JPH0573589B2 - - Google Patents
Info
- Publication number
- JPH0573589B2 JPH0573589B2 JP966685A JP966685A JPH0573589B2 JP H0573589 B2 JPH0573589 B2 JP H0573589B2 JP 966685 A JP966685 A JP 966685A JP 966685 A JP966685 A JP 966685A JP H0573589 B2 JPH0573589 B2 JP H0573589B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- leads
- common
- lead
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 26
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
(イ) 産業上の利用分野
この発明は、特に基板の表面および裏面にコモ
ンリードを備えたサーマルプリントヘツドに関す
る。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention particularly relates to a thermal print head provided with common leads on the front and back surfaces of a substrate.
(ロ) 従来技術
近年において、サーマルプリントヘツド基板の
コモン抵抗を下げるために、基板の表面に形成さ
れるコモンリードを前記基板の裏面に延長させる
ものとして例えば第３図のようなものがある。(B) Prior Art In recent years, in order to lower the common resistance of a thermal print head board, there has been a system as shown in FIG. 3, in which a common lead formed on the front surface of the board is extended to the back surface of the board.
同図に示すサーマルプリントヘツドは、表面の
コモンリード５０と裏面のコモンリード７０とが
個別に形成され、前記基板１０の側面において例
えば導電性ペーストからなる側面リード６０を被
着することにより前記表面および裏面のコモンリ
ード５０，７０を接合させている。このため、前
記表面および裏面のコモンリード５０，７０と側
面リード６０との接触面積が比較的小さいことに
基づいて、コモンリード抵抗が上昇したり、前記
表面および裏面のコモンリード５０，７０と側面
リード６０との接合部分において断線を招いたり
するという問題を生じ、上記サーマルプリントヘ
ツド基板が使用不能になることがある。 In the thermal print head shown in the figure, a common lead 50 on the front surface and a common lead 70 on the back surface are formed separately, and a side lead 60 made of, for example, a conductive paste is attached to the side surface of the substrate 10. And the common leads 50 and 70 on the back side are joined. For this reason, based on the relatively small contact area between the common leads 50, 70 on the front and back surfaces and the side leads 60, the common lead resistance increases, and the common leads 50, 70 on the front and back surfaces and the side leads 60 increase. This may cause problems such as disconnection at the joints with the leads 60, making the thermal print head board unusable.
(ハ) 目的
この発明は上記事情に鑑みてなされたもので、
基板の表面および裏面のコモンリードと側面リー
ドとの接触面積を増大せしめると共に、接合部分
における断線を防止しうるサーマルプリントヘツ
ドを提供することを目的としている。(c) Purpose This invention was made in view of the above circumstances,
It is an object of the present invention to provide a thermal print head that can increase the contact area between common leads and side leads on the front and back surfaces of a substrate, and can prevent disconnection at the bonded portions.
(ニ) 構成
この発明に係るサーマルプリントヘツドは、基
板の表面および裏面にコモンリードを備え、前記
基板の側面において前記各コモンリードを側面リ
ードでもつて接合したサーマルプリントヘツドで
あつて、前記基板の側面には、該基板の厚さ方向
に断面略半円弧状の凹溝が所定数設けられてお
り、前記側面リードは基板の側面に凹溝を含んで
形成されている。(D) Structure The thermal print head according to the present invention is a thermal print head that is provided with common leads on the front and back sides of a substrate, and in which each of the common leads is connected with a side lead on the side surface of the substrate. A predetermined number of grooves having a substantially semicircular cross section are provided in the thickness direction of the substrate on the side surface, and the side surface lead is formed including the grooves on the side surface of the substrate.
