JPH0568101B2 - - Google Patents
Info
- Publication number
- JPH0568101B2 JPH0568101B2 JP63066903A JP6690388A JPH0568101B2 JP H0568101 B2 JPH0568101 B2 JP H0568101B2 JP 63066903 A JP63066903 A JP 63066903A JP 6690388 A JP6690388 A JP 6690388A JP H0568101 B2 JPH0568101 B2 JP H0568101B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding position
- capillary
- bonding
- crimped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01551—Changing the shapes of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はワイヤボンデイング方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a wire bonding method.
［従来の技術］
従来のワイヤボンデイング方法は、例えば特公
昭57−35578号、特公昭57−51934号、特公昭59−
19463号、特公昭59−25377号等に示すように、キ
ヤピラリに挿通されたワイヤを第ボンデイング位
置に押付けて第１ボンデイングを行い、次にキヤ
ピラリを第２ボンデイング位置へ移動させてワイ
ヤを第２ボンデイング位置へ押付けて第２ボンデ
イングを行い、その後キヤピラリをわずかに上昇
させてワイヤクランパを閉じ、ワイヤクランパを
上昇させてワイヤを切断している。[Prior Art] Conventional wire bonding methods are disclosed in, for example, Japanese Patent Publication No. 57-35578, Japanese Patent Publication No. 51934-1987, and Japanese Patent Publication No. 59-1989.
As shown in Japanese Patent Publication No. 19463 and Japanese Patent Publication No. 59-25377, the first bonding is performed by pressing the wire inserted into the capillary to the second bonding position, and then the capillary is moved to the second bonding position and the wire is pressed to the second bonding position. The wire is pressed to the bonding position to perform second bonding, and then the capillary is raised slightly to close the wire clamper, and the wire clamper is raised to cut the wire.
［発明が解決しようとする課題］
上記従来の方法は、第２ボンデイング位置では
ワイヤをキヤピラリで押付けて圧着又は押付けた
状態で超音波をかけて圧着させるのみであるの
で、ワイヤの圧着面積が小さく圧着はがれが発生
するという問題があつた。特に第２ボンデイング
位置の接合面のメツキ厚が薄いものは、接着力が
弱く、製品の信頼性が低い。[Problems to be Solved by the Invention] In the above conventional method, the wire is only pressed by a capillary and crimped at the second bonding position, or ultrasonic waves are applied in the pressed state to crimp it, so the crimping area of the wire is small. There was a problem that the crimping peeled off. Particularly, when the bonding surface at the second bonding position is thinly plated, the adhesive force is weak and the reliability of the product is low.
本発明の目的は、第２ボンデイング位置での圧
着面積が大きくて接着力が増大し、製品の信頼性
が向上するワイヤボンデイング方法を提供するこ
とにある。 An object of the present invention is to provide a wire bonding method in which the bonding area at the second bonding position is large, the adhesive force is increased, and the reliability of the product is improved.
［課題を解決するための手段］
上記目的は、第２ボンデイング位置ヘキヤピラ
リによつてワイヤを接続する際に、ワイヤを圧着
した状態でキヤピラリを第１ボンデイング位置方
向へわずかにずらすことにより解決される。[Means for solving the problem] The above object is solved by slightly shifting the capillary toward the first bonding position while the wire is crimped when connecting the wire by the capillary to the second bonding position. .
［作用］
第２ボンデイング位置へキヤピラリによつてワ
イヤを圧着した状態でキヤピラリを第１ボンデイ
ング位置方向へわずかにずらすので、ワイヤが第
２ボンデイング位置へ圧着する圧着幅、即ち圧着
面積が増大する。[Operation] Since the capillary is slightly shifted toward the first bonding position while the wire is crimped to the second bonding position by the capillary, the crimping width, ie, the crimping area, over which the wire is crimped to the second bonding position increases.
［実施例］
以下、本発明の一実施例を図により説明する。
第１図に示すように、キヤピラリ１に挿通された
ワイヤ２を製品３の第２ボンデイング位置３ａに
押付けて圧着させる。次に第２図に示すように、
ワイヤ２を圧着させた状態でキヤピラリ１第１を
ボンデイング位置方向へわずかにずらす。その後
は従来と同様にキヤピラリ１をわずかに上昇さ
せ、図示しないワイヤクランパを閉じて該ワイヤ
クランパを上昇させる。これにより、ワイヤ２は
第２ボンデイング位置３ａの付根から切断され
る。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.
As shown in FIG. 1, the wire 2 inserted into the capillary 1 is pressed against the second bonding position 3a of the product 3 to be crimped. Next, as shown in Figure 2,
With the wire 2 crimped, the first capillary 1 is slightly shifted toward the bonding position. Thereafter, the capillary 1 is slightly raised as in the conventional case, the wire clamper (not shown) is closed, and the wire clamper is raised. As a result, the wire 2 is cut from the base of the second bonding position 3a.
