JPH0570776B2 - - Google Patents
Info
- Publication number
- JPH0570776B2 JPH0570776B2 JP62109780A JP10978087A JPH0570776B2 JP H0570776 B2 JPH0570776 B2 JP H0570776B2 JP 62109780 A JP62109780 A JP 62109780A JP 10978087 A JP10978087 A JP 10978087A JP H0570776 B2 JPH0570776 B2 JP H0570776B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- diaphragm
- receiving diaphragm
- pressure receiving
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Measuring Fluid Pressure (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプロセス変量である2点間の圧力差を
測定する差圧発信器等に適用して好適な受圧ダイ
ヤフラム保護装置およびその製造方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a pressure receiving diaphragm protection device suitable for application to a differential pressure transmitter, etc. that measures a pressure difference between two points, which is a process variable, and a method for manufacturing the same. .
従来、差圧発信器により管内流体の流量を測定
する場合、管内にオリフイス板を設置して流体抵
抗とし、この抵抗の上下流における圧力差を測定
して所定の演算式に基づき流量を導き出すことが
行われている。そのため、この種の差圧発信器は
実公昭59−30444号公報等にみられるように、一
般に2枚の受圧ダイヤフラムに各測定圧力を与
え、ボデイ本体内における内封液の移動を封入回
路を仕切つて設けた半導体センサの歪により電気
的出力として取出すように構成されている。受圧
ダイヤフラムは圧力を正確に伝達するために、通
常きわめて薄い金属板によつて波形形状に形成さ
れている。そして、従来は受圧ダイヤフラムの受
ける圧力が過剰圧力となつた場合、該ダイヤフラ
ムを保護するためボデイ本体の受圧側面で受け止
めて、その移動を阻止するようにしている。この
時、受圧ダイヤフラムの波形が歪んだり、破損し
たりしないように、すなわち無理な力が加わらな
いようにボデイ本体の受圧側面を受圧ダイヤフラ
ムの波形形状と同様な波形面に形成している。
Conventionally, when measuring the flow rate of fluid in a pipe using a differential pressure transmitter, an orifice plate was installed inside the pipe to create fluid resistance, and the pressure difference upstream and downstream of this resistance was measured to derive the flow rate based on a predetermined calculation formula. is being carried out. Therefore, as seen in Japanese Utility Model Publication No. 59-30444, this type of differential pressure transmitter generally applies each measurement pressure to two pressure-receiving diaphragms, and controls the movement of the sealed liquid within the body through a sealed circuit. It is configured to take out electrical output based on the distortion of a semiconductor sensor provided in a partitioned manner. In order to transmit pressure accurately, the pressure receiving diaphragm is usually made of a very thin metal plate and is formed into a corrugated shape. Conventionally, when the pressure received by the pressure receiving diaphragm becomes excessive, the diaphragm is protected by being received by the pressure receiving side of the body main body and prevented from moving. At this time, in order to prevent the waveform of the pressure-receiving diaphragm from being distorted or damaged, that is, to prevent excessive force from being applied, the pressure-receiving side surface of the body main body is formed into a waveform similar to that of the pressure-receiving diaphragm.
しかしながら、ボデイ本体の表面を機械加工に
よつて高い精度の波形面に形成することは、面倒
で、長時間を要し、製造コストが大幅にアツプす
るという大きな欠点を有していた。また、過剰圧
力が受圧ダイヤフラムに加わつた場合、該ダイヤ
フラムの形状のバラツキ、ボデイ本体の表面加工
のバラツキ等により、受圧ダイヤフラムの一部が
ボデイ本体の受圧側面の形状と合致しないと、部
分的に応力が加わり該ダイヤフラムに永久歪を発
生させ、それ以後は受圧ダイヤフラムに対する圧
力が測定範囲内であるにも拘わらず、該ダイヤフ
ラムがボデイ本体の表面に接触するといつた事態
が生じ、高精度な測定を困難にする。
However, forming the surface of the body body into a highly accurate waveform surface by machining has the major drawbacks of being troublesome and time consuming, and significantly increasing manufacturing costs. In addition, when excessive pressure is applied to the pressure receiving diaphragm, if part of the pressure receiving diaphragm does not match the shape of the pressure receiving side of the body main body due to variations in the shape of the diaphragm, variations in the surface finish of the body, etc. The stress is applied, causing permanent strain on the diaphragm, and after that, even though the pressure on the pressure-receiving diaphragm is within the measurement range, the diaphragm comes into contact with the surface of the body, making it difficult to make high-precision measurements. make it difficult.
