JPH0571060B2 - - Google Patents
Info
- Publication number
- JPH0571060B2 JPH0571060B2 JP19805386A JP19805386A JPH0571060B2 JP H0571060 B2 JPH0571060 B2 JP H0571060B2 JP 19805386 A JP19805386 A JP 19805386A JP 19805386 A JP19805386 A JP 19805386A JP H0571060 B2 JPH0571060 B2 JP H0571060B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive paint
- copper
- cupric
- carbon
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- QGJOPFRUJISHPQ-UHFFFAOYSA-N Carbon disulfide Chemical compound S=C=S QGJOPFRUJISHPQ-UHFFFAOYSA-N 0.000 claims description 42
- 239000003973 paint Substances 0.000 claims description 38
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 23
- 229920000642 polymer Polymers 0.000 claims description 21
- -1 copper halide Chemical class 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 10
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 claims description 10
- 229910052717 sulfur Inorganic materials 0.000 claims description 10
- 239000011593 sulfur Substances 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910021590 Copper(II) bromide Inorganic materials 0.000 claims description 5
- 229960003280 cupric chloride Drugs 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 claims description 3
- 229910021589 Copper(I) bromide Inorganic materials 0.000 claims description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 2
- 229910021593 Copper(I) fluoride Inorganic materials 0.000 claims description 2
- 229910021595 Copper(I) iodide Inorganic materials 0.000 claims description 2
- 229910021594 Copper(II) fluoride Inorganic materials 0.000 claims description 2
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 2
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 claims description 2
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 claims description 2
- GWFAVIIMQDUCRA-UHFFFAOYSA-L copper(ii) fluoride Chemical compound [F-].[F-].[Cu+2] GWFAVIIMQDUCRA-UHFFFAOYSA-L 0.000 claims description 2
- 229940045803 cuprous chloride Drugs 0.000 claims description 2
- 230000002194 synthesizing effect Effects 0.000 claims description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 15
- 239000002904 solvent Substances 0.000 description 14
- 229920001940 conductive polymer Polymers 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000000843 powder Substances 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000921 elemental analysis Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002329 infrared spectrum Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical class CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000006418 Brown reaction Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229920000547 conjugated polymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001197 polyacetylene Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は高導電性を有する新規塗料およびその
製造方法に関する。この塗料は有機溶媒に溶解す
るため、任意の形状の成形物を得ることができ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a novel paint having high conductivity and a method for producing the same. Since this paint is dissolved in an organic solvent, molded articles of any shape can be obtained.
導電性高分子素材として重合体骨格に炭素−炭
素結合による共役系を有するものが一般的に知ら
れている。例えばポリアセチレン、ポリピロー
ル、ポリフエニレン、ポリフエニレンビニレン等
が挙げられる。しかしこれらの共役系高分子は剛
直で、不溶不融でありそのままでは任意の形状の
成形物にすることができない。
As conductive polymer materials, those having a conjugated system formed by carbon-carbon bonds in the polymer skeleton are generally known. Examples include polyacetylene, polypyrrole, polyphenylene, polyphenylene vinylene, and the like. However, these conjugated polymers are rigid, insoluble and infusible, and cannot be molded into arbitrary shapes as they are.
また、金属を含む導電性高分子材料としては、
銀等の金属をフイラーとした導電性高分子が使用
されている。しかしこれらは銀の微粉末を用いる
必要があるために非常に高価である。このため、
最近は銀から銅の微粉末に代替されつつある。し
かし、銅の微粉末は空気中において酸化され、酸
化銅が生成するため、導電性の安定性に問題があ
る。さらに、金属をフイラーとした導電性高分子
は、導電性を付与するために、金属を70重量%以
上も加える必要がある。このためコストが高くな
るということのほかに、ポリマー自身の機械的特
製も低下してくるという問題がある。 In addition, as conductive polymer materials containing metals,
Conductive polymers with fillers made of metals such as silver are used. However, these are very expensive because they require the use of fine silver powder. For this reason,
Recently, fine powder of copper is replacing silver. However, since fine copper powder is oxidized in the air and copper oxide is produced, there is a problem in the stability of conductivity. Furthermore, conductive polymers with metal fillers require the addition of 70% by weight or more of metal in order to impart conductivity. This poses a problem in that not only the cost increases, but also the mechanical properties of the polymer itself deteriorate.