このように、第２ボンデイング位置３ａにおい
ては、ワイヤ２を圧着した状態でキヤピラリ１を
第１ボンデイング位置方向へわずかにずらすの
で、この場合（第２図の場合）の圧着幅ｂは、第
１図に示すように単にキヤピラリ１でワイヤ２を
圧着させた場合の圧着幅ａに比べ大きくなる。 In this way, at the second bonding position 3a, the capillary 1 is slightly shifted in the direction of the first bonding position with the wire 2 crimped, so the crimping width b in this case (in the case of FIG. 2) is the same as that at the first bonding position. As shown in the figure, the crimping width a is larger than the crimping width a when the wire 2 is simply crimped with the capillary 1.
［発明の効果］
以上の説明から明らかなように、本発明によれ
ば、第２ボンデイング位置へのワイヤ圧着面積が
大きくなるので、接着力が増大し、製品の信頼性
が向上する。[Effects of the Invention] As is clear from the above description, according to the present invention, the wire crimping area to the second bonding position is increased, so the adhesive force is increased and the reliability of the product is improved.
第１図及び第２図は本発明の一実施例のワイヤ
ボンデイング方法を示す説明図である。
１：キヤピラリ、２：ワイヤ、３：製品、３
ａ：第２ボンデイング位置。
FIGS. 1 and 2 are explanatory views showing a wire bonding method according to an embodiment of the present invention. 1: Capillary, 2: Wire, 3: Product, 3
a: Second bonding position.
Claims (1)
置との間をキヤピラリに挿通されたワイヤで接続
するワイヤボンデイング方法において、第２ボン
デイング位置へキヤピラリによつてワイヤを接続
する際に、ワイヤを圧着した状態でキヤピラリを
第１ボンデイング位置方向へわずかにずらすこと
を特徴とするワイヤボンデイング方法。1 In a wire bonding method in which a wire inserted through a capillary connects a first bonding position and a second bonding position, when connecting the wire to the second bonding position by the capillary, the wire is crimped. A wire bonding method characterized by slightly shifting a capillary in the direction of a first bonding position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63066903A JPH01239861A (en) | 1988-03-18 | 1988-03-18 | Wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63066903A JPH01239861A (en) | 1988-03-18 | 1988-03-18 | Wire bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01239861A JPH01239861A (en) | 1989-09-25 |
| JPH0568101B2 true JPH0568101B2 (en) | 1993-09-28 |
Family
ID=13329368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63066903A Granted JPH01239861A (en) | 1988-03-18 | 1988-03-18 | Wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01239861A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19823623A1 (en) | 1998-05-27 | 1999-12-02 | Bosch Gmbh Robert | Method and contact point for establishing an electrical connection |
| NZ537272A (en) * | 2002-06-10 | 2005-10-28 | Rheon Automatic Machinery Co | An apparatus and method for beating and rolling a food dough belt |
-
1988
- 1988-03-18 JP JP63066903A patent/JPH01239861A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01239861A (en) | 1989-09-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10135221A (en) | Bump forming method | |
| US5642852A (en) | Method of ultrasonic welding | |
| JP3128718B2 (en) | Wire bonding method | |
| JPH0568101B2 (en) | ||
| JP2727352B2 (en) | Method for manufacturing leaded semiconductor device | |
| JPH03289149A (en) | Bonding method of wire | |
| JP4629284B2 (en) | Semiconductor device and manufacturing method thereof | |
| JPH05267385A (en) | Wire bonding equipment | |
| JPS62219533A (en) | Bonding device | |
| JPS60182730A (en) | Wire bonding method | |
| US6906263B2 (en) | Crossing-wire fixing structure | |
| JPH0195528A (en) | Wire bonding and equipment therefor | |
| JP3289579B2 (en) | Metal joining method | |
| JPH0797521B2 (en) | Sliding contact and manufacturing method thereof | |
| JPS6254500A (en) | Wire connection | |
| JPH08222595A (en) | Wire bonding method | |
| JP2002171020A (en) | Semiconductor laser device and wire bonding method thereof | |
| JP2003007758A (en) | Bonding method for bonding wires for semiconductor devices | |
| JPH01248655A (en) | Manufacture of lead frame for semiconductor device | |
| JPH11168119A (en) | Wire bonding method and pressing tool used for it | |
| JP3277564B2 (en) | Wire bonding method | |
| JPS5853502B2 (en) | How to connect thin metal wires | |
| JPS62115730A (en) | Wire bonding method | |
| JPH01297834A (en) | Wire bonding method | |
| JPH0787104B2 (en) | Connection method of electric wire and crimp terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |