JPH0573065B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a refrigerant conduction pipe, and in particular, to a refrigerant conduction pipe that is effective when applied to a multi-chip module that uses a bellows member to effectively remove heat generated from an integrated circuit chip. It is related to pipes.

[Background of the invention]

Conventionally, as a cooling structure for a multi-chip module that removes heat generated by chips of an integrated circuit, the one described in, for example, Japanese Patent Laid-Open Publication No. 59-200495 has been proposed.

In this proposal, as shown in FIGS. 3 and 4, a multichip module 100 provides an arrangement for encapsulating and cooling a large number of integrated circuit chips 2 mounted on the surface of a substrate 3. Board 3
has a number of module pins 11 for connecting the module to a circuit card or circuit board. Inside the substrate 3 are a number of integrated circuit chips 2.
is mounted via solder terminals 4. The integrated circuit chip 2 is electrically connected to other chips or module pins 11 by wiring layers formed on or inside the substrate 3. The flange 7 is fixed to the bottom surfaces of the wiring board 3 and the housing 6 by brazing or the like, and seals the space between the board 3 and the housing 6. Further, by screwing the cap 5 to the housing 6 with an O-ring 8 and screws 9, the whole is hermetically sealed.
Furthermore, nozzles 10a and 10b are provided in the housing 6 to allow a refrigerant such as water to flow in and out. In order to cool the integrated circuit chips 2, a cooling member 1 is fixed to the back surface of each chip individually, and each cooling member is connected by a flexible pipe (bellows) 12 to allow the refrigerant to flow in and out. There is.

The heat generated by the integrated circuit chip 2 is conducted from the chip to the cooling member 1 and is cooled by a coolant circulating within the cooling member. The refrigerant is introduced from outside the module through the nozzle 10a and sequentially circulates within each cooling member via the bellows 12.
It flows out to the outside of the module through the nozzle 10b. Note that the chips and the cooling members are arranged in a matrix as shown in FIG.

FIG. 5 is a cutaway view showing the cooling member. The cooling member 1 is composed of a cooling block 14 provided with fins 16 inside and having a space through which a refrigerant flows across the fins. The cooling block 14 is formed of a material with good thermal conductivity and easy processing, such as copper, and the fins 16 can be molded as part of the cooling block 14. Alternatively, the fins 16 may be integrally formed with the top cover of the cooling block and fixed to the inner bottom surface of the cooling block by brazing or the like. A pair of pipe members 17 are provided on the upper surface of the cooling block 14 to allow refrigerant to flow into and out of the block. Pipe member 17
is made of a metal with good thermal conductivity, such as copper, and is fixed to the cooling block by brazing or the like. This pipe member 17 is connected to a flexible bellows 12, and each cooling block 14 is connected by brazing or the like.

On the outer bottom surface of the cooling block 14 is soldered a boundary plate 13 made of a material that is electrically insulating, has good thermal conductivity, and has a coefficient of thermal expansion that approximately matches that of the integrated circuit chip, such as silicon carbide. They are fixed to each other via an adhesive layer 15 such as the like. Boundary plate 1
The bottom surface of 3 is fixed to the back surface of integrated circuit chip 2 by soldering or the like.

In the embodiment shown in FIG. 4, the cooling blocks are connected in series by the bellows 12, but they may be connected in parallel as shown in FIG. According to this configuration, the temperature rise of the refrigerant can be further reduced. The pipe 18 in FIG. 6 is the nozzle 10a, 1 shown in FIG.
Connected to 0b.

In short, it is sufficient that the refrigerant flows into and out of each cooling block using a flexible bellows member, and the flow path of the refrigerant can be changed as desired.

However, in the above proposal, no consideration is given to the specific structure of the bellows member necessary for realizing the cooling structure of the multi-chip module.

