JPH0570319B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed circuit board warpage correction device that corrects warpage that occurs in the printed circuit board during the soldering process of the printed circuit board on which electronic components and the like are mounted. be.

[Conventional technology]

2. Description of the Related Art Conventionally, in a process of soldering a printed circuit board to which electronic components having lead wires are attached, the printed circuit board has been greatly warped and deformed due to the influence of heat and the like. Therefore, it is not possible to perform uniform cutting with the next-stage cutting device, so a printed circuit board warpage correction device as shown in FIG. 8 has been used.

FIG. 8 is a schematic configuration diagram showing a conventional warpage correction device, in which 1 is a printed circuit board, 2 is an electronic component, 3 is a lead wire, 4 is a conveyance chain, 5 is a cutter, and 6 is a warpage correction device. Note that FIG. 8 shows an example in which the warpage correction device 6 is used in a cutter device. 7 and 8 are both warp correctors of the warp correction device 6. The warp corrector 7 has pins 7b radially provided on the circumferential surface of the rotating shaft 7a, and the warp corrector 8 has a disk 8b on the rotating shaft 8a. It was established.

[Problem that the invention seeks to solve]

As described above, in the conventional warpage correction device 6 for the printed circuit board 1, since the central portion of the lower surface of the printed circuit board 1 is curved downward, the warpage is brought into contact with the pin 7b of the corrector 7, or the warp corrector 8 The warpage was corrected from below by making it come into contact with the disc 8b of
Since it is not possible to correct the upward curvature of the central portion of the printed circuit board 1, the warpage of the printed circuit board 1 cannot be completely corrected, and the rieet wire 3 may not be cut uniformly due to the vibration caused by the rotation of the cutter 5. There were problems in that the lead wire 3 was cut off or cut diagonally, making it impossible to obtain a clean cut surface.

This invention has been made to solve the above problems, and provides a printed circuit board warpage correction device that corrects the warpage of the printed circuit board by pressing the printed circuit board from both the upper and lower surfaces. With the goal.

[Means for solving problems]

The printed circuit board warpage correction device according to the present invention includes a pin that presses the top surface of the printed circuit board, and a movable plate to which the pin is attached and which can move in the vertical direction, and is moved by the driving force of the traveling printed circuit board. a guide rail that guides the warp corrector to run as the printed circuit board runs; a mounting table on which the warp corrector is placed; and a lifting device that raises the warp corrector placed on the mounting table. and; a transfer device that engages the warp corrector that has been raised by the lifting device and transfers it in the opposite direction to the direction in which the printed circuit board has traveled; and a transfer device that places the warp corrector that has been transferred by the transfer device. A mounting table, a lowering device for lowering the warp corrector placed on the mounting table; an arm for placing the movable plate of the warp corrector that has been lowered; and a printed circuit board that comes into contact with the engagement piece to correct the warp. an elevating device comprising a means for pressing a pin against the top surface of a printed circuit board by lowering a movable plate placed on the arm and separating the warp corrector from the arm at the same time as the device travels; .

[Effect]

In this invention, the warp corrector is pressed from the bottom surface of the printed circuit board, and the warp corrector is pressed by a pin from the top surface of the traveling printed circuit board, so that the warp corrector is pressed from both the bottom surface and the top surface of the printed circuit board. A warpage corrector is performed. In addition, the warp corrector, which presses from the top surface, is engaged with the running printed circuit board and moves, and the lead wires are cut by a cutter for necessary processing, for example, and then raised by a lifting device, and the printed circuit board is moved. It is transported by a transport means that transports it in the opposite direction, and then it is placed on a lowering device and lowered back to its original position.