また、上記、金属をフイラーとしたもののほか
に金属を含むものとして、種々の錯化合物の重合
体が提案されている。 Furthermore, in addition to the above-mentioned filler containing metal, various polymers of complex compounds have been proposed as those containing metal.
例えばテトラチオオキサレートのテトラエチル
アンモニウム塩と酢酸銅の反応により合成されて
いる重合体がある。(John R.Reynolds al、
(ACS)Poly.Prep.、25、No.2241(1984))。この方
法から得られれた重合体においても共役系高分子
重合体と同様不溶不融の粉末であるために、任意
の形状の成形物にすることが不可能である。 For example, there is a polymer synthesized by the reaction of tetraethylammonium salt of tetrathiooxalate and copper acetate. (John R.Reynolds al,
(ACS) Poly.Prep., 25, No. 2241 (1984)). Since the polymer obtained by this method is also an insoluble and infusible powder like the conjugated polymer, it is impossible to mold it into any shape.
また、この方法により合成される重合体はテト
ラチオオキサレートのテトラエチルアンモニウム
塩、〔((C2H4)4N)2C2S4〕という複雑な分子構造
を持つ特異な原料をモノマーとして用いているた
め、高価であり、かつ、合成が容易ではない。さ
らにこの方法で得られた重合体はドーピングを施
しても電導度が向上しない。 In addition, the polymer synthesized by this method uses tetraethylammonium salt of tetrathiooxalate, a unique raw material with a complex molecular structure [((C 2 H 4 ) 4 N) 2 C 2 S 4 ], as a monomer. Therefore, it is expensive and difficult to synthesize. Furthermore, the conductivity of the polymer obtained by this method does not improve even if it is doped.
上述したように、共役系導電性高分子は不溶、
不融であるため、そのままでは任意の形状に成形
することができない。
As mentioned above, conjugated conductive polymers are insoluble,
Since it is infusible, it cannot be molded into any shape as it is.
また、銀や銅などの金属をフイラーとした導電
性高分子は非常に高価であるかあるいは酸化劣化
による導電性の安定性などに問題がある。さら
に、これらは金属を70重量%以上も加える必要が
あるので、ポリマー自身の機械的特性が低下して
くるというような問題がある。 Furthermore, conductive polymers containing metals such as silver or copper as fillers are very expensive or have problems with stability of conductivity due to oxidative deterioration. Furthermore, since it is necessary to add 70% by weight or more of metal to these materials, there is a problem that the mechanical properties of the polymer itself deteriorate.
また、錯化合物の重合体については複雑な分子
構造を持つ特異な原料を必要とするため高価であ
り、かつ、合成が容易でない。さらにこのような
方法で得られた重合体は溶媒に不溶であり、か
つ、ドーピングを施しても電導度が向上しないと
いう問題がある。そこで、本発明は安価な原料を
用い、加熱するだけの簡単な方法で、しかも、溶
媒に溶解する塗料を得ること、さらに、得られた
塗料は空気中で安定で導電性の高いものを得るこ
とを目的としている。 Furthermore, polymers of complex compounds require unique raw materials with complex molecular structures, are expensive, and are not easy to synthesize. Furthermore, there is a problem that the polymer obtained by such a method is insoluble in a solvent, and its conductivity does not improve even if it is doped. Therefore, the present invention aims to obtain a paint that dissolves in a solvent by using inexpensive raw materials and a simple method of heating, and further, to obtain a paint that is stable in the air and has high conductivity. The purpose is to
上記目的を達成するため本発明は下記の構成か
らなる。
In order to achieve the above object, the present invention consists of the following configuration.