[Purpose of the invention]

In view of the above situation, the present invention, when applied to a cooling structure of a multi-chip module, for example,
It efficiently cools multiple integrated circuit chips with large power consumption, allows chips to be easily replaced when an integrated circuit chip breaks down, and maintains cooling efficiency even if there are variations in the height of each chip. It is an object of the present invention to provide a refrigerant conduction pipe that can be used as an independent bellows member.

[Summary of the invention]

In order to achieve the above object, the present invention provides a flexible refrigerant conduit by covering the outer periphery of a core member made of a material with good thermal conductivity in a coil shape with a coating formed of a material with high thermal conductivity. It is characterized by comprising the following.

[Embodiments of the invention]

1 and 2 showing embodiments of the present invention will be explained below. FIG. 1 is a partially sectional perspective view showing a refrigerant conduit according to the present invention, and FIG. 2 is a sectional view of the refrigerant conduit shown in FIG. 1 implemented in a bellows portion of a cooling structure of a multi-chip module.

As shown in FIG. 1, the refrigerant conduit 19 includes a flexible core member 20 formed into a coiled shape of a round bar material with high thermal conductivity, such as copper, bronze, or nickel.
It is formed into a hollow shape by coating the core member 20 with a coating 21 coated around the core member 20 by copper plating or nickel plating using copper pyrophosphate melting or nickel sulfamic acid melting.

The coating 21 is formed by forming the core member 20 into a coil shape by setting the relationship between the concentration of the plating solution and the immersion time in advance through experiments, and then placing it in a plating tank that stores the plating solution. By dipping for a predetermined time, it can be easily formed to a predetermined thickness.

Further, in addition to the above, a coating can also be formed around the member 19 using, for example, an ion plating method, a sputtering method, a vapor deposition method, or the like.

Furthermore, the member 19 can also be made of plastic.

Next, in FIG. 2, two cooling members 21a and 21b are formed in the same manner as the cooling member 1 described in FIG. 5 above. 22a, 22
b are two pipe members, each of which is formed identically to the pipe member 17 shown in FIG. 3 above. 2
3a and 23b are joint parts, and connect both ends of the refrigerant conduit pipe 19 and the two pipe members 22a and 2, respectively.
The tip end portion of 2b is joined by brazing or the like.

〔Effect of the invention〕

Since the refrigerant passage pipe according to the present invention is constructed as described above, it has the following effects.

(1) It has a simple configuration and is easy to manufacture.

(2) Because it is flexible, it can be easily assembled even if the joining heights of the joining members (cooling member, pipe member) at both ends are uneven or inclined; It is not affected by thermal resistance in any way.

(3) When applied to the bellows member in the cooling structure of a multi-chip module, it shortens the heat conduction path between the chip and the refrigerant and is made of a material with good thermal conductivity, so it reduces thermal resistance. Even integrated circuit chips with large power consumption can be efficiently cooled.

(4) Since it is easy to connect and disassemble the joint members at both ends, if a part of the chip fails, the solder between the chip and the boundary plate can be locally heated and removed, and the joint member (cooling member) can be easily replaced. ) can be removed, which allows the tip to be easily replaced.

[Brief explanation of the drawing]

Fig. 1 is a partially sectional perspective view showing a refrigerant conduit according to the present invention, Fig. 2 is a sectional view of the refrigerant conduit shown in Fig. 1 implemented in a bellows part of a cooling structure of a multi-chip module, and Fig. 3. is a cross-sectional view of a cooling structure of a multi-chip module to which the present invention is applied;
FIG. 4 is a plan view showing the arrangement of the cooling members in FIG. 3;
FIG. 5 is a partially sectional perspective view showing the cooling member, and FIG. 6 is a plan view showing another example of the joint between the cooling member and the pipe. 19 ... Refrigerant conduction pipe, 20... Core member, 21...
...Coating, 22...Pipe member, 23...Joint part.

Claims (1)

[Claims] 1. A refrigerant conduction tube characterized in that it is constructed in a flexible hollow shape by covering a core member made of a material with good thermal conductivity in a coiled shape with a coating having good thermal conductivity.