〔Example〕

1, 2, 3, and 4 show an embodiment of the present invention, in which it is used in a cutter device. Figure 1 is a side view showing the overall configuration;
Fig. 2 is a perspective view showing the main parts of Fig. 1, Fig. 3 is a plan view showing the main parts of Fig. 1, and Fig. 4 is a -
FIG. In these figures, the same reference numerals as in FIG. 8 indicate the same parts, and numeral 10 indicates the entire printed circuit board warp correction apparatus of the present invention.
Reference numeral 11 denotes a warp corrector for correcting the upward warpage of the upper surface side of the printed circuit board 1, which moves as the printed board 1 runs, and is connected to the warp correction device 10.
There are multiple machines available. 12 is a base of the warp corrector 11; 13 is a wheel attached to the base 12; 14 is a support shaft fixed to the base 12;
15 is a fixed frame attached to the support shaft 14;
6 is a movable plate guided by the support shaft 14 and can move up and down; 17 is a bearing fixed to the movable plate 16 and slidably fitted to the support shaft 14; This pin corrects upward warping and is fixed to the movable plate 16 so that it can be moved and adjusted. Reference numeral 19 denotes an engaging piece attached to the fixed frame 15, which engages with the printed circuit board 1 and moves the entire warp corrector 11 as the printed circuit board 1 moves. 21 is a lowering device for placing and lowering the warp corrector 11 located above;
22 is an arm of the lowering device 21; 23 is a support shaft;
24 is fixed to the arm 22 and is connected to the support shaft 23
25 is a rodless cylinder that serves as a driving source for moving the arm 22 up and down; 26 is attached to the arm 22 and is attached to the lower surface of the base 12 of the warp corrector 11; The mounting table 27 is an air cylinder that moves the mounting table 26 in a direction perpendicular to the traveling direction of the printed circuit board 1 (direction of arrow A), and 28 is a stopper that determines the position of the warp corrector 11. 31 lowers the movable plate 16 of the warp corrector 11 and removes the pin 1.
8 is brought into contact with the printed circuit board 1 and a lifting device for raising the lowered movable plate 16; 32 is an arm of the lifting device 31; 33 is a spindle; 34 is fixed to the arm 32; A bearing 35 is slidably fitted, a rodless cylinder 35 serves as a driving source for moving the arm 32 up and down, and a roller 36 is provided on the arm 32 and on which the movable plate 16 is placed. Note that the movable plate 16 is directly attached to the arm 3.
2 may be placed. Reference numeral 41 denotes a lifting device for placing and raising the warp corrector 11, and an arm 4 having the same configuration as the lowering device 21.
2. Support shaft 43, bearing 44, rodless cylinder 4
5, a mounting table 46 and an air cylinder 47 are provided. Reference numeral 51 denotes a guide rail provided below the warp corrector 10 on which the wheels 13 of the warp corrector 11 are placed and guides the travel of the warp corrector 11 as the printed circuit board 1 travels. Reference numeral 52 indicates a guide rail provided above the warp corrector 10, 53 indicates the entire transfer device for transferring the warp corrector 11, 54 and 55 indicate rodless cylinders constituting the transfer device 55, and the third As shown in the figure, their longitudinal directions are arranged in the same direction as the running direction (direction of arrow B) of the warp corrector 11, but
A portion of the front end of the rodless cylinder 54 and a portion of the rear end of the rodless cylinder 55 overlap to form two rows, which are arranged in parallel to the traveling direction (direction of arrow B) of the warp corrector 11. . An engagement piece 56 is moved by a piston (not shown) inside the rodless cylinder 54, and engages the base 12 of the warp corrector 11 placed on the arm 42 of the lifting device 41. and move it to the upper guide rail 52. 57 is an engagement piece of the rodless cylinder 55 that moves the warpage corrector 11 on the guide rail 52 toward the mounting table 26 of the lowering device 21. Note that when the engaging pieces 56 and 57 return to their original positions, even if they contact the base 12, they rotate counterclockwise and pass through without engaging, as shown by the broken line in FIG. It's becoming like that. 58 is stoppa,
Reference numeral 59 denotes a rod that goes in and out of the stopper 58, and when the lowering device 21 is in the upper position shown in FIG.
It is designed to allow the movement of the warp corrector 11, and when it is located downward, it protrudes and prevents the movement of the warp corrector 11.

Next, the operation will be explained.

FIGS. 5 a to 5 c show the warp corrector 11 and the lifting device 31.
FIG. 6 is an explanatory diagram showing the operation of the warp correction device 6.
FIG. 7 is an explanatory diagram showing the respective positions of the warp corrector 11 in the lowering device 21, the lifting device 31,
FIG. 4 is an explanatory diagram showing the operation of the lifting device 41. FIG. In Figures 5 a to c, 6 and 7, Figures 1 to 4
The same reference numerals as in the figure indicate the same parts. In FIGS. 6 and 7, S ₁ to S ₁₄ all indicate sensors. Note that sensors S ₁ and S ₃ are photodetectors, and sensors S ₂ and S ₄ ~
_S14 uses a micro switch, but it is not limited to the above.

After the printed circuit board 1 is soldered in a solder bath (not shown) and cooled in a cooler (not shown), the lead wires 3 are cut with a cutter 5 as shown in FIG.

