JPH057479B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a power supply support device for plating lead frames, which is used to apply various types of plating to the outer surface of short lead frames for semiconductors. It is something.

BACKGROUND ART As a power supply support device for plating a lead frame as described above, for example, as shown in Japanese Patent Application Laid-Open No. 61-87900, when the lead frame moves along the plating tank, it is A device is known in which an arm that swings up and down is provided, a groove having a V-shaped cross section is provided on the upper surface of the arm, and a cathode contact portion is formed at the inner bottom of the groove. In such conventional devices, the lead frame to be plated is dropped into the V-shaped groove and comes into contact with the cathode contact portion, where it receives electricity for plating. Since the lead frame and the cathode contact area are in contact only due to the lead frame's own weight, there is a risk that the power supply will become unstable, especially when subjected to buoyancy in liquid, and uniform plating may not be achieved. It was hot.

Problems to be Solved by the Invention The present invention solves the conventional problems as described above, and provides a lead frame that can reliably supply power to a lead frame and that allows easy attachment and detachment of the lead frame. It was completed for the purpose of a power supply support device for plating.

Means for Solving the Problems The power supply support device for plating of the present invention includes a V-shaped support plate that supports the lower end of the lead frame on the upper surface of the support arm that can move up and down, and the support arm 1
A current-carrying arm with an inverted V-shaped current-carrying piece that presses the center of the upper end of the lead frame is provided above the lead frame on the lower surface of the tip, and is movable up and down independently of the support arm. be.

Embodiment Next, the present invention will be explained in more detail with reference to the illustrated embodiment. In the first embodiment shown in FIGS. This is a conveyor chain that moves intermittently along a plucking tank 1 guided by a guide rail 4 on a machine frame 2. As shown in FIG. 4, this conveyor chain 3 is stretched between large sprockets 5 and 6 and is driven in the direction shown. The chain links of this conveyor chain 3 are provided with brackets 7 at regular intervals, and columns 8 are attached to the brackets 7 so as to be able to swing around pins 9. A supporting arm 10 is fixed to the column 8, the tip of which is horizontally immersed in the plating tank 1 when the column 8 is in the vertical position shown by the solid line in FIG. As shown in FIG. 2, a V-shaped support plate 11 made of a perforated plate is provided on the upper surface of the support arm 10. A short lead frame 50 to which this support plate 11 is fitted
This is to support the lower end of the. Further, above the support arm 10, there is a lead frame 50 on the lower surface of the tip.
An energizing arm 13 having an inverted V-shaped energizing piece 12 that presses the center of the upper end is provided. In the first embodiment, the current-carrying arm 13 has two parallel links 14, 15.
The current-carrying arm 13 is supported by the column 8 so as to be able to rise and fall independently of the support arm 10, and the current-carrying arm 13 can be moved up and down in parallel with the upper end of the lead frame 50, so that the current-carrying piece 12 extends along the longitudinal direction of the lead frame 50. A plurality of them can also be formed in the direction. The current-carrying piece 12 is connected to the current-carrying portion 17 of the support arm 10 by a lead wire 16. Further, the lower surface of this current-carrying portion 17 is always in contact with the upper surface of a lifting rail 18 protruding from the side surface of the machine frame 2. The elevating rail 18 has the role of pushing up the support arm 10 at the partition part of the plating tank 1 to the position shown by the imaginary line in FIG.
It has the role of flowing plating current to the negative power source via the current-carrying arm 13, the lead wire 16, and the current-carrying portion 17. Further, as shown in FIG. 3, a release rail 19 that engages with one of the parallel links 15 that supports the current-carrying arm 13 is provided at the supply and take-out positions shown in FIG. It has a structure that allows it to be lifted independently of the arm 10. Therefore, the lead frame 50 can be attached and detached at these supply and take-out positions.
Note that 20 shown in FIG. 1 is an anode for plating provided at the bottom of the plating tank 1.

In the second embodiment shown in FIGS. 5 and 6, the current-carrying arm 13 provided above the support arm 10 is pivoted directly to the column 8 by a pin 21.
It is lifted up in an arc shape by the removal rail 19. In this embodiment, when the height of the lead frame 50 changes, the energizing arm 13 and the supporting arm 10 no longer take a parallel position in the lowered position.
Although only one current-carrying piece 12 is provided, it is also possible to provide a plurality of current-carrying pieces 12 by interposing a balance-type link or the like.

Effect The power feeding support device for plating a lead frame of the present invention configured as described above lifts only the energizing arm 13 upward in the supply position, and the lead frame 5
When the current-carrying arm 13 is lowered after being placed on the V-shaped support plate 11 on the upper surface of the support arm 10 of 0, the inverted V-shaped current-carrying piece 12 is attached to the lead frame by the weight of the current-carrying arm 13. 50 and press the center of its upper surface with a constant force. Therefore, when the conveyor chain 3 is driven, the support arm 10 moves intermittently inside the plating tank 1 together with the current-carrying arm 13, and energizes the lead frame 50 via the current-carrying piece 12, thereby causing the lead frame 50 to become visible. Attachment processing is performed. At this time, even if buoyancy occurs in the lead frame 50, the upper end of the lead frame 50 is pressed by the current carrying piece 12 with a much stronger force, so the power supply will not become unstable and the lead frame 50 The plating process is applied uniformly to the entire surface. The support arm 10 is lifted upward by the lifting rail 18 at the part where it goes in and out of the plating tank 1 and the part where the plating tank and the washing tank are separated, but at this time, the energizing arm 13 is also lifted at the same time. becomes.

Effects of the Invention As is clear from the above description, the present invention includes a current-carrying arm having an inverted V-shaped current-carrying piece that is movable up and down above the support arm having a support plate that supports the lower end of the lead frame. Therefore, unlike the conventional case where the lead frame was in contact with the cathode contact part due to its own weight, the contact pressure between the current-carrying piece and the lead frame is maintained almost constant. , stable charging can be performed without the power supply becoming unstable. In addition, in the present invention, the support plate is V-shaped, and the support arm and the current-carrying arm can be raised and lowered independently.
It has the advantage that the lead frame can be attached and detached very easily. Therefore, the present invention greatly contributes to the industry as a power supply support device for plating lead frames that eliminates the problems of the conventional devices.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway front view showing the first embodiment of the present invention, FIG. 2 is a perspective view showing the main parts, FIG. 3 is a front view showing the state at the supply and takeout positions, and FIG. 5 is a partially cutaway front view showing a second embodiment of the present invention, and FIG. 6 is a front view showing the state at the supply and take-out positions. 10: Support arm, 11: Support piece, 12: Current carrying piece,
13: Current-carrying arm, 50: Lead frame.

Claims (1)

[Claims] 1. A V-shaped support plate 11 that supports the lower end of the lead frame 50 is provided on the upper surface of the support arm 10 that can be moved up and down, and the center of the upper end of the lead frame 50 is pressed against the lower surface of the tip above the support arm 10. A power supply support device for plating a lead frame, characterized in that a power supply arm 13 having an inverted V-shaped power supply piece 12 is provided so as to be movable up and down independently of a support arm 10.