「(1) 炭素、硫黄、銅を主成分とし、それぞれの
組成比が原子比で1.0:0.4〜2.0:0.4〜1.3であ
り、かつ有機溶媒に5重量%以上で溶解するこ
とを特徴とする導電性塗料。(1) It is characterized by having carbon, sulfur, and copper as its main components, having an atomic ratio of 1.0:0.4 to 2.0:0.4 to 1.3, and being soluble in an organic solvent at 5% by weight or more. conductive paint.
(2) 二硫化炭素とハロゲン化銅を溶解状態で60
℃以上の温度条件で反応させ、炭素、硫黄、銅
を主成分とし、それぞれの組成比が原子比で
1.0:0.4〜2.0:0.4〜1.3であり、かつ有機溶媒
に5重量%以上で溶解する性質を有する電導性
塗料を合成することを特徴とする導電性塗料の
製造方法。」
本発明は各々安価なモノマーである二硫化炭素
とハロゲン化銅を用い、60℃以上で加熱・反応さ
せることにより、有機溶媒に可溶な導電性高分子
を合するものである。またこの塗料はドーピング
なしでも0.5S/cm程度の高い電導性を有し、かつ
ドーピングによつてさらに電導度が向上すること
が判明した。本発明はかかる導電性塗料として炭
素、硫黄及び銅原子から構成される塗料で、か
つ、有機溶媒に溶解する導電性塗料を提供するこ
とに関するものである。以下この方法について詳
述する。 (2) Carbon disulfide and copper halide in a dissolved state
The reaction is carried out at temperatures above ℃, and the main components are carbon, sulfur, and copper, and the composition ratio of each is expressed as an atomic ratio.
1.0:0.4 to 2.0:0.4 to 1.3, and a method for producing a conductive paint characterized by synthesizing a conductive paint having a property of being dissolved in an organic solvent at 5% by weight or more. The present invention uses carbon disulfide and copper halide, each of which are inexpensive monomers, and heats and reacts them at 60° C. or higher to combine a conductive polymer soluble in an organic solvent. It was also found that this paint has a high electrical conductivity of about 0.5 S/cm even without doping, and that the electrical conductivity is further improved by doping. The present invention relates to providing such a conductive paint which is composed of carbon, sulfur and copper atoms and which is soluble in an organic solvent. This method will be explained in detail below.
本発明の導電性塗料は二硫化炭素とハロゲン化
銅の適当な溶媒中、60℃以上で加熱重合すること
により製造される。ここで言う適当な溶媒とはジ
メチルスルホオキシド(DMSO)、ジメチルホル
ムアミド(DMF)、テトラヒドロフラン
(THF)、N−メチル−2−ピロリドン(NMP)
などの極性溶媒、ベンゼン、トルエン等の非極性
溶媒のいずれでもよいが、好ましくは重合体が極
性溶媒に可溶であり、重合反応が円滑に進みやす
い極性溶媒が用いられる。また本発明において用
いられるハロゲン化銅としては塩化第1銅、塩化
第2銅、臭化第1銅、臭化第2銅、ヨウ化第1
銅、ヨウ化第2銅、フツ化第1銅、フツ化第2銅
などが挙げられる。もちろんこれらの混合物でも
よい。上記ハロゲン化銅の中で好ましくは塩化第
2銅、臭化第2銅、ヨウ化第2銅が好ましい。ま
た、上記ハロゲン化銅の含水塩をそのまま用いる
こともできるが、重合反応を円滑に進めるために
あらかじめ溶媒中で加熱(200℃以上)・脱水処理
したものを用いるのが好ましい。 The conductive paint of the present invention is produced by heating and polymerizing carbon disulfide and copper halide in a suitable solvent at 60° C. or higher. Suitable solvents mentioned here include dimethylsulfoxide (DMSO), dimethylformamide (DMF), tetrahydrofuran (THF), and N-methyl-2-pyrrolidone (NMP).
It may be a polar solvent such as , or a non-polar solvent such as benzene or toluene, but preferably a polar solvent is used because the polymer is soluble in the polar solvent and the polymerization reaction tends to proceed smoothly. Further, the copper halides used in the present invention include cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, cuprous iodide, etc.
Examples include copper, cupric iodide, cuprous fluoride, and cupric fluoride. Of course, a mixture of these may also be used. Among the above copper halides, cupric chloride, cupric bromide, and cupric iodide are preferred. Further, the hydrated salt of copper halide described above can be used as it is, but in order to proceed smoothly with the polymerization reaction, it is preferable to use one that has been heated (at 200° C. or higher) and dehydrated in a solvent in advance.
重合温度は60℃以上の温度で行うが、二硫化炭
素の沸点が46℃と低いため、二硫化炭素の溶媒中
からの発散を防ぐため密閉下で行う必要がある。
また、重合温度が高すぎると塗料の熱分解が起
る。従つて、重合温度は60〜200℃の範囲で行う
のが好ましい。 The polymerization temperature is 60°C or higher, but since the boiling point of carbon disulfide is as low as 46°C, it is necessary to conduct the polymerization under closed conditions to prevent carbon disulfide from escaping from the solvent.
Furthermore, if the polymerization temperature is too high, thermal decomposition of the paint will occur. Therefore, the polymerization temperature is preferably 60 to 200°C.
モノマーである二硫化炭素とハロゲン化銅の濃
度は特に限定しないが、通常各々0.1〜10mol/
の濃度で用いられる。二硫化炭素とハロゲン化
銅の濃度比は特に限定しないが、通常、二硫化炭
素に対してモル比で1.0〜1.5程度のハロゲン化銅
が好ましい。もちろんこれ以外の濃度比でもそれ
なりに反応が進行する。 The concentrations of the monomers carbon disulfide and copper halide are not particularly limited, but are usually 0.1 to 10 mol/each.
used at a concentration of Although the concentration ratio of carbon disulfide and copper halide is not particularly limited, it is usually preferable to use copper halide in a molar ratio of about 1.0 to 1.5 to carbon disulfide. Of course, the reaction proceeds to a certain degree even at other concentration ratios.
反応時間に関しても特に制約はないが、高収率
に本発明の目的を達成するためには、溶媒の種類
あるいは反応温度との兼ね合いにもよるが、6時
間以上が好ましい。特に低温域において、収率を
上げるためには、反応時間を長くする必要があ
る。反応中、撹拌はなるげく激しく行うことが好
ましく、ハロゲン化銅の粉末をより均一に分散さ
せる上で重要である。 There are no particular restrictions on the reaction time, but in order to achieve the object of the present invention with a high yield, it is preferably 6 hours or more, depending on the type of solvent or the reaction temperature. Particularly in the low temperature range, in order to increase the yield, it is necessary to lengthen the reaction time. During the reaction, it is preferable to stir as vigorously as possible, which is important for more uniformly dispersing the copper halide powder.
以上のようにして、溶媒に可溶な黒色の粉末状
塗料を得ることができる。この塗料はN−メチル
2−ピロリドン(NMP)、ジメチルスルホキシ
ド(DMSO)などの極性有機溶媒に容易に溶解
するという点で従来の導電性電分子とは大きく異
なる。特にNMPは使用し易い溶媒である。 In the manner described above, a black powder paint soluble in a solvent can be obtained. This paint differs greatly from conventional conductive molecules in that it easily dissolves in polar organic solvents such as N-methyl-2-pyrrolidone (NMP) and dimethyl sulfoxide (DMSO). In particular, NMP is an easy-to-use solvent.
溶媒に溶解するという性質を使つて例えば導電
性の塗料や接着剤に応用することができる。 By using its property of being soluble in solvents, it can be applied, for example, to conductive paints and adhesives.
本発明の導電性塗料は、炭素、銅、硫黄の存在
比が原子比で各々1.0:0.4〜1.3:0.4〜2.0(ただし
炭素:銅:硫黄)であることが好ましい。導電
性、及び溶媒への溶解性のためである。 In the conductive paint of the present invention, the abundance ratio of carbon, copper, and sulfur is preferably 1.0:0.4 to 1.3:0.4 to 2.0 (carbon:copper:sulfur) in atomic ratio, respectively. This is because of its conductivity and solubility in solvents.
