JPH0568121B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a MIC (microwave integrated circuit) circulator.

(b) Technical background In recent years, with the advancement of microwave integrated circuit technology,
Circulators are also being formed on dielectric substrates.

There is a MIC circulator in which an input/output pattern having a junction pattern and a matching pattern is formed on the surface of a ferrite substrate, and a magnetic field perpendicular to the ferrite substrate is applied to the junction part using an external magnet to form an irreversible circuit. .

However, ferrite substrates have a larger dielectric loss than other non-magnetic dielectric substrates such as alumina substrates and sapphire substrates.

Furthermore, since the ferrite substrate is a porous crystal and brittle material, the strength of metallization is poor, and the reliability of connection with external circuits by bonding, soldering, etc. is poor.

Therefore, it is desired to provide a MIC circulator that eliminates the above-mentioned drawbacks by using a ferrite substrate for the junction portion and using an alumina substrate or the like for the other input/output pattern portions.

(c) Prior art and problems Figure 1 is a perspective view of a conventional example, A is a diagram showing the manufacturing process, B is a diagram of a completed product, and A and B in Figure 2 are each a diagram of a conventional MIC circulator. FIG.

As shown in FIG. 1A, a round hole 1a is provided approximately at the center of a thin rectangular nonmagnetic dielectric substrate (for example, an alumina substrate) 1. As shown in FIG.

2 is a ferrite disk whose thickness is equal to that of the dielectric substrate 1;

The outer diameter of the ferrite disk 2 is the same as that of the dielectric substrate 1.
The size is such that it can be inserted into the round hole 1a.

As shown in FIG. 1B, such a ferrite disk 2 is fitted into a round hole 1a of a dielectric substrate 1 to form a composite substrate.

A junction pattern 4 is formed on the surface of this composite substrate in a portion corresponding to the ferrite disk 2, three input/output patterns 5 are connected to the junction pattern 4 and radially arranged at equal angles, and a dielectric substrate 1
is formed on the surface of

Further, a ground conductor pattern layer (ground conductor pattern 6 in FIG. 2) is formed on the entire back surface of the composite board to form the MIC circulator 3.

As described above, since the input/output pattern 5 is formed on the portion of the dielectric substrate 1 made of a non-magnetic material with a small dielectric constant, the transmission loss is small.

Hereinafter, with reference to FIG. 2, a method for fitting a ferrite disk related to a conventional MIC circulator into a round hole in a dielectric substrate will be explained.

The means of A in FIG.
a, and connect the outer peripheral surface of the ferrite disk 2 and the round hole 1.
In this method, the ferrite disk 2 is adhesively fixed to the dielectric substrate 1 by adhesively bonding the inner wall of the ferrite disk 2 to the dielectric substrate 1.

In the means shown in FIG. 2B, the round hole 1b of the dielectric substrate 1 is made into a tapered hole, and the outer peripheral surface of the ferrite disk 2a is processed into a tapered shape so as to fit into the round hole 1b.

Then, the ferrite disk 2a is pushed into the round hole 1b and fitted.

However, in the MIC circulator described in FIG. 2A, it is difficult to press the outer circumferential surface of the ferrite disk 2, which is the adhesive surface, against the inner wall of the circular hole 1a of the dielectric substrate 1.

Therefore, it is necessary to precisely process the adhesive layer between the round hole 1a and the ferrite disk 2 so that the thickness of the adhesive layer exhibits optimal adhesiveness, which increases the number of processing steps and costs. There was a problem with getting high.

In addition, in the MIC circulator explained in FIG. must be machined with high precision to match the surface of the

Therefore, there was a problem that the number of processing steps increased and the cost increased.

(d) Purpose of the Invention The present invention was created in view of the above points, and an object of the present invention is to provide a MIC circulator that is low in cost and has little transmission loss.

(e) Structure of the Invention In order to achieve this object, the present invention provides a composite substrate 10 in which a pair of rectangular non-magnetic dielectric substrates 8 are adhered to both side edges of a rectangular ferrite substrate 9. , the junction pattern 4 formed at the center of the front surface of the composite substrate 10, and the dielectric substrate 8.
three input/output patterns 5 formed on the surface of the composite substrate 10 and having one end of each connected to a desired position on the outer periphery of the junction pattern 4; and a ground conductor pattern 6 formed on the entire back surface of the composite substrate 10. , the configuration has the following features.

(f) Embodiments of the Invention The present invention will be described in detail below with reference to illustrated embodiments.

FIG. 3 is a perspective view of an embodiment of the present invention;
Figures A, B, and C are perspective views showing the manufacturing process of an embodiment of the present invention.

In FIG. 3, 9 is a rectangular ferrite substrate. Reference numeral 8 denotes a dielectric substrate made of a non-magnetic material, such as an alumina substrate, having a length equal to the length of the ferrite substrate 9 and a width desirably larger than the width of the ferrite substrate 9 .

Reference numeral 10 denotes a square plate-shaped composite substrate in which a pair of dielectric substrates 8 are bonded to both longitudinal edges of a ferrite substrate 9.

Reference numeral 30 includes a junction pattern 4 formed on the front surface of the composite substrate 10, an input/output pattern 5, and a ground conductor pattern 6 formed on the entire back surface of the composite substrate 10. This is a MIC circulator of the present invention.

More specifically, a junction pattern 4 having a diameter desirably larger than the width of the ferrite substrate 9 is formed in the center of the front surface of the composite substrate 10 .

Then, an input/output pattern 5 is formed on the surface of one dielectric substrate 8, with one end connected to the outer periphery of the junction pattern 4 so as to be orthogonal to the side edge of the dielectric substrate 8 bonded to the ferrite substrate 9. ing.

The above-mentioned connection position of the input/output pattern 5 means that two other input/output patterns 5 are drawn out from each of the outer peripheral edges of the junction pattern 4 with an included angle of 120 degrees to the surface of the other dielectric substrate 8, and They are bent in opposite directions and provided parallel to the side edges bonded to the ferrite substrate 9.

The MIC circulator of the present invention can be easily manufactured as follows.

As shown in Figure 4A, multiple (2 in the figure)
The elongated plate-like long ferrite substrate 90 of
It is processed to a desired width smaller than the diameter of the juncture pattern.

A non-magnetic elongated dielectric substrate 8 in the form of an elongated plate, the thickness and length of which are equal to those of the elongated ferrite substrate 90.
0 (for example, an alumina substrate) is processed to have a desired width sufficient to form an input/output pattern.

The long dielectric substrates 80 are prepared in one more number than the long ferrite substrates 90 (three in the figure).

Then, as shown in Fig. 4B, a long ferrite substrate 9
The elongated dielectric substrates 80 are arranged in parallel on the same plane through the 0, and the side end surfaces of the respective elongated dielectric substrates 80 and the side end surfaces of the opposing elongated ferrite substrate 90 are bonded using an adhesive. Thus, the composite substrate 100 has a rectangular striped shape when viewed from above.

Thereafter, as shown in FIG. 4C, on the surface of the composite substrate 100, the junction patterns 4 arranged in parallel on the respective long ferrite substrates 90 and the respective junction patterns 4 on the long dielectric substrate 80 were connected. It forms an input/output pattern 5.

On the other hand, a ground conductor pattern 60 is formed on the entire back surface of the composite substrate 100.

And each juncture pattern 4
The chain line Y-Y, which is the center line of the elongated dielectric substrate 80, and the chain line Y-Y are aligned so that
The composite substrate 100 is cut along a plurality of chain lines X--X perpendicular to , and is separated into individual MIC circulators 30.

As mentioned above, the MIC circulator 3 of the present invention
0 can be manufactured by cutting a large composite substrate 100 into a matrix shape, and can be mass-produced.

In addition, since all the parts to be processed are straight,
It can be easily processed with high precision.

Further, it is also easy to press the adhesive surfaces of the long dielectric substrate 80 and the long ferrite substrate 90.

Therefore, the MIC circulator of the present invention is low cost.

On the other hand, the input/output pattern 5 is formed on the surface of a dielectric substrate 8 having a small dielectric constant. Therefore, the MIC circulator of the present invention has little transmission loss.

(g) Effects of the Invention As explained above, the MIC circulator of the present invention has excellent practical effects in that it is easy to process, can be mass-produced, is low cost, and has little transmission loss.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional example, A is a diagram showing the manufacturing process, B is a diagram of a completed product, and A and B in FIG. 2 are sectional views of the conventional MIC circulator. FIG. 3 is a perspective view of an embodiment of the present invention;
4A, 4B, and 4C are perspective views showing the manufacturing process of the embodiment of the present invention. In the figure, 1 is a dielectric substrate, 2 and 2a are ferrite disks, 3 and 30 are MIC circulators,
4 is a junction pattern, 5 is an input/output pattern, 6, 60 are ground conductor patterns, 8 is a dielectric substrate, 9 is a ferrite substrate, 10, 100 is a composite substrate, 80 is a long dielectric substrate, 90 is a long sheet A ferrite substrate is shown.

Claims (1)

[Claims] 1. A pair of rectangular non-magnetic dielectric substrates 8,
a composite substrate 10 bonded to both edges of a rectangular ferrite substrate 9; a junction pattern 4 formed at the center of the front surface of the composite substrate 10; and a junction pattern 4 formed on the surface of the dielectric substrate 8. Three input/output patterns 5 each having one end connected to a desired position on the outer periphery of the junction pattern 4, and a ground conductor pattern 6 formed on the entire back surface of the composite substrate 10. characterized by
MIC circulator.