したがつて、本発明では上記したような従来の
欠点を解決し、ボデイ本体の受圧側面を波形形状
にすることなく、受圧ダイヤフラムを過剰圧力か
ら確実に保事し、その塑性変形、破損等を防止し
得る受圧ダイヤフラム保護装置およびその製造方
法を提供しようとするものである。 Therefore, the present invention solves the above-mentioned conventional drawbacks and reliably protects the pressure-receiving diaphragm from excessive pressure without making the pressure-receiving side of the body into a corrugated shape, thereby preventing its plastic deformation, breakage, etc. It is an object of the present invention to provide a pressure-receiving diaphragm protection device and a method for manufacturing the same.
本発明に係る受圧ダイヤフラム保護装置は上記
目的を達成するために、圧力伝達用封入液を内封
したボデイ本体の受圧側面に波形の受圧ダイヤフ
ラムを配設した装置において、前記ボデイ本体の
受圧側面を平坦面に形成し、前記受圧ダイヤフラ
ムの圧力伝達用封入液側面に、前記受圧ダイヤフ
ラムと相似形状でかつ所定間隔をもつて対向する
バツクアツププレートを配設してなり、このバツ
クアツププレートは前記圧力伝達用封入液が流通
できる流通孔を有すると共に、波形面の封入側液
頂部が前記受圧側面に当接しているものである。
In order to achieve the above object, the pressure receiving diaphragm protection device according to the present invention is a device in which a corrugated pressure receiving diaphragm is disposed on the pressure receiving side of a body main body that seals a sealed fluid for pressure transmission. A backup plate is formed on a flat surface, and is disposed on the side of the pressure-transmitting sealed liquid of the pressure-receiving diaphragm, and has a similar shape to the pressure-receiving diaphragm and faces the pressure-receiving diaphragm at a predetermined distance. It has a flow hole through which the sealed liquid for transmission can flow, and the top of the liquid on the sealed side of the corrugated surface is in contact with the pressure-receiving side surface.
また、本発明に係る受圧ダイヤフラム保護装置
の製造方法は、バツクアツププレートを受圧ダイ
ヤフラムのプレス成形時に同時に重ね合わせて成
形するようにしたものである。 Further, in the method for manufacturing a pressure receiving diaphragm protection device according to the present invention, the backup plate is formed by overlapping the pressure receiving diaphragm at the same time when the pressure receiving diaphragm is press-molded.
本発明に係る受圧ダイヤフラム保護装置におい
ては、過剰圧力が作用した際、バツクアツププレ
ートが受圧ダイヤフラムを受け止め、その変形、
破損等を防止する。
In the pressure receiving diaphragm protection device according to the present invention, when excessive pressure acts, the backup plate receives the pressure receiving diaphragm and prevents its deformation.
Prevent damage etc.
また、本発明に係る受圧ダイヤフラム保護装置
の製造方法においては、受圧ダイヤフラムとバツ
クアツププレートとを高い精度の相似形状に形成
することができる。 Further, in the method for manufacturing a pressure receiving diaphragm protection device according to the present invention, the pressure receiving diaphragm and the backup plate can be formed into similar shapes with high precision.
以下、本発明を図面に示す実施例に基づいて詳
細に説明する。
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
第1図は本発明に係る受圧ダイヤフラム保護装
置を備えた差圧発信器の一実施例を示す断面図、
第2図は要部拡大断面図である。これらの図にお
いて、符号1で示すものは圧力伝達用の内封液2
を封入してなるボデイ本体で、このボデイ本体1
の左右両側面、すなわち各受圧側面1a,1bに
は波形に形成された受圧ダイヤフラム3,4がそ
の周縁部をそれぞれ溶接固定されて配設されると
共にこれらの受圧ダイヤフラム3,4を被うよう
にカバー5,6が固定されている。 FIG. 1 is a sectional view showing an embodiment of a differential pressure transmitter equipped with a pressure receiving diaphragm protection device according to the present invention;
FIG. 2 is an enlarged sectional view of the main part. In these figures, the reference numeral 1 indicates the internal sealing fluid 2 for pressure transmission.
This body body 1 is made by enclosing
Pressure-receiving diaphragms 3 and 4 formed in a corrugated manner are arranged on both the left and right side surfaces, that is, each pressure-receiving side surface 1a and 1b, with their peripheral edges welded and fixed, respectively, and so as to cover these pressure-receiving diaphragms 3 and 4. Covers 5 and 6 are fixed to.
前記各受圧ダイヤフラム3,4の材料として
は、被測定流体によつても異なるが、通常耐食性
に優れたステンレス、チタン、タンタル、モネル
等が使用され、その板厚は0.05〜0.06mm程度とさ
れる。そして、図において左側の受圧ダイヤフラ
ム3の外表面にはカバー5の孔7より被測定流体
のオリフイス上流側の圧力PHが導かれ、右側の
受圧ダイヤフラムの外表面にはカバー6の孔8よ
り被測定流体のオリフイス下流側の圧力PLが導
かれている。 The material for each of the pressure receiving diaphragms 3 and 4 varies depending on the fluid to be measured, but stainless steel, titanium, tantalum, monel, etc. with excellent corrosion resistance are usually used, and the plate thickness is about 0.05 to 0.06 mm. Ru. In the figure, the pressure P H of the fluid to be measured on the upstream side of the orifice is introduced from the hole 7 of the cover 5 to the outer surface of the pressure receiving diaphragm 3 on the left side, and the pressure P H on the upstream side of the orifice of the fluid to be measured is introduced from the hole 8 of the cover 6 to the outer surface of the pressure receiving diaphragm 3 on the right side. The pressure P L of the fluid to be measured on the downstream side of the orifice is guided.
また、前記ボデイ本体1の各受圧側面1a,1
bを前記各受圧ダイヤフラム3,4との間には本
考案を特徴ずける受圧ダイヤフラム保護装置とし
てのバツクアツププレート9,10が配設されて
おり、その周縁部が前記各受圧ダイヤフラム3,
4の表面周縁部と共に前記各受圧側面1a,1b
の周縁部に溶接固定されている。これらのバツク
アツププレート9,10は前記各受圧ダイヤフラ
ム3,4と相似形の波形に形成され、かつ該ダイ
ヤフラム3,4と所定の間隔を保つて対向するよ
うに配設され、その適宜箇所には前記封入液2が
流通可能な少なくとも1つの流通孔11がそれぞ
れ形成されている。これは、各バツクアツププレ
ート9,10と受圧ダイヤフラム3,4との隙間
に封入液2を導き、該プレート9,10の表裏面
において圧力差が生じないようにするためのもの
である。そして、これらのバツクアツププレート
9,10は、ステンレス、ハステロイ等によつて
形成され、その板厚は受圧ダイヤフラム3,4の
板厚より十分大きく設定されている(例えば0.4
mm以上)。 Further, each pressure-receiving side surface 1a, 1 of the body main body 1
Back-up plates 9 and 10, which serve as a pressure-receiving diaphragm protection device that characterizes the present invention, are arranged between the pressure-receiving diaphragms 3 and 4, and the peripheral edges thereof are arranged between the pressure-receiving diaphragms 3 and 4.
4 and the respective pressure-receiving side surfaces 1a, 1b.
Welded and fixed to the periphery of the These back-up plates 9, 10 are formed in a similar waveform to the respective pressure-receiving diaphragms 3, 4, and are disposed so as to face the diaphragms 3, 4 with a predetermined distance therebetween. At least one flow hole 11 through which the sealed liquid 2 can flow is formed. This is to guide the sealed liquid 2 into the gap between each backup plate 9, 10 and the pressure receiving diaphragm 3, 4, and to prevent a pressure difference from occurring between the front and back surfaces of the plates 9, 10. These backup plates 9 and 10 are made of stainless steel, Hastelloy, etc., and their thickness is set to be sufficiently larger than that of the pressure receiving diaphragms 3 and 4 (for example, 0.4
mm or more).
この場合、ボデイ本体1の各受圧側面1a,1
bは受圧ダイヤフラム3,4の保護機能を有さ
ず、したがつて平坦面に形成されている。また、
バツクアツププレート9,10は被測定流体の圧
力PH,PLによつて変位されるものである必要が
なく、そのため周縁部のみならず、波形面の前記
受圧側面1a,1bと対向する頂部aが該受圧側
面1a,1bにそれぞれスポツト溶接等により固
定されるものであつてもよい。 In this case, each pressure-receiving side surface 1a, 1 of the body main body 1
b does not have the protective function of the pressure receiving diaphragms 3 and 4, and is therefore formed as a flat surface. Also,
The back-up plates 9 and 10 do not need to be displaced by the pressures P H and PL of the fluid to be measured, and therefore, not only the peripheral portions but also the top portions of the corrugated surfaces facing the pressure-receiving sides 1 a and 1 b a may be fixed to the pressure-receiving sides 1a and 1b by spot welding or the like.
前記ボデイ本体1内には2つの封入回路13,
14が形成されており、これらの封入回路13,
14の上端は該ボデイ本体1の上部に設けられ、
ハーメチツクシール15によつて密閉された上部
室16にそれぞれ連通され、下端は前記各受圧側
面1a,1bに開口されている。前記上部室16
には前記封入液2が封入されると共に半導体セン
サ20が配設されている。半導体センサ20は第
3図に示すように上部室16の底面16a上に配
設されたシリコンベース21と、このシリコンベ
ース21上に配設されたカツプ状のシリコンウエ
ハ22とを備え、シリコンウエハ22の上面起歪
部は拡散性などによりブリツジ結線されたストレ
ンゲージ24が形成されて半導体ダイヤフラム2
3を構成している。そして、前記半導体ダイヤフ
ラム23の上側には封入回路13を介して圧力
PHが与えられ、下側には封入回路14およびシ
リコンベース21の貫通孔25を介して圧力PL
が与えられている。 In the body main body 1, two sealed circuits 13,
14 are formed, and these encapsulated circuits 13,
The upper end of 14 is provided at the upper part of the main body 1,
Each of them communicates with an upper chamber 16 sealed by a hermetic seal 15, and the lower end thereof is opened at each of the pressure-receiving side surfaces 1a and 1b. The upper chamber 16
The liquid 2 is sealed in the housing 2, and a semiconductor sensor 20 is disposed therein. As shown in FIG. 3, the semiconductor sensor 20 includes a silicon base 21 disposed on the bottom surface 16a of the upper chamber 16, and a cup-shaped silicon wafer 22 disposed on the silicon base 21. A strain gauge 24 connected by a bridge due to diffusivity or the like is formed on the upper surface strain-generating portion of the semiconductor diaphragm 2.
3. Then, pressure is applied to the upper side of the semiconductor diaphragm 23 via the sealed circuit 13.
A pressure P L is applied to the lower side through the encapsulation circuit 14 and the through hole 25 of the silicon base 21 .
is given.
次に、前記受圧ダイヤフラム3,4とバツクア
ツププレート9,10の製造方法を説明すると、
これらは同一の型により同時にプレス成形され
る。その場合、第4図に示す絞り成形と第5図に
示す液圧成形との2つの成形方法により製造が可
能である。 Next, a method of manufacturing the pressure receiving diaphragms 3, 4 and backup plates 9, 10 will be explained.
These are press-molded at the same time using the same mold. In that case, manufacturing is possible using two forming methods: draw forming shown in FIG. 4 and hydraulic forming shown in FIG. 5.
すなわち、第4図の絞り成形による方法は、互
いに対向する合せ面が波形面に形成されたダイス
30とポンチ31を使用するもので、これら両者
間に受圧ダイヤフラムとバツクアツププレートの
素材である2枚の薄い金属板からなる成形材3
2,33を重ねて配置し、これらの成形材32,
33をポンチ31でダイス30に押し付けること
により波形の受圧ダイヤフラムとバツクアツププ
レートを同時形成するようにしたものである。こ
の際、ポンチ31の周面には絞り込みの際に成形
材32,33に皺が発生しないように、皺押え3
6が設置されている。これはプレス以前にダイス
30との間に成形材32,33を挾み込んで固定
し、プレス中成形材32,33が内部(ダイスの
中心)に引き込まれないようにするためのもので
ある。 That is, the drawing method shown in FIG. 4 uses a die 30 and a punch 31 whose mating surfaces facing each other are formed into corrugated surfaces, and between these two there is a material 2 for the pressure-receiving diaphragm and the back-up plate. Molded material 3 made of thin metal plates
2 and 33 are placed one on top of the other, and these molded materials 32,
33 is pressed against the die 30 with a punch 31, a corrugated pressure receiving diaphragm and a back-up plate are simultaneously formed. At this time, a wrinkle presser is placed on the circumferential surface of the punch 31 to prevent wrinkles from forming in the molded materials 32 and 33 during narrowing.
6 is installed. This is to sandwich and fix the molded materials 32 and 33 between the die 30 and the die 30 before pressing, and to prevent the molded materials 32 and 33 from being drawn inside (to the center of the die) during pressing. .
また、ダイス30とポンチ31の合せ面の周縁
部に環状の突部37と凹部38を対応して形成
し、これらによつて受圧ダイヤフラムとバツクア
ツププレートの周縁部に環状突起を設けると、組
込み時における受圧ダイヤフラムとバツクアツプ
プレートとの位置合わせが容易で、相互のずれの
発生を防止できる利点を有している。 Further, if an annular protrusion 37 and a recess 38 are formed correspondingly on the periphery of the mating surfaces of the die 30 and the punch 31, and an annular protrusion is provided on the periphery of the pressure receiving diaphragm and the back-up plate, it is possible to This has the advantage that it is easy to align the pressure receiving diaphragm and the backup plate at the time of use, and that mutual misalignment can be prevented.
一方、第5図に示す液圧成形による方法は、ダ
イス30と、カツプ状のカバー部材39とを使用
するもので、カバー部材39の周壁先端面により
2枚の成形材32,33の周縁部をダイス30の
成形面周縁部にOリング40を介して圧接し、か
つカバー部材39と成形材32との間の空間に所
定圧力に加圧された油、水等の液体を注入し、こ
の液圧により成形材32,33を塑性変形させて
波形の受圧ダイヤフラムとバツクアツププレート
とを同時に成形するようにしたものである。この
場合、成形材32,33にはその全面に亘つて均
等な圧力が加わるため、成形材32,33の伸び
等にかたよりが生じる、良好な成形ができる。 On the other hand, the hydroforming method shown in FIG. 5 uses a die 30 and a cup-shaped cover member 39, and the peripheral edge of the two molded materials 32 and 33 is formed by the tip end surface of the peripheral wall of the cover member 39. is pressed against the peripheral edge of the molding surface of the die 30 via an O-ring 40, and a liquid such as oil or water pressurized to a predetermined pressure is injected into the space between the cover member 39 and the molding material 32. The molded materials 32 and 33 are plastically deformed by hydraulic pressure to form a corrugated pressure receiving diaphragm and a back-up plate at the same time. In this case, since uniform pressure is applied to the entire surface of the molding materials 32 and 33, good molding can be achieved without uneven elongation of the molding materials 32 and 33.
以上のような構成からなる差圧発信器におい
て、通常の圧力測定時においては、受圧ダイヤフ
ラム3,4には封入液2を介して差圧PH−PLに
応じた力が第1図において右向きに与えられ、こ
の力が封入回路13,14を通つて上部室16内
の半導体センサ20に加えられる。このため、半
導体ダイヤフラム23は差圧PH−PLに応じて第
3図2点鎖線で示すように下方に変形し、この変
形がストレンゲージ24によつて電気的に取り出
され、増幅器26で増幅された後計器に表示ない
し遠隔発信される。 In the differential pressure transmitter configured as described above, during normal pressure measurement, a force corresponding to the differential pressure P H - P L is applied to the pressure receiving diaphragms 3 and 4 via the sealed liquid 2 as shown in Fig. 1. This force is applied to the semiconductor sensor 20 in the upper chamber 16 through the enclosed circuits 13 and 14. Therefore, the semiconductor diaphragm 23 is deformed downward as shown by the two-dot chain line in FIG . After being amplified, it is displayed on a meter or transmitted remotely.
次に、例えばオリフイス上流側に過剰圧力が発
生すると、受圧ダイヤフラム3は右方に大きく撓
み、これをバツクアツププレート9が受け止める
ことで、前記受圧ダイヤフラム3の破損、変形等
を防止する。この場合、受圧ダイヤフラム3とバ
ツクアツププレート9とは前述した通り同一の型
によつて同時に形成されることで精度の高い相似
形に形成されているので、受圧ダイヤフラム3の
ほぼ全面がバツクアツププレート9に密接し、局
部的な応力を受けることがなく、したがつて永久
歪を生じることはない。 Next, for example, when excessive pressure is generated on the upstream side of the orifice, the pressure receiving diaphragm 3 is deflected significantly to the right, and the back-up plate 9 receives this deflection, thereby preventing the pressure receiving diaphragm 3 from being damaged or deformed. In this case, as described above, the pressure receiving diaphragm 3 and the backup plate 9 are formed at the same time using the same mold and are formed into similar shapes with high precision, so that almost the entire surface of the pressure receiving diaphragm 3 is covered with the backup plate 9, and is not subjected to local stress, so that no permanent deformation occurs.
同様にオリフイス下流側に過剰圧力が生じた場
合には、受圧ダイヤフラム4が左方に大きく撓
み、これをバツクアツププレート10が受け止め
て該ダイヤフラム4の墨形、破損等を防止する。
しかも、受圧ダイヤフラム4とバツクアツププレ
ート10とは上述の受圧ダイヤフラム3とバツク
アツププレート9と同様、同一の型で同時形成さ
れることにより、精度の高い相似形をなしている
ため、これら両者が密接して受圧ダイヤフラム4
に局部的な応力が生じず、したがつてこの場合も
永久歪を生じることはない。それ故、良好かつ精
度の高い差圧測定を行うことができる。また、バ
ツクアツププレート9,10は受圧ダイヤフラム
3,4のプレス成形時に同時に形成されるもので
あるため、製作が極めて簡単で、ボデイ本体1の
受圧側面1a,1bを波形に加工形成するよりは
るかに安価で、製造コストを大幅に低減すること
ができる。 Similarly, when excessive pressure is generated on the downstream side of the orifice, the pressure receiving diaphragm 4 is deflected significantly to the left, and the back-up plate 10 receives this deflection to prevent the diaphragm 4 from becoming ink-shaped or being damaged.
Furthermore, the pressure receiving diaphragm 4 and the backup plate 10 are formed simultaneously using the same mold, similar to the above-mentioned pressure receiving diaphragm 3 and the backup plate 9, so that they have highly accurate similar shapes. Close pressure receiving diaphragm 4
No local stress is generated in this case, so no permanent deformation occurs in this case either. Therefore, good and highly accurate differential pressure measurement can be performed. In addition, since the back-up plates 9 and 10 are formed at the same time as the pressure-receiving diaphragms 3 and 4 are press-molded, they are extremely easy to manufacture, and are much easier to manufacture than forming the pressure-receiving sides 1a and 1b of the body body 1 into a wave shape. It is inexpensive and can significantly reduce manufacturing costs.
また、通常各封入回路13,14には過剰圧力
による半導体センサ20の損傷を防止するため絞
りが設けられているが、この絞りの役割を各バツ
クアツププレート9,10に形成した流通孔11
が代用するため、前記絞りを形成する必要がな
い。 Further, each of the enclosed circuits 13 and 14 is normally provided with a throttle to prevent damage to the semiconductor sensor 20 due to excessive pressure, but the role of this throttle is played by the flow holes 11 formed in the respective backup plates 9 and 10.
is used instead, so there is no need to form the aperture.
〔発明の効果〕
以上説明したように本発明に係る受圧ダイヤフ
ラム保護装置は、ボデイ本体の受圧側面と受圧ダ
イヤフラムとの間に該ダイヤフラムと相似形状で
かつ所定間隔をもつて対向するバツクアツププレ
ートを配設し、過剰圧力が発生した際、該プレー
トにより受圧ダイヤフラムを受け止めるように構
成したので、受圧ダイヤフラムの変形、破損等を
確実に防止し得、またボデイ本体の受圧側面をダ
イヤフラムと同じ形状に加工形成する必要がな
く、ボデイ本体の製作が容易で安価に提供し得
る。[Effects of the Invention] As explained above, the pressure-receiving diaphragm protection device according to the present invention includes a back-up plate that has a similar shape to the diaphragm and faces the diaphragm with a predetermined distance between the pressure-receiving side surface of the body main body and the pressure-receiving diaphragm. Since the plate is configured to receive the pressure receiving diaphragm when excessive pressure occurs, it is possible to reliably prevent deformation or damage of the pressure receiving diaphragm, and the pressure receiving side of the body main body can be made in the same shape as the diaphragm. There is no need for processing and forming, and the body main body can be easily manufactured and provided at low cost.
また、本発明による受圧ダイヤフラム保護装置
の製造方法は、受圧ダイヤフラムとバツクアツプ
プレートとをプレス成形によつて同時に形成する
ようにしているので、精度の高い相似形状のもの
が得られる。 Further, in the method of manufacturing a pressure receiving diaphragm protection device according to the present invention, the pressure receiving diaphragm and the backup plate are simultaneously formed by press molding, so that similar shapes with high precision can be obtained.
第1図は本発明に係る受圧ダイヤフラム保護装
置を備えた差圧発信器の一実施例を示す断面図、
第2図は要部拡大断面図、第3図は半導体センサ
の拡大断面図、第4図は受圧ダイヤフラムとバツ
クアツププレートの成形方法を示す断面図、第5
図は受圧ダイヤフラムとバツクアツプレートの他
の成形方法を示す断面図である。
1……ボデイ本体、1a,1b……受圧側面、
2……圧力伝達用封入液、3,4……受圧ダイヤ
フラム、9,10……バツクアツププレート、1
1……流通孔、13,14……封入回路、20…
…半導体センサ、30……ダイス、31……ポン
チ。
FIG. 1 is a sectional view showing an embodiment of a differential pressure transmitter equipped with a pressure receiving diaphragm protection device according to the present invention;
Fig. 2 is an enlarged sectional view of the main parts, Fig. 3 is an enlarged sectional view of the semiconductor sensor, Fig. 4 is a sectional view showing the method of forming the pressure receiving diaphragm and the backup plate, and Fig. 5 is an enlarged sectional view of the main part.
The figure is a sectional view showing another method of forming the pressure receiving diaphragm and the back-up plate. 1... Body main body, 1a, 1b... Pressure receiving side,
2...Pressure transmission sealed liquid, 3, 4...Pressure receiving diaphragm, 9, 10...Backup plate, 1
1... Distribution hole, 13, 14... Enclosed circuit, 20...
...Semiconductor sensor, 30...Dice, 31...Punch.
Claims (1)
圧側面に波形の受圧ダイヤフラムを配設した装置
において、前記ボデイ本体の受圧側面を平坦面に
形成し、前記受圧ダイヤフラムの圧力伝達用封入
液側面に、前記受圧ダイヤフラムと相似形状でか
つ所定間隔をもつて対向するバツクアツププレー
トを配設してなり、このバツクアツププレートは
前記圧力伝達用封入液が流通できる流通孔を有す
ると共に、波形面の封入液側頂部が前記受圧側面
に当接していることを特徴とする受圧ダイヤフラ
ム保護装置。 2 圧力伝達用封入液を内封したボデイ本体の受
圧側面に配設された受圧ダイヤフラムの圧力伝達
用封入液側面に、このダイヤフラムの相似形状で
かつ所定間隔をもつて対向するように配設される
バツクアツププレートを、前記受圧ダイヤフラム
のプレス成形時に同時に重ね合わせて成形するよ
うにしたことを特徴とする受圧ダイヤフラム保護
装置の製造方法。[Scope of Claims] 1. In a device in which a corrugated pressure receiving diaphragm is disposed on the pressure receiving side of a body main body containing sealed liquid for pressure transmission, the pressure receiving diaphragm of the body main body is formed into a flat surface, and the pressure receiving diaphragm is A back-up plate having a similar shape to the pressure receiving diaphragm and facing at a predetermined distance is disposed on the side of the pressure-transmitting sealed liquid, and this back-up plate has a flow hole through which the pressure-transmitting sealed liquid can flow. A pressure receiving diaphragm protection device characterized in that the top portion of the corrugated surface on the sealed liquid side is in contact with the pressure receiving side surface. 2. A pressure-receiving diaphragm, which is disposed on the pressure-receiving side of the body main body that seals the pressure-transmitting liquid, has a pressure-receiving diaphragm that is disposed opposite to the side of the pressure-transmitting liquid with a similar shape to the diaphragm and with a predetermined spacing therebetween. 1. A method for manufacturing a pressure receiving diaphragm protection device, characterized in that a backup plate is overlapped and molded at the same time as the pressure receiving diaphragm is press-molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10978087A JPS63274832A (en) | 1987-05-07 | 1987-05-07 | Pressure-receiving diaphragm protection device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10978087A JPS63274832A (en) | 1987-05-07 | 1987-05-07 | Pressure-receiving diaphragm protection device and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63274832A JPS63274832A (en) | 1988-11-11 |
| JPH0570776B2 true JPH0570776B2 (en) | 1993-10-05 |
Family
ID=14519035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10978087A Granted JPS63274832A (en) | 1987-05-07 | 1987-05-07 | Pressure-receiving diaphragm protection device and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63274832A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012052078A1 (en) * | 2010-10-22 | 2012-04-26 | C.Miethke Gmbh & Co Kg | Implant for measuring the intracorporeal pressure, featuring telemetric transmission of measured values |
| US10675451B2 (en) | 2010-10-22 | 2020-06-09 | Christoph Miethke Gmbh & Co Kg | Hydrocephalus shunt arrangement and components thereof for draining cerebrospinal fluid in a patient having hydrocephalus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5536703A (en) * | 1978-09-06 | 1980-03-14 | Toshiba Corp | Transducer for pressure gauge |
-
1987
- 1987-05-07 JP JP10978087A patent/JPS63274832A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63274832A (en) | 1988-11-11 |
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