本発明の導電性塗料は、導電性の程度が導電度
σ=0.01S/cm以上であることが好ましい。目的
とする導電性を得るためである。 The conductive paint of the present invention preferably has a degree of conductivity of σ = 0.01 S/cm or more. This is to obtain the desired conductivity.
また、この塗料自身の電導度は0.5S/cmと高
く、さらに、ドーピングにより電導度が約4倍も
向上する。このようにドーピングにより電導度が
向上するという点でも従来の錯化合物などの金属
を含む導電性高分子と異なつている。 Furthermore, the electrical conductivity of this paint itself is as high as 0.5 S/cm, and doping improves the electrical conductivity by about four times. It is also different from conventional conductive polymers containing metals such as complex compounds in that the conductivity is improved by doping.
ドーピングの方法としてはドーパントガス雰囲
気中に塗料をさらすことによつてドーピングする
方法、ドーパント溶液中に塗料を浸漬することに
よつてドーピングする方法、電気化学的にドーピ
ングする方法、イオン注入法による方法、塗料の
溶液中にドーパントを混入した後、塗料を成形す
る方法などがある。 Doping methods include doping by exposing the paint to a dopant gas atmosphere, doping by immersing the paint in a dopant solution, electrochemical doping, and ion implantation. There is a method in which a dopant is mixed into a paint solution and then the paint is molded.
本発明によつて合成される塗料体は極性溶媒に
溶解するという特異な塗料であるので、塗料の溶
液中に混入させる方法が可能である。従来から知
られている導電性高分子であるポリアセチレン、
ポリピロール、ポリチオフエン、ポリパラフエニ
レンあるいは金属を含む錯体などはいずれも不
融、不溶であるため、この方法によるドーピング
は不可能である。このように塗料の溶液中にドー
パントを混入させる方法は他のドーピング法と比
べてドーピング時間が短縮でき、また塗料に均一
にドーピングをすることができるという利点があ
る。もちろん、他のいずれのドーピング法によつ
ても本発明の塗料にドーピング処理を施すことは
可能である。 Since the paint body synthesized according to the present invention is a unique paint that dissolves in a polar solvent, it is possible to mix it into a paint solution. Polyacetylene, a conventionally known conductive polymer,
Polypyrrole, polythiophene, polyparaphenylene, or complexes containing metals are all infusible and insoluble, so doping by this method is impossible. This method of mixing a dopant into a paint solution has advantages over other doping methods in that the doping time can be shortened and the paint can be doped uniformly. Of course, it is possible to dope the coating material of the present invention by any other doping method.
以下、実施例により本発明を更に具体的に説明
する。 Hereinafter, the present invention will be explained in more detail with reference to Examples.
実施例 1
撹拌機を備えた容量100mlのガラス製オートク
レーブ(耐圧10Kg/cm2)に二硫化炭素20mlと無水
塩化第2銅57.5grおよび溶媒としてN−メチル
−2−ピロリドン(NMP)30mlを入れ、N2で置
換後密封して温度150℃(圧力5Kg/cm2)で6時
間撹拌しながら反応した。一部黒褐色の沈でん物
を含む反応液を得た。反応終了後、室温まで降温
し反応液中の固形物を過して除去した後、液
に水100mlを加えて沈でんを析出させる。この沈
でん物を水で数回くり返し洗浄を行つたのち、室
温下、6時間真空乾燥して黒褐色の粉末1.5gを
得た。該、重合体は水、アルコール、アセトン、
トルエンなどに不溶であるが、NMP、DMSO、
DMFなどの溶媒に10重量%以上の割合で溶解し
た。
Example 1 20 ml of carbon disulfide, 57.5 g of anhydrous cupric chloride, and 30 ml of N-methyl- 2 -pyrrolidone (NMP) as a solvent were placed in a 100 ml glass autoclave equipped with a stirrer (pressure resistance 10 Kg/cm 2 ). After purging with N 2 , the reactor was sealed and reacted at a temperature of 150° C. (pressure of 5 Kg/cm 2 ) for 6 hours with stirring. A reaction solution containing some blackish brown precipitate was obtained. After the reaction is completed, the temperature is lowered to room temperature, solids in the reaction solution are removed by filtration, and 100 ml of water is added to the solution to precipitate a precipitate. This precipitate was washed several times with water and then vacuum dried at room temperature for 6 hours to obtain 1.5 g of a blackish brown powder. The polymer is water, alcohol, acetone,
Insoluble in toluene etc., but NMP, DMSO,
Dissolved in a solvent such as DMF at a ratio of 10% by weight or more.
この重合体の元素分析結果は炭素9.6%、銅
54.3%、硫黄35.0%で、塩素、窒素、水素は検出
限界以下であつた。このように、該重合体は炭
素、銅、硫黄から構成されており、元素構成比は
C1.00Cu1.06S1.36であつた。 Elemental analysis of this polymer shows 9.6% carbon and copper.
54.3%, sulfur 35.0%, and chlorine, nitrogen, and hydrogen were below detection limits. In this way, the polymer is composed of carbon, copper, and sulfur, and the elemental composition ratio is
It was C1.00Cu1.06S1.36.
この重合体の導電度を測定した結果(粉末を加
圧成型し、ペレツトで測定)、室温で0.5S/cmで
あり、さらに真空下、ヨウ素の蒸気と接触させた
ところ約4倍向上し、2.3S/cmまで向上した。 The conductivity of this polymer was measured (by press-molding the powder and measuring it as a pellet) and found that it was 0.5 S/cm at room temperature, and when it was brought into contact with iodine vapor under vacuum, it improved by about 4 times. Improved to 2.3S/cm.
また、この重合体の赤外スペクトルをKBr法、
400〜4000cm-1の範囲で測定した結果、1600〜
4000cm-1の高波数域にわたつて吸収を示すスペク
トルが観測された。 In addition, the infrared spectrum of this polymer was analyzed using the KBr method.
As a result of measurement in the range of 400 to 4000 cm -1 , 1600 to
A spectrum showing absorption in the high wavenumber region of 4000 cm -1 was observed.
実施例 2
実施例1で溶媒として用いたNMPの代りに
DMSOを用いて、また、重合温度を80℃(圧力
1.0Kg/cm2)にして、実施例1と同じ方法で二硫
化炭素と塩化第2銅を6時間反応させた。黄褐色
から黒褐色の反応液を得、これを実施例1と同様
に洗浄、乾燥し、黄褐色から黒褐色の粉末0.8g
rを得た。該粉末は実施例1の場合と同様、水、
アルコール、アセトン、トルエンなどに不溶であ
り、DMSO、NMP、DMFに溶解する。元素分
析結果は炭素:銅:硫黄の原子比が1.0:0.78:
0.71であつた。Example 2 Instead of NMP used as a solvent in Example 1
Using DMSO, we also adjusted the polymerization temperature to 80 °C (pressure
1.0 Kg/cm 2 ), and carbon disulfide and cupric chloride were reacted for 6 hours in the same manner as in Example 1. A yellow-brown to black-brown reaction solution was obtained, which was washed and dried in the same manner as in Example 1 to obtain 0.8 g of a yellow-brown to black-brown powder.
I got r. As in Example 1, the powder was mixed with water,
Insoluble in alcohol, acetone, toluene, etc., soluble in DMSO, NMP, DMF. The elemental analysis results show that the atomic ratio of carbon: copper: sulfur is 1.0:0.78:
It was 0.71.
この重合体の電導度もドープ前は0.3S/cmであ
り、さらにこれにヨウ素をドーピングすると
1.2S/cmまで向上した。KBr粉末法のIRスペク
トルの測定結果も実施例1と同様のスペクトルが
得られた。 The conductivity of this polymer is also 0.3S/cm before doping, and when it is further doped with iodine,
Improved to 1.2S/cm. As for the measurement results of the IR spectrum using the KBr powder method, the same spectrum as in Example 1 was obtained.
実施例 3
実施例1でハロゲン化銅として用いた塩化第2
銅の代りに臭化第2銅30grを用い、重合温度を
150℃から60℃(圧力0.7Kg/cm2)にして、実施例
1と同じ方法で二硫化炭素と臭化第2銅を16時間
反応させた。黄褐色から黒褐色の一部沈でん物を
含む反応液を得た。反応終了後、室温まで降温
し、実施例1と同様の方法で洗浄、乾燥を行な
い、黒褐色状の粉末1.6grを得た。該粉末は実
施例1の場合と同様DMSO、NMP、DMFに溶
解する。また、該重合体の元素分析、電導度の測
定、および赤外スペクトルの測定を行つたとこ
ろ、これらについても実施例1に示したものとほ
ぼ同等の測定結果であつた。Example 3 Second chloride used as copper halide in Example 1
Using 30g of cupric bromide instead of copper, the polymerization temperature was adjusted to
The temperature was raised from 150°C to 60°C (pressure 0.7 Kg/cm 2 ), and carbon disulfide and cupric bromide were reacted for 16 hours in the same manner as in Example 1. A yellow-brown to black-brown reaction solution containing some precipitates was obtained. After the reaction was completed, the temperature was lowered to room temperature, and the mixture was washed and dried in the same manner as in Example 1 to obtain 1.6 gr of a dark brown powder. The powder is dissolved in DMSO, NMP and DMF as in Example 1. Further, when the polymer was subjected to elemental analysis, measurement of electrical conductivity, and measurement of infrared spectrum, the measurement results were almost the same as those shown in Example 1.
導電性高分子材料は従来の金属による電導体と
比べて軽量であり、かつ加工性を有するため、電
磁遮蔽板、発熱体、抵抗素子、電線、電極板ある
いはその他の導電材料としてのエレクロトニクス
分野で、今後利用される可能性が大きく、将来の
有望な工業材料となることが期待される。
Conductive polymer materials are lighter and easier to process than conventional metal conductors, so they can be used as electromagnetic shielding plates, heating elements, resistive elements, wires, electrode plates, and other conductive materials in electronics. It has great potential to be used in various fields in the future, and is expected to become a promising industrial material in the future.
本発明はこのような導電性高分子材料として、
二硫化炭素とハロゲン化銅を出発原料とする塗料
の合成に関するものである。低価格である二硫化
炭素とハロゲン化銅を出発原料にしているため
に、非常に低コストの導電材料が可能となると期
待できる。 The present invention provides such a conductive polymer material as
This paper concerns the synthesis of paints using carbon disulfide and copper halide as starting materials. Since the starting materials are low-cost carbon disulfide and copper halide, it is expected that very low-cost conductive materials will become possible.