(ホ) 実施例
第１図はこの発明に係るサーマルプリントヘツ
ドの一実施例を示す説明図であり、ａはその斜視
図、ｂはａ図のＡ−A′線断面図をそれぞれ示し
ている。同図において、１はサーマルプリントヘ
ツド、２は略矩形板状のセラミツクからなる基
板、３は基板２の表面に形成された複数の外部引
出しリード、４は前記外部引出しリード３に関連
して基板２の表面に形成される表面のコモンリー
ド、５は前記基板２の裏面に形成される裏面のコ
モンリード、６は前記コモンリード４と５とを接
合する導電性ペーストからなる側面リード、７は
基板２の長い方の一辺の端部近傍に突脈状に形成
されるガラス質のペーストからなるグレーズ層、
８は前記グレーズ層７の上面中央位置に略全長に
わたつて形成され、且つ、感熱紙等を押圧して印
字させる部分である抵抗体をそれぞれ示してい
る。(E) Embodiment FIG. 1 is an explanatory diagram showing an embodiment of the thermal print head according to the present invention, in which a shows a perspective view thereof, and b shows a sectional view taken along the line A-A' in FIG. . In the figure, 1 is a thermal print head, 2 is a substantially rectangular plate-shaped ceramic substrate, 3 is a plurality of external lead leads formed on the surface of the substrate 2, and 4 is a substrate connected to the external lead leads 3. 2, a front common lead formed on the front surface of the substrate 2; 5, a rear common lead formed on the back surface of the substrate 2; 6, a side lead made of conductive paste for joining the common leads 4 and 5; 7, a side lead made of conductive paste; a glaze layer made of glassy paste formed in a vein shape near the end of one long side of the substrate 2;
Reference numeral 8 designates a resistor which is formed at the center of the upper surface of the glaze layer 7 over substantially the entire length and is a part that presses thermal paper or the like to print.
詳しくは、前記基板２の側面には、該基板２の
厚さ方向に沿つた断面略半円弧状の凹溝２１が所
定数形成されており、基板２の側面の面積が大幅
に増大されている。前記凹溝２１は次のように形
成される。つまり、グレーズ層７および抵抗体８
が基板２の所定位置に形成された後において、グ
レーズ層７と所定間隔を隔てて平行に基板２の厚
さ方向に貫通する円形孔２２を例えばレーザ装置
にて所定数穿設し、前記各円形孔２２を切断線２
３に沿つて切断することにより、前記円形孔２２
が略半円となつた凹溝２１を形成させる（第２図
参照）。この円形孔２２の直径は本実施例におい
て約100μｍに設定されている。 Specifically, a predetermined number of concave grooves 21 having a substantially semicircular cross section along the thickness direction of the substrate 2 are formed on the side surface of the substrate 2, and the area of the side surface of the substrate 2 is greatly increased. There is. The groove 21 is formed as follows. That is, the glaze layer 7 and the resistor 8
are formed at predetermined positions on the substrate 2, a predetermined number of circular holes 22 are bored through the substrate 2 in the thickness direction in parallel with the glaze layer 7 at predetermined intervals using, for example, a laser device. Cutting line 2 of circular hole 22
3 by cutting along the circular hole 22
A groove 21 having a substantially semicircular shape is formed (see FIG. 2). The diameter of this circular hole 22 is set to about 100 μm in this embodiment.
そして、前記外部引出しリード３は、その一端
がグレーズ層７の抵抗体８と重なるように、且つ
グレーズ層７の略全長にわたつてその直交方向に
それぞれ所定間隔を隔てて形成されている。前記
表面のコモンリード４も前記外部引出しリード３
とグレーズ層７を隔てて形成され、且つ、その一
端が前記グレーズ層７の抵抗体８と重なるように
形成されている。前記裏面のコモンリード５は、
前記表面のコモンリード４の形成された位置に関
連して形成されている。なお、本実施例では、前
記表面および裏面のコモンリード４，５がそれぞ
れ前記凹溝２１に所定量回り込むように形成され
ている。但し、前記表面および裏面のコモンリー
ド４，５の回り込みが凹溝２１部分においてオー
バラツプさせるのが望ましいが、オーバラツプし
なくても別に構わない。さらに、基板２に形成し
た凹溝２１のある面全面に導電性ペーストからな
る側面リード６を塗布することにより、表面およ
び裏面のコモンリード４，５を接合させている。
このようにすれば、第１図ｂからも分かるように
表面および裏面のコモンリード４，５と側面リー
ド６との各接触面積が従来に比べ大幅に増大され
ることとなる。 The external lead leads 3 are formed so that one end thereof overlaps with the resistor 8 of the glaze layer 7, and are spaced at predetermined intervals along substantially the entire length of the glaze layer 7 in the orthogonal direction. The common lead 4 on the front surface also connects to the external lead 3.
and the glaze layer 7, and one end thereof is formed to overlap the resistor 8 of the glaze layer 7. The common lead 5 on the back side is
It is formed in relation to the position on the surface where the common lead 4 is formed. In this embodiment, the common leads 4 and 5 on the front and back surfaces are each formed to wrap around the groove 21 by a predetermined amount. However, although it is desirable that the common leads 4 and 5 on the front and back surfaces overlap in the groove 21, there is no problem even if they do not overlap. Further, by applying side leads 6 made of conductive paste to the entire surface of the substrate 2 where the grooves 21 are located, the common leads 4 and 5 on the front and back surfaces are joined.
In this way, as can be seen from FIG. 1B, the contact areas between the common leads 4 and 5 on the front and back surfaces and the side leads 6 are greatly increased compared to the conventional case.
なお、上記実施例の凹溝２１はそれぞれ所定の
間隔をおいて形成されているが、隣合う凹溝２１
相互がそれぞれオーバラツプするように形成させ
れば接触面積をより一層増大させることが可能と
なる。 Note that although the grooves 21 in the above embodiment are formed at predetermined intervals, the adjacent grooves 21
If they are formed so as to overlap with each other, it is possible to further increase the contact area.
(ヘ) 効果
この発明によれば、凹溝によつて側面の面積を
適宜に広げられると共に、前記凹溝部に表面のコ
モンリードおよび裏面のコモンリードが回り込む
ように形成されているから、表面および裏面のコ
モンリードと側面リードとの接触面積を大幅に増
大することができ、しかも、該基板の端縁部分の
カバーリングを良好にすることができる。従つ
て、コモンリード抵抗を有効に減少させることが
できると共に、表面および裏面のコモンリードと
側面リードとの接合部分における断線を無くする
ことができる。(f) Effects According to the present invention, the surface area of the side surface can be appropriately expanded by the groove, and since the common lead on the front surface and the common lead on the back surface are formed so as to wrap around the groove portion, the surface and The contact area between the common lead on the back surface and the side lead can be greatly increased, and the edge portions of the substrate can be covered well. Therefore, it is possible to effectively reduce the common lead resistance, and also to eliminate disconnections at the joint portions between the common leads and the side leads on the front and back surfaces.
第１図はこの発明に係るサーマルプリントヘツ
ドの一実施例を示す説明図、ａはその斜視図、ｂ
はａ図のＡ−A′線断面図、第２図は基板２に円
形孔２２を穿設したところを示す斜視説明図、第
３図は従来のサーマルプリントヘツドを示す説明
図、ａはその斜視図、ｂはａ図のＢ−B′線断面
図である。
１……サーマルプリントヘツド、２……基板、
２１……凹溝、３……外部引出しリード、４……
表面のコモンリード、５……裏面のコモンリー
ド、６……側面リード、７……グレーズ層。
FIG. 1 is an explanatory diagram showing an embodiment of a thermal print head according to the present invention, a is a perspective view thereof, and b
is a cross-sectional view taken along the line A-A' in figure a, figure 2 is a perspective explanatory view showing the circular hole 22 bored in the substrate 2, figure 3 is an explanatory view showing a conventional thermal print head, and figure a is its sectional view. A perspective view, b is a sectional view taken along the line B-B' of figure a. 1... Thermal print head, 2... Board,
21... Concave groove, 3... External drawer lead, 4...
Common lead on the front surface, 5... common lead on the back surface, 6... side lead, 7... glaze layer.
Claims (1)
え、前記基板の側面において前記各コモンリード
を側面リードでもつて接合したサーマルプリント
ヘツドであつて、前記基板の側面には、該基板の
厚さ方向に断面略半円弧状の凹溝が所定数設けら
れており、前記側面リードは基板の側面に凹溝を
含んで形成されていることを特徴とするサーマル
プリントヘツド。1 A thermal print head provided with common leads on the front and back sides of a substrate, and in which each of the common leads is connected to the side surface of the substrate by a side lead, and the side surface of the substrate has a cross section in the thickness direction of the substrate. 1. A thermal print head, wherein a predetermined number of substantially semicircular grooves are provided, and the side leads are formed including the grooves on the side surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP966685A JPS61167575A (en) | 1985-01-21 | 1985-01-21 | Thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP966685A JPS61167575A (en) | 1985-01-21 | 1985-01-21 | Thermal printing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61167575A JPS61167575A (en) | 1986-07-29 |
| JPH0573589B2 true JPH0573589B2 (en) | 1993-10-14 |
Family
ID=11726535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP966685A Granted JPS61167575A (en) | 1985-01-21 | 1985-01-21 | Thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61167575A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2529475Y2 (en) * | 1990-12-19 | 1997-03-19 | シャープ株式会社 | Reflective photo interrupter |
| JPH0569576A (en) * | 1991-09-13 | 1993-03-23 | Rohm Co Ltd | Structure of line thermal printing head |
-
1985
- 1985-01-21 JP JP966685A patent/JPS61167575A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61167575A (en) | 1986-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |