JPH0568100B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead detection device in a tape bonder for bonding a single bump or a bump provided on a pellet to a lead provided on a carrier tape.

[Prior Art] Conventionally, as a tape bonding method, as shown in, for example, Japanese Patent Publication No. 57-53974, Japanese Patent Publication No. 62-27735, Japanese Patent Publication No. 62-55298, etc., bumps of pellets are formed on the lead of a carrier tape. Bonding, and Special Publication No. 62-31819,
As shown in Japanese Patent Publication No. 62-34142, it is known to bond a single bump to the lead of a carrier tape.

Incidentally, the position of the lead in this tape bonding method is detected by detecting the reflected light on the surface of the lead with a camera disposed above the lead positioned on the bond guide.

[Problems to be Solved by the Invention] The above-mentioned conventional technology detects reflected light from the lead surface, so the flatness, bending, surface condition, etc. of the lead surface affect the detection, making it difficult to accurately detect the position of the lead. It was difficult.

An object of the present invention is to provide a lead detection device for a tape bonder that can detect the position of a lead with high precision.

[Means for Solving the Problems] The above object includes: a camera disposed above a lead of a carrier tape positioned on a bond guide; an illumination means for illuminating the lead from above;
This problem can be solved by using a configuration that includes a reflecting mirror that is provided below the lead so that it can move forward and backward.

[Operation] Light irradiated onto the lead from above is blocked by the lead portion, and the shadow of the lead is reflected in the reflected light placed below the lead. Since the shadow of this lead is detected with a camera, the position of the lead can be detected with high precision.

[Example] Hereinafter, an example of the present invention will be described with reference to FIG. A carrier tape 1 made of polyimide film or the like is provided with a large number of leads 2 in order.
This carrier tape 1 is guided from a supply reel (not shown) to a bond guide 3, and is wound onto a take-up reel (not shown). A bond tool 4 is disposed above the bond guide 3 and is moved in the vertical (Z) direction and horizontal (X, Y) direction by a driving means (not shown). It is designed to be inserted into a bond window 3a provided in the.

Further, above the bond window 3a of the bond guide 3, a lead detection camera 5 for detecting the position of the lead 2 of the carrier tape 1 is disposed. A half mirror 6 is attached to the lower end of each lead detection camera 5, and epi-illumination 7 is attached to the side of the half mirror 6.

A bond stage 10 is arranged below the bond guide 3, and this bond stage 10
is a horizontal (X, Y) direction by a driving means (not shown),
It can be moved in the vertical (Z) direction and rotational (θ) direction. The bonding stage 10 has a vacuum chuck 11 at its upper end, and a substrate 13 made of glass or the like on which bumps 12 are formed is held by the vacuum chuck 11. Also lead 2
A reflecting mirror holder 15 having a reflecting mirror 14 on its upper surface is provided between the substrate 13 and the substrate 13 so as to be movable forward and backward.

Next, the effect will be explained. The bond tool 4 is in a state where it has escaped from below the lead detection camera 5. Further, the reflecting mirror 14 is located below the bond guide 3. In this state, when the carrier tape 1 is fed and the lead 2 to be bonded is positioned in the bond window 3a, the lead detection camera 5 detects the positional deviation of the lead 2, and this detection result is sent to an arithmetic device (not shown). is memorized.

In this case, the light from the epi-illumination 7 is irradiated onto the lead 2 by the half mirror 6. The light irradiated onto this lead 2 is blocked by the lead 2 portion, and the lead 2 is blocked.
The shadow of the lead 2 is reflected on a reflecting mirror 14 disposed below the lead 2. The lead detection camera 5 detects the shadow of this lead 2.
Since the position of the lead 2 can be detected with high accuracy. Further, the position detection result of the lead 2 stored in the arithmetic device is processed by one of the following two methods. In the first method, the carrier tape 1 is moved together with the bond guide 3 in the XY direction so as to correct the positional deviation of the lead 2. In the second method, the bonding stage 10 is moved as will be described later, taking into account the positional deviation of the leads 2.

After detecting the position of the lead 2 as described above, the reflector holder 15 rotates or moves linearly in a horizontal plane and escapes from below the lead 2. Next, the bonding stage 10 is moved in the XY directions, and the bumps 12 to be bonded are aligned with the leads 2. In this case, if the misalignment of the lead 2 has been dealt with by the first method as described above, the bump 12 to be bonded is normally located on the lead 2.
The bonding stage 10 is moved so as to be located below. Further, when the positional deviation of the lead 2 is treated by the second method, the bump 12 to be bonded is taken into account the positional deviation of the lead 2.
The bonding stage 10 is moved so that the bonding stage 10 is positioned below the actual lead 2.

After the leads 2 and bumps 12 are aligned as described above, the bonding stage 10 is raised and the bumps 12 are brought into contact with the leads 2. Also, the bonding tool 4 moves and descends in the XY direction to release the lead 2.
is pressed onto the bump 12 to bond the bump 12 to the lead 2. After that, the bonding tool 4 rises and moves in the XY direction, and the bonding stage 1
0 is falling.

Next, the carrier tape 1 is fed at a constant pitch, and the leads 2 to be bonded next are positioned below the bond window 3a. Further, the reflecting mirror holder 15 is moved and the reflecting mirror 14 is disposed below the lead 2. Thereafter, the bumps 12 are sequentially bonded to the leads 2 by repeating the above-described operations.

In the above embodiment, a case has been described in which a single bump 12 is bonded to a lead 2, but it goes without saying that the present invention can be similarly applied to a case where a pellet, that is, a bump provided on a pellet is bonded.

[Effects of the Invention] As is clear from the above description, according to the present invention, since the shadow of the lead reflected on the reflecting mirror is detected by the camera, the position of the lead can be detected with high accuracy.

[Brief explanation of the drawing]

FIG. 1 is a schematic front view showing one embodiment of the present invention. 1: Carrier tape, 2: Lead, 3: Bond guide, 5: Lead detection camera, 7: Epi-illumination, 14: Reflector.

Claims (1)

[Claims] 1. A tape bonder equipped with a camera disposed above the carrier tape lead positioned on a bond guide, a lighting means for illuminating the lead from above, and a reflector provided below the lead so as to be movable forward and backward. Lead detection device.