First, as shown in FIG. 1, the printed circuit board 1 is engaged with the conveyance chain 4, and travels in the direction of arrow A from the cooler at the previous stage.

Next, as shown in FIG. 5a, when the traveling printed circuit board 1 comes into contact with the engagement piece 19 of the warp corrector 11 which is in a standby state, the warp corrector 11 moves the printed circuit board 1 forward. It moves in the direction of arrow A due to the driving force. Next, as shown in FIG. 5b, the warp corrector 11 is gradually moved. At the same time, the lifting device 31 descends, so the movable plate 16 placed on the roller 36 of the arm 32 also descends, and then, as shown in FIG. 5c, the movable plate 16 comes into contact with the fixed frame 15. . At the same time, the pin 18 comes into contact with the top surface of the printed circuit board 1, and the bottom surface of the printed circuit board 1 also comes into contact with the rotating pin 7b of the warp corrector 7, so the printed circuit board 1 is pressed from both the top and bottom surfaces and warps. is corrected and becomes fixed, and the lead wire 3 is cut by the cutter 5. Even after the lead wire 3 is cut, the disk 8b of the warp corrector 8 is in contact with the lower surface of the printed circuit board 1 while rotating, so that the warp of the printed circuit board 1 when the lead wire 3 is cut is corrected.
In addition, the printed circuit board 1 is not moved due to the vibration of the cutter 5 when cutting the lead wire 3, and the lead wire 3 is not cut diagonally.

Next, in FIGS. 6 and 7, the warp corrector 1
1, descending device 21, elevating device 31, elevating device 41
, and the actions of each sensor S ₁ to S ₁₄ will be explained.

The sensor S ₁ detects when the warp corrector 11 starts moving due to the running of the printed circuit board 1. When the sensor S ₁ detects this, the lifting device 31
begins to descend, and sensor _S2 detects the end of the descent.

Next, when the continuously moving warp corrector 11 comes to the position of the sensor S ₃ and detects that the warp corrector 11 has completely separated from the lifting device 31, the lifting device 31 starts to rise and the sensor S ₄ to detect the end of the rise.

Then, the warp corrector 11 continues to move further,
Sensor S ₅ indicates that it is completely placed on the lifting device 41.
When the sensor S 6 is detected, the lifting device 41 rises and the sensor S ₆
Detects that the rise has ended.

Due to the detection by sensor S ₆ , the rodless cylinder 5
4 is activated, the warp corrector 11 is moved in the direction of arrow B by the engaging piece 56, and its position is confirmed by the sensor _S7 . The rising device 41 is lowered by the detection by the sensor _S7 , and the completion of the lowering is detected by the sensor _S8 . Further, the engagement piece 56 returns to its original position as detected by the sensor _S7 , and the return of the engagement piece 56 is detected by the sensor _S9 . Further, the rodless cylinder 55 is actuated by the detection by the sensor _S7 , the engagement piece 57 moves the warp corrector 11 to the lowering device 21, the position is detected by the sensor _S10 , and the warp corrector ₁₁ is moved by the sensor S11. When it is detected that the tray is completely placed, the lowering device 21 starts lowering. On the other hand, the engagement piece 57
returns to its original position as detected by sensor _S10 , and sensor _S12 detects that the engaging piece 57 has returned.

Next, when the descent of the descending device 21 is completed, the end of the descent is detected by the sensor _S13 . By lowering the lowering device 21, the wheels 13 of the warp corrector 11 are placed on the guide rails 51, and the movable plate 16 is placed on the rollers 36 of the arm 32 of the lifting device 31.

Next, the lowering device 21 is activated by the detection by the sensor _S13 .
rises, and the sensor _S14 detects that the rise has ended.

Further, when the lowering device 21 starts lowering as detected by the sensor _S11 , the rod 59 of the stopper 58 protrudes to prevent the warp corrector 11 from moving toward the lowering device 21. When the lowering device 21 is raised and detected by the sensor S ₁₄ , the rod 59 is retracted so that the warp corrector 11 can be moved to the lowering device 21.

When the lowering device 21 is in the upper position, each mounting table 26 is moved inward by the drive of each air cylinder 27, so that it can be engaged with the base 12 of the warp corrector 11 and placed thereon. There is. Further, when the lowering device 21 is located below, each mounting table 26 is moved outward and removed from the base 12, so that the lowering device 21 can be raised. In the lifting device 41, when the warp corrector 11 is raised, the mounting table 46 moves inward to engage and place the warp corrector 11 on the base 12, and when it is lowered, it opens outward. It is now possible to descend.

Note that the warp correction device 10 for the printed circuit board 1
shows the case where it is used in a cutter device as an example, but it can be used not only in a cutter device but also in a solder bath.

Moreover, the above-mentioned warpage correction device 1 for the printed circuit board 1
0 is not limited to a carrierless soldering device that engages the printed circuit board 1 with the conveyance chain 4, but can also be used in a soldering device that attaches the printed circuit board 1 to a carrier and conveys it. In this case, the traveling carrier contacts the engagement piece 19 of the warp corrector 11 and transports it.

〔Effect of the invention〕

As explained above, the present invention includes a pin that presses the top surface of a printed circuit board, a pin that presses the top surface of a printed circuit board, and a
It also has a movable plate that allows vertical movement.
a warp corrector that moves by the driving force of a traveling printed circuit board; a guide rail that guides the travel of the warp corrector by the travel of the printed circuit board; a mounting table on which the warp corrector is placed; a lifting device that raises the warp corrector; a transfer device that engages the warp corrector that has been raised by the lift device and transfers it in a direction opposite to the direction in which the printed circuit board has traveled; A mounting table on which the warp corrector placed on the mounting table is placed; a lowering device for lowering the warp corrector placed on the mounting table; an arm on which the movable plate of the warp corrector that has been lowered is placed; and a printed circuit board. contacts the engagement piece, and at the same time as the warp corrector moves, a movable plate placed on the arm is lowered and the warp corrector is separated from the arm, thereby pressing the pin against the top surface of the printed circuit board. Since it is equipped with a lifting device and a The lead wires are not cut diagonally. Furthermore, when used in a soldering device, it is possible to prevent upward and downward warping of printed circuit boards due to heating of the solder melt, thereby providing an advantage in improving the quality of printed circuit boards.

[Brief explanation of the drawing]

Figures 1 to 4 show one embodiment of the present invention, with Figure 1 being a side view showing the overall configuration, Figure 2 being a perspective view showing the main parts of Figure 1, and Figure 3 being a perspective view showing the main parts of Figure 1. is the first
A plan view showing the main parts of the figure, Fig. 4 is a - of Fig. 3.
5A to 5C are explanatory diagrams showing the operation of the warp corrector and the lifting device. FIG. 6 is a side view showing the respective positions of the warp corrector in the warp corrector. FIG. 8 is an explanatory diagram showing the operations of the lowering device, the lifting device, and the lifting device. FIG. 8 is a schematic configuration diagram showing a conventional warpage correction device. In the figure, 1 is a printed circuit board, 2 is an electronic component, 3 is a lead wire, 4 is a conveyance chain, 5 is a cutter, and 6
10 is a warp corrector, 11 is a warp corrector, 12 is a base, 13 is a wheel, 14 is a support shaft, 15 is a fixed frame, 16 is a movable plate, 17 is a bearing,
18 is a pin, 19 is an engagement piece, 21 is a lowering device, 2
2, 32, 42 are arms, 26, 46 are mounting tables,
28 is a stopper, 31 is a lifting device, 36 is a roller, 41 is a lifting device, 51 and 52 are guide rails, 53 is a transfer device, and 56 and 57 are engaging pieces.

Claims (1)

[Claims] 1. A warpage correction device that corrects the warpage of a printed circuit board by pressing from the bottom surface of a traveling printed circuit board, which includes a pin that presses the top surface of the printed circuit board, and a movable device to which this pin is attached and which enables vertical movement. a warp corrector comprising a plate and moved by the driving force of the traveling printed circuit board;
a guide rail that guides the travel of the warp corrector; a mounting table on which the warp corrector is mounted; a lifting device that raises the warp corrector placed on the mounting table; a transfer device that engages the warp corrector and transfers it in a direction opposite to the direction in which the printed circuit board has traveled; a mounting table on which the warp corrector that has been transferred by the transfer device is placed; a lowering device that lowers the warp corrector placed on a mounting table; an arm that places the movable plate of the warp corrector that has been lowered; and the printed circuit board abuts the engagement piece, and the warp corrector is lowered; an elevating device comprising means for pressing the pin against the upper surface of the printed circuit board by detaching the warpage corrector from the arm while lowering the movable plate placed on the arm at the same time as the device travels; A printed circuit board warpage correction device comprising: