JPH0570932B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor assembly apparatus, and more particularly to a semiconductor assembly apparatus used for mounting a plurality of semiconductor pellets of different sizes on a semiconductor element.

[Technical Background of the Invention] Conventionally, when mounting a plurality of semiconductor pellets of different sizes on a semiconductor device, there is a method in which an operator uses tweezers to mount the required semiconductor pellets at a desired position on the semiconductor device. Are known.

[Problems with the Background Art] However, with the method of manually mounting a semiconductor pellet onto a semiconductor element, there may be variations in the quality of the mounting condition, there may be damage to the semiconductor pellet with tweezers, and there may be problems with the work. This method has problems such as requiring a long time to complete and requiring a considerable level of skill from the operator.

[Object of the invention] The present invention was made in view of the above problems, and
The purpose of the present invention is to provide a semiconductor assembly device that reduces the number of work steps and improves the reliability of semiconductor devices.

[Summary of the Invention] In order to achieve this object, the semiconductor assembly apparatus of the present invention has a semiconductor assembly device that uses a semiconductor pellet according to the size of the semiconductor pellet to be mounted on a semiconductor element, in order to adsorb the semiconductor pellet without damaging its surface. several types of die collets to be selected, a die collet holder that adsorbs the semiconductor pellet to the tip of the die collet after adsorbing the die collet, and presses and joins the semiconductor pellet to the semiconductor element; an X-Y stage section that sequentially stops the holding section on each of the die collet, the semiconductor pellet, and the semiconductor placed on a horizontally moving path; and an X-Y stage section that sequentially stops the holding section; a mount head section for raising and lowering the die collet holding section for carrying out a series of work steps, and a mount head section for raising and lowering the
It is equipped with a stage section and a control section that controls the operation of the mount head section.

[Embodiments of the Invention] Preferred embodiments of the present invention will be described in detail below with reference to FIGS. 1 and 2. The semiconductor assembly apparatus of the present invention is comprised of die collets 1a and 1b, a die collet holding section 2, an X-Y stage section 3, and a mount head section 4, as shown in FIGS. As shown in Figure 1, the die collection 1a
The size of the semiconductor pellet 8 is determined in order to adsorb the semiconductor pellet 8 placed on the semiconductor pellet supply stand 7 to be mounted on the semiconductor element 6 placed on the semiconductor element feed stand 5 without damaging its surface. There are several types available, which are selected depending on the situation. The die collet 1a is placed on a die collet storage device 9 and fixed with a clamper 10a. As shown in FIG. 2, after the die collet holding section 2 has sucked the die collet 1b,
The semiconductor pellet 8 is attracted to the tip of the die collet 1b, and the semiconductor pellet 8 is pressed against the semiconductor element 6 to effect eutectic bonding. The die collet holding section 2 is provided with a pipe 11 for adsorbing the die collet and a pipe 12 for adsorbing the pellet, and is mechanically connected to the mounting head section 4. As shown in FIG. 1, the X-Y stage section 3 is
The die collet holder 2 is placed on each of the die collet 1a, the semiconductor pellet 8, and the semiconductor element 6, which are placed on the path along which the die collet holder 2 moves horizontally.
This is to stop the operation one after another. The X-Y stage section 3 is equipped with a mount head section 4, which will be described later. The mount head section 4 is used to raise and lower the die collet holder 2 when the die collet holder 2 is stopped on each of the die collet 1a, the semiconductor pellet 8, and the semiconductor element 6. The mount head section 4 is mechanically connected to the die collet holding section 2 and is mounted on the X-Y stage section 3. The control unit also controls the die collet holding unit 2, X-Y
It controls the operations of the stage section 3 and mount head section 4.

The operation of the semiconductor assembly apparatus of the present invention configured as described above is as follows. As shown in Figure 1,
First, the die collet holding section 2 is moved by the X-Y stage section 3 to a position above the storage area of the die collet 1a. Die collection 1a in this case
is stored in the die collet storage tool 9, and is fixed so that the clamper 10a, which can be opened and closed, will not be displaced. Then, the die collet holding part 2 stopped above the die collet 1a.
vacuum adsorbs the die collet 1a. At the same time, the clamper 10a fixing the die collet 1a opens, and the die collet 1b moves upward as shown in FIG. Also, when replacing the die collet 1b, by performing the reverse operation, the die collet 1b can be replaced.
can be returned to the designated storage location. Next, the die collet holding section 2 that has attracted the die collet 1b is moved to above the semiconductor pellet 8 by the XY stage section 3. Thereupon, the die collet holding section 2 is pulled down by the mounting head section 4, and the semiconductor pellet 8 is vacuum-adsorbed. Furthermore, the die collet holding section 2 which is adsorbing the semiconductor pellet 8 is moved to above the semiconductor element 6 by the X-Y stage section 3. The die collet holding part 2 is then pulled down by the mounting head part 4. In this state, the semiconductor pellet 8 is
By being pressed onto the semiconductor element 6 and vibrating it, a strong eutectic bond is formed. Then, when the bonding of the semiconductor pellet 8 is completed, the die collet holding section 2 stops vacuum suction of the semiconductor pellet 8, and is raised by the mounting head section 4. Next, in order to mount semiconductor pellets 8 of different sizes on the semiconductor element 6, the die collet holder 2 returns the die collet 1b that has been used so far, and moves it to an X-Y stage in order to replace it with a new die collet. Section 3 moves the die collection to the storage location. By repeating this series of operations, a plurality of semiconductor pellets 8 of different sizes can be mounted on the semiconductor element 6. The above series of operations is repeated automatically by the control section.

[Effects of the Invention] As is clear from the above embodiments, the semiconductor assembly apparatus of the present invention uses several types of die collets selected depending on the size of the semiconductor pellet, and presses and joins the semiconductor pellet against the semiconductor element. a die collet holder, and an X-Y stage part that sequentially stops the die collet holder on each of the die collet, the semiconductor pellet, and the semiconductor element;
It is composed of a mount head section that moves the die collet holder up and down when the die collet holder stops, and a control section that controls the operation of the die collet holder This has effects such as improving the reliability of the element.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a semiconductor assembly apparatus according to the present invention, and FIG. 2 is a block diagram of the semiconductor assembly apparatus according to the present invention in a die collet adsorption state. 1a, 1b...Die collet, 2...Die collet holding part, 3...XY stage part, 4...Mount head part, 6...Semiconductor element, 8...Semiconductor pellet.

Claims (1)

[Claims] 1. In order to adsorb a semiconductor pellet to be mounted on a semiconductor element without damaging its surface, several types of die collets are selected according to the size of the semiconductor pellet, and after adsorbing the die collet, a die collet is attached to the tip of the die collet. A die collet holder that adsorbs the semiconductor pellet and presses and joins the semiconductor pellet to the semiconductor element, and each of the die collet, the semiconductor pellet, and the semiconductor element is placed on a path along which the die collet holder moves horizontally. an X-Y stage section for successively stopping the holding section; a mount head section for moving the holding section up and down when the die collet holding section stops; and a mounting head section for moving the die collet holding section up and down to perform a series of work steps 1. A semiconductor assembly apparatus comprising: a control section for controlling operations of the X-Y stage section and the mount head section.