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JPH0567184B2 - - Google Patents
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JPH0567184B2 - - Google Patents

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Publication number
JPH0567184B2
JPH0567184B2 JP62070526A JP7052687A JPH0567184B2 JP H0567184 B2 JPH0567184 B2 JP H0567184B2 JP 62070526 A JP62070526 A JP 62070526A JP 7052687 A JP7052687 A JP 7052687A JP H0567184 B2 JPH0567184 B2 JP H0567184B2
Authority
JP
Japan
Prior art keywords
electromagnetic
probe
radiator
map
electromagnetic radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62070526A
Other languages
Japanese (ja)
Other versions
JPS62237363A (en
Inventor
Rarufu Guuretsuto Richaado
Kishito Zabieru Sutanirasu
Resurii Guriinfuiirud Reimondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Publication of JPS62237363A publication Critical patent/JPS62237363A/en
Publication of JPH0567184B2 publication Critical patent/JPH0567184B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G01R31/002Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/08Measuring electromagnetic field characteristics
    • G01R29/0807Measuring electromagnetic field characteristics characterised by the application
    • G01R29/0814Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、印刷回路板及び同様な回路パツケー
ジにおいて電磁放射(electromagnetic
emission)の高レベル源を見付けるための方法
及び装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The invention relates to the field of electromagnetic radiation in printed circuit boards and similar circuit packages.
The present invention relates to a method and apparatus for locating high level sources of radiation.

従来の技術及び発明が解決しようとする問題点 多くの国における通信規制当局は、認可無線通
信への電磁干渉を防止するために、計算装置及び
他のデジタル装置からの電磁放射が制限されるこ
とを必要とする規制を導入した。例えば、米国に
おいては、連邦通信委員会は、検査方法及び制限
を規定するFCC(米国連邦通信委員会)規則のパ
ート15、サブパートJを導入した。
PRIOR ART AND THE PROBLEM SOLVED BY THE INVENTION Telecommunications regulatory authorities in many countries require that electromagnetic emissions from computing devices and other digital devices be limited to prevent electromagnetic interference with licensed wireless communications. introduced regulations requiring For example, in the United States, the Federal Communications Commission has introduced Part 15, Subpart J of the FCC Rules, which provides testing methods and limitations.

問題点を解決するための手段 放射を制限する1つの方法は、フアラデー箱
(Farady cage)として作用する遮蔽囲い内に装
置を取り付けることによつて行われる。これは、
遮蔽が囲い開口又は外部電気接続を通る電磁漏れ
によつて危険にさらされないことを保証するため
の多数の処理のために、高価であることがわか
る。このように、電気的結合パネルへの特殊伝導
ガスケツト、及び装置を出るすべての配線の無線
周波数フイルターが必要とされる。長期的にみて
より安価な方法は、装置内のいろいろな電気的・
電子的部品が、実際、高レベルの電磁放射を生成
しないことを保証することである。従つて、回路
板設計における重要な手段は、動作回路板からの
電磁放射を容易にかつ正確に捜し出し且つ測定す
るための方法である。
Means for Solving the Problem One method of limiting radiation is by mounting the device within a shielded enclosure that acts as a Farady cage. this is,
This proves to be expensive due to the numerous treatments required to ensure that the shielding is not compromised by electromagnetic leakage through enclosure openings or external electrical connections. Thus, special conductive gaskets to the electrical bonding panels and radio frequency filters of all wiring exiting the device are required. A cheaper method in the long run is to
The goal is to ensure that electronic components do not actually generate high levels of electromagnetic radiation. Therefore, an important tool in circuit board design is a method for easily and accurately locating and measuring electromagnetic emissions from active circuit boards.

既知のシステムを使用して、試作回路板パツケ
ージが、電磁干渉の全くない無反響室のような環
境に置かれる。それから、監視装置が、著しい電
磁放射を確めるために回路板又は装置に対し間隔
をへだてた関係に組立られる。
Using known systems, a prototype circuit board package is placed in an anechoic chamber-like environment free of any electromagnetic interference. A monitoring device is then assembled in spaced relation to the circuit board or device to ascertain significant electromagnetic emissions.

これは、実際に、回路板において電磁放射がど
こで高いかを正確に決定するのに役立たない。こ
れに対して、さらに局所化された監視装置が必要
とされる。
This does not actually help in determining exactly where electromagnetic radiation is high on the circuit board. In contrast, more localized monitoring devices are required.

本発明の一見地によれば、電磁放射体をテスト
する電磁放射体テスト装置において電磁放射体に
近接し既知の空間配置を有する所定の位置に配置
され、電磁放射体からの電磁放射に応じて電気出
力を供給するプローブ手段と、特定のプローブ手
段を順次アドレスするためのプローブ選択手段
と、プローブ手段からの電気出力を解析し、電磁
放射レベルの測定値を得る解析手段と、解析手段
で得られた測定値から、放射体に近接する各所定
位置における電磁放射レベルを表わすマツプを作
成するマツプ作成手段とを備えている。
According to an aspect of the present invention, in an electromagnetic radiator test device for testing an electromagnetic radiator, the electromagnetic radiator is arranged at a predetermined position having a known spatial arrangement in close proximity to the electromagnetic radiator, and probe means for providing an electrical output; probe selection means for sequentially addressing particular probe means; analysis means for analyzing the electrical output from the probe means to obtain a measurement of an electromagnetic radiation level; and map creation means for creating a map representing the electromagnetic radiation level at each predetermined position near the radiator from the measured values.

好ましくは、電磁放射体をテストする電磁放射
体テスト装置において、プローブ手段は少なくと
も一つのワイヤループ及びダイオードを有し、こ
れらのワイヤループ及びダイオードはプローブ選
択手段からの対応する行及び列導体間に直列に接
続される。
Preferably, in an electromagnetic radiator test device for testing electromagnetic radiators, the probe means comprises at least one wire loop and diode, which wire loop and diode are connected between corresponding row and column conductors from the probe selection means. connected in series.

好ましくは、電磁放射体をテストする電磁放射
体テスト装置において、マツプ作成手段は、所定
位置の既知の空間配置に対応して作成されたマツ
プを表示し、各測定値は関連する所定位置に対応
するマツプ上の位置に表示される。
Preferably, in an electromagnetic radiator testing device for testing electromagnetic radiators, the map creation means displays a map created corresponding to a known spatial arrangement of predetermined positions, each measurement value corresponding to an associated predetermined position. displayed on the map.

本発明の他の見地によれば、電磁放射体をテス
トする電磁放射体テスト装置は、さらに、基準放
射体から前もつて得られた電磁放射レベルの基準
レベルデータのマツプを含む手段と、電磁放射レ
ベルの測定値と前記基準レベルデータとを比較し
それらの差を供給するための手段とを含む。
According to another aspect of the invention, an electromagnetic radiator test apparatus for testing an electromagnetic radiator further comprises means including a map of reference level data of electromagnetic radiation levels previously obtained from a reference radiator; and means for comparing radiation level measurements and said reference level data and providing a difference therebetween.

実施例 本発明の実施態様を、添付図面を参照して以下
に実施例によつて説明する。
Examples Embodiments of the invention will be explained below by means of examples with reference to the accompanying drawings.

図面を詳細に参照すると、第1図は電磁放射走
査システムのブロツク図を示している。このシス
テムは、復号器・ドライバー回路12によつて駆
動されるプローブ配列(probe array)10、測
定受信器14、信号プロセツサー16、制御器1
8、そして視覚表示装置20を有する。プローブ
配列は、平面状格子配置の所定の位置に配置され
たプローブ22の形態の一連のプローブ手段を有
する。
Referring in detail to the drawings, FIG. 1 shows a block diagram of an electromagnetic radiation scanning system. The system includes a probe array 10 driven by a decoder and driver circuit 12, a measurement receiver 14, a signal processor 16, and a controller 1.
8, and a visual display device 20. The probe array comprises a series of probe means in the form of probes 22 arranged at predetermined positions in a planar grid arrangement.

第2図に示されるように、プローブ配列は、多
層プリント回路板50によつて支持されている。
各プローブは、2つの直列接続のワイヤ・ループ
24,26から成り、このワイヤ・ループは(図
示されたように水平な)配列のテストされる電磁
放射体が置かれるプリント回路板の表面に互いに
直交して取り付けられる。電流は、ループの平面
に垂直な方向の電磁束に比例して各ループに誘導
される。各ループの領域は、プローブ感度に対し
て必要とされる大領域と走査装置の分解能を増大
させるためにより多くのプローブが配列にパツク
されることを可能にする小領域との間の中間
(compromise)である。適切な中間領域は、0.04
平方インチ(約0.256cm2)である。クロスしたプ
ローブが、全方向特性を提供するために使用され
る。
As shown in FIG. 2, the probe array is supported by a multilayer printed circuit board 50.
Each probe consists of two series-connected wire loops 24, 26, which are connected to one another on the surface of a printed circuit board on which an array (horizontal as shown) of the electromagnetic radiators to be tested is placed. Can be mounted orthogonally. A current is induced in each loop proportional to the electromagnetic flux in a direction perpendicular to the plane of the loop. The area of each loop is intermediate between the large area required for probe sensitivity and the small area that allows more probes to be packed into the array to increase the resolution of the scanning device. ). A suitable intermediate region is 0.04
square inch (approximately 0.256 cm 2 ). Crossed probes are used to provide omnidirectional properties.

本実施態様には記載されていないが、他のルー
プに垂直に取付けられた更に他のループが、配列
の面に垂直な電磁放射を測定するために使用され
る。単一ループが、単一方向における測定のため
に使用されることができる。
Although not described in this embodiment, yet another loop attached perpendicular to another loop is used to measure electromagnetic radiation perpendicular to the plane of the array. A single loop can be used for measurements in a single direction.

テストされる回路板パツケージ39は、走査配
列に接近して配置され、その結果、板導体
(broard conductor)41内の電流によつて生成
された磁場の変化は、プローブ22内に対応する
電流を誘導する。これらの誘導電流は、受信器1
4によつて測定される。プローブの配列は、復号
器・ドライバー回路12R,12Cを使用して電
子的に走査され、また、各プローブは更に受信器
に接続される。
The circuit board package 39 to be tested is placed in close proximity to the scanning array so that changes in the magnetic field produced by the current in the broad conductor 41 cause a corresponding current in the probe 22. Induce. These induced currents are
Measured by 4. The array of probes is electronically scanned using decoder and driver circuits 12R, 12C, and each probe is further connected to a receiver.

標準的に、電磁放射走査は、ある範囲の周波数
に対して行われる。優先権は、最高速の反復速度
を有する板(board)におけるこれ等の信号に与
えられる。特定の応用の範囲内に入る信号高調波
(harmonic)周波数のみが、考慮される必要があ
る(例えば、FCCパート15J必要要件に対しては
30MHzから1000MHzである)。あるいはまた、回
路板の全無線周波数発散放射は、ある距離を離し
て置かれた無線受信器とアンテナを使用して従来
の手段によつて測定され、そして最高振幅を有す
る放射の周波数が板走査に対して選択される。
Typically, electromagnetic radiation scanning is performed over a range of frequencies. Priority is given to those signals on the board with the fastest repetition rate. Only signal harmonic frequencies that fall within the scope of a particular application need to be considered (e.g., for FCC Part 15J requirements)
30MHz to 1000MHz). Alternatively, the total radio frequency divergent radiation of the circuit board is measured by conventional means using a radio receiver and antenna placed a distance apart, and the frequency of the radiation with the highest amplitude is determined by scanning the board. selected for.

最初に、受信器14は、電磁放射が測定される
特定の周波数に対して同調される。アドレスされ
るプローブ22に誘導される電流は、受信器の終
端入力インピーダンスに電圧を発生する。受信器
は可変帯域幅、例えば10KHzと120KHz、及び異
なる周波数において電磁放射を測定するために選
択可能な(ピーク又は平均)検出レベル
(detection level)を有する。
Initially, receiver 14 is tuned to the particular frequency at which electromagnetic radiation is to be measured. The current induced in the addressed probe 22 generates a voltage across the receiver's terminating input impedance. The receiver has a variable bandwidth, for example 10KHz and 120KHz, and a selectable (peak or average) detection level to measure electromagnetic radiation at different frequencies.

受信器の出力は、信号プロセツサー16に送ら
れ、そこで制御器18への入力に適切な形成にデ
ジタル化される。
The output of the receiver is sent to a signal processor 16 where it is digitized into a form suitable for input to a controller 18.

制御器18は、所定の順序で縦列配列のプロー
ブ22をアドレスするような必要なハウスキーピ
ング(housekeeping)・タスクを実行する。それ
はまた、周波数、帯域幅、及び検出モード(振幅
又は周波数変調)のような受信器のパラメーター
を設定する。さらに、それは、受信器からの信号
のデジタル化において信号プロセツサー16に命
令する。最後に、制御器18は、表示されるマツ
プが等高線又は色形式で必要とされるか否かに従
つて視覚表示装置20への入力用データをフオー
マツトする。
Controller 18 performs necessary housekeeping tasks such as addressing the columns of probes 22 in a predetermined order. It also sets receiver parameters such as frequency, bandwidth, and detection mode (amplitude or frequency modulation). Additionally, it directs the signal processor 16 in digitizing the signal from the receiver. Finally, controller 18 formats the data for input to visual display 20 according to whether the displayed map is required in contour or color format.

各プローブ22の選択は、ダイオード行列
(matrix)配置により達成される。たとえば、
D16(第1図)においては、スイツチング又は
PINダイオード29が各プローブにおけるループ
に直列に接続される。横の行/縦列の交点におけ
る特定プローブは、正電圧を縦列32の1つに、
そして関連ダイオード29をオンさせるために負
電圧を適当な横の行30に適用することによつて
選択される。選択されたプローブ、例えば第1図
の参照番号22で示したプローブ、において誘導
される電流は、横の行30にそつて左にD24と
C20を通過しコレクタバス34と受信器14に流
れる。選択されたプローブ22から測定受信器1
4へと続くパス(path)は、制御されたインピ
ーダンス、典型的には50オーム、である。20MHz
を超える高周波数においては、各横の行30の長
さは波長の評価可能(appreciable)部分となる。
信号反射からの受信信号における変動を避けるた
めに、横の行30は伝送線の特性インピーダンス
に等しいR9〜R12のようなインピーダンス、典
型的には50オーム、によつて終端される。
Selection of each probe 22 is accomplished by a diode matrix arrangement. for example,
In D16 (Fig. 1), switching or
A PIN diode 29 is connected in series with the loop in each probe. A particular probe at the horizontal row/column intersection places a positive voltage on one of the columns 32;
and is selected by applying a negative voltage to the appropriate horizontal row 30 to turn on the associated diode 29. The current induced in a selected probe, such as the probe designated by reference numeral 22 in FIG.
C20 and flows to collector bus 34 and receiver 14. From the selected probe 22 to the measurement receiver 1
The path leading to 4 is of controlled impedance, typically 50 ohms. 20MHz
At high frequencies above , the length of each horizontal row 30 becomes an appreciable portion of the wavelength.
To avoid variations in the received signal from signal reflections, the horizontal rows 30 are terminated by impedances, such as R9-R12, equal to the characteristic impedance of the transmission line, typically 50 ohms.

信号は、ストリツプライン36を介してプロー
ブ22から送られ、また、ストリツプラインは反
復する間隔、典型的には0.3インチ(約7.6mm)毎
にバイアス41によつて上方及び下方接地面38
に結合された側面接地トラツク37を有する。各
プローブ中のダイオードのアノード端は、C1〜
C16のようなコンデンサにより交流的に接地され
ている。これは、高い自己共振周波数を提供する
表面取り付け型のコンデンサーである。
Signals are sent from probe 22 via stripline 36, which is connected to upper and lower ground planes 38 by bias 41 at repeating intervals, typically every 0.3 inches.
It has a side ground track 37 coupled to the lateral ground track 37. The anode end of the diode in each probe is C1~
It is AC grounded by a capacitor like C16. This is a surface-mounted capacitor that provides a high self-resonant frequency.

プローブの選択のための制御信号は、多層プリ
ント回路板50の下方層40,42に送られる。
使用においては、印刷回路パツク39は、プロー
ブ配列の頂部にトラツク側を下(部品側を上)に
して配置されるが、しかし電気的短絡を防ぐため
に薄い絶縁層44によつてプローブから分離され
る。テスト中の印刷回路パツクは、標準の動作に
おいて期待される信号と供給電圧を受ける。それ
から、配列は、一度に1つのプローブが走査さ
れ、そして各プローブからの出力の大きさが、受
信器14において測定される。それから、受信器
の出力が信号プロセツサ16で処理され、そして
制御器18に送られる。メモリ・マツプが制御器
において生成され、そして特定の板に対するコン
ピユータ援用設計(computeraided design)
(CAD)データと重ね合せて表示される。データ
は、いろいろなレベルの電磁放射を異なる色又は
異なる等高線として示すようにフオーマツトされ
る。結局、高放射レベルの原因となる回路要素が
識別できる。
Control signals for probe selection are sent to lower layers 40, 42 of multilayer printed circuit board 50.
In use, printed circuit pack 39 is placed track side down (component side up) on top of the probe array, but separated from the probe by a thin insulating layer 44 to prevent electrical shorting. Ru. The printed circuit pack under test receives the expected signals and supply voltages in normal operation. The array is then scanned one probe at a time and the magnitude of the output from each probe is measured at receiver 14. The receiver output is then processed by signal processor 16 and sent to controller 18. A memory map is generated in the controller and computer aided design for a particular board.
(CAD) data is displayed. The data is formatted to show different levels of electromagnetic radiation as different colors or different contours. Eventually, the circuit elements responsible for the high radiation levels can be identified.

本発明は、回路板設計段階において特定の応用
を有するが、通常高レベルの電磁放射を有する板
の製作を避けるために生産管理においても使用す
ることができる。
Although the invention has particular application in the circuit board design stage, it can also be used in production control to avoid producing boards that typically have high levels of electromagnetic radiation.

本発明の走査装置は、さらに印刷回路板からの
EMI放射を測定することにも用いられる。
The scanning device of the present invention further provides
It is also used to measure EMI radiation.

この装置は、例えば、印刷回路板の障害診断に
おいて使用することができる。各印刷回路板
(PCB)は、電圧を加えられ動作された時、電磁
走査システムによつて測定されるようなそれ自身
の特性電磁気サイン(signature)(又は等高線マ
ツプ)を有する。与えられた形式のPCBに対し
て、回路導体又は部品における障害は、このサイ
ンを変更させる。これは、信号電流が中断され
(例えば、オープン回路によつて)、分流され(短
絡回路によつて)、又はそうでなければ不良部品
によつて振幅又は波形が変化するために発生す
る。検査中のPCBからのサインと良好であるこ
とが分かつているPCBから得られた基準サイン
とを比較することによつて、障害の位置と性質が
分かる。
This device can be used, for example, in fault diagnosis of printed circuit boards. Each printed circuit board (PCB), when energized and operated, has its own characteristic electromagnetic signature (or contour map) as measured by an electromagnetic scanning system. For a given type of PCB, a fault in a circuit conductor or component will cause this signature to change. This occurs because the signal current is interrupted (eg, by an open circuit), shunted (by a short circuit), or otherwise changed in amplitude or waveform by a defective component. By comparing the signature from the PCB under test with a reference signature obtained from a known good PCB, the location and nature of the fault can be determined.

障害がEM走査装置の感度が良くない所で直流
又は非常に低周波数で動作する回路構成の部品上
に存在するときは、問題の回路に注入された適当
な周波数のトレーサ信号を使用する。この走査装
置は、障害診断において役立つようにこの信号に
従うパス(path)をマツプするように動作する。
この技法の実施例は、トレーサ信号電流を電源と
PCBの接地端子の間に注入し、これらの端子の
間の可能な短絡の位置をトレースするのを助ける
ことである。
When the fault is on a component of the circuitry that operates at direct current or very low frequencies where the EM scanning equipment is not sensitive, use a tracer signal of the appropriate frequency injected into the circuit in question. The scanning device is operative to map a path along this signal to aid in fault diagnosis.
An embodiment of this technique uses the tracer signal current as a power supply.
It is to inject between the ground terminals of the PCB to help trace the location of possible short circuits between these terminals.

この装置はまた、電磁遮蔽評価(shielding
evaluation)においても使用することができる。
良い電磁遮蔽は、遮蔽材料(プラスチツク装置の
ハウジングに塗られた特に薄い伝導性コーテイン
グ)が、クラツクのような欠陥及び薄い領域がな
いことを必要とする。また、結合が遮蔽パネルの
間に生ずる場合には、電気的結合は連続でなけれ
ばならない。そのような遮蔽が外部発生器からの
無線周波数電流で付勢されると、これらの欠陥に
おけるRF漏れの領域が走査装置表示を使用して
はつきりと表示されそして捜し出される。
This device also performs electromagnetic shielding evaluation (shielding
It can also be used in evaluation.
Good electromagnetic shielding requires that the shielding material (especially a thin conductive coating applied to the housing of a plastic device) be free of defects such as cracks and thin areas. Also, if the bond occurs between shielding panels, the electrical bond must be continuous. When such a shield is energized with radio frequency current from an external generator, areas of RF leakage at these defects are clearly displayed and located using a scanning device display.

同様に、金属コーテイング又はシートにおける
欠陥は、サンプルがRFエネルギーで適切に付勢
されれば、走査装置によつて検出される。これ
は、RF電流を検査中のサンプルを通して注入す
るか又は外部RF放射でサンプルを照らし、そし
てそれから走査装置を使用してサンプル表面にお
けるその結果得られるRF電流の流れのパターン
を観察することによつて達成される。クラツクの
ような欠陥又は不良結合金属パネルは、視覚表示
装置上に異常として現れる。
Similarly, defects in a metal coating or sheet can be detected by a scanning device if the sample is properly energized with RF energy. This is done by injecting an RF current through the sample under test or by illuminating the sample with external RF radiation and then using a scanning device to observe the resulting pattern of RF current flow at the sample surface. It will be achieved. Defects such as cracks or poorly bonded metal panels appear as anomalies on the visual display.

別の応用においては、この走査装置は、逆に動
作する。受信器に標準的に結合される走査装置ポ
ートは、その代わり、信号発生器のようなRFエ
ネルギー源に結合される。走査回路が動作する
時、印加された信号はRF電流を走査装置ヘツド
上の各個々のRFプローブに連続して流れる。そ
の結果、走査装置は逆に動作し、検出されたRF
磁場をプローブ位置において生成させる。走査装
置ヘツドは、RFに敏感な又は響されることが知
られているPCBと密接に接触して置かれ、そし
てPCB妨害又は機能不良の発生の正確な時間が
監視される。これは、その時電圧を加えられてい
る走査装置の特定のプローブに関連する。この技
法は、RFに対するPCB感度のマツプを生成する
ために使用される。
In other applications, the scanning device operates in reverse. The scanning device port, which is typically coupled to a receiver, is instead coupled to a source of RF energy, such as a signal generator. When the scanning circuit operates, the applied signals cause an RF current to flow sequentially to each individual RF probe on the scanning device head. As a result, the scanning device operates in reverse and the detected RF
A magnetic field is generated at the probe location. The scanner head is placed in close contact with a PCB that is known to be sensitive to or exposed to RF, and the precise time of occurrence of PCB disturbance or malfunction is monitored. This relates to the particular probe of the scanning device that is being energized at the time. This technique is used to generate a map of PCB sensitivity to RF.

特定の応用によつて、適当な調整が、RF受信
器感度と帯域幅選択について行われる。受信器
は、振幅又は周波数変調に応答するように設計さ
れる。あるいはまた、ピーク、平均、RMS又は
対数応答信号検出器が使用できる。
Depending on the particular application, appropriate adjustments are made to RF receiver sensitivity and bandwidth selection. The receiver is designed to respond to amplitude or frequency modulation. Alternatively, peak, average, RMS or log response signal detectors can be used.

前に示したように、表示は、異なる放射レベル
を異なる色、色レベル、等高線マツプ、色輝度変
調マツプ、又はシミユレートされた3次元グラフ
として表示する。既知の画像処理技法が、表示画
像の見掛けの分解能を増大させるために、又はそ
のコントラスト又は情報対雑音比を高めるために
使用される。各プローブ位置に対応する表示強さ
又は色が、パス/フエイル(pas/fail)状況を
示すために2進で表されるか、又はそれは検査中
の回路のあるパラメーターの連続測定に対応する
多数の量子化段階又はレベルから構成されること
ができる。
As previously indicated, the display may display different radiation levels as different colors, color levels, contour maps, color intensity modulation maps, or simulated three-dimensional graphs. Known image processing techniques are used to increase the apparent resolution of the displayed image, or to enhance its contrast or information-to-noise ratio. The display intensity or color corresponding to each probe position may be expressed in binary to indicate a pass/fail situation, or it may be multiple times corresponding to successive measurements of some parameter of the circuit under test. quantization stages or levels.

最後に、走査装置自身において、プローブ・サ
イズ、画像比(aspect ratio)、及びループの巻
数は、特定の応用に従つて選択されることができ
る。選択的に、プローブ・ワイヤは、低周波数電
磁場に対するプローブ感度を増大させるための磁
心、又は好ましくない電場の干渉効果を排除する
ための電場遮蔽層を有することができる。上記の
走査装置は平らな矩形プローブ配列を有するが、
この走査装置はこの形式に制限されず、そして、
その応用に従い、円筒形、球形、又は円盤形状の
支持表面を形成するように配置されたプローブで
配置することができる。
Finally, in the scanning device itself, the probe size, aspect ratio, and number of loop turns can be selected according to the particular application. Optionally, the probe wire can have a magnetic core to increase probe sensitivity to low frequency electromagnetic fields, or an electric field shielding layer to eliminate undesirable electric field interference effects. The above scanning device has a flat rectangular probe array,
The scanning device is not limited to this format, and
Depending on the application, it can be arranged with probes arranged to form a cylindrical, spherical or disc-shaped support surface.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明に従う電磁放射監視装置のブ
ロツク概略図。第2図は、上記装置の1部を形成
する走査配列の1つのプローブを示す尺度を無視
した概略斜視図。 12…複合器・ドライバー回路、14…測定受
信器、16…信号プロセツサー、18…制御器、
20…表示器、30…行導体、32…列導体。
FIG. 1 is a block diagram of an electromagnetic radiation monitoring device according to the present invention. FIG. 2 is a schematic perspective view, not to scale, showing one probe of a scanning array forming part of the apparatus. 12... Composite device/driver circuit, 14... Measurement receiver, 16... Signal processor, 18... Controller,
20...Display device, 30...Row conductor, 32...Column conductor.

Claims (1)

【特許請求の範囲】 1 電磁放射体をテストする装置において: 電磁放射体に近接し既知の空間配置を有する所
定の位置に配置され、電磁放射体からの電磁放射
に応じて電気出力を供給するプローブ手段と、 特定のプローブ手段を順次アドレスするための
プローブ選択手段と、 前記プローブ手段からの電気出力を解析し、電
磁放射レベルの測定値を得る解析手段と、 前記解析手段で得られた測定値から、放射体に
近接する各所定位置における電磁放射レベルを表
わすマツプを作成するマツプ作成手段と、 を備えたことを特徴とする電磁放射体テスト装
置。 2 特許請求の範囲第1項の電磁放射体テスト装
置において、 前記プローブ手段は少なくとも一つのワイヤル
ープ及びダイオードを有し、これらのワイヤルー
プ及びダイオードは前記プローブ選択手段からの
対応する行及び列導体間に直列に接続されること
を特徴とする電磁放射体テスト装置。 3 特許請求の範囲第1項の電磁放射体テスト装
置において、 前記マツプ作成手段は、所定位置の既知の空間
配置に対応して作成されたマツプを表示し、各測
定値は関連する所定位置に対応するマツプ上の位
置に表示されることを特徴とする電磁放射体テス
ト装置。 4 特許請求の範囲第1項の電磁放射体テスト装
置において、 基準放射体から前もつて得られた電磁放射レベ
ルの基準レベルデータのマツプを含む手段と、 電磁放射レベルの測定値と前記基準レベルデー
タとを比較しそれらの差を供給するための手段と
を含むことを特徴とする電磁放射体テスト装置。
[Scope of Claims] 1. In an apparatus for testing an electromagnetic radiator: located at a predetermined position having a known spatial arrangement in close proximity to the electromagnetic radiator and providing an electrical output in response to electromagnetic radiation from the electromagnetic radiator; probe means; probe selection means for sequentially addressing particular probe means; analysis means for analyzing the electrical output from said probe means to obtain measurements of electromagnetic radiation levels; and measurements obtained by said analysis means. An electromagnetic radiator test device comprising: map creation means for creating a map representing the electromagnetic radiation level at each predetermined position near the radiator from the values. 2. The electromagnetic radiator testing device of claim 1, wherein the probe means comprises at least one wire loop and diode, which wire loop and diode are connected to corresponding row and column conductors from the probe selection means. An electromagnetic radiator test device characterized in that the electromagnetic radiator is connected in series between the two. 3. In the electromagnetic radiator testing device according to claim 1, the map creation means displays a map created corresponding to a known spatial arrangement of a predetermined position, and each measurement value is displayed at a related predetermined position. An electromagnetic radiator test device characterized in that the device is displayed at a corresponding position on a map. 4. The electromagnetic radiator test device according to claim 1, comprising: a map of reference level data of electromagnetic radiation levels previously obtained from a reference radiator; and a map of electromagnetic radiation level measurement values and the reference level. and means for comparing the data and providing the difference thereof.
JP62070526A 1986-03-27 1987-03-26 Electromagnetic radiation inspection method and device Granted JPS62237363A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA505485 1986-03-27
CA000505485A CA1286724C (en) 1986-03-27 1986-03-27 Method and apparatus for monitoring electromagnetic emission levels

Publications (2)

Publication Number Publication Date
JPS62237363A JPS62237363A (en) 1987-10-17
JPH0567184B2 true JPH0567184B2 (en) 1993-09-24

Family

ID=4132767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62070526A Granted JPS62237363A (en) 1986-03-27 1987-03-26 Electromagnetic radiation inspection method and device

Country Status (5)

Country Link
US (2) US4829238A (en)
EP (1) EP0239251B1 (en)
JP (1) JPS62237363A (en)
CA (1) CA1286724C (en)
DE (1) DE3785955T2 (en)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744501B2 (en) * 1986-11-19 1995-05-15 清水建設株式会社 Intelligent building radio wave leakage diagnosis system
US4939446A (en) * 1988-03-30 1990-07-03 Rogers Wesley A Voltage transmission link for testing EMI susceptibility of a device or circuits
JPH0621849B2 (en) * 1989-02-13 1994-03-23 工業技術院長 Conductive indenter for material testing machine
DK459789A (en) * 1989-09-18 1991-03-19 Martin Larsen METHOD AND APPARATUS FOR LOCATION OF SHORT CIRCUIT BETWEEN CIRCUITS
US5028866A (en) * 1990-05-30 1991-07-02 General Motors Corporation Method and apparatus for mapping printed circuit fields
FR2663426B1 (en) * 1990-06-14 1992-10-02 Centre Nat Rech Scient MEASURING DEVICE, AT A PLURALITY OF POINTS OF A SURFACE OF THE MICROWAVE FIELD RADIATED BY A SOURCE.
US5300879A (en) * 1990-06-18 1994-04-05 Nec Corporation Bidimensional electromagnetic emission level monitoring equipment
EP0490116A3 (en) * 1990-12-12 1992-10-14 Vdo Adolf Schindling Ag Method for measuring the interference potential of an integrated circuit
CA2049616C (en) * 1991-01-22 2000-04-04 Jacob Soiferman Contactless test method and system for testing printed circuit boards
US5424633A (en) * 1991-01-22 1995-06-13 Advanced Test Technologies Inc. Contactless test method and system for testing printed circuit boards
US5101106A (en) * 1991-04-02 1992-03-31 Digital Equipment Corporation Resonant technique and apparatus for thermal capacitor screening
US5256960A (en) * 1991-04-09 1993-10-26 Novini Amir R Portable dual band electromagnetic field radiation measurement apparatus
EP0508062B1 (en) * 1991-04-10 1995-07-19 atg test systems GmbH Method and device for testing an arrangement of electrical conductors
US5414345A (en) * 1991-04-29 1995-05-09 Electronic Development, Inc. Apparatus and method for low cost electromagnetic field susceptibility testing
US5414366A (en) * 1991-04-29 1995-05-09 Electronic Development, Inc. Electromagnetic field susceptibility test apparatus and methods
US5749049A (en) * 1991-11-01 1998-05-05 Worp; Nicholas Jacob Method and apparatus for measuring the inherent capacitance of a circuit supporting substrate
US5311116A (en) * 1992-04-02 1994-05-10 Electronic Development, Inc. Multi-channel electromagnetically transparent voltage waveform monitor link
SE500305C2 (en) * 1992-10-27 1994-05-30 Ericsson Telefon Ab L M Method and apparatus for measuring electromagnetic radiation from or reception of external electromagnetic radiation in a circuit board
US5406209A (en) * 1993-02-04 1995-04-11 Northern Telecom Limited Methods and apparatus for testing circuit boards
US5475606A (en) * 1993-03-05 1995-12-12 International Business Machines Corporation Faraday cage for a printed circuit card
US5631572A (en) * 1993-09-17 1997-05-20 Teradyne, Inc. Printed circuit board tester using magnetic induction
US5920984A (en) * 1993-12-10 1999-07-13 Ericsson Ge Mobile Communications Inc. Method for the suppression of electromagnetic interference in an electronic system
US5490090A (en) * 1994-06-14 1996-02-06 The United States Of America As Represented By The Secretary Of The Army Two tone test method for determining frequency domain transfer
US5500600A (en) * 1994-07-05 1996-03-19 Lockheed Corporation Apparatus for measuring the electrical properties of honeycomb core
JP2842290B2 (en) * 1995-02-16 1998-12-24 日本電気株式会社 Multilayer printed wiring board and method of manufacturing the same
JP3106895B2 (en) * 1995-03-01 2000-11-06 松下電器産業株式会社 Electromagnetic radiation measurement device
US5517110A (en) * 1995-04-06 1996-05-14 Yentec Inc. Contactless test method and system for testing printed circuit boards
US5694053A (en) * 1995-06-07 1997-12-02 Xerox Corporation Display matrix tester
US5912554A (en) * 1995-10-30 1999-06-15 Matsushita Electric Industrial Co., Ltd. Electromagnetic radiation measuring apparatus for high frequency analysis of radiation produced by a circuit board
CA2162347C (en) * 1995-11-07 2001-01-09 Gary Gunthorpe Method and apparatus for high-speed scanning of electromagnetic field levels
US5818246A (en) * 1996-05-07 1998-10-06 Zhong; George Guozhen Automatic multi-probe PWB tester
SE515553C2 (en) * 1996-06-28 2001-08-27 Ericsson Telefon Ab L M PCB Test
US6242923B1 (en) 1997-02-27 2001-06-05 International Business Machines Corporation Method for detecting power plane-to-power plane shorts and I/O net-to power plane shorts in modules and printed circuit boards
US5821759A (en) * 1997-02-27 1998-10-13 International Business Machines Corporation Method and apparatus for detecting shorts in a multi-layer electronic package
US5818239A (en) * 1997-03-05 1998-10-06 International Business Machines Corporation Simplified contactless test of MCM thin film I/O nets using a plasma
US6118279A (en) * 1997-07-30 2000-09-12 Candescent Technologies Corporation Magnetic detection of short circuit defects in plate structure
US6107806A (en) * 1997-07-30 2000-08-22 Candescent Technologies Corporation Device for magnetically sensing current in plate structure
JPH1194889A (en) * 1997-09-19 1999-04-09 Fujitsu Ltd Apparatus for analyzing electromagnetic radiation from multilayer substrates
JP3214415B2 (en) * 1997-10-30 2001-10-02 日本電産リード株式会社 Substrate inspection device and substrate inspection method
JPH11166963A (en) 1997-12-04 1999-06-22 Kyodo Kumiai Joint Labo Sendai Magnetic field direction detection method
US6160517A (en) * 1998-01-20 2000-12-12 Dell Usa, Llp Method and apparatus for testing electronic systems using electromagnetic emissions profiles
DE19821974B4 (en) * 1998-05-18 2008-04-10 Schwarte, Rudolf, Prof. Dr.-Ing. Apparatus and method for detecting phase and amplitude of electromagnetic waves
IL124961A (en) 1998-06-16 2006-10-05 Orbotech Ltd Contactless test method and system
JP3189801B2 (en) * 1998-08-28 2001-07-16 日本電気株式会社 Semiconductor evaluation device, magnetic field detector used therefor, manufacturing method thereof, and storage medium storing semiconductor evaluation program
US6300785B1 (en) 1998-10-20 2001-10-09 International Business Machines Corporation Contact-less probe of semiconductor wafers
JP4277398B2 (en) * 1999-03-26 2009-06-10 富士通株式会社 Wiring board inspection equipment
JP2000304790A (en) * 1999-04-23 2000-11-02 Hitachi Ltd Apparatus for locating electromagnetic wave source, its method and its analysis method
JP2001272430A (en) * 2000-03-24 2001-10-05 Oht Inc Apparatus and method for inspection
US6529020B1 (en) 2000-11-15 2003-03-04 Ge Fanuc Automation North America, Inc. Methods and systems for automated emissions measuring
US6734681B2 (en) 2001-08-10 2004-05-11 James Sabey Apparatus and methods for testing circuit boards
DE10246235A1 (en) * 2002-10-02 2004-04-22 Arno Wilhelm Rodenbeck Displaying electromagnetic field strength and/or frequency involves detecting field strengths/frequencies with spatial resolution at least along flat area and displaying them with spatial resolution
US20040196060A1 (en) * 2003-04-03 2004-10-07 Taiwan Semiconductor Manufacturing Co., Ltd. Method of identifying physical mapping of IC products
US7220990B2 (en) * 2003-08-25 2007-05-22 Tau-Metrix, Inc. Technique for evaluating a fabrication of a die and wafer
US6975108B2 (en) * 2003-11-13 2005-12-13 Yuli Bilik Methods and devices for eddy current PCB inspection
JP2006200955A (en) * 2005-01-19 2006-08-03 Nec Engineering Ltd Instrument for measuring magnetic field distribution
JP4619799B2 (en) * 2005-01-20 2011-01-26 太陽誘電株式会社 Electric field vector calculation method and apparatus, electric field vector calculation program, and recording medium recording the program
JP2007156572A (en) * 2005-11-30 2007-06-21 Toshiba Corp Design support system and design support method
US7276914B2 (en) * 2006-01-31 2007-10-02 University Of Delaware System and method for guided TDR/TDT computerized tomography
US7496466B2 (en) * 2007-01-19 2009-02-24 Huntron, Inc. System for fault determinations for high frequency electronic circuits
US7919973B2 (en) * 2007-06-22 2011-04-05 Microchip Technology Incorporated Method and apparatus for monitoring via's in a semiconductor fab
US7982468B2 (en) * 2008-03-13 2011-07-19 Oracle America, Inc. Apparatus and method for testing electrical interconnects with switches
US8643539B2 (en) * 2008-11-19 2014-02-04 Nokomis, Inc. Advance manufacturing monitoring and diagnostic tool
US8136982B2 (en) * 2009-03-16 2012-03-20 International Business Machines Corporation Thermal profiling to validate electronic device authenticity
US8242793B2 (en) * 2009-03-17 2012-08-14 International Business Machines Corporation Electromagnetic profiling to validate electronic device authenticity
US8269505B2 (en) * 2009-12-15 2012-09-18 International Business Machines Corporation Locating short circuits in printed circuit boards
FR2965930B1 (en) * 2010-10-08 2013-05-10 Satimo Ind DEVICE FOR ELECTROMAGNETICALLY TESTING AN OBJECT
FR2974634B1 (en) * 2011-04-27 2014-01-17 Thales Sa METHOD FOR CONTROLLING THE OPERATION OF AN ELECTRONIC COMPONENT, ELECTRONIC DEVICE AND ELECTRONIC COMPUTER FOR CORRESPONDING INBOARDS
EP2726887B1 (en) * 2011-07-01 2015-03-25 Telefonaktiebolaget LM Ericsson (PUBL) Device and method for emi source location
RU2529673C2 (en) * 2012-06-13 2014-09-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Device of 3d scanning of electromagnetic emissions in near-field of electronic means
TWI487916B (en) 2013-03-06 2015-06-11 Univ Nat Taiwan Magnetic field probe and probe head thereof
TWI509272B (en) 2013-12-09 2015-11-21 Univ Nat Taiwan Magnetic field probe,magnetic field measurement system and magnetic field measurement method
RU2604113C2 (en) * 2015-01-12 2016-12-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Near electric field scanner for two-sided and multilayer printed boards
US10448864B1 (en) 2017-02-24 2019-10-22 Nokomis, Inc. Apparatus and method to identify and measure gas concentrations
KR102562793B1 (en) 2017-12-06 2023-08-03 삼성전자주식회사 Prinred circuit and electronic device including the same
DE102017129153B4 (en) 2017-12-07 2019-07-11 Deutsches Zentrum für Luft- und Raumfahrt e.V. Device for the spatially resolved detection of electromagnetic surface waves in electrical circuits with electrical and / or electronic components
US11489847B1 (en) 2018-02-14 2022-11-01 Nokomis, Inc. System and method for physically detecting, identifying, and diagnosing medical electronic devices connectable to a network
FI20185463A1 (en) * 2018-05-18 2019-11-19 Enics Ag Method and system for fault detection
RU189820U1 (en) * 2019-03-26 2019-06-05 Федеральное государственное бюджетное образовательное учреждение высшего образования "Воронежский государственный технический университет" (ВГТУ) MIDDLE ELECTRIC FIELD SCANNER FOR BILATERAL AND MULTILAYERED PCB
CN113848422B (en) * 2021-09-22 2023-04-18 中国商用飞机有限责任公司 Cable conduction testing device
CN119395394A (en) * 2023-12-07 2025-02-07 宁夏大学 A single-station detection system and method for reciprocal circuit leakage electromagnetic signal based on photoconductive effect

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2509045A (en) * 1947-11-26 1950-05-23 Collins Radio Co Ultra high frequency radiation indicating system
US3327212A (en) * 1963-02-07 1967-06-20 Cutler Hammer Inc Multi-mode microwave power meter having oversized measuring waveguide section with probes on all four walls
US3463007A (en) * 1967-02-27 1969-08-26 North American Rockwell Field gradient correlator system for field effect testing
FR2105040A1 (en) * 1970-09-18 1972-04-28 Pernice Charles
US3750017A (en) * 1971-09-16 1973-07-31 Us Health Electromagnetic field measuring device
US3810138A (en) * 1972-01-10 1974-05-07 Westinghouse Electric Corp Interpolative sensor output visual map display system
US3796947A (en) * 1973-02-27 1974-03-12 Bell Telephone Labor Inc Electron beam testing of film integrated circuits
US3848189A (en) * 1973-03-26 1974-11-12 W Pope Qualitative rf output-reflected power indicator
US3848188A (en) * 1973-09-10 1974-11-12 Probe Rite Inc Multiplexer control system for a multi-array test probe assembly
US4097797A (en) * 1974-10-17 1978-06-27 Burroughs Corporation Apparatus for testing electrical circuit units such as printed circuit cards
US4164939A (en) * 1977-06-24 1979-08-21 The Regents Of The University Of California Orthogonal electromagnetic flow and diameter sensor system
JPS55103468A (en) * 1979-02-02 1980-08-07 Nec Corp Matrix detection circuit
US4354153A (en) * 1979-11-19 1982-10-12 Litton Systems, Inc. Microwave oven leakage detector and method of using same to test door seal leakage
DE3235119A1 (en) * 1982-09-22 1984-03-22 Siemens AG, 1000 Berlin und 8000 München ARRANGEMENT FOR THE TESTING OF MICROWIRE WIRES AND METHOD FOR THEIR OPERATION
US4584529A (en) * 1983-06-02 1986-04-22 Bill Checker Co., Ltd. Method and apparatus for discriminating between genuine and suspect paper money
US4706021A (en) * 1983-08-08 1987-11-10 The Charles Stark Draper Laboratory, Inc. Crossed wire defect detector employing eddy currents
US4797614A (en) * 1984-11-02 1989-01-10 Sierracin Corporation Apparatus and method for measuring conductance including a temperature controlled resonant tank circuit with shielding
JPS61267336A (en) * 1985-05-21 1986-11-26 Matsushita Electric Ind Co Ltd Method and device for inspecting semiconductor device
JPS6261390A (en) * 1985-09-11 1987-03-18 興和株式会社 Method and apparatus for inspecting printed board
US4786865A (en) * 1986-03-03 1988-11-22 The Boeing Company Method and apparatus for testing integrated circuit susceptibility to cosmic rays
EP0246034A3 (en) * 1986-05-16 1989-04-05 AT&T Corp. Method of testing electronic assemblies while they are being produced
US4792683A (en) * 1987-01-16 1988-12-20 Hughes Aircraft Company Thermal technique for simultaneous testing of circuit board solder joints
US4791357A (en) * 1987-02-27 1988-12-13 Hyduke Stanley M Electronic Circuit board testing system and method

Also Published As

Publication number Publication date
EP0239251B1 (en) 1993-05-26
EP0239251A3 (en) 1988-07-27
US5006788A (en) 1991-04-09
DE3785955D1 (en) 1993-07-01
EP0239251A2 (en) 1987-09-30
DE3785955T2 (en) 1993-09-02
US4829238A (en) 1989-05-09
JPS62237363A (en) 1987-10-17
CA1286724C (en) 1991-07-23

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