socket main body 10. Slits 14a, 14b, and 14c having a width matching the pitch width of the terminal L are the socket body 1.
These are first to third insertion holes for mounting contact pins 33, which will be described later, which are bored on the slit 12 in the lower part 10a of the slit 12. The second insertion hole 14b is formed in each slit, and the third insertion hole 14c is formed in every second slit of each slit 12, and the third insertion hole 14c is formed on the slit that is shifted two places upward in FIG. 3 with respect to the first insertion hole 14a. . 15 is a guide protrusion; 16 is a pair of arms extending along opposing sides of the socket main body 10 and having a hook 16a at the tip for engaging a release body 20 to be described later; 17;
is the upper surface of the socket body 10.

20 is the arm 16,1 of the socket body 10 on both sides.
The contact pin 3 has protrusions 21, 21 that engage with the hooks 16a, 16a formed in the contact pin 3.
A release member 20a is a recess formed on each side of the release member 20 corresponding to the lower part 10a of the socket main body 10. , 22 is the recess 20
A pushing part 24 is formed in a shape and has a row of notches 23 for preventing the pushed pieces 33b from coming into contact with each other. This is the bottom surface of the release body 20.

30, 31, and 32 are three types of contact pins having similar shapes with different base shapes as described later; 33
is a general term for the three types of contact pins 30, 31, and 32, 33a is the base of the contact pin disposed in the slit 12 of the socket body 10, and 33b is the base extending from one end of the base 33a and exerting elasticity in the left rotation direction in FIG. The release body 20 extends toward the other end of the base 33a via the elastic curved portion 33c.
The pressed piece 33d, which enters the notch 23 and presses the pushing part 22 upward, extends in the opposite direction from the middle of the pressed piece 33b and exerts elasticity in the direction of pressing the lead terminal L. These contact pieces have a common shape to each contact pin 30, 31, 32. 30a extends downward from the end of the base 33a of the contact pin 30 on the side where the elastic curved portion 33c is located, and is inserted into the first insertion hole 14 of the socket body 10.
The external terminal inserted in a, 30b is the base 33a
A second insertion hole 14 extending downward from the center of
The fixing piece 31a inserted into the contact pin 31b extends downward from the center of the base 33a of the contact pin 31 and is integrally formed with the fixing piece 31b.
0 fixing piece 30b is inserted into the second insertion hole 14b.
The external terminal inserted into the insertion hole 14b next to 3
2a is an external terminal extending downward from the other end of the base 33a of the contact pin 32 and inserted into the third insertion hole 14c; 32b is a second external terminal extending downward from the center of the base 33a of the contact pin 33 in the same row; This is a fixed piece inserted into the insertion hole 14b, and each contact pin 30, 31, 32 is inserted into each slit in this way repeatedly. The base 33a, the external terminal 30a and the fixing piece 30b are used as the base of the contact pin 30, and the contact pin 3
1 and 32 are similarly formed.

The IC testing socket according to this embodiment has the above structure, and its operation will be explained next.

First, when the upper surface of the release body 20 is pressed, the pressed pieces 33b of the contact pins 33 inserted into the respective slits 12 of the lower part 10a formed on each side of the socket body 10 are pressed against the elastic curved parts 33c. The release body 20 is pushed by the pushing part 22 of the notch 23 against the elasticity of the protrusion 21 and the socket body 1.
0 disengages from the hook 16a and descends, and the contact side 33d rotates in a direction to release the pressure on the lead terminal L and leaves the base 11. The pressing operation of the release body 20 is such that the lower surface 24 is connected to the upper surface 17 of the socket body 10.
Since the contact pin 33 is stopped at the position where it abuts, no more load than necessary is applied to the contact pin 33. At that position, place the IC package P on the base 11 along the guide protrusion 15, and then place the release body 2.
If you release the pressure to 0, contact pin 3
3, due to the elasticity of the elastic curved portion 33c, the pushed piece 33b pushes up the pushing portion 22 and engages the protrusion 21 of the release body 20 with the hook 16a again, and the contact side 33d also pushes the lead terminal L. Rotate in the direction of pressing and connect the lead terminal L of the IC package P.
The IC package P is locked by pressing the upper part of the IC package P. This allows the IC package P to be inspected, but the adjacent contact pins 3
0, 31, 32 external terminals 30a, 31a, 3
2a are first to third insertion holes 14 in different rows;
Since the external terminals are inserted into terminals a, 14b, and 14c and arranged in a row, there is no risk that adjacent external terminals will come into contact with each other even if it is for a high-density IC package. Then, insert the IC package P into the socket body 2.
To remove the contact pin 33 from the contact piece 3 of the contact pin 33, press the release body 20.
3d rotates against the elasticity of the elastic curved portion 33c, separates from the lead terminal L, and releases the pressure, so that it can be easily removed and replaced. Here, the release body 20 and the pressing portion 22 constitute a release means.

Further, in the embodiment, the first insertion hole 14a and the third insertion hole 14c are bored every two slits 12, but they may be continuously bored in each slit like the second insertion hole 14b.

In this way, the IC package P is attached to and detached from the IC inspection socket, but according to this embodiment,
The IC testing socket has a structure in which the contact piece 33d such as the contact pin 33 presses the lead terminal L of the IC package P placed on the base 11 from above, so that contact is reliable and the lead terminal L can be folded. It has the advantage that there is no risk of bending, deformed lead terminals can be corrected during mounting, and there is no risk of damaging the lower surface of the lead terminal L. In addition, since the partition plate 13 of the socket body 10 does not protrude from the base 11 by a small amount, the wall thickness can be reduced to 0.25 mm, and the pitch width of the lead terminal L can be narrowed to achieve high density.
It is suitable for IC packages and can improve injection molding accuracy. Furthermore, the release body 20
It is easy to attach the contact pin 33 to the socket body 10, and since the pressed piece 33b of the contact pin 33 also acts as a resilient member of the release body 20, the device can be assembled quickly with a small number of parts. .

〔Effect of the invention〕

As described above, the present invention allows for reliable insertion without the risk of deforming or damaging the lead terminals of the IC package when mounting the IC package in the socket body, and also allows deformed lead terminals to be removed during mounting. It can also be straightened and is particularly useful as a test socket for high-density IC packages.

[Brief explanation of drawings]

1 to 6 show an embodiment of the IC testing socket according to the present invention, in which FIG. 1 is a vertical sectional view of the main part, and FIG. 2 is a vertical sectional view of the socket body and release body. Figure 3 is a partial sectional view of the socket body showing the contact pin insertion hole, Figure 4 is a perspective view showing the arrangement of the contact pins, and Figure 5 is a main part for explaining the operation of the contact pins. 6 is a schematic plan view showing an IC package mounted on the socket body, FIG. 7 is a longitudinal sectional view of a conventional IC socket, and FIG. 8 is a plan view of the same. 10...Socket body, 11...Base, P...
IC package, L...lead terminal, 12...slit, 20...release body, 30, 31, 32...
Contact pin, 33b...Pushed piece, 33d...
...Contact piece.

Claims (1)

[Claims] 1 A socket body provided with a base on which the lead terminals of the IC package are placed, a base inserted into the socket body, a pushed piece extending from the base via an elastic curved part, and the pushed piece. A contact having a contact piece branching from the pushing piece and extending in a direction opposite to the pushed piece and capable of pressing a lead terminal placed on the base with the elasticity of the elastic curved part. An IC testing socket comprising a pin and a release means that comes into contact with the pressed piece and can release the pressure on the lead terminal by the contact piece.