本発明によつて合成された塗料は有機溶媒に溶
解するため、例えばキヤスト成型法などにより任
意の形状に成型することができる。さらに本発明
によつて合成された塗料の電導度は従来のもの、
例えばテトラチオオキサレートのテトラエチルア
ンモニウム塩から合成される重合体はI2などのド
ーピング効果がみられないのに対し、本発明によ
るものはヨウ素などのドーピングにより、約4倍
も導電度を向上させることができるという特徴を
有している。 Since the paint synthesized according to the present invention is dissolved in an organic solvent, it can be molded into any shape by, for example, a cast molding method. Furthermore, the electrical conductivity of the paint synthesized according to the present invention is that of the conventional one,
For example, the polymer synthesized from the tetraethylammonium salt of tetrathiooxalate shows no effect of doping with I2 , etc., whereas the polymer according to the present invention improves the conductivity by about 4 times by doping with iodine etc. It has the characteristic of being able to
Claims (1)
成比が原子比で1.0:0.4〜2.0:0.4〜1.3であり、
かつ有機溶媒に5重量%以上で溶解することを特
徴とする導電性塗料。 2 有機溶媒がN−メチル−2−ピロリドンであ
ることを特徴とする特許請求の範囲第1項記載の
導電性塗料。 3 導電性の程度が、電導度σ=0.01S/cm以上
であることを特徴とする特許請求の範囲第1項記
載の導電性塗料。 4 二硫化炭素とハロゲン化銅を溶解状態で60℃
以上の温度条件で反応させ、炭素、硫黄、銅を主
成分とし、それぞれの組成比が原子比で1.0:0.4
〜2.0:0.4〜1.3であり、かつ有機溶媒に5重量%
以上で溶解する性質を有する導電性塗料を合成す
ることを特徴とする導電性塗料の製造方法。 5 ハロゲン化銅が塩化第1銅、塩化第2銅、臭
化第1銅、臭化第2銅、ヨウ化第1銅、ヨウ化第
2銅、フツ化第1銅、フツ化第2銅から選ばれる
1種以上であることを特徴とする特許請求の範囲
第4項記載の導電性塗料の製造方法。 6 反応を加圧下または密閉下で行うことを特徴
とする特許請求の範囲第4項記載の導電性塗料の
製造方法。 7 二硫化炭素とハロゲン化銅を溶解状態で60℃
以上の温度で反応して得られる重合体をドーピン
グ処理することを特徴とする特許請求の範囲第4
項記載の導電性塗料の製造方法。[Claims] 1 The main components are carbon, sulfur, and copper, and the composition ratio of each is 1.0:0.4 to 2.0:0.4 to 1.3 in atomic ratio,
A conductive paint characterized by being soluble in an organic solvent at 5% by weight or more. 2. The conductive paint according to claim 1, wherein the organic solvent is N-methyl-2-pyrrolidone. 3. The conductive paint according to claim 1, wherein the degree of conductivity is σ = 0.01 S/cm or more. 4 Carbon disulfide and copper halide are dissolved at 60°C.
The reaction is carried out under the above temperature conditions, and the main components are carbon, sulfur, and copper, and the atomic ratio of each is 1.0:0.4.
~2.0: 0.4~1.3 and 5% by weight in organic solvent
A method for producing a conductive paint, which comprises synthesizing a conductive paint having a property of dissolving in the above manner. 5 Copper halides include cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, cuprous iodide, cupric iodide, cuprous fluoride, and cupric fluoride. 5. The method for producing a conductive paint according to claim 4, wherein the conductive paint is one or more selected from the following. 6. The method for producing a conductive paint according to claim 4, wherein the reaction is carried out under pressure or in a closed environment. 7 Carbon disulfide and copper halide are dissolved at 60°C.
Claim 4, characterized in that the polymer obtained by reacting at a temperature above is subjected to a doping treatment.
2. Method for producing a conductive paint as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19805386A JPS6354436A (en) | 1986-08-26 | 1986-08-26 | Electroconductive polymer and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19805386A JPS6354436A (en) | 1986-08-26 | 1986-08-26 | Electroconductive polymer and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6354436A JPS6354436A (en) | 1988-03-08 |
| JPH0571060B2 true JPH0571060B2 (en) | 1993-10-06 |
Family
ID=16384748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19805386A Granted JPS6354436A (en) | 1986-08-26 | 1986-08-26 | Electroconductive polymer and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6354436A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9051683B2 (en) | 1997-02-28 | 2015-06-09 | Columbia Insurance Company | Carpet, carpet backings and methods |
| US9376769B2 (en) | 1997-02-28 | 2016-06-28 | Columbia Insurance Company | Homogeneously branched ethylene polymer carpet backsizing compositions |
-
1986
- 1986-08-26 JP JP19805386A patent/JPS6354436A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9051683B2 (en) | 1997-02-28 | 2015-06-09 | Columbia Insurance Company | Carpet, carpet backings and methods |
| US9376769B2 (en) | 1997-02-28 | 2016-06-28 | Columbia Insurance Company | Homogeneously branched ethylene polymer carpet backsizing compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6354436A (en) | 1988-03-08 |
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